DE60103798D1 - Elektromagnetische Wellen absorbierende, wärmeleitende Silikongummi-Zusammensetzungen - Google Patents

Elektromagnetische Wellen absorbierende, wärmeleitende Silikongummi-Zusammensetzungen

Info

Publication number
DE60103798D1
DE60103798D1 DE60103798T DE60103798T DE60103798D1 DE 60103798 D1 DE60103798 D1 DE 60103798D1 DE 60103798 T DE60103798 T DE 60103798T DE 60103798 T DE60103798 T DE 60103798T DE 60103798 D1 DE60103798 D1 DE 60103798D1
Authority
DE
Germany
Prior art keywords
electromagnetic wave
silicone rubber
heat conductive
rubber compositions
wave absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60103798T
Other languages
English (en)
Other versions
DE60103798T2 (de
Inventor
Akio Suzuki
Naoki Fuse
Hiroshi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE60103798D1 publication Critical patent/DE60103798D1/de
Publication of DE60103798T2 publication Critical patent/DE60103798T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/004—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using non-directional dissipative particles, e.g. ferrite powders
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Hard Magnetic Materials (AREA)
  • Soft Magnetic Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Aerials With Secondary Devices (AREA)
DE60103798T 2000-04-11 2001-04-11 Elektromagnetische Wellen absorbierende, wärmeleitende Silikongummi-Zusammensetzungen Expired - Lifetime DE60103798T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000109249 2000-04-11
JP2000109249A JP4623244B2 (ja) 2000-04-11 2000-04-11 電磁波吸収性熱伝導性シリコーンゴム組成物

Publications (2)

Publication Number Publication Date
DE60103798D1 true DE60103798D1 (de) 2004-07-22
DE60103798T2 DE60103798T2 (de) 2005-07-14

Family

ID=18621962

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60103798T Expired - Lifetime DE60103798T2 (de) 2000-04-11 2001-04-11 Elektromagnetische Wellen absorbierende, wärmeleitende Silikongummi-Zusammensetzungen

Country Status (5)

Country Link
US (1) US6514428B2 (de)
EP (1) EP1146085B1 (de)
JP (1) JP4623244B2 (de)
DE (1) DE60103798T2 (de)
TW (1) TWI222459B (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3641797B2 (ja) 1999-10-18 2005-04-27 Ｎｅｃトーキン株式会社 電磁干渉抑制体
JP3641796B2 (ja) * 1999-10-18 2005-04-27 Ｎｅｃトーキン株式会社 電磁干渉抑制体
JP3719382B2 (ja) * 2000-10-25 2005-11-24 信越化学工業株式会社 電磁波吸収性シリコーンゴム組成物
JP2002198686A (ja) * 2000-12-27 2002-07-12 Sony Corp 電子部品用シートおよびその製造方法
JP3608612B2 (ja) 2001-03-21 2005-01-12 信越化学工業株式会社 電磁波吸収性熱伝導組成物及び熱軟化性電磁波吸収性放熱シート並びに放熱施工方法
JP2002329995A (ja) * 2001-05-07 2002-11-15 Shin Etsu Chem Co Ltd 電磁波吸収体
EP1403326B1 (de) * 2001-05-14 2008-12-03 Dow Corning Toray Co., Ltd. Wärmeleitende silikonzusammensetzung
JP2002374092A (ja) * 2001-06-15 2002-12-26 Polymatech Co Ltd 放熱性電波吸収体
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP4365067B2 (ja) * 2002-05-14 2009-11-18 東レ・ダウコーニング株式会社 複合軟磁性体形成用硬化性シリコーン組成物および複合軟磁性体
JP3949612B2 (ja) * 2002-06-06 2007-07-25 富士高分子工業株式会社 放熱シート及びその製造方法
JP3990658B2 (ja) * 2002-08-19 2007-10-17 住友電気工業株式会社 電磁波吸収体
TWI357425B (en) * 2003-09-09 2012-02-01 Laird Technologies Inc Microwave-absorbing form-in-place paste
JP2005320390A (ja) * 2004-05-07 2005-11-17 Denki Kagaku Kogyo Kk 硬化可能な組成物、成型物及び放熱部材
CN100561602C (zh) * 2004-07-16 2009-11-18 鸿富锦精密工业（深圳）有限公司 聚热元件
DE102005008951A1 (de) * 2005-02-24 2006-09-07 Wacker Chemie Ag Siliconkautschukmassen und daraus erhaltene dauerbelastungsbeständige Siliconelastomere
WO2006112001A1 (ja) * 2005-04-12 2006-10-26 Ubiquitous Environment Company 全天候型電波反射吸収体及びその組込構造体
JP2007138100A (ja) * 2005-11-22 2007-06-07 Shin Etsu Chem Co Ltd 高熱伝導性シリコーンゴム組成物
KR101249078B1 (ko) * 2006-01-20 2013-03-29 삼성전기주식회사 실록산계 분산제 및 이를 포함하는 나노입자 페이스트조성물
KR100745692B1 (ko) * 2006-02-28 2007-08-03 한국전자통신연구원 방열 특성과 전자파 차폐 및 흡수 특성을 갖는 복합 시트용조성물 및 상기 조성물로 제조된 단층형 복합 시트
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
JP2008205111A (ja) * 2007-02-19 2008-09-04 Fujitsu Ltd 配線基板および半導体装置、配線基板の製造方法
DE102007025053B4 (de) * 2007-04-20 2020-09-03 Barlog Plastics Gmbh Verfahren zum Herstellen eines permanent magnetischen Formteiles und permanent magnetisches Formteil
KR100849496B1 (ko) * 2007-06-01 2008-07-31 한국전자통신연구원 목표 주파수 대역에서 방열 특성과 전자파 차폐 및 흡수특성을 지닌 복합 시트용 조성물 및 상기 조성물로 제조된단층형 복합 시트
EP2045285A1 (de) * 2007-10-01 2009-04-08 Doo Sung Industrial Co., Ltd. Rollenförmige Verbundfolie mit verbesserter Wärmefreisetzung, Absorption elektromagnetischer Wellen und Schlagfestigkeit sowie Herstellungsverfahren dafür
KR100942786B1 (ko) * 2007-10-01 2010-02-18 두성산업 주식회사 방열 특성과 전자파 및 충격 흡수 특성이 향상된 롤 타입의복합 시트 및 그 제조 방법
US20090236804A1 (en) * 2008-03-20 2009-09-24 Daniel Kirsch Playing Cards with Electronic Circuitry
US7704438B2 (en) 2008-04-25 2010-04-27 Barlog Plastics Gmbh Process for producing a permanently magnetic molding
JP2010183057A (ja) * 2009-01-07 2010-08-19 Sumitomo Electric Ind Ltd 軟磁性材料の製造方法、軟磁性材料、および圧粉磁心
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN102924923B (zh) * 2012-10-24 2014-12-03 江苏大学 一种高导热磁性金属纤维/硅橡胶复合材料及其制备方法
US9999158B2 (en) 2013-01-03 2018-06-12 Henkel IP & Holding GmbH Thermally conductive EMI suppression compositions
JP6168851B2 (ja) * 2013-05-31 2017-07-26 アイシン化工株式会社 放熱樹脂成形体
GB2519133B (en) * 2013-10-11 2018-06-27 Qinetiq Ltd Electromagnetic field absorbing composition
JP6511832B2 (ja) * 2014-05-14 2019-05-15 Tdk株式会社 軟磁性金属粉末、およびその粉末を用いた軟磁性金属圧粉コア
US11229147B2 (en) 2015-02-06 2022-01-18 Laird Technologies, Inc. Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide
JP6384437B2 (ja) * 2015-09-17 2018-09-05 信越化学工業株式会社 シリコーンゴム組成物及び電力ケーブル
EP3348124B1 (de) 2015-10-16 2021-05-26 Laird Technologies, Inc. Zwischen abschirmungen auf plattenebene und kühlkörpern positionierte oder positionierbare wärmeleitfähige absorber von elektromagnetischen interferenzen (emi)
US10462944B1 (en) * 2018-09-25 2019-10-29 Getac Technology Corporation Wave absorbing heat dissipation structure
CN109535725A (zh) * 2018-12-12 2019-03-29 深圳丰盈磁性材料有限公司 一种耐高温磁性橡胶及其制备方法
JP7456572B2 (ja) 2019-03-28 2024-03-27 積水ポリマテック株式会社 シリコーン組成物および硬化型グリス
CN110294939A (zh) * 2019-06-04 2019-10-01 深圳市飞荣达科技股份有限公司 高导热吸波有机硅组合物及其制备方法
US11785752B2 (en) 2019-06-10 2023-10-10 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermally conductive composition and sheet thereof
CN110938310A (zh) * 2019-10-17 2020-03-31 清远高新华园科技协同创新研究院有限公司 一种高导热吸波硅胶片、制备方法及设备
KR102542423B1 (ko) 2020-09-23 2023-06-12 라이르드 테크놀로지스, 아이엔씨 열전도성 전자파 장해(emi) 흡수체
WO2022161634A1 (de) 2021-01-29 2022-08-04 Wacker Chemie Ag Siliziumhaltige wärmeleitpasten
CN114058186B (zh) * 2021-11-02 2023-06-06 华南理工大学 MXene/锌锰铁氧体/发泡硅橡胶吸波复合材料及其制备方法与应用
CN117083326A (zh) 2022-01-28 2023-11-17 瓦克化学股份公司 含有轻金属合金的导热膏

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3069326D1 (en) * 1980-01-04 1984-10-31 Ford Motor Co Polysiloxane elastomer composition and dispensable precursor therefor
JPS6144951A (ja) * 1984-08-09 1986-03-04 Toshiba Silicone Co Ltd 導電性シリコ−ンゴム組成物
JPS62257967A (ja) * 1986-05-02 1987-11-10 Canon Inc 導電性樹脂組成物
JP2612628B2 (ja) * 1990-01-24 1997-05-21 富士写真フイルム株式会社 磁気記録媒体
JP3134333B2 (ja) * 1991-03-27 2001-02-13 ジェイエスアール株式会社 導電性エラストマー用組成物
US5278377A (en) 1991-11-27 1994-01-11 Minnesota Mining And Manufacturing Company Electromagnetic radiation susceptor material employing ferromagnetic amorphous alloy particles
US5366664A (en) 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
JPH07207160A (ja) * 1994-01-11 1995-08-08 Toshiba Silicone Co Ltd シリコーン組成物およびその製造方法
JPH0935927A (ja) 1995-07-20 1997-02-07 Tokin Corp 複合磁性体及びそれを用いた電磁干渉抑制体
EP0919115B1 (de) * 1996-08-18 2003-10-29 Helmut Kahl Leitfähiges dichtungsmaterial und dichtungsprofil
JP3528455B2 (ja) * 1996-09-09 2004-05-17 Ｎｅｃトーキン株式会社 電磁干渉抑制体
JPH10237415A (ja) * 1996-12-25 1998-09-08 Taniyama Bussan Kk 電磁波遮蔽組成物及び電磁波遮蔽板
JP4015722B2 (ja) 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
JPH1126977A (ja) * 1997-07-02 1999-01-29 Daido Steel Co Ltd 電磁波吸収用シート
JPH11116807A (ja) * 1997-10-13 1999-04-27 Suzuki Sogyo Co Ltd 熱伝導性シリコーンゴム組成物及びその成形体
DE19756620A1 (de) * 1997-12-19 1999-06-24 Bosch Gmbh Robert Verfahren zur Herstellung eines Absorbermaterials
JPH11269454A (ja) * 1998-03-19 1999-10-05 Tokin Corp 構造体補修用充填材料
JP3969618B2 (ja) * 1998-03-23 2007-09-05 富士高分子工業株式会社 電磁波吸収性熱伝導性シリコーンゲル成形シートおよびその製造方法
JPH11317591A (ja) * 1998-05-07 1999-11-16 Porimatec Kk 熱伝導性電磁波シールドシート
JP2000013083A (ja) * 1998-06-23 2000-01-14 Daido Steel Co Ltd 高性能電磁波吸収シート
JP3041787B2 (ja) * 1998-08-13 2000-05-15 有限会社テー・エス・ビー 複合材料組成物、同組成物で形成した被膜を有する物品、同組成物で成型した物品
JP2000063670A (ja) * 1998-08-24 2000-02-29 Suzuki Sogyo Co Ltd 熱伝導性シリコーンゴム組成物およびその成形体
JP2000174480A (ja) * 1998-12-01 2000-06-23 Fujikura Rubber Ltd 難燃電磁波遮蔽シート及びその製造方法
JP2000232293A (ja) * 1999-02-12 2000-08-22 Hitachi Metals Ltd 電磁波吸収体
JP2001044687A (ja) * 1999-07-29 2001-02-16 Nitto Denko Corp 電波吸収体及びその製造方法
JP2001068312A (ja) * 1999-08-26 2001-03-16 Fuji Elelctrochem Co Ltd 電波吸収熱伝導シート
JP2001189586A (ja) * 1999-12-28 2001-07-10 Daido Steel Co Ltd 準ミリ−ミリ波帯用電磁波吸収体

Also Published As

Publication number Publication date
DE60103798T2 (de) 2005-07-14
TWI222459B (en) 2004-10-21
EP1146085B1 (de) 2004-06-16
JP2001294752A (ja) 2001-10-23
EP1146085A1 (de) 2001-10-17
JP4623244B2 (ja) 2011-02-02
US20010051673A1 (en) 2001-12-13
US6514428B2 (en) 2003-02-04

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