JPS54865B2 - - Google Patents

Info

Publication number
JPS54865B2
JPS54865B2 JP10064674A JP10064674A JPS54865B2 JP S54865 B2 JPS54865 B2 JP S54865B2 JP 10064674 A JP10064674 A JP 10064674A JP 10064674 A JP10064674 A JP 10064674A JP S54865 B2 JPS54865 B2 JP S54865B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10064674A
Other languages
Japanese (ja)
Other versions
JPS5127819A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49100646A priority Critical patent/JPS5127819A/en
Publication of JPS5127819A publication Critical patent/JPS5127819A/en
Publication of JPS54865B2 publication Critical patent/JPS54865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
JP49100646A 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki Granted JPS5127819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49100646A JPS5127819A (en) 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49100646A JPS5127819A (en) 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki

Publications (2)

Publication Number Publication Date
JPS5127819A JPS5127819A (en) 1976-03-09
JPS54865B2 true JPS54865B2 (en) 1979-01-17

Family

ID=14279577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49100646A Granted JPS5127819A (en) 1974-09-02 1974-09-02 Do oyobi dogokinyokagakushorieki

Country Status (1)

Country Link
JP (1) JPS5127819A (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
JPS5983771A (en) * 1982-11-05 1984-05-15 Denki Kagaku Kogyo Kk Manufacture of etched copper-coated metal substrate
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
JPH1129883A (en) * 1997-07-08 1999-02-02 Mec Kk Microetching agent for copper and copper alloy
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US6521139B1 (en) * 2000-08-04 2003-02-18 Shipley Company L.L.C. Composition for circuit board manufacture
JP4090951B2 (en) * 2003-06-26 2008-05-28 株式会社荏原電産 Mirror finish etchant for copper and copper alloys
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
JP2009299096A (en) * 2008-06-10 2009-12-24 Ebara Densan Ltd Surface treatment solution and surface treatment method of copper and copper alloy for printed circuit board
US8980121B2 (en) 2010-01-28 2015-03-17 Mitsubishi Gas Chemical Company, Inc. Etching liquid for a copper/titanium multilayer thin film
JP2011179085A (en) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd Pretreatment agent and pretreatment method for electroplating and electroplating method
US9782036B2 (en) 2015-02-24 2017-10-10 Ember Technologies, Inc. Heated or cooled portable drinkware
EP3159432B1 (en) 2015-10-23 2020-08-05 ATOTECH Deutschland GmbH Surface treatment agent for copper and copper alloy surfaces
JP6870245B2 (en) * 2016-09-06 2021-05-12 昭和電工マテリアルズ株式会社 Surface treatment method for copper members and manufacturing method for semiconductor mounting substrates
KR20180035662A (en) 2016-09-29 2018-04-06 엠버 테크놀로지스 인코포레이티드 Heated or cooled drinkware
US10433672B2 (en) 2018-01-31 2019-10-08 Ember Technologies, Inc. Actively heated or cooled infant bottle system
JP7230908B2 (en) * 2018-04-24 2023-03-01 三菱瓦斯化学株式会社 Etching solution for copper foil and method for producing printed wiring board using the same, etching solution for electrolytic copper layer and method for producing copper pillar using the same
CN109112540A (en) * 2018-08-09 2019-01-01 苏州纳勒电子科技有限公司 A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892230A (en) * 1972-03-08 1973-11-30
JPS49122432A (en) * 1973-03-27 1974-11-22
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
JPS5332341A (en) * 1976-09-02 1978-03-27 Nat Eng Co Method and device for producing battery paste

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892230A (en) * 1972-03-08 1973-11-30
JPS49122432A (en) * 1973-03-27 1974-11-22
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
JPS5332341A (en) * 1976-09-02 1978-03-27 Nat Eng Co Method and device for producing battery paste

Also Published As

Publication number Publication date
JPS5127819A (en) 1976-03-09

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