MY114539A - Process for silver plating in printed circuit board manufacture - Google Patents
Process for silver plating in printed circuit board manufactureInfo
- Publication number
- MY114539A MY114539A MYPI95003868A MYPI19953868A MY114539A MY 114539 A MY114539 A MY 114539A MY PI95003868 A MYPI95003868 A MY PI95003868A MY PI19953868 A MYPI19953868 A MY PI19953868A MY 114539 A MY114539 A MY 114539A
- Authority
- MY
- Malaysia
- Prior art keywords
- silver
- ions
- circuit board
- printed circuit
- deposit
- Prior art date
Links
Landscapes
- Chemically Coating (AREA)
Abstract
IN PCB MANUFACTURE, THE PADS AND/OR THROUGH-HOLES OF A BARE BOARD ARE PROTECTED PRIOR TO MOUNTING OF OTHER COMPONENTS BY A SILVER PLATING PROCESS. THE SILVER PLATE IS APPLIED FROM A PLATING COMPOSITION BY A REPLACEMENT PROCESS IN WHICH SILVER IONS OXIDIZED COPPER AND DEPOSIT A LAYER OF SILVER AT THE SURFACE. IN THE AQUEOUS PLATING COMPOSITION THE SILVER IONS ARE MAINTAINED IN SOLUTION BY THE INCORPORATION OF A MULTIDENTATE COMPLEXING AGENT. THE COMPOSITIONS MAY CONTAIN A SILVER TARNISH INHIBITOR AND ARE FREE OF REDUCING AGENT CAPABLE OF REDUCING SILVER IONS TO SILVER METAL, HALIDE IONS AND SUBSTANTIALLY FREE OF NON-AQUEOUS SOLVENT. SURFACE MOUNTED COMPONENTS CAN BE SOLDERED DIRECT TO THE SILVER COATED CONTACT USING ANY COMMERCIALLY AVAILABLE SOLDER. SILVER DOES NOT DEPOSIT ONTO SOLDER MASK, BUT ONLY ONTO METAL WHICH IS LESS ELECTROPOSITIVE THAN SILVER.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI95003868A MY114539A (en) | 1995-12-14 | 1995-12-14 | Process for silver plating in printed circuit board manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI95003868A MY114539A (en) | 1995-12-14 | 1995-12-14 | Process for silver plating in printed circuit board manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY114539A true MY114539A (en) | 2002-11-30 |
Family
ID=81534532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI95003868A MY114539A (en) | 1995-12-14 | 1995-12-14 | Process for silver plating in printed circuit board manufacture |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY114539A (en) |
-
1995
- 1995-12-14 MY MYPI95003868A patent/MY114539A/en unknown
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