WO2016121563A1 - Composition thermoconductrice - Google Patents

Composition thermoconductrice Download PDF

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Publication number
WO2016121563A1
WO2016121563A1 PCT/JP2016/051349 JP2016051349W WO2016121563A1 WO 2016121563 A1 WO2016121563 A1 WO 2016121563A1 JP 2016051349 W JP2016051349 W JP 2016051349W WO 2016121563 A1 WO2016121563 A1 WO 2016121563A1
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heat
thermally conductive
heat conductive
conductive filler
conductive composition
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PCT/JP2016/051349
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English (en)
Japanese (ja)
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学 北田
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ポリマテック・ジャパン株式会社
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Application filed by ポリマテック・ジャパン株式会社 filed Critical ポリマテック・ジャパン株式会社
Priority to JP2016571954A priority Critical patent/JP7025612B2/ja
Publication of WO2016121563A1 publication Critical patent/WO2016121563A1/fr
Priority to JP2021206973A priority patent/JP7315133B2/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Definitions

  • the present invention relates to a thermally conductive composition used by being disposed between a heat generator and a heat radiator.
  • a heat radiating body 2 such as a heat sink is used to radiate heat generated from a heat generating body 1 such as a semiconductor element or a mechanical component mounted on a substrate (see FIG. 1).
  • a heat conductor 3 such as a heat conductive grease or a heat conductive sheet is interposed between the heat generating element 1 and the heat dissipating element 2 for the purpose of efficiently transferring heat to the heat dissipating element 2.
  • reworkability or “repairability”.
  • the heating element 1 and the radiator 2 are firmly fixed via the heat conductor 3, the heating element 1 and the radiator 2 are difficult to be separated from each other, or the heating element 1 or the There is a possibility that the radiator 2 or the like may be damaged, and the parts cannot be repaired or replaced.
  • JP 2009-096961 A Patent Document 1
  • a heat conductive filler having a predetermined particle size is dispersed in a polyorganosiloxane having a specific viscosity so that the heat generating element and the heat radiating element are not in an excessively close contact state.
  • a heat conductive grease with improved reworkability is disclosed.
  • the heat generating body and the heat radiating body are prevented from being excessively adhered, and the heat radiating body can be easily removed from the heat generating body (paragraph [0027], paragraph [0057], etc.). ).
  • JP 2011-246536 A discloses a thermally conductive grease that improves reworkability by blending a specific compound and controlling the hydrosilylation reaction. More specifically, by controlling the reaction, the consistency after curing is in a specific range, and both misalignment resistance and reworkability are achieved (paragraph [0040]).
  • This invention solves the problem in the non-cured grease that the material itself cannot maintain its shape and causes a shift, and the problem in the grease that is hardened and bonded that it is difficult to peel off the material without destroying the element. (Paragraph [0003]).
  • Patent Document 1 and Patent Document 2 it is easy to separate the heating element and the heat dissipation element, but in many cases, the residue 3 'remains on these adherends. As a result (see FIG. 2), considerable effort was required to clean off the residue 3 '.
  • Patent Document 1 and Patent Document 2 reference is made to peeling the heat radiating body from the heat generating element, but no mention is made of removing the heat conductive grease from the heat generating element or the heat radiating element.
  • Patent Document 3 a room temperature moisture-curing heat conductive silicone composition is applied in advance to a surface of a heat dissipation member and cured, and then placed on a heat-generating electronic component.
  • a technique for obtaining an electronic device is disclosed (paragraph [0005]).
  • the heat conductor is given strength at the expense of flexibility (the invention specifically shown in the examples is hard with a durometer type A hardness of 40 to 75).
  • the heat conductor itself can be prevented from being damaged. Therefore, there is an advantage that there is no generation of a residue that causes a problem in Patent Document 1 and Patent Document 2, and that it is not necessary to repaint the heat conductor after repair or replacement of parts (paragraph [0007]).
  • Patent Document 3 a hard heat conductor as disclosed in Patent Document 3 tends to have a high thermal resistance with the adherend, and in addition, there is a possibility that it cannot follow an uneven adherend. In addition, since it is difficult to remove the heat conductor from the heat radiating body, there is a problem in reworkability in the first place.
  • the sheet becomes strong and unbreakable, It can be removed relatively easily from the heating element.
  • the filling amount of the heat conductive filler tends to be small and the thermal conductivity tends to be low
  • the filling amount of the heat conductive filler is increased, the sheet becomes brittle and easily torn and difficult to peel off.
  • the residue remaining on the adherend is also in close contact with the adherend and is difficult to wipe off.
  • the heat conductor can be easily peeled off when the heating element and the heat dissipation element are separated. For example, as shown in FIG. 3, even if the heat generating body 1 and the heat radiating body 2 are separated and the heat conductor 3 remains on the heat radiating body 2 side ((i) of FIG. 3), the heat conductor 3 is removed from the heat radiating body 2. This is a case where it can be easily peeled off ((ii) in FIG. 3). Alternatively, as shown in FIG. 4, even if the heating element 1 and the radiator 2 are separated and the thermal conductor 3 remains on the heating element 1 side ((i) in FIG. 4), the thermal conductor 3 is removed from the heating element 1.
  • the residue 3' remaining on the heating element 1 and the radiator 2 can be easily wiped off.
  • the residue 3 'can be easily wiped off even if the heat generating body 1 and the heat radiating body 2 are separated and the residue 3 'of the heat conductor 3 remains on the heat generating body 1 side or the heat radiating body 2 side, This is a case where the residue 3 'can be easily wiped off.
  • the present invention has been made in order to obtain a heat conductor with good reworkability, and its first object is to provide a technique for easily peeling the heat conductor from a heat generator or a heat radiator.
  • a second object is to provide a technique that can be easily wiped off even if it is difficult to remove the residue.
  • the present invention provides the following thermally conductive composition in order to achieve the above-mentioned problems. That is, for a thermally conductive composition comprising a polymer matrix and a thermally conductive filler having an average particle size of 8.0 to 50 ⁇ m occupying 50 to 90% by volume, the particle size of the thermally conductive filler is It is a heat conductive composition whose particle
  • thermally conductive filler with an average particle size of 8.0 to 50 ⁇ m occupying 50 to 90% by volume in the polymer matrix, and 20% by volume or less of particles having a particle size of 5 ⁇ m or less with respect to the entire thermally conductive filler Therefore, it is a thermally conductive composition that is excellent in releasability from the adherend and that can be easily wiped off even if there is no unremoved or unremoved residue.
  • the heat conductive composition of the present invention has a hardness of E20 or less and an immiscibility penetration of 100 or less. Since the hardness is E20 or less and the immiscibility consistency is 100 or less, it becomes a rubber-like, gel-like, clay-like or putty-like thermally conductive composition, and even if residue remains on the adherend, it can be easily wiped off It is.
  • the thermally conductive composition of the present invention contains 25% by volume or more of particles having a particle size of more than 30 ⁇ m in the thermally conductive filler with respect to the entire thermally conductive filler. Since the proportion of particles having a particle size exceeding 30 ⁇ m is 25% by volume or more based on the entire thermally conductive filler, the thermally conductive composition has high thermal conductivity.
  • the heat conductive composition of this invention contains aluminum hydroxide and aluminum oxide as a heat conductive filler. Since the heat conductive filler contains aluminum hydroxide and aluminum oxide, the heat conductive composition is excellent in peelability and wiping property.
  • the reuse of the heat conductor when reworkability is a problem is not taken into consideration, and any heat generator and heat radiator can be used.
  • the reason is that the price of the heat conductor is generally lower than that of the heat generating body and the heat radiating body, and the problem of deterioration of the heat radiation characteristics due to the reuse of the heat conductor becomes larger.
  • the heat conductor can be easily peeled off from the heat radiating body or the heat generating body in the flexible heat conductive composition filled with the heat conductive filler. Moreover, even if it is difficult to peel off, it can be easily wiped off and has excellent reworkability.
  • FIG. 6 is a schematic cross-sectional view showing a state where a heat radiator is separated from a heat generator with a heat conductor, and further a heat conductor is separated from the heat generator.
  • FIG. 3 is a schematic cross-sectional view showing a state in which the heat conductor is divided into a heating element and a radiator, and the separated residue is separated from the heating element and the radiator.
  • the heat conductive composition described in the present embodiment includes a polymer matrix and a heat conductive filler having an average particle size of 8.0 to 50 ⁇ m occupying 50 to 90% by volume (vol%). It is an electroconductive composition, Comprising: The particle
  • the polymer matrix is a polymer such as rubber or elastomer. This can consist of a mixed system such as a main agent and a curing agent. Therefore, the polymer matrix can contain, for example, uncrosslinked rubber and a crosslinking agent, or can contain uncrosslinked rubber containing a crosslinking agent and a crosslinking accelerator.
  • the curing reaction between the main agent and the curing agent may be room temperature curing or heat curing. If the polymer matrix is a silicone-based polymer, a silicone rubber main component and a curing agent such as a vinyl group-containing silicone raw rubber and a peroxide can be exemplified.
  • a diol and a dicarboxylic acid can be used for a polyester-based thermoplastic elastomer or a polyamide-based thermoplastic elastomer, and a diisocyanate and a diol can be used for a polyurethane-based thermoplastic elastomer.
  • the main agent and the curing agent are distinguished by calling one of at least two components before mixing as the main agent and the other as the curing agent, which may be defined as the main agent or the curing agent. Therefore, for example, the lower mixing ratio and the lower viscosity can be used as the main agent. Moreover, even if it says a polymer matrix, the component which comprises it does not necessarily need to be a high molecular weight of the grade called a general resin or a polymer.
  • addition reaction type silicone examples include a combination of a polyorganosiloxane having an alkenyl group and an organohydrogenpolysiloxane. Such an addition reaction type silicone can easily fill the heat conductive filler in a high amount, and a flexible heat conductive composition can be obtained.
  • the polymer matrix may be any one of the main agent and the curing agent.
  • the properties of the polymer matrix tend to affect the properties of the thermally conductive composition.
  • the viscosity of the polymer matrix is preferably 100 to 10,000 mPa ⁇ s. If the viscosity is within this range, the adhesive force does not become too high, and a heat conductive composition having a certain degree of cohesion can be obtained, so that the heat conductive composition can be easily peeled off from the heating element and the heat dissipation element. It is easy to manufacture. When the viscosity is less than 100 mPa ⁇ s, the cohesive force becomes too low, so that the heat conductive composition is easily spread on the adherend and has poor wiping property. On the other hand, when the viscosity exceeds 10,000 mPa ⁇ s, it is difficult to highly fill the heat conductive filler, and the thermal conductivity may be lowered.
  • thermally conductive filler examples include fine powder made of metal, carbon, metal oxide, metal nitride, metal carbide, metal hydroxide, carbon fiber, and the like.
  • metal examples include copper and aluminum.
  • carbon examples include pitch-based carbon fiber, PAN-based carbon fiber, fiber obtained by carbonizing resin fiber, fiber obtained by graphitizing resin fiber, and graphite powder.
  • Such a thermally conductive filler can be oriented in a certain direction in the polymer matrix, and is preferable in terms of increasing the thermal conductivity in the oriented direction. When voltage resistance is required for the heat conductive sheet, it is preferable to use a heat conductive filler other than metal or carbon.
  • Examples of the metal oxide include aluminum oxide, magnesium oxide, zinc oxide, iron oxide, and quartz, and examples of the metal nitride include boron nitride and aluminum nitride.
  • examples of the metal carbide include silicon carbide, and examples of the metal hydroxide include aluminum hydroxide.
  • the shape of the heat conductive filler may be spherical or non-spherical, but preferably includes irregularly shaped particles. This is because it is considered that the amorphous particles are combined with the spherical particles, whereby the cohesive force is increased and the heat conductive composition is easily peeled off.
  • the average particle diameter of the heat conductive filler is 8.0 to 50 ⁇ m.
  • the particle size is less than 8.0 ⁇ m, the number of particles having a particle size of 5 ⁇ m or less is relatively increased, and the adherence of the heat conductive composition to the adherend becomes high, so that it is difficult to peel from the adherend.
  • the heat conductive filler of the small particle size which penetrates between the heat conductive fillers of a large particle size will decrease, and heat conductivity will worsen.
  • the particle size of 5 ⁇ m or less is 20% by volume or less, and more preferably 14% by volume or less. This is because if the proportion of particles having a particle size of 5 ⁇ m or less exceeds 20% by volume, the adherence of the thermally conductive composition to the adherend becomes high and it is difficult to remove it from the adherend. If it is 14 volume% or less, it is easier to peel off the heat conductive composition from the adherend.
  • the content of the entire heat conductive filler is 100% by volume, it is preferable to contain 25% by volume or more of particles having a particle size of 30 ⁇ m or more, and more preferably 30% by volume or more. This is because as the proportion of particles having a particle size of 30 ⁇ m or more increases, the thermal conductivity is easily increased.
  • the content of the said heat conductive filler you may make it use the several heat conductive filler from which an average particle diameter differs.
  • the heat conductive filler occupies 50 to 90% by volume in the heat conductive composition mixed with the polymer matrix, and more preferably 60 to 90% by volume. If it is less than 50% by volume, the thermal conductivity may be lowered. Moreover, there exists a possibility that the peelability from a to-be-adhered body may worsen. On the other hand, if it exceeds 90% by volume, the heat conductive composition does not become a lump, or even if it becomes a lump, the cohesive force becomes low and becomes brittle, so that it is difficult to peel off the adherend. If it is 60 to 90% by volume, it is excellent in peelability from the adherend and can be easily wiped even if there is no peeling residue.
  • the thermally conductive composition can contain various additives for the purpose of enhancing various properties such as productivity, weather resistance, and heat resistance.
  • additives include various functional improvers such as a plasticizer, a reinforcing material, a colorant, a heat resistance improver, a coupling agent, a flame retardant, a catalyst, a curing retarder, and a deterioration inhibitor.
  • the production of the heat conductive composition is performed by adding a heat conductive filler and other necessary additives to the polymer matrix and sufficiently stirring and dispersing. After mixing the heat conductive filler in one of the main component and the curing agent of the polymer matrix, either the main agent not containing the heat conductive filler and the curing agent may be mixed, A heat conductive filler may be mixed with both of the curing agents, and then the main agent and the curing agent may be mixed.
  • the obtained heat conductive composition is a rubber-like, gel-like, clay-like, or putty-like that does not flow enough to be deformed by its own weight, and is a grease-like one that is fluid enough to be deformed by its own weight. Is excluded. This is because the grease-like material remains when the heat-generating body and the heat-radiating body are peeled off, so that it is difficult to wipe off the residue.
  • the hardness of the thermally conductive composition is a value measured by a Japanese Industrial Standard JIS K-6253 type E hardness meter (hereinafter referred to as “E hardness”) in order to achieve a desired reworkability. 20, more preferably 0.
  • E hardness exceeds 20
  • sufficient conformity to the shape of the heating element or the heat radiating body is not obtained, and the adhesion between the heating element or the heat radiating body and the polymer matrix is reduced, and the heat of the heat conductive composition is reduced.
  • Conductivity may be reduced.
  • the polymer matrix follows well along the shape of the heating element and the heat dissipation element, and thus the adhesion between the heating element and the heat dissipation element and the heat conductive composition, and the heat conductivity Sufficient flexibility of the composition can be ensured. Therefore, these adherends can be suitably protected when the heat conductive composition absorbs the impact applied to the heat generator and the heat radiator.
  • the heat conductive composition may cohesively break down when the heating element and the heat radiating member are separated, and a residue may remain on the surface.
  • the E hardness is 20 or less, wiping can be performed, and if the E hardness is 0. It is easy to wipe off.
  • the immiscible consistency measured using a 1/4 cone according to JIS K 2220 (also simply referred to as “consistency”) is 100 or less. It is preferable that it is 90 or less.
  • the consistency exceeds 100 the heat conductive composition is excessively soft, and the adhesive force to the adherend becomes too high, and is easily broken when peeled off. Moreover, it becomes difficult to wipe off the residue remaining on the adherend. If the consistency is 90 or less, it is difficult to tear off when peeling, and the residue is easily wiped off.
  • the consistency is generally 60 or more.
  • Such a hardness value is a value after curing in the case of a thermally conductive composition comprising a polymer matrix obtained by mixing and curing a main agent and a curing agent.
  • Sample 1 As a polymer matrix, vinyl-terminated organopolysiloxane (liquid silicone main ingredient) which is an addition reaction type liquid silicone (viscosity at 25 ° C. is 300 mPa ⁇ s) 100 parts by weight (50% by volume), and a heat conductive filler 150 parts by weight (31% by volume) of thermally conductive filler 3 (aluminum hydroxide powder having an irregular shape and an average particle size of 10 ⁇ m) shown in Table 1 below, and thermally conductive filler 4 (spherical shape having an average particle size of 45 ⁇ m) 150 parts by weight (19% by volume) of alumina and 1 part by weight (less than 0.5% by volume) of a reaction retarder were mixed to prepare a main component of the heat conductive composition.
  • thermally conductive filler 3 aluminum hydroxide powder having an irregular shape and an average particle size of 10 ⁇ m
  • thermally conductive filler 4 spherical shape having an average particle size of 45 ⁇ m
  • organohydrogenpolysiloxane liquid silicone curing agent
  • a viscosity of 400 mPa ⁇ s is mixed with the same amount of the same heat conductive filler as the main agent (not including reaction retarder).
  • a curing agent of a thermally conductive composition having a different polymer matrix was prepared.
  • the heat conductive composition of the sample 1 was manufactured by mixing this main ingredient and a hardening
  • Table 2 shows the composition and test results described later.
  • the content of the reaction retardant is less than 0.5% by volume, it is not shown in Table 2, and the other component amounts are the total content other than the reaction retardant by rounding off the decimals. It is 100% by volume.
  • the average particle diameter of the thermally conductive filler in the table the content of particles of 5 ⁇ m or less, and the content of particles exceeding 30 ⁇ m (content of particles exceeding 30 ⁇ m) are measured by a laser diffraction particle size distribution analyzer (Cirrus Corporation). This is a value measured by Cilas-920).
  • the content of particles of 5 ⁇ m or less and the content of particles exceeding 30 ⁇ m in the table indicate the content ratio (volume%) of the corresponding particles with respect to the entire thermally conductive filler.
  • Sample 2 to Sample 13 Sample 2 to Sample 9 shown in Table 2 or Table 3 are the same as Sample 1 except that the thermally conductive filler added in Sample 1 is replaced with the materials and blending ratios shown in Table 2 or Table 3 below.
  • the heat conductive compositions of Sample 11 to Sample 13 were manufactured.
  • Sample 10 was produced in the same manner as Sample 2 except that the main polymer matrix was 40% by volume and the curing agent polymer matrix was 60% by volume.
  • Viscosity was measured immediately after mixing the main component of the heat conductive composition and the curing agent with a viscometer (rotary viscometer DV-E manufactured by Brook Field) using spindle No. The measurement was performed at a rotation speed of 1 rpm and a measurement temperature of 23 ° C. using 14 rotors.
  • ⁇ Peel test> The main component and curing agent of the thermally conductive composition are applied between a 1 mm thick stainless steel plate and an aluminum plate, fixed so that the distance between the stainless steel plate and the aluminum plate is 0.5 mm, and then heated at 120 ° C. for 60 minutes. And cured.
  • the aluminum plate was peeled from the stainless steel plate so that one end of the aluminum plate was lifted from the stainless steel plate (peeling 1).
  • the end portions of the heat conductive composition remaining on the stainless steel plate or the aluminum plate or both were picked, and the heat conductive composition was peeled off from the adherend (peeling 2).
  • peelability the heat-conductive composition was peeled off from the adherend without breaking, and the peelability was designated as “ ⁇ ”.
  • ⁇ indicates that it was difficult to peel off the adherend in close contact with the adherend, or that it was difficult to peel off the shredded pieces adhering to the adherend.
  • the heat conductive composition of each sample was formed into a sheet having a thickness of 1 mm to prepare a test piece for measuring thermal conductivity.
  • Each test piece was evaluated by measuring the thermal conductivity by a non-stationary thin wire heating method using a rapid thermal conductivity meter QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd.
  • a sample having a thermal conductivity of 1.4 W / m ⁇ K or higher was indicated by “ ⁇ ”, a sample having a thermal conductivity of 1.2 W / m ⁇ K or higher by “ ⁇ ”, and a sample having a thermal conductivity of 0.9 or less by “X”.
  • Sample 1 where the peelability and the amount of residue were “ ⁇ ” and the wipeability was “ ⁇ ”
  • Sample 3 where the peelability, the amount of residue and the wipeability were all “ ⁇ ” were all
  • the content of particles of 5 ⁇ m or less is 12.8 to 12.9% by volume.
  • Samples 4 to 9 which are all “x” in terms of peelability, residue amount, and wiping property, the content of particles of 5 ⁇ m or less is 27.2% by volume or more.
  • Sample 11 and sample 12 were “12” in all of the peelability, the amount of residue, and the wiping property, whereas the sample 7 having the same content of the heat conductive filler had the peelability.
  • the amount of residue and the wiping property were all “x”.
  • the maximum content of particles of 5 ⁇ m or less was 15.9% by volume, whereas in Sample 7, the content of particles of 5 ⁇ m or less was 27.2% by volume. From these facts, it is considered that the content of particles of 5 ⁇ m or less is 20% by volume or less, which is good for the releasability, the amount of residue and the wiping property.
  • Samples 2, 11, and 12 were “ ⁇ ” in all of the peelability, the amount of residue, and the wipeability. However, the thermal conductivity of Sample 2 and Sample 11 was “ ⁇ ”, whereas the thermal conductivity of Sample 12 was “ ⁇ ”.
  • the content of particles exceeding 30 ⁇ m in the thermally conductive filler was 32.5% by volume, in sample 11 it was as high as 41.9% by volume, whereas in sample 12, it was as low as 18.5% by volume.
  • the content of particles exceeding 30 ⁇ m is preferably 25% by volume or more, and more preferably 30% by volume or more.
  • thermally conductive filler in order to increase the thermal conductivity, it is preferable that a large amount of thermally conductive filler is contained in a possible range.
  • the viscosity of the thermally conductive composition tends to increase, and it is difficult to increase the filling amount by itself. Therefore, it is preferable to use a heat conductive filler with a large particle size in combination with a heat conductive filler with a small particle size, but it is better to have fewer particles with a particle size of 5 ⁇ m or less, so the average particle size is about 8 to 20 ⁇ m. It is considered preferable to use in combination with those having a medium particle size.
  • Sample 2 was “ ⁇ ” in all of peelability, amount of residue, and wipeability.
  • Sample 10 was “ ⁇ ” in terms of peelability and residue, but the wiping property was “ ⁇ ”.
  • Sample 2 and sample 10 contain the same amount of the same thermally conductive filler, but the amount of curing agent in the polymer matrix is different. That is, with regard to the wiping property, it can be seen that the hardness E0 of the sample 2 is more preferable than the hardness E20 of the sample 10, and a softer one is better.
  • the consistency of the thermally conductive composition is preferably 100 or less, and more preferably 90 or less.

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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Abstract

La présente invention concerne une composition thermoconductrice qui présente une bonne aptitude au repositionnement et donne un conducteur thermique qui peut être facilement pelée de l'élément chauffant et de l'objet de rayonnement de chaleur ou qui, même lorsque le pelage est difficile et que des résidus persistent, peut être facilement essuyée. La composition thermoconductrice comprend une matrice polymère et une charge thermoconductrice de 50 à 90 % en volume présentant un diamètre moyen de particule de 8 à 50 µm, la charge thermoconductrice comprenant des particules présentant chacune un diamètre de particule de 5 µm ou moins dans une quantité de 20 % en volume ou moins de la totalité de la charge thermoconductrice. La composition thermoconductrice présente une dureté de 20 ou moins en termes de dureté E et une pénétration non travaillée de 100 ou moins.
PCT/JP2016/051349 2015-01-29 2016-01-19 Composition thermoconductrice WO2016121563A1 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020095902A1 (fr) * 2018-11-09 2020-05-14 積水ポリマテック株式会社 Composition thermoconductrice, élément thermoconducteur, procédé de production d'un élément thermoconducteur, structure de dissipation thermique, élément composite de génération de chaleur, et élément composite de dissipation de chaleur
WO2021095507A1 (fr) * 2019-11-14 2021-05-20 信越化学工業株式会社 Composition de silicone thermoconductrice et feuille de silicone thermoconductrice
WO2023140006A1 (fr) * 2022-01-18 2023-07-27 信越化学工業株式会社 Composition de silicone thermoconductrice et dispositif semi-conducteur

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