DE60004464D1 - Thermisch leitfähige Silikonkautschuk-Zusammensetzung - Google Patents

Thermisch leitfähige Silikonkautschuk-Zusammensetzung

Info

Publication number
DE60004464D1
DE60004464D1 DE60004464T DE60004464T DE60004464D1 DE 60004464 D1 DE60004464 D1 DE 60004464D1 DE 60004464 T DE60004464 T DE 60004464T DE 60004464 T DE60004464 T DE 60004464T DE 60004464 D1 DE60004464 D1 DE 60004464D1
Authority
DE
Germany
Prior art keywords
rubber composition
thermally conductive
silicone rubber
conductive silicone
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60004464T
Other languages
English (en)
Other versions
DE60004464T2 (de
Inventor
Hiroji Enami
Masayuki Onishi
Tadashi Okawa
Masaaki Atnako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of DE60004464D1 publication Critical patent/DE60004464D1/de
Application granted granted Critical
Publication of DE60004464T2 publication Critical patent/DE60004464T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]
    • Y10T428/2995—Silane, siloxane or silicone coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
DE60004464T 1999-11-15 2000-11-15 Thermisch leitfähige Silikonkautschuk-Zusammensetzung Expired - Fee Related DE60004464T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32408699 1999-11-15
JP32408699A JP4727017B2 (ja) 1999-11-15 1999-11-15 熱伝導性シリコーンゴム組成物

Publications (2)

Publication Number Publication Date
DE60004464D1 true DE60004464D1 (de) 2003-09-18
DE60004464T2 DE60004464T2 (de) 2004-06-09

Family

ID=18162007

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60004464T Expired - Fee Related DE60004464T2 (de) 1999-11-15 2000-11-15 Thermisch leitfähige Silikonkautschuk-Zusammensetzung

Country Status (5)

Country Link
US (1) US6380301B1 (de)
EP (1) EP1101798B1 (de)
JP (1) JP4727017B2 (de)
KR (1) KR20010051681A (de)
DE (1) DE60004464T2 (de)

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KR100858836B1 (ko) * 2001-05-14 2008-09-17 다우 코닝 도레이 캄파니 리미티드 열전도성 실리콘 조성물
TWI242584B (en) * 2001-07-03 2005-11-01 Lord Corp High thermal conductivity spin castable potting compound
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP3999994B2 (ja) * 2002-04-03 2007-10-31 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP4646496B2 (ja) * 2003-02-13 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
TW200427732A (en) * 2003-02-18 2004-12-16 Circle Promotion Science & Eng Polymer-coated metal oxide and the method for producing it
US20060079634A1 (en) * 2003-05-30 2006-04-13 Shin-Etsu Chemical Co., Ltd. RTV heat conductive silicone rubber compositions
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
JP2005042096A (ja) * 2003-07-04 2005-02-17 Fuji Polymer Industries Co Ltd 熱伝導性組成物及びこれを用いたパテ状放熱シートと放熱構造体
EP1501135B1 (de) * 2003-07-22 2011-06-15 Polymatech Co., Ltd. Wärmeleitfähiger Halter
CN1629209B (zh) * 2003-12-17 2010-04-28 北京三辰化工有限公司 非高温真空脱水法电子级单组份脱醇型室温硫化硅橡胶的制备方法
WO2006049792A1 (en) * 2004-10-28 2006-05-11 Dow Corning Corporation Conductive curable compositions
ATE473027T1 (de) * 2004-11-05 2010-07-15 Gambro Lundia Ab Herstellungsverfahren für ein katheter für gefässzugang
JP4590253B2 (ja) 2004-12-16 2010-12-01 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびシリコーン組成物
JP4931350B2 (ja) 2005-01-05 2012-05-16 東レ・ダウコーニング株式会社 複合シリコーンゴム粉末、その製造方法、塗料、および化粧料
JP4828146B2 (ja) 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP2006328164A (ja) 2005-05-25 2006-12-07 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物
JP4530927B2 (ja) * 2005-07-08 2010-08-25 関西電力株式会社 高耐熱フィルムコンデンサ
KR20130140875A (ko) * 2005-09-21 2013-12-24 다우 코닝 코포레이션 오가노보란 아민 착물을 사용하는 주변 조건하의 리소그래피 방법
CN1978582A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 导热膏及使用该导热膏的电子装置
KR100712079B1 (ko) 2006-01-19 2007-05-02 주식회사 케이씨씨 열전도성이 우수한 방열용 실리콘고무 조성물
KR101357514B1 (ko) * 2006-01-26 2014-02-03 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 방열재와 이를 이용한 반도체 장치
WO2007149422A2 (en) * 2006-06-20 2007-12-27 Dow Corning Corporation Curable organosilicon composition
DE102006033236A1 (de) * 2006-07-18 2008-01-24 Wacker Chemie Ag Zusammensetzung auf der Basis von Organosiliciumverbindungen
JP5232153B2 (ja) 2006-09-18 2013-07-10 ダウ コーニング コーポレーション 有機ポリシロキサンを用いて処理された充填剤、色素及び鉱物粉末
JP5388409B2 (ja) * 2006-09-28 2014-01-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
JP5058664B2 (ja) * 2007-04-20 2012-10-24 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性シリコーン組成物及びそれを用いた半導体装置
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
JP2009203373A (ja) * 2008-02-28 2009-09-10 Momentive Performance Materials Inc 熱伝導性シリコーン組成物
JP5507059B2 (ja) * 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP5365572B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
WO2012102852A1 (en) * 2011-01-26 2012-08-02 Dow Corning Corporation High temperature stable thermally conductive materials
JP5699901B2 (ja) * 2011-10-24 2015-04-15 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
CN104011148B (zh) * 2011-12-21 2017-12-15 日挥触媒化成株式会社 低聚物修饰微粒与其制造方法以及涂料
EP2882821B1 (de) 2012-07-30 2020-06-03 Dow Silicones Corporation Wärmeleitende, durch kondensationsreaktion härtbare polyorganosiloxanzusammensetzung und verfahren zur herstellung und verwendung der zusammensetzung
EP2832439A1 (de) * 2013-08-01 2015-02-04 Uhde Fertilizer Technology B.V. Reaktor für die Herstellung von stickstoffhaltigen Düngergranulaten
KR102263350B1 (ko) 2013-08-14 2021-06-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 신규한 오가노폴리실록산, 이를 포함하는 표면 처리제, 이를 포함하는 수지 조성물, 및 이의 겔상물 또는 경화물
US10604658B2 (en) * 2013-08-14 2020-03-31 Dow Toray Co., Ltd. Organic silicon compound, surface treatment agent containing same, resin composition containing same, and gel or cured product of same
JP2017101171A (ja) * 2015-12-03 2017-06-08 信越化学工業株式会社 熱伝導性室温硬化性オルガノポリシロキサン組成物及び部材
US10190031B2 (en) * 2016-06-06 2019-01-29 Jiali Wu Thermally conductive interface composition and use thereof
WO2019021825A1 (ja) * 2017-07-24 2019-01-31 東レ・ダウコーニング株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
US10344194B2 (en) 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
EP3743467B1 (de) 2018-01-23 2021-11-17 Worlée-Chemie GmbH Bindemittelzusammensetzung und verwendung davon
JP6603777B1 (ja) * 2018-10-24 2019-11-06 株式会社アドマテックス 表面処理済金属酸化物粒子材料、その製造方法、及び電子材料用樹脂組成物、並びにシリコーン樹脂材料用のフィラー
CN110951448B (zh) * 2019-10-23 2022-05-17 新纶光电材料(深圳)有限公司 一种双组份加成型有机硅导热胶及其制备方法
JPWO2021206064A1 (de) * 2020-04-06 2021-10-14
JP2023044473A (ja) 2021-09-17 2023-03-30 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱伝導性シリコーン組成物
JP7368656B2 (ja) * 2021-09-30 2023-10-24 旭化成ワッカーシリコーン株式会社 熱伝導性シリコーン組成物および該組成物を使用するギャップフィラーの製造方法
JP2023062628A (ja) 2021-10-21 2023-05-08 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱伝導性シリコーン組成物

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Also Published As

Publication number Publication date
KR20010051681A (ko) 2001-06-25
EP1101798A2 (de) 2001-05-23
DE60004464T2 (de) 2004-06-09
JP2001139815A (ja) 2001-05-22
US6380301B1 (en) 2002-04-30
EP1101798A3 (de) 2001-07-11
EP1101798B1 (de) 2003-08-13
JP4727017B2 (ja) 2011-07-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee