JPS5127819A - Do oyobi dogokinyokagakushorieki - Google Patents

Do oyobi dogokinyokagakushorieki

Info

Publication number
JPS5127819A
JPS5127819A JP49100646A JP10064674A JPS5127819A JP S5127819 A JPS5127819 A JP S5127819A JP 49100646 A JP49100646 A JP 49100646A JP 10064674 A JP10064674 A JP 10064674A JP S5127819 A JPS5127819 A JP S5127819A
Authority
JP
Japan
Prior art keywords
dogokinyokagakushorieki
oyobi
oyobi dogokinyokagakushorieki
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49100646A
Other languages
Japanese (ja)
Other versions
JPS54865B2 (en
Inventor
Yutaka Oshida
Itaru Iketani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP49100646A priority Critical patent/JPS5127819A/en
Publication of JPS5127819A publication Critical patent/JPS5127819A/en
Publication of JPS54865B2 publication Critical patent/JPS54865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
JP49100646A 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki Granted JPS5127819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49100646A JPS5127819A (en) 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49100646A JPS5127819A (en) 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki

Publications (2)

Publication Number Publication Date
JPS5127819A true JPS5127819A (en) 1976-03-09
JPS54865B2 JPS54865B2 (en) 1979-01-17

Family

ID=14279577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49100646A Granted JPS5127819A (en) 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki

Country Status (1)

Country Link
JP (1) JPS5127819A (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54865B2 (en) * 1974-09-02 1979-01-17
JPS5983771A (en) * 1982-11-05 1984-05-15 Denki Kagaku Kogyo Kk Manufacture of etched copper-coated metal substrate
WO1996019097A1 (en) * 1994-12-12 1996-06-20 Alpha Fry Ltd. Copper coating
EP0890660A1 (en) * 1997-07-08 1999-01-13 MEC CO., Ltd. Microetching agent for copper or copper alloys
JP2002115077A (en) * 2000-08-04 2002-04-19 Shipley Co Llc Composition for producing circuit board
US6395329B2 (en) 1994-12-09 2002-05-28 Soutar Andrew Mcintosh Printed circuit board manufacture
JP2005015860A (en) * 2003-06-26 2005-01-20 Ebara Densan Ltd Mirror finish etching liquid for copper and copper alloy
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
JP2009299096A (en) * 2008-06-10 2009-12-24 Ebara Densan Ltd Surface treatment solution and surface treatment method of copper and copper alloy for printed circuit board
WO2011093445A1 (en) * 2010-01-28 2011-08-04 三菱瓦斯化学株式会社 Etching liquid for a copper/titanium multilayer thin film
US20110214994A1 (en) * 2010-03-02 2011-09-08 C. Uyemura & Co., Ltd Pretreating agent for electroplating, pretreatment method for electroplating, and electroplating method
USRE45175E1 (en) 1994-12-09 2014-10-07 Fry's Metals, Inc. Process for silver plating in printed circuit board manufacture
USRE45297E1 (en) 1996-03-22 2014-12-23 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
USRE45881E1 (en) 1996-03-22 2016-02-09 Ronald Redline Method for enhancing the solderability of a surface
EP3159432A1 (en) 2015-10-23 2017-04-26 ATOTECH Deutschland GmbH Surface treatment agent for copper and copper alloy surfaces
JP2018040030A (en) * 2016-09-06 2018-03-15 日立化成株式会社 Surface treatment method of copper component and production method of semiconductor packaging substrate
CN109112540A (en) * 2018-08-09 2019-01-01 苏州纳勒电子科技有限公司 A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive
US10383476B2 (en) 2016-09-29 2019-08-20 Ember Technologies, Inc. Heated or cooled drinkware
US10413119B2 (en) 2015-02-24 2019-09-17 Ember Technologies, Inc. Heated or cooled portable drinkware
US10433672B2 (en) 2018-01-31 2019-10-08 Ember Technologies, Inc. Actively heated or cooled infant bottle system
WO2019208461A1 (en) * 2018-04-24 2019-10-31 三菱瓦斯化学株式会社 Etching liquid for copper foils, method for producing printed wiring board using said etching liquid for copper foils, etching liquid for electrolytic copper layers, and method for producing copper pillar said etching liquid for electrolytic copper layers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122432A (en) * 1973-03-27 1974-11-22

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892230A (en) * 1972-03-08 1973-11-30
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
US4098494A (en) * 1976-09-02 1978-07-04 National Engineering Company Method and apparatus for making battery paste

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122432A (en) * 1973-03-27 1974-11-22

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54865B2 (en) * 1974-09-02 1979-01-17
JPS5983771A (en) * 1982-11-05 1984-05-15 Denki Kagaku Kogyo Kk Manufacture of etched copper-coated metal substrate
USRE45175E1 (en) 1994-12-09 2014-10-07 Fry's Metals, Inc. Process for silver plating in printed circuit board manufacture
USRE45279E1 (en) 1994-12-09 2014-12-09 Fry's Metals, Inc. Process for silver plating in printed circuit board manufacture
US6395329B2 (en) 1994-12-09 2002-05-28 Soutar Andrew Mcintosh Printed circuit board manufacture
US6860925B2 (en) 1994-12-09 2005-03-01 Enthone Incorporated Printed circuit board manufacture
WO1996019097A1 (en) * 1994-12-12 1996-06-20 Alpha Fry Ltd. Copper coating
USRE45297E1 (en) 1996-03-22 2014-12-23 Ronald Redline Method for enhancing the solderability of a surface
USRE45881E1 (en) 1996-03-22 2016-02-09 Ronald Redline Method for enhancing the solderability of a surface
EP0890660A1 (en) * 1997-07-08 1999-01-13 MEC CO., Ltd. Microetching agent for copper or copper alloys
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
JP2002115077A (en) * 2000-08-04 2002-04-19 Shipley Co Llc Composition for producing circuit board
JP2005015860A (en) * 2003-06-26 2005-01-20 Ebara Densan Ltd Mirror finish etching liquid for copper and copper alloy
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
JP2009299096A (en) * 2008-06-10 2009-12-24 Ebara Densan Ltd Surface treatment solution and surface treatment method of copper and copper alloy for printed circuit board
WO2011093445A1 (en) * 2010-01-28 2011-08-04 三菱瓦斯化学株式会社 Etching liquid for a copper/titanium multilayer thin film
JP5685204B2 (en) * 2010-01-28 2015-03-18 三菱瓦斯化学株式会社 Etching solution for copper / titanium multilayer thin film
CN102834547A (en) * 2010-01-28 2012-12-19 三菱瓦斯化学株式会社 Etching liquid for a copper/titanium multilayer thin film
JPWO2011093445A1 (en) * 2010-01-28 2013-06-06 三菱瓦斯化学株式会社 Etching solution for copper / titanium multilayer thin film
US8980121B2 (en) 2010-01-28 2015-03-17 Mitsubishi Gas Chemical Company, Inc. Etching liquid for a copper/titanium multilayer thin film
US20110214994A1 (en) * 2010-03-02 2011-09-08 C. Uyemura & Co., Ltd Pretreating agent for electroplating, pretreatment method for electroplating, and electroplating method
US10413119B2 (en) 2015-02-24 2019-09-17 Ember Technologies, Inc. Heated or cooled portable drinkware
WO2017068042A1 (en) 2015-10-23 2017-04-27 Atotech Deutschland Gmbh Surface treatment agent for copper and copper alloy surfaces and method for treating copper or copper alloy surfaces
EP3159432A1 (en) 2015-10-23 2017-04-26 ATOTECH Deutschland GmbH Surface treatment agent for copper and copper alloy surfaces
JP2018040030A (en) * 2016-09-06 2018-03-15 日立化成株式会社 Surface treatment method of copper component and production method of semiconductor packaging substrate
US10383476B2 (en) 2016-09-29 2019-08-20 Ember Technologies, Inc. Heated or cooled drinkware
US10433672B2 (en) 2018-01-31 2019-10-08 Ember Technologies, Inc. Actively heated or cooled infant bottle system
WO2019208461A1 (en) * 2018-04-24 2019-10-31 三菱瓦斯化学株式会社 Etching liquid for copper foils, method for producing printed wiring board using said etching liquid for copper foils, etching liquid for electrolytic copper layers, and method for producing copper pillar said etching liquid for electrolytic copper layers
JPWO2019208461A1 (en) * 2018-04-24 2021-05-13 三菱瓦斯化学株式会社 A method for manufacturing an etching solution for copper foil and a printed wiring board using the same, and a method for manufacturing an etching solution for an electrolytic copper layer and a copper pillar using the same.
TWI808158B (en) * 2018-04-24 2023-07-11 日商三菱瓦斯化學股份有限公司 Copper etchant and method of manufacturing printed wiring board or copper pillar using the same
CN109112540A (en) * 2018-08-09 2019-01-01 苏州纳勒电子科技有限公司 A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive

Also Published As

Publication number Publication date
JPS54865B2 (en) 1979-01-17

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