IN185455B - - Google Patents

Info

Publication number
IN185455B
IN185455B IN1610CA1995A IN185455B IN 185455 B IN185455 B IN 185455B IN 1610CA1995 A IN1610CA1995 A IN 1610CA1995A IN 185455 B IN185455 B IN 185455B
Authority
IN
India
Prior art keywords
silver
reexamination
ions
reexaminations
cfr
Prior art date
Application number
Other languages
English (en)
Inventor
Andrew Mcintosh Soutar
Peter Thomas Mcgrath
Original Assignee
Alpha Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10765790&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IN185455(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Alpha Metals Ltd filed Critical Alpha Metals Ltd
Publication of IN185455B publication Critical patent/IN185455B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Insulating Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Other Liquid Machine Or Engine Such As Wave Power Use (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
IN1610CA1995 1994-12-09 1995-12-11 IN185455B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9425030.5A GB9425030D0 (en) 1994-12-09 1994-12-09 Silver plating

Publications (1)

Publication Number Publication Date
IN185455B true IN185455B (de) 2001-01-27

Family

ID=10765790

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1610CA1995 IN185455B (de) 1994-12-09 1995-12-11

Country Status (14)

Country Link
US (3) US5955141A (de)
EP (1) EP0795043B1 (de)
JP (1) JP2902586B2 (de)
KR (1) KR100442405B1 (de)
CN (1) CN1071805C (de)
AT (1) ATE178949T1 (de)
AU (1) AU4122096A (de)
DE (2) DE795043T1 (de)
FI (1) FI972422A (de)
GB (1) GB9425030D0 (de)
HK (1) HK1002868A1 (de)
IN (1) IN185455B (de)
TW (1) TW408189B (de)
WO (1) WO1996017974A1 (de)

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GB9425031D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
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US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
US7267259B2 (en) 1999-02-17 2007-09-11 Ronald Redline Method for enhancing the solderability of a surface
JP2000144440A (ja) * 1998-11-18 2000-05-26 Nippon Kojundo Kagaku Kk 電子部品用無電解銀めっき液
JP2000160350A (ja) * 1998-11-26 2000-06-13 Nippon Kojundo Kagaku Kk 電子部品用無電解銀めっき液
JP2000160351A (ja) * 1998-11-26 2000-06-13 Nippon Kojundo Kagaku Kk 電子部品用無電解銀めっき液
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
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JP5188683B2 (ja) * 2006-06-12 2013-04-24 パナソニック株式会社 接点部品または電池部品用材料と、それを用いた電池
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TWI674300B (zh) * 2012-02-27 2019-10-11 美商黎可德X印製金屬公司 可溶於極性質子溶劑之自還原性金屬錯合物墨水及改良的固化方法
KR101483733B1 (ko) 2012-09-26 2015-01-16 김상호 전도성 분말 및 그 제조방법
CN104419922B (zh) * 2013-08-26 2017-06-06 比亚迪股份有限公司 一种化学置换镀银液和化学置换镀银方法
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KR102159547B1 (ko) * 2014-03-13 2020-09-24 엘지이노텍 주식회사 패키지 기판 및 그의 제조 방법
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US20190029122A1 (en) * 2017-07-19 2019-01-24 Anaren, Inc. Encapsulation of circuit trace
CN108315725A (zh) * 2018-01-11 2018-07-24 广东禾木科技有限公司 一种银键合丝表面的杂质的去除方法
KR102623838B1 (ko) 2018-08-20 2024-01-11 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN109338343B (zh) * 2018-09-26 2020-09-25 长沙理工大学 一种化学镀银液及镀银方法
CN110016663A (zh) * 2019-04-28 2019-07-16 江苏东源电器集团股份有限公司 铜导体表面敷银工艺
CN111663124A (zh) * 2020-06-11 2020-09-15 大连理工大学 一种在碳化硅表面镀银的方法
CN116420433A (zh) * 2020-11-05 2023-07-11 Dic株式会社 半加成法用层叠体及使用其的印刷配线板
CN113897601A (zh) * 2021-09-29 2022-01-07 深圳市虹喜科技发展有限公司 化学镀银液
CN115595567B (zh) * 2022-08-30 2023-09-22 胜宏科技（惠州）股份有限公司 一种防变色化学镀银液

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Also Published As

Publication number Publication date
EP0795043B1 (de) 1999-04-14
GB9425030D0 (en) 1995-02-08
EP0795043A1 (de) 1997-09-17
KR100442405B1 (ko) 2004-12-09
DE69509116T2 (de) 1999-11-18
FI972422A (fi) 1997-08-06
USRE45279E1 (en) 2014-12-09
US5955141A (en) 1999-09-21
CN1071805C (zh) 2001-09-26
TW408189B (en) 2000-10-11
USRE45175E1 (en) 2014-10-07
HK1002868A1 (en) 1998-09-25
JPH08232072A (ja) 1996-09-10
ATE178949T1 (de) 1999-04-15
AU4122096A (en) 1996-06-26
DE795043T1 (de) 1998-02-19
DE69509116D1 (de) 1999-05-20
WO1996017974A1 (en) 1996-06-13
FI972422A0 (fi) 1997-06-06
JP2902586B2 (ja) 1999-06-07
CN1175284A (zh) 1998-03-04

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