DE69622641D1 - Wärmeleitende Siliconkautschukzusammensetzung - Google Patents

Wärmeleitende Siliconkautschukzusammensetzung

Info

Publication number
DE69622641D1
DE69622641D1 DE69622641T DE69622641T DE69622641D1 DE 69622641 D1 DE69622641 D1 DE 69622641D1 DE 69622641 T DE69622641 T DE 69622641T DE 69622641 T DE69622641 T DE 69622641T DE 69622641 D1 DE69622641 D1 DE 69622641D1
Authority
DE
Germany
Prior art keywords
rubber composition
thermally conductive
silicone rubber
conductive silicone
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69622641T
Other languages
English (en)
Other versions
DE69622641T2 (de
Inventor
Katsutoshi Mine
Kimio Yamakawa
Noriyasu Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of DE69622641D1 publication Critical patent/DE69622641D1/de
Application granted granted Critical
Publication of DE69622641T2 publication Critical patent/DE69622641T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69622641T 1995-05-29 1996-05-24 Wärmeleitende Siliconkautschukzusammensetzung Expired - Lifetime DE69622641T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15388695A JP3576639B2 (ja) 1995-05-29 1995-05-29 熱伝導性シリコーンゴム組成物

Publications (2)

Publication Number Publication Date
DE69622641D1 true DE69622641D1 (de) 2002-09-05
DE69622641T2 DE69622641T2 (de) 2003-04-24

Family

ID=15572271

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622641T Expired - Lifetime DE69622641T2 (de) 1995-05-29 1996-05-24 Wärmeleitende Siliconkautschukzusammensetzung

Country Status (5)

Country Link
US (1) US6025435A (de)
EP (1) EP0745643B1 (de)
JP (1) JP3576639B2 (de)
KR (1) KR100405841B1 (de)
DE (1) DE69622641T2 (de)

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JP4727017B2 (ja) * 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
KR100361216B1 (ko) * 1999-12-24 2002-11-23 주식회사 해룡실리콘 자기 밀착성이 우수한 부가 반응형 저경도 열전도 실리콘고무 조성물 및 그 제조 방법
JP4646357B2 (ja) * 2000-06-08 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4435952B2 (ja) * 2000-08-30 2010-03-24 東レ・ダウコーニング株式会社 定着ロール用熱伝導性液状シリコーンゴム組成物およびフッ素樹脂被覆定着ロール
JP4885351B2 (ja) * 2000-11-10 2012-02-29 東レ・ダウコーニング株式会社 有機樹脂用添加剤および有機樹脂組成物
US6448329B1 (en) 2001-02-28 2002-09-10 Dow Corning Corporation Silicone composition and thermally conductive cured silicone product
JP4875251B2 (ja) * 2001-04-26 2012-02-15 東レ・ダウコーニング株式会社 シリコーンゲル組成物
WO2002092693A1 (fr) * 2001-05-14 2002-11-21 Dow Corning Toray Silicone Co., Ltd. Composition de silicone thermoconductrice
JP3781105B2 (ja) * 2001-07-12 2006-05-31 信越化学工業株式会社 シリコーン組成物及びこれを用いた剥離フィルム
JP3807995B2 (ja) * 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP4676671B2 (ja) * 2002-11-21 2011-04-27 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー組成物
JP4646496B2 (ja) 2003-02-13 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
DE112004001779B4 (de) * 2003-09-29 2021-03-25 Momentive Performance Materials Japan Llc Wärmeleitfähige Siliconzusammensetzung
CN1616523B (zh) * 2003-09-29 2010-12-08 三洋电机株式会社 有机金属聚合物材料及其制造方法
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP2006003676A (ja) * 2004-06-18 2006-01-05 Lintec Corp 表示画面用機能フィルム及びその製造法
JP5000085B2 (ja) * 2004-08-10 2012-08-15 信越化学工業株式会社 定着ベルト用熱硬化型液状シリコーンゴム組成物及び定着ベルト
US7457507B2 (en) * 2004-12-01 2008-11-25 Sanyo Electric Co., Ltd. Organometallic polymer material
JP4828146B2 (ja) 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
US20060228542A1 (en) * 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
US20060264566A1 (en) * 2005-05-19 2006-11-23 Wacker Chemical Corporation HCR room temperature curable rubber composition
TW200720359A (en) * 2005-11-17 2007-06-01 Dow Corning Toray Co Ltd Method of controlling oil-absorbing properties of a silicone rubber powder
CN1978582A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 导热膏及使用该导热膏的电子装置
JP4933094B2 (ja) * 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
KR100712079B1 (ko) * 2006-01-19 2007-05-02 주식회사 케이씨씨 열전도성이 우수한 방열용 실리콘고무 조성물
PL2053161T3 (pl) * 2006-08-14 2012-10-31 Dow Corning Toray Co Ltd Kompozycja kauczuku silikonowego do powlekania materiału włókienniczego i powlekany materiał włókienniczy
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
JP2008150439A (ja) * 2006-12-14 2008-07-03 Momentive Performance Materials Japan Kk 熱伝導性シリコーン組成物及びそれを用いた塗布装置
US20090143522A1 (en) * 2007-12-04 2009-06-04 Sea-Fue Wang Thermally Conductive Silicone Composition
JP5345340B2 (ja) * 2008-05-16 2013-11-20 新日鉄住金マテリアルズ株式会社 アルミナ配合粒子および樹脂成形体
JP5283553B2 (ja) * 2009-04-09 2013-09-04 株式会社デンソー 熱伝導性シリコーングリース組成物
JP2012102301A (ja) * 2010-11-13 2012-05-31 Nitto Denko Corp 気泡含有熱伝導性樹脂組成物層およびその製造方法、それを用いた感圧性接着テープ又はシート
CN102408869B (zh) * 2011-08-04 2013-07-24 绵阳惠利电子材料有限公司 无卤阻燃电子电器用加成型有机硅灌封胶
EP3299419B1 (de) * 2015-05-22 2021-07-07 Momentive Performance Materials Japan LLC Wärmeleitfähige zusammensetzung
JP6654593B2 (ja) * 2017-03-15 2020-02-26 信越化学工業株式会社 ダイボンディング用シリコーン樹脂組成物及び硬化物
KR101864534B1 (ko) 2017-03-31 2018-06-04 주식회사 케이씨씨 방열 겔형 실리콘 고무 조성물
EP3737727B1 (de) * 2018-01-11 2022-03-09 Dow Silicones Corporation Verfahren zum aufbringen einer wärmeleitenden zusammensetzung auf elektronische bauteile
EP3796342B1 (de) 2019-09-18 2023-11-01 Premo, S.A. Leistungstransformatoranordnung und wärmeleitende verbindung zum abdichten einer leistungstransformatoranordnung
CN116368195A (zh) * 2020-09-23 2023-06-30 陶氏环球技术有限责任公司 具有低分配粘度、分配后具有低竖向流动且固化后具有低热阻抗的热界面材料
CN116102890A (zh) * 2023-02-09 2023-05-12 广州回天新材料有限公司 一种有机硅橡胶组合物及其制备方法

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Also Published As

Publication number Publication date
EP0745643A3 (de) 1997-07-02
KR100405841B1 (ko) 2004-05-17
EP0745643A2 (de) 1996-12-04
KR960041281A (ko) 1996-12-19
DE69622641T2 (de) 2003-04-24
US6025435A (en) 2000-02-15
EP0745643B1 (de) 2002-07-31
JPH08325457A (ja) 1996-12-10
JP3576639B2 (ja) 2004-10-13

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Legal Events

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