JPS55154597A - Gold alloy electroplating bath - Google Patents

Gold alloy electroplating bath

Info

Publication number
JPS55154597A
JPS55154597A JP6302979A JP6302979A JPS55154597A JP S55154597 A JPS55154597 A JP S55154597A JP 6302979 A JP6302979 A JP 6302979A JP 6302979 A JP6302979 A JP 6302979A JP S55154597 A JPS55154597 A JP S55154597A
Authority
JP
Japan
Prior art keywords
added
gold
nonmetals
metals
brightness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6302979A
Other languages
Japanese (ja)
Inventor
Eiji Togawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP6302979A priority Critical patent/JPS55154597A/en
Publication of JPS55154597A publication Critical patent/JPS55154597A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To improve the mechanical characteristics of a plated gold-tin alloy and the brightness of deposit by adding a restricted amount of a compound which complexes added metal or nonmetal to a multicomponent alloy plating bath based on a predetermined amount of gold and tin.
CONSTITUTION: To a gold alloy electroplating bath contg. gold added as potassium cyanide 1W40g/l, stannous ions 5W100g/l and ions of one or more kinds of metals or nonmetals selected from Ib, IVa, Va, VIa, VIIa and VIII group metals and IVb, Vb and VIb group nonmetals 80g/l or less are added 5W500g/l of a compound such as org. carboxylic acid which complexes the added metals or nonmetals even by a little. A brightener and an antioxidant for stannous ions may be added. Using the resulting bath the surface hardeness, brightness, etc. of a deposited film are enhanced.
COPYRIGHT: (C)1980,JPO&Japio
JP6302979A 1979-05-22 1979-05-22 Gold alloy electroplating bath Pending JPS55154597A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6302979A JPS55154597A (en) 1979-05-22 1979-05-22 Gold alloy electroplating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6302979A JPS55154597A (en) 1979-05-22 1979-05-22 Gold alloy electroplating bath

Publications (1)

Publication Number Publication Date
JPS55154597A true JPS55154597A (en) 1980-12-02

Family

ID=13217484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6302979A Pending JPS55154597A (en) 1979-05-22 1979-05-22 Gold alloy electroplating bath

Country Status (1)

Country Link
JP (1) JPS55154597A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE45175E1 (en) 1994-12-09 2014-10-07 Fry's Metals, Inc. Process for silver plating in printed circuit board manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE45175E1 (en) 1994-12-09 2014-10-07 Fry's Metals, Inc. Process for silver plating in printed circuit board manufacture
USRE45279E1 (en) 1994-12-09 2014-12-09 Fry's Metals, Inc. Process for silver plating in printed circuit board manufacture

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