DE69630082D1 - Siliconkautschukzusammensetzung - Google Patents

Siliconkautschukzusammensetzung

Info

Publication number
DE69630082D1
DE69630082D1 DE69630082T DE69630082T DE69630082D1 DE 69630082 D1 DE69630082 D1 DE 69630082D1 DE 69630082 T DE69630082 T DE 69630082T DE 69630082 T DE69630082 T DE 69630082T DE 69630082 D1 DE69630082 D1 DE 69630082D1
Authority
DE
Germany
Prior art keywords
rubber composition
silicone rubber
silicone
composition
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69630082T
Other languages
English (en)
Other versions
DE69630082T2 (de
Inventor
Akito Nakamura
Yoshito Ushio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Application granted granted Critical
Publication of DE69630082D1 publication Critical patent/DE69630082D1/de
Publication of DE69630082T2 publication Critical patent/DE69630082T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69630082T 1995-06-21 1996-06-18 Siliconkautschukzusammensetzung Expired - Fee Related DE69630082T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17819695A JP3574227B2 (ja) 1995-06-21 1995-06-21 シリコーンゴム組成物
JP17819695 1995-06-21

Publications (2)

Publication Number Publication Date
DE69630082D1 true DE69630082D1 (de) 2003-10-30
DE69630082T2 DE69630082T2 (de) 2004-06-09

Family

ID=16044270

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69630082T Expired - Fee Related DE69630082T2 (de) 1995-06-21 1996-06-18 Siliconkautschukzusammensetzung

Country Status (4)

Country Link
US (1) US5908897A (de)
EP (1) EP0750017B1 (de)
JP (1) JP3574227B2 (de)
DE (1) DE69630082T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407852B2 (ja) * 1997-06-26 2003-05-19 信越化学工業株式会社 フッ素樹脂系表面層を有する定着ロール用液状付加硬化型シリコーンゴム組成物
US6245875B1 (en) 1999-06-08 2001-06-12 General Electric Company High durometer low structuring heat curable silicone elastomer
US7005460B2 (en) * 2001-01-25 2006-02-28 Kettenbach Gmbh & Co. Kg Two-step curable mixer-suitable materials
US7431892B2 (en) * 2001-09-25 2008-10-07 Piezo Top Ltd. Apparatus for sterilizing a liquid with focused acoustic standing waves
US20030171487A1 (en) * 2002-03-11 2003-09-11 Tyco Electronics Corporation Curable silicone gum thermal interface material
JP4568472B2 (ja) * 2002-11-29 2010-10-27 東レ・ダウコーニング株式会社 銀粉末の製造方法および硬化性シリコーン組成物
US7018776B2 (en) * 2002-12-12 2006-03-28 Arch Specialty Chemicals, Inc. Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems
JP4520159B2 (ja) * 2004-01-07 2010-08-04 信越化学工業株式会社 シリコーンゴム組成物
KR20050098035A (ko) * 2004-04-06 2005-10-11 주식회사 상진미크론 탄소나노튜브를 포함하는 열전도성 실리콘 고무 조성물
JP5845118B2 (ja) * 2012-03-14 2016-01-20 Ntn株式会社 等速自在継手用ブーツ
DE202013012759U1 (de) 2013-01-30 2019-04-23 Jenoptik Industrial Metrology Germany Gmbh Tastkörper-Halteanordnung
US10261430B2 (en) * 2016-01-14 2019-04-16 Samsung Electronics Co., Ltd. Photoreceptor for electrophotography and image forming apparatus employing the same
WO2017217510A1 (ja) * 2016-06-15 2017-12-21 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性ポリオルガノシロキサン組成物及びその使用
DE102018103420A1 (de) 2018-02-15 2019-08-22 Jenoptik Industrial Metrology Germany Gmbh Messgerät zur Oberflächen- oder Konturmessung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952671B2 (ja) * 1976-09-27 1984-12-20 ト−レ・シリコ−ン株式会社 加熱加硫型シリコ−ンゴム組成物
JPS5641252A (en) * 1979-09-11 1981-04-17 Toshiba Silicone Co Ltd Heat-curable silicone rubber composition
JPS62197454A (ja) * 1986-02-25 1987-09-01 Toray Silicone Co Ltd 加熱加硫型オルガノポリシロキサン組成物
JPS63130663A (ja) * 1986-11-20 1988-06-02 Shin Etsu Chem Co Ltd シリコ−ンゴム組成物
JPS6448859A (en) * 1987-08-19 1989-02-23 Shinetsu Chemical Co Silicone composition for impregnation of electronic component
JPH0684475B2 (ja) * 1988-11-02 1994-10-26 信越化学工業株式会社 シリコーンゴム組成物
JPH04300962A (ja) * 1991-03-29 1992-10-23 Toshiba Silicone Co Ltd 加熱加硫型シリコーンゴム組成物

Also Published As

Publication number Publication date
JPH093329A (ja) 1997-01-07
US5908897A (en) 1999-06-01
EP0750017A2 (de) 1996-12-27
DE69630082T2 (de) 2004-06-09
JP3574227B2 (ja) 2004-10-06
EP0750017B1 (de) 2003-09-24
EP0750017A3 (de) 1997-08-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee