JPS55154597A - Gold alloy electroplating bath - Google Patents
Gold alloy electroplating bathInfo
- Publication number
- JPS55154597A JPS55154597A JP6302979A JP6302979A JPS55154597A JP S55154597 A JPS55154597 A JP S55154597A JP 6302979 A JP6302979 A JP 6302979A JP 6302979 A JP6302979 A JP 6302979A JP S55154597 A JPS55154597 A JP S55154597A
- Authority
- JP
- Japan
- Prior art keywords
- added
- gold
- nonmetals
- metals
- brightness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To improve the mechanical characteristics of a plated gold-tin alloy and the brightness of deposit by adding a restricted amount of a compound which complexes added metal or nonmetal to a multicomponent alloy plating bath based on a predetermined amount of gold and tin.
CONSTITUTION: To a gold alloy electroplating bath contg. gold added as potassium cyanide 1W40g/l, stannous ions 5W100g/l and ions of one or more kinds of metals or nonmetals selected from Ib, IVa, Va, VIa, VIIa and VIII group metals and IVb, Vb and VIb group nonmetals 80g/l or less are added 5W500g/l of a compound such as org. carboxylic acid which complexes the added metals or nonmetals even by a little. A brightener and an antioxidant for stannous ions may be added. Using the resulting bath the surface hardeness, brightness, etc. of a deposited film are enhanced.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6302979A JPS55154597A (en) | 1979-05-22 | 1979-05-22 | Gold alloy electroplating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6302979A JPS55154597A (en) | 1979-05-22 | 1979-05-22 | Gold alloy electroplating bath |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55154597A true JPS55154597A (en) | 1980-12-02 |
Family
ID=13217484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6302979A Pending JPS55154597A (en) | 1979-05-22 | 1979-05-22 | Gold alloy electroplating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55154597A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE45175E1 (en) | 1994-12-09 | 2014-10-07 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
-
1979
- 1979-05-22 JP JP6302979A patent/JPS55154597A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE45175E1 (en) | 1994-12-09 | 2014-10-07 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
USRE45279E1 (en) | 1994-12-09 | 2014-12-09 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
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