WO2002092693A1 - Composition de silicone thermoconductrice - Google Patents

Composition de silicone thermoconductrice Download PDF

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Publication number
WO2002092693A1
WO2002092693A1 PCT/JP2002/004642 JP0204642W WO02092693A1 WO 2002092693 A1 WO2002092693 A1 WO 2002092693A1 JP 0204642 W JP0204642 W JP 0204642W WO 02092693 A1 WO02092693 A1 WO 02092693A1
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Prior art keywords
group
sio
conductive silicone
thermally conductive
weight
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PCT/JP2002/004642
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English (en)
Japanese (ja)
Inventor
Hiroshi Fukui
Manabu Sutoh
Hiroji Enami
Masayuki Onishi
Tadashi Okawa
Satoshi Onodera
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Dow Corning Toray Silicone Co., Ltd.
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Application filed by Dow Corning Toray Silicone Co., Ltd. filed Critical Dow Corning Toray Silicone Co., Ltd.
Priority to EP02769587A priority Critical patent/EP1403326B1/fr
Priority to DE60230142T priority patent/DE60230142D1/de
Priority to JP2002589569A priority patent/JP4255287B2/ja
Priority to KR1020037014852A priority patent/KR100858836B1/ko
Priority to US10/476,998 priority patent/US7329706B2/en
Publication of WO2002092693A1 publication Critical patent/WO2002092693A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Definitions

  • the present invention relates to a thermally conductive silicone composition, and more particularly, to a thermally conductive silicone composition having a good thermal conductivity even if it contains a large amount of a thermally conductive filler in order to obtain a highly thermally conductive silicone composition. And a functional silicone composition.
  • thermally conductive silicone composition a thermally conductive silicone grease, a thermally conductive silicone gel yarn composition, and a thermally conductive silicone rubber composition are known.
  • thermally conductive silicone composition examples include, for example, an adhesive agent selected from the group consisting of an organopolysiloxane having a beer group, an organohydrogenpolysiloxane, a thermally conductive filler, an aminosilane, an epoxysilane and an alkyl titanate.
  • Conductive silicone composition comprising an agent and a platinum-based catalyst (see Japanese Patent Application Laid-Open No.
  • an organopolysiloxane having an average of two alkenyl groups per molecule Heat consisting of organopolysiloxane containing an average of 3 or more silicon-bonded hydrogen atoms in one molecule, heat conductive filler consisting of zinc oxide and magnesium oxide, filler treating agent, and platinum-based catalyst
  • the conductive silicone composition contains at least 0.1 mol% of alkenyl groups in one molecule.
  • a thermally conductive silicone composition comprising spherical or non-spherical alumina powder having a particle diameter of less than 0 ⁇ m and platinum or a platinum-based compound (see Japanese Patent Application Laid-Open No.
  • Heat-conductive silicone composition comprising a polysiloxane, a heat-conductive filler having an average particle size of 5 to 20 ⁇ m, an adhesion aid, and platinum and a platinum-based compound (JP-A-2-97755) No. 9) has been proposed.
  • thermally conductive silicone fiber examples include, for example, an organopolysiloxane containing at least two silicon-bonded alkenyl groups in one molecule, and at least two silicon-bonded hydrogen atoms in one molecule.
  • Organohydrogenpolysiloxane organosiloxane containing at least one silicon-bonded alkoxy group or silicon-bonded hydroxyl group in one molecule, spherical or non-organic having an average particle diameter of less than 10 ⁇ m
  • raw silicone composition comprising a spherical alumina fine powder, a spherical or non-spherical alumina fine powder having an average particle diameter of 10 to 50 ⁇ , and a catalyst for a hydrosilylation reaction (Japanese Unexamined Patent Publication No. Select from liquid silicone, zinc oxide, alumina, aluminum nitride, boron nitride, and silicon carbide powder.
  • a thermally conductive silicone composition comprising at least one thickener, an organopolysiloxane having at least one hydroxyl group directly bonded to a silicon atom in one molecule, and an alkoxysilane (Japanese Patent Laid-Open No. 958 publication) has been proposed.
  • the organosiloxane containing at least one silicon atom-bonded hydroxyl group in one molecule is a diorganosiloxane having silanol groups at both ends of the molecular chain.
  • a diorganosiloxane improves the thermal conductivity of a cured silicone product obtained by curing the same. Therefore, when the content of the thermally conductive filler in this composition is increased, there is a problem that the handleability and moldability of the obtained silicone composition are deteriorated.
  • JP-A-2000-256558 and JP-A-2001-139815 disclose a formula:
  • an object of the present invention is to provide a thermally conductive silicone composition having good handling workability even if a large amount of a thermally conductive filler is contained in order to obtain a highly thermally conductive silicone composition. It is in. Disclosure of the invention
  • the thermally conductive silicone composition of the present invention comprises (A) an organopolysiloxane, (B) a thermally conductive filler, and (C) (i) a general formula:
  • R 1 is a monovalent hydrocarbon group having an aliphatic unsaturated bond
  • R 2 is a monovalent hydrocarbon group having no same or different aliphatic unsaturated bond
  • R 3 is an alkyl group.
  • an organosiloxane having one silicon atom-bonded hydroxyl group in one molecule and having at least 5 silicon atoms
  • R 4 is the same or different monovalent hydrocarbon group
  • R 5 is an oxygen atom or a divalent hydrocarbon group
  • R 3 is the same as above
  • p is 100 to 20 Is an integer of 0, and d is the same as described above.
  • the composition is characterized by comprising at least the above components (A), (B) and (C). Further, the present composition may be further blended with (D) a curing agent to form a curable composition.
  • the curing mechanism of the present composition is not limited, and examples thereof include a hydrosilylation reaction, a condensation reaction, and a free radical reaction due to an organic peroxide, which are rapidly cured and do not generate by-products. And a hydrosilylation reaction.
  • the organopolysiloxane of the component (A) is the main component of the composition.
  • the group bonded to the silicon atom in the organopolysiloxane include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a noninole group, Decyl, decyl, dodecyl, tridecyl, tetra Linear alkyl groups such as decyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, eicosyl group; isopropyl group, tertiary butyl group, isobutyl group, 2-methylpentadecyl group, and 11-hexyl
  • a branched alkyl group such as a cycloalkyl group; a cyclic alkyl group such as a cyclopentyl group, a cyclohexyl group, or a cyclododecyl group; a alkenyl group such as a butyl group, an aryl group, a butenyl group, a pentenyl group, or a hexenyl group; Aralkyl groups such as benzyl group, phenethyl group and 2- (2,4,6-trimethylphenyl) propyl group; 3,3,3- Halogenated alkyl groups such as a trifluoropropyl group and a 3-chloropropyl group are preferred, and an alkyl group, Group, a Ariru group, particularly preferably a methyl group, Bulle group, a phenyl group.
  • the viscosity of the organopolysiloxane at 25 ° C. is not limited, but is preferably in the range of 20 to 100,000 OmPa's. It is preferably in the range of 0,000 O mPa's, more preferably in the range of 50 to 50,000 O mPa's, and in particular, in the range of 100 to 50,0 It is preferably within the range of 0 O mPa's. This is because if the viscosity at 25 ° C is less than the lower limit of the above range, the physical properties of the obtained silicone composition tend to be significantly reduced. This is because the handling efficiency of the obtained silicone composition tends to be significantly reduced.
  • the molecular structure of such an organopolysiloxane is not limited, and may be, for example, linear, branched, or partially branched.
  • examples of the organopolysiloxane include linear and dendritic (dendrimer), and preferably linear or partially branched linear.
  • Such organopolysiloxanes include, for example, dimethylvinylsiloxane at both ends of the molecular chain, dimethylpolysiloxane at the both ends of the molecular chain, dimethylpolysiloxane at the both ends of the molecular chain, and dimethylvinylsiloxane at both ends of the molecular chain.
  • the component (A) is preferably an organopolysiloxane having on average 0.1 or more silicon atom-bonded alkenyl groups in the molecule.
  • an organopolysiloxane having an average of 0.5 or more silicon atom-bonded alkenyl groups in one molecule is preferable, and in particular, an average of 0.8 or more silicon atom-bonded alkenyl groups in one molecule is preferable.
  • Examples of the silicon atom-bonded alkyl group in the reganopolysiloxane include the same alkenyl groups as described above, and preferably a butyl group.
  • Examples of the group bonded to a silicon atom other than the alkenyl group in this organopolysiloxane include the same linear alkyl group, branched alkyl group, cyclic alkyl group, aryl group, aralkyl group as described above.
  • the viscosity of the organopolysiloxane at 25 ° C. is not limited, but is preferably in the range of 20 to 100,000 OmPa's, and more preferably 50 to 100,000. It is preferably in the range of 100 mPa's, more preferably in the range of 50 to 50,000 mPa's, and particularly preferably in the range of 100 to 50,000 OmPa's. It is preferably within the range of mPa's.
  • the molecular structure of such an organopolysiloxane is not limited, and the same structure as described above is exemplified. Preferably, the structure is linear or partially branched linear. Examples of such an organopolysiloxane include a single polymer having these molecular structures, a copolymer having these molecular structures, or a mixture of these polymers. Examples of such an organopolysiloxane include the same alkenyl group-containing organopolysiloxanes as described above.
  • the component (A) is an organopolysiloxane having at least two silano mono groups or a silicon atom-bonded hydrolyzable group in one molecule.
  • the silicon atom-bonded hydrolyzable group in the organopolysiloxane include an alkoxy group such as a methoxy group, an ethoxy group and a propoxy group; a vinyloxy group, a propoxy group, an isopropoxy group, and the like.
  • Alkenyl groups such as ethethyl 1-2-methylvinyloxy group; alkoxyalkoxy groups such as methoxetoxy group, ethoxytoxy group and methoxypropoxy group; acyloxy groups such as acetoxy group and octanoyloxy group; dimethylketoxime N, methylamino, acetylamino, dimethylamino, dimethylamino, butylamino, etc .; aminoxy, such as dimethylamino, dimethylamino, etc .; N-methyl / acetoamide And amide groups such as N-ethylacetoamide group.
  • a group bonded to a silicon atom other than a silanol group and a silicon atom-bonded hydrolyzable group in the organopolysiloxane includes Examples thereof include the same linear alkyl group, branched alkyl group, cyclic alkyl group, alkyl group, aryl group, aralkyl group, and halogenated alkyl group as described above.
  • the viscosity of the organopolysiloxane at 25 ° C. is not limited, but is preferably in the range of 20 to 100,000 OmPa's, and more preferably 50 to 100,000. It is preferably in the range of 100 O mPa's, and particularly preferably in the range of 100 to 100,000 O mPa's.
  • the molecular structure of such an organopolysiloxane is not limited, and the same structures as described above are exemplified. Preferably, it is a linear or partially branched linear. Examples of such an organopolysiloxane include the same organopolysiloxanes having at least two silanol groups or silicon atom-bonded hydrolyzable groups in one molecule as described above.
  • the organopolysiloxane of the component (A) is not limited, but preferably at least one silicon atom per molecule. It is an organopolysiloxane having a linked alkyl group. Examples of the group bonded to the silicon atom in the organopolysiloxane include a linear alkyl group, a branched alkyl group, a cyclic alkyl group, an alkyl group, an aryl group, and an aralkyl group as described above.
  • a halogenated alkyl group are preferably an alkyl group, an alkyl group, or an aryl group, and particularly preferably a methyl group, a vinyl group, or a phenyl group.
  • the viscosity of the organopolysiloxane at 25 ° C. is not limited, but is preferably in the range of 20 to 100,000 OmPa's, and more preferably 50 to 100,000. It is preferably within the range of 0 O mPa's, more preferably within the range of 50 to 50,000 O mPa's, and particularly preferably within the range of 100 to 50,000 O. It is preferably within the range of mPa's.
  • the molecular structure of such an organopolysiloxane is not limited, and the same structure as described above is exemplified. Preferably, it is linear or partially branched linear. Examples of such an organopolysiloxane include a single polymer having these molecular structures, a copolymer having these molecular structures, or a mixture of these polymers. Examples of such an organopolysiloxane include the same organopolysiloxanes as described above.
  • the heat conductive filler of the component (B) is a component for imparting heat conductivity to the obtained silicone composition.
  • metal powders such as aluminum powder, copper powder, and nickel powder; alumina powder.
  • Metal oxide-based powders such as magnesium oxide powder, beryllium oxide powder, beryllium oxide powder, silicon oxide powder, and titanium oxide powder; metal nitride-based powders such as boron nitride powder and aluminum nitride powder; boron carbide powder; Metal carbide powders such as titanium powder and silicon carbide powder; Fe_Si alloy, Fe-A1 alloy, Fe-Si-A1 alloy, Fe-Si-Cr alloy, Fe-Ni alloy, Fe-Ni-Co alloy, Fe- Soft magnetic alloy powders such as Ni-Mo alloy, Fe-Co alloy, Fe-Si-Al-Cr alloy, Fe_Si-B alloy, Fe-Si-Co-B alloy; Mn-Zn ferrite, Mn-Mg-Zn Ferrite, M
  • the component (B) may be a metal oxide-based powder, a metal nitride-based powder, or a metal carbide. It is preferably a system powder, and particularly preferably an alumina powder.
  • the average particle size of the component (B) is not limited, but is preferably in the range of 0.1 to 100 ⁇ m, and particularly preferably in the range of 0.1 to 50 ⁇ . .
  • the thermally conductive filler of the component ( ⁇ ) spherical alumina having an average particle size of 5 to 50 m (but not including 5 ⁇ ).
  • the mixture is a mixture of the powder and (B 2 ) a spherical or irregularly shaped alumina powder having an average particle size of 0.1 to 5 m. 0-9 0 is in the weight percent range, the content of said (B 2) component is preferably in the range of 1 0-7 0 wt% "
  • the content of the component (B) is not limited. However, in order to form a silicone composition having good thermal conductivity, the volume% must be at least 30% by volume in the present composition.
  • the content of the component (B) should be at least 50% by weight in the present yarn. Preferably, it is more preferably in the range of 70 to 98% by weight, and particularly preferably in the range of 90 to 97% by weight. Specifically, the content of the component (B) is preferably in the range of 500 to 2,500 parts by weight based on 100 parts by weight of the component (A), and more preferably 500 to 2,000 parts by weight.
  • Parts by weight and particularly preferably in the range of 800 to 2,000 parts by weight. This is because if the content of the component (B) is less than the lower limit of the above range, the thermal conductivity of the obtained silicone composition tends to be insufficient. The viscosity of the obtained silicone composition becomes too high, so that the component (B) cannot be uniformly dispersed in the obtained silicone composition, or the handling workability thereof tends to be significantly reduced. is there.
  • the component (C) is a heat conductive silicone composition that has good workability even if it contains a large amount of the heat conductive filler of the above component (B) in order to obtain a silicone composition having high heat conductivity.
  • R 1 is a monovalent hydrocarbon group having an aliphatic unsaturated bond
  • R 2 is a monovalent hydrocarbon group having no same or different aliphatic unsaturated bond
  • R 3 is an alkyl group.
  • m is an integer of 0 or more, n is an integer of 0 or more, provided that when a is 0, And m is an integer of 1 or more.
  • An organosiloxane having at least 5 silicon atoms, (iii) a general formula:
  • R 4 is the same or different monovalent hydrocarbon group
  • R 5 is an oxygen atom or a divalent hydrocarbon group
  • R 3 is the same as described above
  • p is an integer of 100 to 200.
  • d is the same as above.
  • organosiloxane selected from the group consisting of organosiloxanes represented by
  • This component (i) does not impair the handleability and moldability of the composition even if it contains a large amount of the thermally conductive filler of component (B) in order to obtain a silicone composition having high thermal conductivity.
  • the composition has curability, it is a component for imparting good adhesiveness to a substrate that is in contact with the composition during curing.
  • R 1 is a monovalent hydrocarbon group having an aliphatic unsaturated bond, for example, a vinyl group, an aryl group, a butenyl group, a hexyl group, a decenyl group, a pendecenyl group, a dodecenyl group, Linear alkenyl groups such as tridecyl group, tetradecenyl group, pentadecenyl group, hexadecenyl group, heptadecenyl group, octadeceyl group, nonadecenyl group, eicosenyl group; isopropenyl group, 2-methyl-2-propane- Branched alkenyl groups such as 2-methyl-10-denylenyl group; cyclic alkynole groups having an aliphatic unsaturated bond such as vinylcyclohexyl group and butylcyclododecy
  • An aryl having an unsaturated unsaturated bond such as a bulbenzyl group or a bulpentyl group;
  • the alkyl group is preferably a linear alkyl group, and particularly preferably a vinyl group, an aryl group, or a hexeninol group.
  • the position of the aliphatic unsaturated bond in R 1 is not limited, but is preferably a position farther from the silicon atom to be bonded.
  • R 2 in the above formula is the same or different monovalent hydrocarbon group having no aliphatic unsaturated bond, and is the same as the above-mentioned linear alkyl group, branched alkyl group, and cyclic alkyl group.
  • R 3 in the above formula is an alkyl group, an alkoxyalkyl group, an alkyl group, or an acyl group.
  • the alkyl group for R 3 includes, for example, the same straight-chain alkyl group, branched-chain alkyl group, and cyclic alkyl group as described above, and is preferably a straight-chain alkyl group, and particularly preferably.
  • alkoxyalkyl group for R 3 include a methoxyethoxy group, an ethoxyethoxy group, and a methoxypropoxy group, and a methoxyethoxy group is preferable.
  • alkenyl group for R 3 include the same alkenyl groups as described above, and are preferably isopropenyl groups.
  • Examples of the acyl group for R 3 include an acetoxyl group.
  • a in the above formula is an integer of 0 to 3, and is preferably 1.
  • b in the above formula is 1 or 2, and preferably 1.
  • c in the above formula is an integer of 1 to 3, and is preferably 1.
  • d in the above formula is an integer of 1 to 3, and is preferably 3.
  • c + d in the above equation is an integer of 2 to 4.
  • 'm in the above formula is an integer of 0 or more.
  • m in the above formula is an integer of 1 or more.
  • Such m is preferably an integer of 0 to 100, more preferably an integer of 1 to 100, further preferably an integer of 1 to 50, and 1 It is preferably an integer of from 25 to 25, and particularly preferably an integer of from 1 to 10.
  • n in the above formula is an integer of 0 or more.
  • Such n is preferably an integer of 0 to 100, more preferably an integer of 1 to 100, further preferably an integer of 5 to 100, and furthermore, , Preferably an integer of 10 to 100, particularly an integer of 10 to 75 Is preferred.
  • organosiloxane having a silanol group at one end of the molecular chain and represented by the general formula: R 2 ( 4.f) S i (OR 3 ) f
  • a silane compound represented by the following formula in the presence of an acid catalyst such as acetic acid in the above silanol-terminated organosiloxane, I 1 and R 2 in the formula are the same groups as described above, and a, b, m, and n in the formula are the same integers as described above.
  • R 2 and R 3 in the formula are the same groups as described above.
  • f in the formula is an integer of 2 to 4, and is preferably 4.
  • Such silane compounds include, for example, dialkoxydialkylsilanes such as dimethoxydimethylsilane, dimethyoxyethylsilyl, ethoxydimethylsilane, and methoxyethoxylsilane; trimethoxymethylsilane, trimethyxylsilane, Trialkoxyalkylsilanes such as trimethoxypropyl silane, triethoxymethylsilane, and triethoxysylsilane; tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane, and tetrapropoxysilane; methyltri (methoxyethoxy) silane Alkoxyalkoxysilanes; alkenoxysilanes such as methyltriisoproponoxysilane; and acyloxysilanes such as methyltriacetoxysilane.
  • the acid catalyst include fatty acids such as
  • organosiloxane as the component (i) examples include the following compounds.
  • Si (OC (ii) component is an organosiloxane having one silicon atom-bonded hydroxyl group per molecule and at least 5 silicon atoms, and has high thermal conductivity.
  • thermally conductive filler (B) Even if a large amount of the thermally conductive filler (B) is contained in order to obtain the above silicone composition, it is a component that imparts the characteristic of the present composition that the handleability is excellent.
  • Component ii) treats the surface of the thermally conductive filler of component (B) with a silicon atom-bonded hydroxyl group in the molecule, lowers the viscosity of the resulting composition, and allows for the blending of more filler. It is considered to function as a treating agent or a plasticizer.
  • the component (ii) needs to have only one silicon atom-bonded hydroxyl group in one molecule, and if the number is two or more, it is necessary to promote the interparticle bonding of the component (B). The viscosity of the resulting composition increases and the filling amount cannot be increased.
  • the component (ii) needs to have at least 5 silicon atoms in one molecule, preferably at least 10, more preferably 10 to 500, and particularly preferably. Is 50-200.
  • organosiloxanes in which the number of silicon atoms in one molecule is less than the lower limit of the above range are too small in molecular size, and the component (B)
  • organosiloxanes exceeding the upper limit of the above range tend to be unable to sufficiently treat the surface of (ii), and the molecular volume bound to the surface of the component (II) is too large, and
  • the organosiloxane of the component (ii) is not limited.
  • the component (ii) is represented by the general formula
  • the organosiloxane is represented by R 4 in the above formula is the same or different monovalent hydrocarbon group, and is the same as the above-mentioned linear alkyl group, branched alkyl group, cyclic alkyl group, aryl group, aralkyl group, alkenyl group, halogen
  • An alkyl group is exemplified, preferably an alkyl group, and particularly preferably a methyl group.
  • r in the above formula is an integer of 5 or more, preferably an integer of 10 to 50 °, and particularly preferably an integer of 50 to 200.
  • the organosiloxane of the component (iii) is an organosiloxane having a silicon atom-bonded hydrolyzable group at one end of the molecular chain, and the repeating unit of diorganosiloxane in the organosiloxane is within a specific range. Therefore, even if a large amount of the thermally conductive filler of the above-mentioned component (B) is contained in order to obtain a highly thermally conductive silicone composition, it is possible to obtain a thermally conductive silicone composition having good handling workability. It is a component having the characteristic that it can be formed.
  • R 4 in the formula is the same or different monovalent hydrocarbon group, and is the same as described above for a linear alkyl group, a branched alkyl group, a cyclic alkyl group, an aryl group, and an aralkyl group. And a halogenated alkyl group and a halogenated alkyl group are preferred. A linear alkyl group is preferred, and a methyl group is particularly preferred.
  • R 5 in the above formula is an oxygen atom or a divalent hydrocarbon group. Examples of the divalent hydrocarbon group for R 5 include an alkylene group such as a methylene group, an ethylene group, a propylene group, an isopropylene group, and a butylene group.
  • R 5 is preferably an oxygen atom.
  • R 3 in the above formula is the same group as described above.
  • P in the above formula is an integer of 100 to 200, preferably an integer of 105 to 200, and more preferably 105 to 200.
  • organosiloxane of the component (iii) examples include, for example,
  • the organosiloxane of the component (iv) deteriorates the handleability of the composition even if a large amount of the thermally conductive filler of the component (B) is contained in order to obtain a silicone composition having high thermal conductivity.
  • the composition has curability, the composition is excellent in moldability and is a component for imparting good adhesion to a substrate that is in contact with the composition during curing.
  • R 2 in the above formula is a monovalent hydrocarbon group having no same or different aliphatic unsaturated bond, and the same groups as described above are exemplified, preferably, an alkyl group and an aryl group, More preferred are alkyl groups having 1 to 4 carbon atoms, and particularly preferred are a methyl group and an ethyl group.
  • R 3 in the above formula is an alkyl group, an alkoxyalkyl group, an alkoxyl group, or an acyl group, examples of which are the same as those described above, preferably an alkyl group, particularly preferably a methyl group, These are ethyl and propyl groups.
  • e in the above formula is an integer of 1 to 3, and is preferably 1.
  • c in the above formula is an integer of 1 to 3, and is preferably 1.
  • d is an integer of 1 to 3, and is preferably 3.
  • c + d in the above equation is an integer of 2 to 4.
  • n in the above formula is an integer of 0 or more, preferably an integer of 0 to 100, more preferably an integer of 1 to 100, further preferably an integer of 5 to 100, more preferably Is an integer of 10 to 100, particularly preferably an integer of 10 to 75.
  • R 2 in the formula is the same or different monovalent hydrocarbon group having no aliphatic unsaturated bond, and the same groups as described above are exemplified.
  • e in the above formula is an integer of 1 to 3, and is preferably 1.
  • n is an integer of 0 or more, preferably an integer of 0 to 100, more preferably an integer of 1 to 100, and still more preferably an integer of 5 to 100. Yes, more preferably an integer of 10 to 100, particularly preferably an integer of 10 to 75.
  • R 2 in the formula is the same or different monovalent hydrocarbon group having no aliphatic unsaturated bond, and the same groups as described above are exemplified.
  • R 3 in the above formula is an alkyl group, an alkoxyalkyl group, an alkoxy group, or an acyl group, and the same groups as described above are exemplified.
  • f in the above formula is an integer of 2 to 4, and is preferably 4.
  • Such silane compounds include, for example, dialkoxydialkylsilanes such as dimethoxydimethylsilane, dimethoxydimethylsilyl, diethoxydimethylsilane, and ethoxyethoxylsilane; trimethoxymethylsilane, trimethoxyethylsilane, Trialkoxyalkylsilanes such as trimethoxypropyl silane, triethoxymethylsilane, and triethoxysylsilane; tetraalkoxysilanes such as tetramethoxysilane, tetraethoxysilane and tetrapropoxysilane; methyltri (methoxyethoxy) silane Alkoxyalkoxysilanes; alkenoxysilanes such as methyltriisoproponoxysilane; and acyloxysilanes such as methyltriacetoxysilane.
  • the acid catalyst include fatty acids such as ace
  • the content of the component (C) is not limited, and may be any amount as long as the surface of the component (B) can be treated to improve the dispersibility in the obtained thermally conductive silicone composition.
  • the amount is preferably in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the component (B), and more preferably, with respect to 100 parts by weight of the component (B). It is preferably in the range of 0.1 to 5 parts by weight. This is because if the content of the component (C) is less than the lower limit of the above range, the moldability of the obtained silicone composition will be reduced or the product will be obtained if the content of the component (B) is large. This is because the component (B) tends to settle and separate during storage of the silicone composition. On the other hand, if it exceeds the upper limit of the above range, the physical properties of the obtained silicone composition tend to decrease. .
  • any one of the above components (i) to (iv) can be used alone or in combination of two or more as the above component (C).
  • the above component (B) is contained in order to obtain a silicone composition having high thermal conductivity, in order to obtain a thermally conductive silicone composition having good workability,
  • R 4 is a monovalent hydrocarbon group
  • R 3 is an alkyl group, an alkoxyalkyl group, an alkenyl group, or an acyl group
  • 'g is an integer of 1 to 3.
  • R 4 is the same or different monovalent hydrocarbon group
  • R 5 is an oxygen atom or a divalent hydrocarbon group
  • R 3 is an alkyl group, an alkoxyalkyl group, an alkenyl group, or an acyl group.
  • y is an integer of 0 to 99
  • d is an integer of 1 to 3.
  • the organosiloxane represented by the formula (1) may be used in combination.
  • R 4 in the formula is a monovalent hydrocarbon group, and the same groups as described above are exemplified.
  • R 3 in the formula is an alkyl group, an alkoxyalkyl group, an alkenyl group, or an acyl group, and the same groups as described above are exemplified.
  • G in the formula is an integer of 1 to 3, and is preferably 2 or 3.
  • Examples of such a silane compound include alkoxysilanes such as methyltrimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, butyltrimethoxysilane, dimethyltrimethoxysilane, ethyltrimethoxysilane, octinoletrimethoxysilane, noeltrimethoxysilane, and the like.
  • Examples include alkoxyalkoxylanes such as silane; alkenoxysilanes such as methyltriisoproponoxysilane; and acyloxysilanes such as methyltriacetoxysilane.
  • R 4 in the formula is the same or different monovalent hydrocarbon group, and the same groups as described above are exemplified.
  • R 5 in the formula is an oxygen atom or a divalent hydrocarbon group, and the same groups as described above are exemplified.
  • R 3 in the formula is an alkyl group, an alkoxyalkyl group, an alkenyl group, or an acyl group, and the same groups as described above are exemplified.
  • y in the formula is an integer of 0 to 99, preferably an integer of 0 to 80, and particularly preferably an integer of 0 to 60.
  • d in the formula is an integer of from:! To 3, and is preferably 3. Examples of such an organosiloxane include, for example,
  • the content of the above-mentioned silane compound or organosiloxane is not limited, and the dispersibility in the heat conductive silicone composition obtained by treating the surface of the component (B) together with the component (C) is obtained. Any amount can be used as long as it can improve, specifically, (B
  • the amount is preferably in the range of 0.001 to 10 parts by weight per 100 parts by weight of the component (B), and in particular, 0.001 to 100 parts by weight of the component (B). It is preferably within the range of 5 to 5 parts by weight. This is because if the content of the silane compound or organosiloxane is less than the lower limit of the above range, when the component (B) is contained in a large amount, the moldability of the obtained silicone thread and component may be reduced, This is because the component (B) tends to settle and separate during storage of the obtained silicone composition, and the consistency tends to decrease significantly. On the other hand, when the content exceeds the upper limit of the above range, the physical properties of the obtained silicone composition are reduced. This is because the characteristic tends to decrease.
  • Examples of the method of adding the component (C) or the component (C) and the silane compound or the organosiloxane to the composition include, for example, the component (B) and the component (C), and A method in which a silane compound or an organosiloxane is mixed and the surface of the component (B) is pre-treated and added; after the components (A) and (B) are mixed, the component (C) is added, if necessary. And a method in which the surface of the component (B) is treated in the component (A) and then added, and the latter method is particularly preferred.
  • the component (C) or the component (C) and the silane compound or the organosiloxane are contained in the surface of the component (B) in a state where the surface of the component (B) is treated. Even if it is simply contained in Good.
  • the treatment may be carried out by heating or using acetic acid, phosphoric acid, An acidic substance or a basic substance such as trialkylamine, quaternary ammonium salts, ammonia gas, or ammonium carbonate may be used in combination.
  • a curable composition can also be added to the yarn composition by further mixing (D) a curing agent.
  • the curing agent of the component (D) comprises an organopolysiloxane having an average of two or more silicon-bonded hydrogen atoms in one molecule and a platinum-based catalyst. It is.
  • the group bonded to the silicon atom bond in the organopolysiloxane include the same linear alkyl group, branched alkyl group, cyclic alkyl group, aryl group, aralkyl group, and halogenated alkyl group as described above.
  • the viscosity of the organopolysiloxane at 25 ° C. is not limited, but is preferably in the range of 1 to 100,000 O mPa ′s, and particularly preferably 1 to 500,000 O mPa ′s. It is preferred that the s is in the range of s.
  • the molecular structure of such an organopolysiloxane is not limited and includes, for example, linear, branched, partially branched linear, cyclic, and dendritic (dendrimer).
  • Such organopolysiloxanes include, for example, homopolymers having these molecular structures, copolymers having these molecular structures, and mixtures thereof.
  • Such organopolysiloxanes include, for example, dimethylpolysiloxane having dimethylhydrogensiloxy groups at both ends of the molecular chain, dimethylsiloxane having trimethylsiloxy groups at both ends of the molecular chain, methylhydrogensiloxane copolymer, and dimethylhydrogen at both ends of the molecular chain.
  • the content of the organopolysiloxane is an amount necessary for curing the present composition.
  • the content of the organopolysiloxane is based on 1 mole of a silicon atom-bonded alkenyl group in the component (A).
  • the amount of silicon-bonded hydrogen atoms in this component is preferably in the range of 0.1 to 10 mol, and more preferably in the range of 0.1 to 5 mol. In particular, the amount is preferably in the range of 0.1 to 3.0 mol.
  • the platinum-based catalyst is a catalyst for accelerating the curing of the present composition.
  • examples thereof include chloroplatinic acid, an alcohol solution of chloroplatinic acid, a platinum olefin complex, a platinum alkenylsiloxane complex, and platinum platinum. And carbonyl complexes.
  • the content of the platinum-based catalyst is an amount necessary for curing the present composition.
  • the amount of platinum metal in the present component is in the range of 0.01 to 1.0 ppm by weight with respect to the component (A). :! Preferably, the amount is within the range of ppm500 ppm. This is because if the content of the component is less than the lower limit of the above range, the obtained silicone composition tends not to be sufficiently hardened, while the amount exceeding the upper limit of the above range is compounded. This is because the curing rate of the obtained silicone composition does not significantly improve.
  • the component (D) is composed of a silane having at least three silicon-bonded hydrolyzable groups in one molecule or a partial hydrolyzate thereof, and And a catalyst for condensation reaction.
  • the silicon atom-bonded hydrolyzable group in this silane include the same alkoxy group, alkoxyalkoxy group, acyloxy group, ketoxime group, alkenoxy group, amino group, aminoxy group, and amide group as described above.
  • the silicon atom of this silane includes, for example, the same linear alkyl group, branched alkyl group, cyclic alkyl group, alkenyl group, aryl group, and aralkyl group as described above.
  • the group may be bonded to a halogenated alkyl group.
  • Such silane or its silane Examples of the partially decomposed hydrolyzate include methyltriethoxysilane, butyltriethoxysilane, butyltriacetoxysilane, and ethyl ortho silicate.
  • the content of the silane or a partial hydrolyzate thereof is an amount necessary for curing the present composition, and specifically, is 0.1% by weight based on 100 parts by weight of the component (A). It is preferably in the range of 0.1 to 20 parts by weight, particularly preferably in the range of 0.1 to 10 parts by weight. This is because if the content of the silane or its partial hydrolyzate is less than the lower limit of the above range, the storage stability of the obtained composition tends to decrease, and the adhesiveness tends to decrease. On the other hand, if the amount exceeds the upper limit of the above range, curing of the obtained composition tends to be extremely slow.
  • the condensation reaction catalyst is an optional component, and is not essential when, for example, a silane having a hydrolyzable group such as an aminoxy group, an amino group or a ketoxime group is used as a curing agent.
  • a silane having a hydrolyzable group such as an aminoxy group, an amino group or a ketoxime group
  • examples of such a catalyst for the condensation reaction include organic titanates such as tetrabutyl titanate and tetraisopropyl titanate; and dioxopropoxybis (acetyl acetate) titanium and diisopropoxybis (ethyl acetate acetate) titanium.
  • Organic titanium chelate compounds organic aluminum compounds such as aluminum tris (acetyl acetoacetate) and aluminum tris (ethyl acetoacetate); dinoreconium tetra (acetyl acetonate); Organic aluminum compounds such as dibutyltin dioctoate, dibutyltin dilaterate, butyltin-2-ethylhexoate, and the like; tin naphthenate, tin oleate, tin butylate, cobalt naphthenate; Steer Metal salts of organic carboxylic acids such as zinc phosphate; amine compounds such as hexylamine and dodecylamine phosphate; and salts thereof; quaternary ammonium salts such as benzyltriethylammonium acetate; potassium acetate and lithium nitrate Lower fatty acid salts of alkali metals; dialkylhydroxylamines such as dimethylhydroxylamine and getylhydroxy
  • the content of the condensation reaction catalyst is an arbitrary amount, and may be an amount necessary for curing the present composition. Specifically, based on 100 parts by weight of the component (A) It is preferably in the range of 0.1 to 20 parts by weight, and particularly preferably in the range of 0.1 to 10 parts by weight. This is because, when the catalyst is essential, if the content of the catalyst is less than the lower limit of the above range, the obtained composition tends to be insufficiently cured. If the upper limit is exceeded, the storage stability of the obtained composition tends to decrease.
  • the component (D) is an organic peroxide.
  • the organic peroxides include benzoyl peroxide, dicumyl peroxide, 2,5-dimethylbis (2,5-t-butylperoxy) hexane, and di-tert-butyl peroxide. , T-butyl parbenzoate.
  • the content of the organic peroxide compound is an amount necessary for curing the present composition.
  • the content of the organic peroxy acid is 100 parts by weight based on 100 parts by weight of the organopolysiloxane (A). It is preferably in the range of 5 to 5 parts by weight.
  • the present composition may include, as long as the purpose of the present invention is not impaired, other optional components such as fillers such as fumed silica, precipitated silica, and fumed silica.
  • Filler whose surface has been hydrophobized with an organic silicon compound; Adhesion-imparting agent such as 3-glycidoxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane; other pigments, dyes, fluorescent dyes, heat-resistant additives, It may contain a flame retardant, such as a lyazole compound, or a plasticizer.
  • the curing speed of the present composition is adjusted and the handling efficiency is improved.
  • Acetylene-based compounds such as 3-butyn-1-onole and 1-ethyninole-1-cyclohexanol; en-yne compounds such as 3-methyl-3-pentene-1-yne and 3,5-dimethyl-3-hexene-1-yne
  • a curing reaction inhibitor such as a hydrazine-based compound, a phosphine-based compound, or a mercaptan-based compound.
  • the content of the curing reaction inhibitor is not limited, but is preferably in the range of 0.001 to: 1.0% by weight based on the composition.
  • the method of curing the composition is not limited. For example, after forming the present composition, leaving it at room temperature, or after forming the present composition, 50 to 200 ° The method of heating to C is mentioned.
  • the properties of the silicone rubber thus obtained are not limited, and examples thereof include a gel, a low-hardness rubber, and a high-hardness rubber.
  • the heat conductive silicone composition of the present invention will be described in more detail with reference to examples.
  • the characteristics in the examples are values at 25 ° C.
  • thermally conductive silicone rubber composition The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured as follows, and the results are shown in Table 1.
  • the 14 consistency of this heat conductive silicone rubber composition was measured according to the method specified in JISK 2220.
  • a high consistency value means that the heat conductive silicone rubber composition has high plasticity and excellent handleability.
  • the thermally conductive silicone rubber composition was sandwiched between 0.2-thick ethylene tetrafluoride resin films so as to have a thickness of 2 orchids, and was heated and cured at 150 ° C. for 15 minutes. Thereafter, the film made of the tetrafluoroethylene resin was peeled off, and it was observed whether a silicone rubber sheet could be formed.
  • Good moldability was obtained when a uniform silicone rubber sheet could be formed: ⁇ , Moldable in a sheet form, and poor moldability when a part where the strength was weak was partially good: ⁇ , Sheet form The case where the molding was not possible or the strength was weak even if the molding was possible was evaluated as poor moldability: X,.
  • the heat conductivity of the heat-conductive silicone rubber obtained by heating and curing the heat-conductive silicone rubber composition at 150 ° C for 15 minutes was measured according to the hot wire method specified in JISR 2616 by Kyoto Electronics Co., Ltd. It was measured by a thermal conductivity meter QTM-500.
  • the thermally conductive silicone rubber composition was sandwiched between adherends of the same kind, and then cured by heating at 150 ° C. for 30 minutes.
  • adherends As the adherend, an aluminum plate (JISH 4000, A1050P), a nickel plate (SPCC-SB), and a stainless steel plate (SUS-3042B) manufactured by Paltec Co., Ltd. were used.
  • the bonding area was 25 mm ⁇ 10 mm, and the thickness of the bonding layer was 1 mm.
  • the tensile shear adhesive strength of this heat conductive silicone rubber was measured according to the provisions of JIS K 6249.
  • 900 parts by weight of alumina powder, and formula (CH 2 CH) (CH 3 ) 2 SiO [(CH 3 ) 2 SiO] 5 .
  • thermoly conductive silicone rubber composition was prepared.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 1, and the results are shown in Table 1.
  • this mixture has a viscosity of 5 mPa's, and has a molecular chain having an average of 5 silicon-bonded hydrogen atoms in one molecule.
  • thermo conductivity 0.5 parts by weight of a 1,3-dibutyl-1,1,3,3-tetramethyldisiloxane complex of platinum having a platinum content of 0.5% by weight is mixed with the mixture to obtain a thermal conductivity.
  • a silicone rubber composition was prepared. The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 1, and the results are shown in Table 1.
  • the mixture was added with a viscosity of 5 raPa's, and dimethylsiloxane / methylhydrogensiloxane having both ends of a molecular chain having an average of 5 silicon-bonded hydrogen atoms in one molecule.
  • a heat-conductive silicone rubber composition was prepared in the same manner as in Comparative Example 1, except that the same amount of decyltrimethoxysilane was used in place of methinoletrimethoxysilane.
  • the properties of the heat conductive silicone rubber composition and the heat conductive silicone rubber were measured in the same manner as in Example 1, and the results are shown in Table 1.
  • thermally conductive silicone rubber composition was prepared in the same manner as in Comparative Example 1, except that the same amount of the organosiloxane represented by the following formula was used.
  • the properties of the thermally conductive silicone rubber composition were measured in the same manner as in Example 1, and the results are shown in Table 1.
  • silicone rubber base 1 platinum platinum content of 0.5 weight 0/0, 3 Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by weight were uniformly mixed heat
  • a conductive silicone rubber composition was prepared.
  • thermally conductive silicone rubber composition The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured as follows, and the results are shown in Table 2.
  • This thermally conductive silicone rubber composition was sandwiched between a 50 ⁇ -thick polyethylene terephthalate resin film (PET film) to a thickness of 1 mm and cured by heating at 100 ° C. for 30 minutes. Then, the PET film was peeled off, and it was observed whether or not the silicone rubber sheet could be molded. If the uniform silicone rubber sheet could be molded, the moldability was good: 1, although it could be molded into a sheet, it was partially molded Poor moldability was evaluated when there was a part where the strength was weak, and poor moldability was evaluated as poor when the sheet could not be formed into a sheet, or when the strength was weak even if it could be partially formed.
  • PET film polyethylene terephthalate resin film
  • the heat-conductive silicone rubber composition was cured by heating at 100 ° C. for 30 minutes, and the heat conductivity of the obtained heat-conductive silicone rubber was measured according to the hot wire method specified in JISR 2616 by a rapid heat It was measured with a conductivity meter Q TM-500.
  • This heat conductive silicone rubber composition was cured by heating at 100 ° C for 30 minutes.
  • the hardness of the obtained thermally conductive silicone rubber was measured with a type E durometer specified in JISK625.
  • Example 5 instead of the dimethylsiloxane having a silanol group at one end of the molecular chain, the formula:
  • a thermally conductive silicone rubber base was prepared in the same manner as in Example 5 except that the same amount of dimethylsiloxane having a silanol group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this heat conductive silicone rubber base was measured in the same manner as in Example 5, and the results are shown in Table 2.
  • the silicone rubber base platinum content 0.5 wt 0/0 1 platinum is, 3-divinyl _ 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by weight of uniformly
  • a thermally conductive silicone rubber composition The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 5, and the results are shown in Table 2.
  • Example 5 instead of the dimethylsiloxane having a silanol group at one end of the molecular chain, the formula:
  • a thermally conductive silicone rubber base was prepared in the same manner as in Example 5 except that the same amount of dimethylsiloxane having a silanol group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this heat conductive silicone rubber base was measured in the same manner as in Example 5, and the results are shown in Table 2.
  • the silicone rubber base platinum content 0.5 wt 0/0 1 platinum is, 3-Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by weight of uniformly
  • a thermally conductive silicone rubber composition The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 5, and the results are shown in Table 2.
  • Example 5 instead of the dimethylsiloxane having a silanol group at one end of the molecular chain, the formula:
  • a thermally conductive silicone rubber base was prepared in the same manner as in Example 5 except that the same amount of dimethylsiloxane having a silanol group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this heat conductive silicone rubber base was measured in the same manner as in Example 5, and the results are shown in Table 2.
  • the silicone rubber base 1 platinum platinum content of 0.5 weight 0/0, 3 Jibyuru one 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by uniformly
  • a thermally conductive silicone rubber composition The properties of the thermally conductive silicone rubber, the composition, and the thermally conductive silicone rubber were measured in the same manner as in Example 5, and the results are shown in Table 2.
  • the silicone rubber base 1 platinum platinum content of 0.5 weight 0/0, 3 Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by uniformly and The mixture was mixed to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 5, and the results are shown in Table 2. Compared to the results of Examples 5 to 8, the consistency before curing is high and the handling is poor, and despite having the same crosslinking density, the hardness after curing is high and elasticity is lost. I understand.
  • Example 5 instead of the dimethylsiloxane having a silanol group at one end of the molecular chain, the formula:
  • thermally conductive silicone rubber composition in the same manner as in Example 5 except that the same amount of dimethylxanxane-blocked silanol groups at both ends of the molecular chain represented by was used, but the viscosity of the composition was too high. 1,200 parts by weight of a truly spherical alumina powder having an average particle diameter of 100 / m and 800 parts by weight of an irregularly shaped alumina powder having an average particle diameter of 2.2 ⁇ are mixed together. It is not possible to measure the consistency of the thermally conductive silicone rubber base, evaluate the moldability of the thermally conductive silicone rubber composition, and measure the thermal conductivity and hardness of the thermally conductive silicone rubber. could not.
  • Comparative Example 5 a truly spherical alumina powder having an average particle size of 10 ⁇ m was reduced to 9900 parts by weight, and an alumina powder having an average particle size of 2.2 ⁇ was reduced to 600 parts by weight.
  • a heat-conductive silicone rubber base was prepared in the same manner as in Comparative Example 5, except that the total content was 93% by weight. The consistency of this heat conductive silicone rubber base was measured in the same manner as in Example 5, and the results are shown in Table 2. Then, the silicone rubber base, 1 platinum platinum content of 0.5 weight 0/0, 3 Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 wt capital uniformly The mixture was mixed to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 5, and the results are shown in Table 2.
  • the filling amount of the spherical alumina powder having an average particle diameter of 10 ⁇ and the irregularly shaped alumina powder having an average particle diameter of 2.2 ⁇ was reduced.
  • Example 5 instead of dimethylxanxane having a silanol group at one end of the molecular chain, a compound represented by the formula:
  • a thermally conductive silicone rubber base was prepared in the same manner as in Example 5 except that the same amount of dimethylsiloxane having a silanol group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this heat conductive silicone rubber base was measured in the same manner as in Example 5, and the results are shown in Table 2.
  • the silicone rubber base 1 platinum platinum content of 0.5 weight 0/0, 3 Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by uniformly and The mixture was mixed to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 5, and the results are shown in Table 2.
  • the dimethylsioxaxane with a silanol group blocked at one end of the molecular chain used here is the same dimethylsiloxane as the dimethylsioxaxane with a blocked silanol group at one end of the molecular chain used in Examples 5 to 8, but the degree of polymerization is small. Therefore, effective treatment could not be performed, and it was found that the obtained composition had high consistency before curing and poor handleability, and also had high hardness after curing and lost elasticity.
  • Table 2 Table 2
  • this silicone rubber base has a platinum content of 0.5 weight. / 0 1 platinum is 3- Jibieru one 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by weight (platinum metal with respect to the molecular chain terminal Jimechirubi two Rushirokishi group-blocked dimethylpolysiloxane 1 Oppm) to prepare a thermally conductive silicone rubber composition.
  • the content of alumina powder in this composition was 94.0% by weight (79.4% by volume).
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured as follows, and the results are shown in Table 3.
  • This thermally conductive silicone rubber composition was sandwiched between a 50 / m-thick polyethylene terephthalate resin film (PET film) to a thickness of 1 mm, and cured by heating at 100 ° C for 30 minutes. . Thereafter, the PET film was peeled off, and it was observed whether the silicone rubber sheet could be formed. If the sheet could be formed without any problems, the moldability was determined to be “ ⁇ ”. If it could be formed into a sheet, but was partially agglomerated and broken Is indicated as “ ⁇ ” as a poor formability, and “X” as a poor formability when most of the sheets could not be formed due to cohesive failure.
  • PET film polyethylene terephthalate resin film
  • the thermal conductivity of the thermally conductive silicone rubber obtained by heating and curing the thermally conductive silicone rubber composition at 100 ° C for 30 minutes is determined according to the heat conductivity specified in JISR 2616. According to the linear method, it was measured with a rapid thermal conductivity meter QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd.
  • the hardness of the thermally conductive silicone rubber obtained by heating and curing the thermally conductive silicone rubber composition at 100 ° C. for 30 minutes was measured with a type E durometer specified in JISK6253. It was measured.
  • Example 9 instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 9 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 3.
  • Example 9 instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 9 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 3.
  • the silicone rubber base platinum content 0. 5 wt 0/0 is a platinum 1, 3-Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0. 2 parts by weight (of the The amount of platinum metal was 1 O ppm with respect to the dimethylpolysiloxane having a dimethylbielsuccinyl group at both ends of the molecular chain) to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 3.
  • Example 9 instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 9 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 3.
  • the silicone rubber base platinum content 0.5 wt 0/0 at a 1 platinum, 3- Jibyuru one 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by weight (the Dimethylpoly-siloxy group-blocked dimethylpolysiloxaxane at an amount such that platinum metal becomes 1 O ppm) to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 3.
  • Example 9 instead of dimethylpolysiloxane having a trimethoxyxyloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 9 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 3.
  • the silicone rubber base the platinum content 0 5 wt 0/0 at a 1 platinum, 3-divinyl -.. Lou 1, 1, 3, 3-tetramethyldisiloxane complex 0 2 parts by weight
  • a heat-conductive silicone rubber composition was prepared by mixing the above-mentioned dimethylvinylsiloxy group-blocked dimethylpolysiloxane with both ends of the molecular chain with platinum metal in an amount of 1 ⁇ ).
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 3.
  • Example 9 instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 9 except that the same amount of dimethylpolysiloxane having a trimethoxycoxyoxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of the silicone rubber base was measured in the same manner as in Example 9, and the consistency was measured. Table 3 shows the results.
  • the silicone rubber base the platinum content is 0 5 1 platinum wt%, three to Jibiniru 1;.. 1, 3, 3-tetramethyldisiloxane complex 0 2 parts by weight (above molecular chain
  • the amount of platinum metal was 1 O ppm with respect to dimethylpolysiloxane having dimethylvinylsiloxy groups at both ends) to obtain a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 3.
  • Example 9 instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 9 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 3.
  • the silicone rubber base platinum content 0.5 wt 0/0 at a 1 platinum, 3- Jibyuru one 1, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by weight (the Was mixed with dimethylpolysiloxane blocked with dimethyl bi-siloxy groups at both ends of the molecular chain so that the amount of platinum metal was 1 O ppm) to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 3.
  • Example 9 instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • Example 9 instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat conductive silicone rubber base was prepared in the same manner as in Example 9 except that the same amount was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 3.
  • the silicone rubber base platinum content 0. 5 wt 0/0 is a platinum 1, 3-Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0. 2 parts by weight (of the The amount of platinum metal was 1 O ppm with respect to the dimethyl polysiloxane having a dimethyl bierchie xy group blocked at both ends of the molecular chain) to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 3. Table 3
  • Table 3 shows that the content of the alumina powder in the thermally conductive silicone rubber composition was 79.4% by volume.
  • Examples 9 to 11 and Comparative Examples 8 to 11 are compared, the difference in the number of repeating units of dimethylsiloxane in the dimethylpolysiloxane capped with trimethoxysiloxy group at one end of the molecular chain indicates that the thermally conductive silicone rubber composition is slightly different. It was found that the degree of change greatly changed and the hardness of the silicone rubber obtained by curing also changed greatly.
  • Example 9 comparing Example 9 with Comparative Examples 13 and 13, even if the number of repeating units of dimethylsiloxane in dimethylpolysiloxane is equal, the force at which one end of a molecular chain is blocked by a trimethoxysiloxy group, It was found that the degree of thermal conductivity of the silicone rubber composition was greatly changed and the hardness of the silicone rubber obtained by curing was greatly changed depending on whether or not was blocked with a trimethoxysiloxy group. Furthermore, comparing Comparative Examples 12 and 13, if both molecular chain terminals of dimethylpolysiloxane are blocked with trimethoxysiloxy groups, heat conduction is independent of the number of repeating units of dimethylsiloxane. It has been found that the silicone rubber composition has a high degree of adhesion and the handling efficiency is reduced.
  • dimethylpolysiloxane with a viscosity of 40 O mPa's at both ends of the molecular chain and dimethylvinylsiloxane having a hydroxyl group blocked (vinyl group content 0.44% by weight) 10 0 parts by weight, 1,500 parts by weight of truly spherical alumina powder having an average particle size of 10 ⁇ m, 1,000 parts by weight of amorphous alumina powder having an average particle size of 2.2 / im, and the formula:
  • Example 12 in place of dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 12, except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 4.
  • the silicone rubber base platinum content 0.5 wt 0/0 1, 3 one Jibyuru one first platinum is, 1, 3, 3-tetramethyldisiloxane complex 0.2 parts by weight (the (The amount of platinum metal becomes 1 O ppm with respect to dimethylpolysiloxane with dimethylbielsic acid at both ends of the molecular chain) to prepare a thermally conductive silicone rubber composition.
  • the content of alumina powder in this composition was 95.0% by weight (82.4% by volume).
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 4.
  • Example 12 in place of dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 12 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 4.
  • the silicone rubber base, platinum content 0. 5 wt 0/0 is a platinum 1, 3-Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0.
  • thermally conductive silicone rubber composition 2 parts by weight (of the The amount of platinum metal was 1 O ppm with respect to dimethylpolysiloxane blocked with dimethylvinylsiloxy groups at both ends of the molecular chain) to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 4.
  • Example 12 instead of the dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • Example 12 instead of the dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 12 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 4. Then, the silicone rubber base, platinum content of 0 5 wt 0/0 at a 1 platinum, 3 -. Divinyl -.
  • Example 12 in place of dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 12 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 4.
  • the silicone rubber base platinum content 0. 5 wt 0/0 is a platinum 1, 3-Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0. 2 parts by weight (of the The amount of platinum metal was 1 O ppm with respect to dimethylpolysiloxane blocked with dimethylvinylsiloxy groups at both ends of the molecular chain) to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 4.
  • Example 12 in place of dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat-conductive silicone rubber base was prepared in the same manner as in Example 12 except that the same amount of dimethylpolysiloxane having a trimethoxysiloxy group blocked at one end of the molecular chain represented by the following formula was used.
  • the consistency of this silicone rubber base was measured in the same manner as in Example 9, and the results are shown in Table 4.
  • the silicone rubber base platinum content 0. 5 wt 0/0 is a platinum 1, 3-Jibiniru 1, 1, 3, 3-tetramethyldisiloxane complex 0. 2 parts by weight (of the The amount of platinum metal was 1 O ppm with respect to dimethylpolysiloxane blocked with dimethylvinylsiloxy groups at both ends of the molecular chain) to prepare a thermally conductive silicone rubber composition.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 9, and the results are shown in Table 4.
  • Example 12 in place of dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat conductive silicone rubber base was prepared in the same manner as in Example 12 except that the same amount of dimethylpolysiloxane capped with trimethoxysiloxy groups at both ends of the molecular chain represented by was used, but the viscosity of the base was too high. Therefore, 1,500 parts by weight of a truly spherical alumina powder having an average particle size of 10 m and 1,000 parts by weight of an amorphous powder having an average particle size of 2.2 ⁇ could not be mixed.
  • Example 12 in place of dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat conductive silicone rubber base was prepared in the same manner as in Example 12 except that the same amount of dimethylpolysiloxane capped with trimethoxysiloxy groups at both ends of the molecular chain represented by was used.However, the viscosity of the base was too high. 1,500 parts by weight of a truly spherical alumina powder having an average particle diameter of 10 ⁇ m and 100,000 parts by weight of an irregularly shaped alumina powder having an average particle diameter of 2.2 are mixed. I could't do that. Table 4
  • Table 4 shows that the content of the alumina powder in the thermally conductive silicone rubber composition was extremely high as 82.4% by volume.
  • a comparison of Examples 12 to 14 and Comparative Examples 15 to 17 shows that the heat conductive silicone rubber composition is different due to the difference in the number of repeating units of dimethylsiloxane in the dimethylpolysiloxane blocked at one end of the molecular chain. It was found that the consistency changed significantly and the hardness of the silicone rubber obtained by curing also changed significantly.
  • Comparative Example 18 shows that even if the number of repeating units of dimethylsiloxane in dimethylpolysiloxane is equal, if both molecular chain terminals are blocked with trimethoxysiloxy groups, Regardless of the number of repeating units, it was found that the consistency of the thermally conductive silicone rubber composition was increased and the handling workability was reduced.
  • thermally conductive silicone rubber composition The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured as follows, and the results are shown in Table 5.
  • the 1/4 consistency of this thermally conductive silicone rubber composition was measured according to the method specified in JIS K2220.
  • a high consistency value means that the heat conductive silicone rubber composition has high plasticity and excellent handleability.
  • thermal conductive silicone rubber composition [Moldability of thermal conductive silicone rubber composition]
  • the thermally conductive silicone rubber composition was sandwiched between 0.2 mm thick tetrafluoroethylene resin films so as to have a thickness of 2 mm, and was heated and cured at 150 ° C. for 15 minutes. Thereafter, the film made of the tetrafluoroethylene resin was peeled off, and it was observed whether a silicone rubber sheet could be formed.
  • Good moldability was obtained when a uniform silicone rubber sheet could be formed: ⁇ , Moldable in a sheet form, and poor moldability when a part where the strength was weak was partially good: ⁇ , Sheet form The case where the molding was not possible or the strength was weak even if the molding was possible was evaluated as poor moldability: X,.
  • the heat conductivity of the heat-conductive silicone rubber obtained by heating and curing the heat-conductive silicone rubber composition at 150 ° C for 15 minutes was measured according to the hot wire method specified in JISR 2616 by Kyoto Electronics Co., Ltd. It was measured by a thermal conductivity meter QTM-500.
  • the heat conductive silicone rubber composition was sandwiched between adherends of the same kind, and then cured by heating at 150 ° C. for 30 minutes.
  • adherends As the adherend, an aluminum plate (JISH 4000, A1050P), a nickel plate (SPCC_SB), and a stainless steel plate (SUS-3042B) manufactured by Paltec Co., Ltd. were used.
  • the bonding area was 25 mm X 10 mm, and the thickness of the bonding layer was 1 mm.
  • the tensile shear adhesive strength of the heat conductive silicone rubber was measured according to JISK 6249.
  • the mixing device has a molecular chain with both ends having a viscosity of 30 OmPa's.
  • thermoly conductive silicone grease A part of this thermally conductive silicone grease was poured into a 50 ml glass beaker, and the 1/4 penetration of this silicone grease was measured by the method specified in JISK 2220. The results are shown in Table 6. Note that a large value of the likelihood means that the heat conductive silicone grease has high plasticity and is excellent in handleability.
  • the heat conductive silicone grease is wrapped in a salted vinylidene resin film, and the heat conductivity is measured by a rapid heat conductivity meter QTM-500 manufactured by Kyoto Electronics Manufacturing Co., Ltd. in accordance with the hot wire method specified in JISR 2616. Measure and the result Are shown in Table 6.
  • Example 16 in place of the dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat conductive silicone grease was prepared in the same manner as in Example 16 except that the same amount of the organosiloxane represented by the following formula was used.
  • the thermal conductivity and the thermal conductivity of this thermally conductive silicone grease were measured in the same manner as in Example 16, and the results are shown in Table 6.
  • Example 16 in place of the dimethylpolysiloxane capped at one end of the molecular chain, the formula:
  • a heat conductive silicone grease was prepared in the same manner as in Example 16 except that the same amount of oligosiloxane represented by the following formula was used.
  • the thermal conductivity of this silicone grease was measured in the same manner as in Example 16, and the results are shown in Table 6.
  • Example 16 in place of the trimethoxysiloxy group-blocked dimethyl ⁇ / repolysiloxane at one end of the molecular chain, a compound represented by the formula:
  • the thermal conductivity and thermal conductivity of this thermally conductive silicone grease were measured in the same manner as in Example 16, and the results are shown in Table 6.
  • a heat conductive silicone grease was prepared. The thermal conductivity and thermal conductivity of this thermal conductive silicone grease were measured in the same manner as in Example 16, and the results are shown in Table 6.
  • Example 16 an attempt was made to prepare a thermally conductive silicone grease in the same manner as in Example 16 except that the same amount of methyltrimethoxysilane was used instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain.
  • the viscosity of the composition was too high, a predetermined amount of the alumina powder could not be mixed, and the measurement of the thermal conductivity and the thermal conductivity of the thermally conductive silicone grease could not be performed.
  • Example 16 in place of the dimethylpolysiloxane capped with a trimethoxysiloxy group at one end of the molecular chain, a compound represented by the formula:
  • a heat conductive silicone grease was prepared in the same manner as in Example 16 except that the same amount of the oligosiloxane represented by the formula was used.However, the viscosity of the composition was too high, and a predetermined amount of the alumina powder was mixed. It was not possible to measure the thermal conductivity just after thermal conductive silicone grease.
  • a heat-conductive silicone grease was prepared in the same manner as in Example 16 except that the same amount of decyltrimethoxysilane was used in place of dimethylpolysiloxane blocked with a trimethoxysiloxy group at one end of the molecular chain.
  • the thermal conductivity and thermal conductivity of this thermally conductive silicone grease were measured in the same manner as in Example 16, and the results are shown in Table 6.
  • a heat conductive silicone grease was prepared in the same manner as in Example 21 except that the same amount of decyltrimethoxysilane was used instead of dimethylpolysiloxane having a trimethoxysiloxy group at one end of the molecular chain.
  • the thermal conductivity of this silicone dolly was measured in the same manner as in Example 16, and the results are shown in Table 6. Table 6
  • a loss mixer 72.05 parts by weight of a dimethylpolysiloxane having a viscosity of 30 OmPa's and capped with trimethylsiloxy groups at both ends of the molecular chain, 137 parts by weight of spherical alumina powder having an average particle diameter of 0.4 m, and an average particle diameter of 2 / m 167.6 parts by weight of spherical alumina powder, 615.4 parts by weight of spherical alumina powder having an average particle size of 18 ⁇ m,
  • a loss mixer 75 parts by weight of a dimethylpolysiloxane having a viscosity of 30 OmPa's and capped with trimethylsiloxy groups at both ends of the molecular chain, 137 parts by weight of spherical alumina powder having an average particle size of 0.4 ⁇ m, 137 parts by weight, and an average particle size of 2 ⁇ 167.6 parts by weight of spherical alumina powder having an average particle diameter of 18 ⁇ 6 15.4 parts by weight of spherical alumina powder having the following formula:
  • the dimethylpolysiloxane blocked at both ends of the molecular chain having a viscosity of 40 OraPa's (dimethyl group content 0.44% by weight) 43.6 parts by weight, average particle size 40 ⁇ 550 parts by weight of spherical alumina powder having a particle size of m, and 368 parts by weight of alumina powder having an irregular shape having an average particle size of 2.2 m.
  • a rubber composition was prepared. The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 1, and the results are shown in Table 8. Was.
  • the mixture has a viscosity of 5 mPa's, and a molecular chain having an average of 5 silicon-bonded hydrogen atoms in one molecule.
  • thermo conductivity 0.5 parts by weight of a platinum 1,3-dibutyl-1,1,3,3-tetramethyldisiloxane complex having a platinum content of 0.5% by weight.
  • a silicone rubber composition was prepared. The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 1, and the results are shown in Table 8.
  • a heat conductive silicone rubber composition was prepared in the same manner as in Comparative Example 24, except that the same amount of decyltrimethoxysilane was used instead of methyltrimethoxysilane in Comparative Example 24.
  • the properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 1, and the results are shown in Table 8.
  • a heat conductive silicone rubber composition was prepared in the same manner as in Comparative Example 24 except that the same amount of the organosiloxane represented by The properties of the thermally conductive silicone rubber composition and the thermally conductive silicone rubber were measured in the same manner as in Example 1, and the results are shown in Table 8.
  • the mixing device was used to obtain 70 parts by weight of a dimethylpolysiloxane having a viscosity of 30 O mPa's and capped with a trimethylsiloxy group at both ends of the molecular chain, and 552 parts by weight of a spherical alumina powder having an average particle size of 40 ⁇ m.
  • thermally conductive silicone grease was poured into a 5 O ml glass beaker, and the 1 g4 penetration of the silicone grease was measured by the method specified in JISK2220. It was shown to. Note that a large value of the likelihood means that the heat conductive silicone grease has high plasticity and is excellent in handleability.
  • the heat conductive silicone grease is wrapped in a Shii-Dani Vinylidene resin film, and the heat conductivity is measured according to the hot wire method specified in JISR 266 16 by a rapid heat conductivity meter manufactured by Kyoto Electronics Industry Co., Ltd. The measurement was performed using QTM-5Q0, and the results are shown in Table 9.
  • the mixing device was used to obtain 70 parts by weight of a dimethylpolysiloxane having a viscosity of 30 O mPa's and capped with a trimethylsiloxy group at both ends of the molecular chain, and 552 parts by weight of a spherical alumina powder having an average particle size of 40 ⁇ m.
  • thermally conductive silicone grease was mixed at room temperature to prepare a thermally conductive silicone grease.
  • the properties of this thermally conductive silicone grease were measured in the same manner as in Example 29, and the results are shown in Table 9.
  • the heat conductive silicone composition of the present invention is characterized by good handling workability even if a large amount of a heat conductive filler is contained in order to obtain a high heat conductive silicone composition.

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Abstract

L'invention concerne une composition de silicone thermoconductrice comprenant au moins (A) un organopolysiloxane, (B) une charge thermoconductrice et (C) un organosiloxane spécifique. Ladite composition de silicone est très facile à manipuler, y compris lorsqu'elle contient une grande quantité d'une charge thermoconductrice afin d'atteindre une conductibilité thermique supérieure.
PCT/JP2002/004642 2001-05-14 2002-05-14 Composition de silicone thermoconductrice WO2002092693A1 (fr)

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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001348483A (ja) * 2000-06-08 2001-12-18 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP2003213133A (ja) * 2002-01-25 2003-07-30 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
WO2003095560A1 (fr) * 2002-05-14 2003-11-20 Dow Corning Toray Silicone Co., Ltd. Composition au silicium pouvant etre soumise a traitement, pour la production de materiaux magnetiques composites mous, et materiaux magnetiques composites mous
JP2004262972A (ja) * 2003-02-13 2004-09-24 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーン組成物
JP2005325211A (ja) * 2004-05-13 2005-11-24 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及び成型品
JP2005325212A (ja) * 2004-05-13 2005-11-24 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及び成型品
JP2006503166A (ja) * 2002-10-17 2006-01-26 ダウ・コーニング・コーポレイション 熱軟化熱伝導性組成物およびその調製方法
US7135232B2 (en) * 2003-07-04 2006-11-14 Fuji Polymer Industries Co., Ltd. Thermal conductive composition, a heat dissipating putty sheet and heat dissipating structure using the same
JP2007177001A (ja) * 2005-12-27 2007-07-12 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
WO2009136508A1 (fr) * 2008-05-08 2009-11-12 富士高分子工業株式会社 Composition de résine thermiquement conductrice
US7695817B2 (en) 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US7737212B2 (en) 2005-05-25 2010-06-15 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition
US7823647B2 (en) 2005-10-06 2010-11-02 Baker Hughes Incorporated Process for foaming a wet hydrocarbon composition
US8119758B2 (en) 2006-08-30 2012-02-21 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone composition and cured product thereof
JP2012052137A (ja) * 2011-11-28 2012-03-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2012077256A (ja) * 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2013028742A (ja) * 2011-07-29 2013-02-07 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2013091683A (ja) * 2011-10-24 2013-05-16 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
US8618211B2 (en) 2009-03-16 2013-12-31 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP2015110792A (ja) * 2015-01-22 2015-06-18 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
WO2016121563A1 (fr) * 2015-01-29 2016-08-04 ポリマテック・ジャパン株式会社 Composition thermoconductrice
JPWO2016190188A1 (ja) * 2015-05-22 2017-06-15 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JPWO2016190189A1 (ja) * 2015-05-22 2017-06-15 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
WO2020261958A1 (fr) 2019-06-24 2020-12-30 信越化学工業株式会社 Composition de silicone hautement thermoconductrice et produit durci correspondant
JP6942907B1 (ja) * 2020-07-07 2021-09-29 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
WO2022009486A1 (fr) * 2020-07-07 2022-01-13 富士高分子工業株式会社 Composition de gel de silicone thermoconducteur et feuille de gel de silicone thermoconducteur et leur procédé de production
KR20240037182A (ko) 2021-07-29 2024-03-21 세키수이 폴리머텍 가부시키가이샤 열전도성 조성물 및 경화물

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
US20060079634A1 (en) * 2003-05-30 2006-04-13 Shin-Etsu Chemical Co., Ltd. RTV heat conductive silicone rubber compositions
DE102004046179A1 (de) * 2004-09-23 2006-03-30 Wacker Chemie Ag Vernetzbare Massen auf der Basis von Organosiliciumverbindungen
JP4590253B2 (ja) * 2004-12-16 2010-12-01 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびシリコーン組成物
US8907026B2 (en) 2004-12-23 2014-12-09 Dow Corning Corporation Crosslinkable saccharide-siloxane compositions, and networks, coatings and articles formed therefrom
JP4931350B2 (ja) 2005-01-05 2012-05-16 東レ・ダウコーニング株式会社 複合シリコーンゴム粉末、その製造方法、塗料、および化粧料
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
US20060264566A1 (en) * 2005-05-19 2006-11-23 Wacker Chemical Corporation HCR room temperature curable rubber composition
WO2006127883A2 (fr) 2005-05-23 2006-11-30 Dow Corning Corporation Compositions d'hygiene personnelle a copolymeres de saccharide-siloxane
EA016186B1 (ru) * 2005-09-26 2012-03-30 Медарекс, Инк. Человеческие моноклональные антитела к cd70 и их применение
US7527873B2 (en) * 2006-02-08 2009-05-05 American Standard Circuits Thermally and electrically conductive interface
KR100729412B1 (ko) * 2006-03-15 2007-06-15 대일소재(주) 자기점착형 열전도성 젤 조성물 및 그 성형체
WO2007121006A2 (fr) * 2006-04-11 2007-10-25 Dow Corning Corporation Moules composites en silicone à faible distorsion thermique
KR101460980B1 (ko) 2006-05-23 2014-11-13 다우 코닝 코포레이션 활성제를 전달하기 위한 신규한 실리콘막 형성제
TWI419931B (zh) * 2006-06-16 2013-12-21 Shinetsu Chemical Co 導熱聚矽氧潤滑脂組成物
AU2007333098A1 (en) * 2006-12-14 2008-06-19 Medarex, Inc. Human antibodies that bind CD70 and uses thereof
EP2115065B1 (fr) * 2007-02-20 2016-05-11 Dow Corning Corporation Agents de traitement de charge basés sur des polyorganosiloxanes se liant à l'hydrogène
JP2008239719A (ja) 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
KR20150043545A (ko) * 2007-08-31 2015-04-22 캐보트 코포레이션 열 계면 물질
US8062742B2 (en) * 2007-12-03 2011-11-22 Seoung Kyu Oh Method for manufacturing silicone foam having an air permeable structure
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
KR100973701B1 (ko) * 2008-05-13 2010-08-04 성시민 호흡용 공기 압축기를 위한 공기 공급 장치
JP2010018786A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010021533A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
US20100213415A1 (en) * 2009-02-26 2010-08-26 Nitto Denko Corporation Metal oxide fine particles, silicone resin composition and use thereof
RU2543202C2 (ru) * 2009-11-09 2015-02-27 Упм Рафлатак Ой Снимаемая накладка для многослойной этикетки
JP2011140566A (ja) * 2010-01-07 2011-07-21 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
JP5619487B2 (ja) * 2010-06-24 2014-11-05 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
WO2012027073A1 (fr) 2010-08-23 2012-03-01 Dow Corning Corporation Saccharide-siloxanes stables dans des environnements aqueux, et procédé d'élaboration et d'utilisation de tels saccharide-siloxanes
US9243165B2 (en) * 2010-08-25 2016-01-26 Nissan Chemical Industries, Ltd. Film-forming composition
JP4917184B1 (ja) * 2010-10-01 2012-04-18 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 高電圧電気絶縁部品用液状シリコーンゴム組成物
KR101043201B1 (ko) * 2010-11-08 2011-06-21 성시민 공기 충전 압축기용 흡입 필터
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN102408869B (zh) * 2011-08-04 2013-07-24 绵阳惠利电子材料有限公司 无卤阻燃电子电器用加成型有机硅灌封胶
JP5664563B2 (ja) * 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
US9752007B2 (en) 2012-07-30 2017-09-05 Dow Corning Corporation Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition
MY170487A (en) 2013-01-22 2019-08-07 Shinetsu Chemical Co Heat conductive silicone composition, heat conductive layer, and semiconductor device
US9070660B2 (en) * 2013-03-15 2015-06-30 Intel Corporation Polymer thermal interface material having enhanced thermal conductivity
JP5898139B2 (ja) 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6075261B2 (ja) * 2013-10-02 2017-02-08 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
US9688869B2 (en) * 2013-10-17 2017-06-27 Dow Corning Toray Co., Ltd. Curable silicone composition, and optical semiconductor device
EP3059768A4 (fr) * 2013-10-17 2017-05-03 Dow Corning Toray Co., Ltd. Composition de silicone pouvant durcir et dispositif à semi-conducteur optique
WO2015155948A1 (fr) * 2014-04-09 2015-10-15 東レ・ダウコーニング株式会社 Composition de silicone thermoconductrice et appareil électrique/électronique
ES2796925T3 (es) 2014-09-25 2020-11-30 Shinetsu Chemical Co Composición de grasa de silicona térmicamente conductora de espesamiento por UV
JP6524879B2 (ja) 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
JP6642145B2 (ja) 2016-03-14 2020-02-05 信越化学工業株式会社 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法
US10002857B2 (en) * 2016-04-12 2018-06-19 Qualcomm Incorporated Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
US9725577B1 (en) * 2016-08-30 2017-08-08 International Business Machines Corporation Self-healing thermal interface materials
KR101872199B1 (ko) * 2016-12-13 2018-06-28 비엔비머티리얼 주식회사 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법
KR102166470B1 (ko) 2017-05-16 2020-10-16 주식회사 엘지화학 수지 조성물
KR102625362B1 (ko) 2017-07-24 2024-01-18 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
KR20200033274A (ko) * 2017-07-24 2020-03-27 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물 열전도성 부재 및 방열 구조체
CN111051434B (zh) 2017-07-24 2022-03-29 陶氏东丽株式会社 多成分硬化型导热性硅酮凝胶组合物、导热性部件及散热构造体
EP3688097B1 (fr) * 2017-09-29 2024-05-15 Dow Silicones Corporation Composition de silicone comprenant une charge
JP6919716B2 (ja) 2017-11-09 2021-08-18 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US10968351B2 (en) * 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US10941251B2 (en) * 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
CN112805334B (zh) 2018-11-07 2023-08-04 陶氏环球技术有限责任公司 导热组合物以及使用所述组合物的方法和装置
CN109722218B (zh) * 2018-12-25 2021-05-04 烟台德邦科技股份有限公司 一种耐电解液密封胶及其制备方法
CN113508460A (zh) * 2019-03-29 2021-10-15 陶氏东丽株式会社 多成分型固化性聚有机硅氧烷组合物、导热性构件以及散热结构体
KR102172003B1 (ko) * 2019-11-28 2020-11-02 (주)매그나텍 접착제 대체 기판 제조 방법
CN111393855A (zh) * 2020-03-18 2020-07-10 平湖阿莱德实业有限公司 一种具有优异耐候性的高导热凝胶组合物
EP4013800B1 (fr) * 2020-10-28 2024-06-19 Dow Silicones Corporation Compositions de siloxane ramifié à fonction trialcoxy
US20240141110A1 (en) 2021-02-23 2024-05-02 Byk-Chemie Gmbh Polysiloxane dispersing agent
WO2023283819A1 (fr) * 2021-07-14 2023-01-19 Dow Silicones Corporation Composition de silicone thermoconductrice
KR20240056092A (ko) * 2022-10-21 2024-04-30 부산대학교 산학협력단 방열용 피커링 에멀젼 조성물, 이를 이용한 방열 페이스트 및 이의 제조방법

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
JPH0413767A (ja) * 1990-05-07 1992-01-17 Shin Etsu Chem Co Ltd 硬化性シリコーン組成物及び硬化物
JPH04147847A (ja) * 1990-10-11 1992-05-21 Shin Etsu Chem Co Ltd シリコーンゴム積層体及びその製造方法
JPH051237A (ja) * 1991-06-24 1993-01-08 Shin Etsu Chem Co Ltd 表面処理アルミナ及びそれを含有する熱伝導性シリコーン組成物
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH10130504A (ja) * 1996-10-29 1998-05-19 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
JPH1112481A (ja) * 1997-06-20 1999-01-19 Toray Dow Corning Silicone Co Ltd 熱伝導性ポリマー組成物
JPH1149958A (ja) * 1997-08-06 1999-02-23 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物
JP2000256558A (ja) * 1999-03-11 2000-09-19 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及びその製造方法
JP2001139815A (ja) * 1999-11-15 2001-05-22 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP2001294752A (ja) * 2000-04-11 2001-10-23 Shin Etsu Chem Co Ltd 電磁波吸収性熱伝導性シリコーンゴム組成物
JP2001348483A (ja) * 2000-06-08 2001-12-18 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP2002003831A (ja) * 2000-06-26 2002-01-09 Shin Etsu Chem Co Ltd 放熱用部材
JP2002129019A (ja) * 2000-10-25 2002-05-09 Shin Etsu Chem Co Ltd 電磁波吸収性シリコーンゴム組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251466A (ja) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
JP2876017B2 (ja) * 1987-10-27 1999-03-31 松下電工株式会社 モニタカメラ用方向調整装置及び人体検出器用方向調整装置
JP2857725B2 (ja) * 1991-08-05 1999-02-17 株式会社日立製作所 樹脂封止型半導体装置

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
JPH0413767A (ja) * 1990-05-07 1992-01-17 Shin Etsu Chem Co Ltd 硬化性シリコーン組成物及び硬化物
JPH04147847A (ja) * 1990-10-11 1992-05-21 Shin Etsu Chem Co Ltd シリコーンゴム積層体及びその製造方法
JPH051237A (ja) * 1991-06-24 1993-01-08 Shin Etsu Chem Co Ltd 表面処理アルミナ及びそれを含有する熱伝導性シリコーン組成物
JPH08325457A (ja) * 1995-05-29 1996-12-10 Toray Dow Corning Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JPH10130504A (ja) * 1996-10-29 1998-05-19 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
JPH1112481A (ja) * 1997-06-20 1999-01-19 Toray Dow Corning Silicone Co Ltd 熱伝導性ポリマー組成物
JPH1149958A (ja) * 1997-08-06 1999-02-23 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物
JP2000256558A (ja) * 1999-03-11 2000-09-19 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及びその製造方法
JP2001139815A (ja) * 1999-11-15 2001-05-22 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP2001294752A (ja) * 2000-04-11 2001-10-23 Shin Etsu Chem Co Ltd 電磁波吸収性熱伝導性シリコーンゴム組成物
JP2001348483A (ja) * 2000-06-08 2001-12-18 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP2002003831A (ja) * 2000-06-26 2002-01-09 Shin Etsu Chem Co Ltd 放熱用部材
JP2002129019A (ja) * 2000-10-25 2002-05-09 Shin Etsu Chem Co Ltd 電磁波吸収性シリコーンゴム組成物

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001348483A (ja) * 2000-06-08 2001-12-18 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP4646357B2 (ja) * 2000-06-08 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP2003213133A (ja) * 2002-01-25 2003-07-30 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
US6844393B2 (en) * 2002-01-25 2005-01-18 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone rubber composition
WO2003095560A1 (fr) * 2002-05-14 2003-11-20 Dow Corning Toray Silicone Co., Ltd. Composition au silicium pouvant etre soumise a traitement, pour la production de materiaux magnetiques composites mous, et materiaux magnetiques composites mous
JP2006503166A (ja) * 2002-10-17 2006-01-26 ダウ・コーニング・コーポレイション 熱軟化熱伝導性組成物およびその調製方法
JP2004262972A (ja) * 2003-02-13 2004-09-24 Dow Corning Toray Silicone Co Ltd 熱伝導性シリコーン組成物
JP4646496B2 (ja) * 2003-02-13 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
US7135232B2 (en) * 2003-07-04 2006-11-14 Fuji Polymer Industries Co., Ltd. Thermal conductive composition, a heat dissipating putty sheet and heat dissipating structure using the same
CN100402626C (zh) * 2003-07-04 2008-07-16 富士高分子工业株式会社 导热性组合物及使用其的腻子状散热片和散热结构体
KR101155940B1 (ko) 2003-11-05 2012-07-05 다우 코닝 코포레이션 열 전도성 그리스, 당해 그리스가 사용되는 방법 및디바이스
US7695817B2 (en) 2003-11-05 2010-04-13 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP2005325211A (ja) * 2004-05-13 2005-11-24 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及び成型品
US7547743B2 (en) 2004-05-13 2009-06-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone rubber composition and molded article
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4557136B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
KR101237558B1 (ko) 2004-05-13 2013-02-26 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 고무 조성물 및 성형품
JP2005325212A (ja) * 2004-05-13 2005-11-24 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物及び成型品
KR101235385B1 (ko) 2005-05-25 2013-02-20 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물
US7737212B2 (en) 2005-05-25 2010-06-15 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition
US7823647B2 (en) 2005-10-06 2010-11-02 Baker Hughes Incorporated Process for foaming a wet hydrocarbon composition
US8017684B2 (en) 2005-12-27 2011-09-13 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease compositions
JP2007177001A (ja) * 2005-12-27 2007-07-12 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
US8119758B2 (en) 2006-08-30 2012-02-21 Shin-Etsu Chemical Co., Ltd. Heat-conductive silicone composition and cured product thereof
WO2009136542A1 (fr) 2008-05-08 2009-11-12 富士高分子工業株式会社 Composition de résine thermiquement conductrice
US8324313B2 (en) 2008-05-08 2012-12-04 Fuji Polymer Industries Co., Ltd. Thermally conductive resin composition
WO2009136508A1 (fr) * 2008-05-08 2009-11-12 富士高分子工業株式会社 Composition de résine thermiquement conductrice
CN101981130B (zh) * 2008-05-08 2013-04-17 富士高分子工业株式会社 导热性树脂组合物
JPWO2009136542A1 (ja) * 2008-05-08 2011-09-08 富士高分子工業株式会社 熱伝導性樹脂組成物
US8618211B2 (en) 2009-03-16 2013-12-31 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
JP2012077256A (ja) * 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
US9238734B2 (en) 2011-07-29 2016-01-19 Shin-Etsu Chemical Co., Ltd. Room temperature and humidity thickening thermo-conductive silicon grease composition
JP2013028742A (ja) * 2011-07-29 2013-02-07 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2013091683A (ja) * 2011-10-24 2013-05-16 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2012052137A (ja) * 2011-11-28 2012-03-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP2015110792A (ja) * 2015-01-22 2015-06-18 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
WO2016121563A1 (fr) * 2015-01-29 2016-08-04 ポリマテック・ジャパン株式会社 Composition thermoconductrice
JPWO2016190188A1 (ja) * 2015-05-22 2017-06-15 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JPWO2016190189A1 (ja) * 2015-05-22 2017-06-15 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
WO2020261958A1 (fr) 2019-06-24 2020-12-30 信越化学工業株式会社 Composition de silicone hautement thermoconductrice et produit durci correspondant
KR20220024818A (ko) 2019-06-24 2022-03-03 신에쓰 가가꾸 고교 가부시끼가이샤 고열전도성 실리콘 조성물 및 그 경화물
JP6942907B1 (ja) * 2020-07-07 2021-09-29 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
WO2022009486A1 (fr) * 2020-07-07 2022-01-13 富士高分子工業株式会社 Composition de gel de silicone thermoconducteur et feuille de gel de silicone thermoconducteur et leur procédé de production
KR20240037182A (ko) 2021-07-29 2024-03-21 세키수이 폴리머텍 가부시키가이샤 열전도성 조성물 및 경화물

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KR20030097869A (ko) 2003-12-31
US7329706B2 (en) 2008-02-12
US20040254275A1 (en) 2004-12-16
JP4255287B2 (ja) 2009-04-15
EP1403326A4 (fr) 2005-06-01
DE60230142D1 (de) 2009-01-15
JPWO2002092693A1 (ja) 2004-08-26
EP1403326B1 (fr) 2008-12-03
KR100858836B1 (ko) 2008-09-17
ATE416235T1 (de) 2008-12-15

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