Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Metals LtdfiledCriticalAlpha Metals Ltd
Priority to MYPI9503867priorityCriticalpatent/MY120099A/en
Publication of MY120099ApublicationCriticalpatent/MY120099A/en
A PROCESS USED DURING MANUFACTURE OF PRINTED CIRCUIT BOARDS COMPRISES PROTECTING METAL PADS AND/OR THROUGH-HOLES TO PROVIDE A TRANISH-RESISTANT AND SOLDERABLE COATING. IN THE METHOD, THE PADS AND/OR THROUGH-HOLES ARE BRIGHT-ETCHED, METAL PLATED, PREFERABLY BY AN IMMERSION PROCESS, AND TREATED WITH A TARNISH INHIBITOR. THE TARNISH INHIBITOR MAY BE INCORPORATED INTO THE IMMERSION PLATING. THE METAL PLATING IS USUALLY WITH SILVER OR BISMUTH AND THE PADS AND/OR THROUGH-HOLES COMPRISE COPPER.
Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering.
Electrolytic treatment of copper foil to deposit a dark-coloured, nodular layer of copper-nickel alloy to improve bond strength to dielectric substrate