DE60230142D1 - Wärmeleitende silikonzusammensetzung - Google Patents
Wärmeleitende silikonzusammensetzungInfo
- Publication number
- DE60230142D1 DE60230142D1 DE60230142T DE60230142T DE60230142D1 DE 60230142 D1 DE60230142 D1 DE 60230142D1 DE 60230142 T DE60230142 T DE 60230142T DE 60230142 T DE60230142 T DE 60230142T DE 60230142 D1 DE60230142 D1 DE 60230142D1
- Authority
- DE
- Germany
- Prior art keywords
- organosiloxane
- formula
- silicone composition
- heat conductive
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001143109 | 2001-05-14 | ||
JP2001151356 | 2001-05-21 | ||
JP2001221952 | 2001-07-23 | ||
PCT/JP2002/004642 WO2002092693A1 (fr) | 2001-05-14 | 2002-05-14 | Composition de silicone thermoconductrice |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60230142D1 true DE60230142D1 (de) | 2009-01-15 |
Family
ID=27346699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60230142T Expired - Lifetime DE60230142D1 (de) | 2001-05-14 | 2002-05-14 | Wärmeleitende silikonzusammensetzung |
Country Status (7)
Country | Link |
---|---|
US (1) | US7329706B2 (de) |
EP (1) | EP1403326B1 (de) |
JP (1) | JP4255287B2 (de) |
KR (1) | KR100858836B1 (de) |
AT (1) | ATE416235T1 (de) |
DE (1) | DE60230142D1 (de) |
WO (1) | WO2002092693A1 (de) |
Families Citing this family (104)
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JP4588285B2 (ja) * | 2002-01-25 | 2010-11-24 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物 |
JP4365067B2 (ja) * | 2002-05-14 | 2009-11-18 | 東レ・ダウコーニング株式会社 | 複合軟磁性体形成用硬化性シリコーン組成物および複合軟磁性体 |
US6783692B2 (en) * | 2002-10-17 | 2004-08-31 | Dow Corning Corporation | Heat softening thermally conductive compositions and methods for their preparation |
JP4587636B2 (ja) * | 2002-11-08 | 2010-11-24 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーン組成物 |
JP4646496B2 (ja) * | 2003-02-13 | 2011-03-09 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーン組成物 |
JP2004352947A (ja) * | 2003-05-30 | 2004-12-16 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
US20060079634A1 (en) * | 2003-05-30 | 2006-04-13 | Shin-Etsu Chemical Co., Ltd. | RTV heat conductive silicone rubber compositions |
TWI251320B (en) * | 2003-07-04 | 2006-03-11 | Fuji Polymer Ind | Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same |
JP4828429B2 (ja) | 2003-11-05 | 2011-11-30 | ダウ・コーニング・コーポレイション | 熱伝導性グリース、並びに前記グリースを用いる方法及びデバイス |
JP4557137B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
JP4557136B2 (ja) | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
DE102004046179A1 (de) * | 2004-09-23 | 2006-03-30 | Wacker Chemie Ag | Vernetzbare Massen auf der Basis von Organosiliciumverbindungen |
JP4590253B2 (ja) * | 2004-12-16 | 2010-12-01 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサンおよびシリコーン組成物 |
EP1833918B1 (de) | 2004-12-23 | 2011-09-28 | Dow Corning Corporation | Vernetzbare saccharid-siloxan-zusammensetzungen und daraus gebildete netzwerke, überzüge und artikel |
JP4931350B2 (ja) | 2005-01-05 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 複合シリコーンゴム粉末、その製造方法、塗料、および化粧料 |
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CN101627082B (zh) * | 2007-02-20 | 2014-06-25 | 道康宁公司 | 基于键合氢聚有机硅氧烷的填料处理剂 |
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JP4144998B2 (ja) * | 2000-06-26 | 2008-09-03 | 信越化学工業株式会社 | 放熱用部材 |
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- 2002-05-14 US US10/476,998 patent/US7329706B2/en not_active Expired - Lifetime
- 2002-05-14 JP JP2002589569A patent/JP4255287B2/ja not_active Expired - Lifetime
- 2002-05-14 DE DE60230142T patent/DE60230142D1/de not_active Expired - Lifetime
- 2002-05-14 WO PCT/JP2002/004642 patent/WO2002092693A1/ja active Application Filing
- 2002-05-14 AT AT02769587T patent/ATE416235T1/de not_active IP Right Cessation
- 2002-05-14 KR KR1020037014852A patent/KR100858836B1/ko active IP Right Grant
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US7329706B2 (en) | 2008-02-12 |
EP1403326A4 (de) | 2005-06-01 |
EP1403326B1 (de) | 2008-12-03 |
US20040254275A1 (en) | 2004-12-16 |
EP1403326A1 (de) | 2004-03-31 |
KR20030097869A (ko) | 2003-12-31 |
JPWO2002092693A1 (ja) | 2004-08-26 |
ATE416235T1 (de) | 2008-12-15 |
JP4255287B2 (ja) | 2009-04-15 |
KR100858836B1 (ko) | 2008-09-17 |
WO2002092693A1 (fr) | 2002-11-21 |
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