DE60230142D1 - Wärmeleitende silikonzusammensetzung - Google Patents

Wärmeleitende silikonzusammensetzung

Info

Publication number
DE60230142D1
DE60230142D1 DE60230142T DE60230142T DE60230142D1 DE 60230142 D1 DE60230142 D1 DE 60230142D1 DE 60230142 T DE60230142 T DE 60230142T DE 60230142 T DE60230142 T DE 60230142T DE 60230142 D1 DE60230142 D1 DE 60230142D1
Authority
DE
Germany
Prior art keywords
organosiloxane
formula
silicone composition
heat conductive
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60230142T
Other languages
English (en)
Inventor
H Fukui
M Sutoh
H Enami
M Onishi
T Okawa
S Onodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of DE60230142D1 publication Critical patent/DE60230142D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/045Polysiloxanes containing less than 25 silicon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60230142T 2001-05-14 2002-05-14 Wärmeleitende silikonzusammensetzung Expired - Lifetime DE60230142D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001143109 2001-05-14
JP2001151356 2001-05-21
JP2001221952 2001-07-23
PCT/JP2002/004642 WO2002092693A1 (fr) 2001-05-14 2002-05-14 Composition de silicone thermoconductrice

Publications (1)

Publication Number Publication Date
DE60230142D1 true DE60230142D1 (de) 2009-01-15

Family

ID=27346699

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60230142T Expired - Lifetime DE60230142D1 (de) 2001-05-14 2002-05-14 Wärmeleitende silikonzusammensetzung

Country Status (7)

Country Link
US (1) US7329706B2 (de)
EP (1) EP1403326B1 (de)
JP (1) JP4255287B2 (de)
KR (1) KR100858836B1 (de)
AT (1) ATE416235T1 (de)
DE (1) DE60230142D1 (de)
WO (1) WO2002092693A1 (de)

Families Citing this family (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4646357B2 (ja) * 2000-06-08 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4588285B2 (ja) * 2002-01-25 2010-11-24 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP4365067B2 (ja) * 2002-05-14 2009-11-18 東レ・ダウコーニング株式会社 複合軟磁性体形成用硬化性シリコーン組成物および複合軟磁性体
US6783692B2 (en) * 2002-10-17 2004-08-31 Dow Corning Corporation Heat softening thermally conductive compositions and methods for their preparation
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP4646496B2 (ja) * 2003-02-13 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
US20060079634A1 (en) * 2003-05-30 2006-04-13 Shin-Etsu Chemical Co., Ltd. RTV heat conductive silicone rubber compositions
TWI251320B (en) * 2003-07-04 2006-03-11 Fuji Polymer Ind Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same
JP4828429B2 (ja) 2003-11-05 2011-11-30 ダウ・コーニング・コーポレイション 熱伝導性グリース、並びに前記グリースを用いる方法及びデバイス
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4557136B2 (ja) 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
DE102004046179A1 (de) * 2004-09-23 2006-03-30 Wacker Chemie Ag Vernetzbare Massen auf der Basis von Organosiliciumverbindungen
JP4590253B2 (ja) * 2004-12-16 2010-12-01 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびシリコーン組成物
EP1833918B1 (de) 2004-12-23 2011-09-28 Dow Corning Corporation Vernetzbare saccharid-siloxan-zusammensetzungen und daraus gebildete netzwerke, überzüge und artikel
JP4931350B2 (ja) 2005-01-05 2012-05-16 東レ・ダウコーニング株式会社 複合シリコーンゴム粉末、その製造方法、塗料、および化粧料
JP4828146B2 (ja) 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
US20060264566A1 (en) * 2005-05-19 2006-11-23 Wacker Chemical Corporation HCR room temperature curable rubber composition
KR101261256B1 (ko) 2005-05-23 2013-05-07 다우 코닝 코포레이션 사카라이드-실록산 공중합체를 포함하는 퍼스널 케어조성물
JP2006328164A (ja) 2005-05-25 2006-12-07 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物
AU2006294663B2 (en) * 2005-09-26 2012-03-22 Medarex, Inc. Human monoclonal antibodies to CD70
US7823647B2 (en) 2005-10-06 2010-11-02 Baker Hughes Incorporated Process for foaming a wet hydrocarbon composition
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US7527873B2 (en) * 2006-02-08 2009-05-05 American Standard Circuits Thermally and electrically conductive interface
KR100729412B1 (ko) * 2006-03-15 2007-06-15 대일소재(주) 자기점착형 열전도성 젤 조성물 및 그 성형체
EP2005248A2 (de) * 2006-04-11 2008-12-24 Dow Corning Corporation Silikonverbundformen mit geringer thermischer verformung
WO2007139812A2 (en) 2006-05-23 2007-12-06 Dow Corning Corporation Novel silicone film former for delivery of actives
TWI419931B (zh) * 2006-06-16 2013-12-21 Shinetsu Chemical Co 導熱聚矽氧潤滑脂組成物
JP4514058B2 (ja) * 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
KR20090088946A (ko) * 2006-12-14 2009-08-20 메다렉스, 인코포레이티드 씨디70에 결합하는 인간 항체 및 이의 용도
CN101627082B (zh) * 2007-02-20 2014-06-25 道康宁公司 基于键合氢聚有机硅氧烷的填料处理剂
JP2008239719A (ja) 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
KR20150043545A (ko) * 2007-08-31 2015-04-22 캐보트 코포레이션 열 계면 물질
US8062742B2 (en) * 2007-12-03 2011-11-22 Seoung Kyu Oh Method for manufacturing silicone foam having an air permeable structure
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
WO2009136508A1 (ja) 2008-05-08 2009-11-12 富士高分子工業株式会社 熱伝導性樹脂組成物
KR100973701B1 (ko) * 2008-05-13 2010-08-04 성시민 호흡용 공기 압축기를 위한 공기 공급 장치
JP2010021533A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010018786A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
EP2223973A1 (de) * 2009-02-26 2010-09-01 Nitto Denko Corporation Metaloxidfeinpartikel, Silikonharzzusammensetzung und Verwendung davon
EP2408860B1 (de) 2009-03-16 2020-03-18 Dow Silicones Corporation Wärmeleitfähiges schmierfett sowie dieses fett verwendende verfahren und vorrichtungen
US20120231197A1 (en) * 2009-11-09 2012-09-13 Upm Raflatac Oy Release liner for label laminate
JP2011140566A (ja) * 2010-01-07 2011-07-21 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
JP5619487B2 (ja) * 2010-06-24 2014-11-05 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
WO2012027073A1 (en) 2010-08-23 2012-03-01 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
JP5874637B2 (ja) 2010-08-25 2016-03-02 日産化学工業株式会社 膜形成用組成物
JP4917184B1 (ja) * 2010-10-01 2012-04-18 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 高電圧電気絶縁部品用液状シリコーンゴム組成物
JP2012077256A (ja) * 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
KR101043201B1 (ko) * 2010-11-08 2011-06-21 성시민 공기 충전 압축기용 흡입 필터
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5733087B2 (ja) * 2011-07-29 2015-06-10 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
CN102408869B (zh) * 2011-08-04 2013-07-24 绵阳惠利电子材料有限公司 无卤阻燃电子电器用加成型有机硅灌封胶
JP5699901B2 (ja) * 2011-10-24 2015-04-15 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2012052137A (ja) * 2011-11-28 2012-03-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
JP5664563B2 (ja) * 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5783128B2 (ja) 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
KR102041096B1 (ko) 2012-07-30 2019-11-07 다우 실리콘즈 코포레이션 열 전도성 축합 반응 경화성 폴리오가노실록산 조성물 및 조성물의 제조 방법 및 사용 방법
CA2896300C (en) 2013-01-22 2020-10-27 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone composition, heat conductive layer, and semiconductor device
US9070660B2 (en) * 2013-03-15 2015-06-30 Intel Corporation Polymer thermal interface material having enhanced thermal conductivity
JP5898139B2 (ja) 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6075261B2 (ja) * 2013-10-02 2017-02-08 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
CN105764992A (zh) * 2013-10-17 2016-07-13 道康宁东丽株式会社 可固化有机硅组合物和光半导体装置
JP6569036B2 (ja) * 2013-10-17 2019-09-04 ダウ・東レ株式会社 硬化性シリコーン組成物および光半導体装置
EP3141583B1 (de) * 2014-04-09 2021-03-10 Dow Toray Co., Ltd. Wärmeleitfähige silikonzusammensetzung und elektrische/elektronische vorrichtung
CN106715592A (zh) 2014-09-25 2017-05-24 信越化学工业株式会社 紫外线增稠型导热性硅润滑脂组合物
JP5846323B2 (ja) * 2015-01-22 2016-01-20 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
WO2016121563A1 (ja) * 2015-01-29 2016-08-04 ポリマテック・ジャパン株式会社 熱伝導性組成物
WO2016190189A1 (ja) * 2015-05-22 2016-12-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JP6223590B2 (ja) * 2015-05-22 2017-11-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性組成物
JP6524879B2 (ja) 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
JP6642145B2 (ja) 2016-03-14 2020-02-05 信越化学工業株式会社 付加一液加熱硬化型熱伝導性シリコーングリース組成物の硬化物の製造方法
US10002857B2 (en) * 2016-04-12 2018-06-19 Qualcomm Incorporated Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer
US9725577B1 (en) * 2016-08-30 2017-08-08 International Business Machines Corporation Self-healing thermal interface materials
KR101872199B1 (ko) * 2016-12-13 2018-06-28 비엔비머티리얼 주식회사 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법
KR102166470B1 (ko) 2017-05-16 2020-10-16 주식회사 엘지화학 수지 조성물
JP7160508B2 (ja) 2017-07-24 2022-10-25 ダウ・東レ株式会社 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
EP3660101B1 (de) * 2017-07-24 2024-10-02 Dow Toray Co., Ltd. Wärmeleitende silikongelzusammensetzung, wärmeleitendes element und wärmeableitstruktur
JP7094960B2 (ja) 2017-07-24 2022-07-04 ダウ・東レ株式会社 多成分硬化型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
CN111148793B (zh) * 2017-09-29 2022-07-08 美国陶氏有机硅公司 包含填料的有机硅组合物
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
JP6919716B2 (ja) 2017-11-09 2021-08-18 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US10968351B2 (en) * 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US10941251B2 (en) * 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
WO2020093258A1 (en) 2018-11-07 2020-05-14 Dow Global Technologies Llc Thermally conductive composition and methods and devices in which said composition is used
CN109722218B (zh) * 2018-12-25 2021-05-04 烟台德邦科技股份有限公司 一种耐电解液密封胶及其制备方法
CN113519051A (zh) 2019-03-29 2021-10-19 陶氏东丽株式会社 多组分导热硅酮凝胶组合物、导热部件以及散热结构体
EP3951858A4 (de) * 2019-03-29 2022-12-28 Dow Toray Co., Ltd. Härtbare mehrkomponenten-organopolysiloxanzusammensetzung, wärmeleitendes element und wärmeableitstruktur
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR20220024818A (ko) 2019-06-24 2022-03-03 신에쓰 가가꾸 고교 가부시끼가이샤 고열전도성 실리콘 조성물 및 그 경화물
KR102172003B1 (ko) * 2019-11-28 2020-11-02 (주)매그나텍 접착제 대체 기판 제조 방법
CN111393855A (zh) * 2020-03-18 2020-07-10 平湖阿莱德实业有限公司 一种具有优异耐候性的高导热凝胶组合物
WO2022009486A1 (ja) * 2020-07-07 2022-01-13 富士高分子工業株式会社 熱伝導性シリコーンゲル組成物、熱伝導性シリコーンゲルシート及びその製造方法
EP4039750A4 (de) * 2020-07-07 2023-01-25 Fuji Polymer Industries Co., Ltd. Wärmeleitende silikongelzusammensetzung und wärmeleitende silikongelfolie und verfahren zum produzieren derselben
CN115885381A (zh) * 2020-08-21 2023-03-31 陶氏东丽株式会社 固化性聚有机硅氧烷组合物、导热性构件以及散热结构体
EP4013800B1 (de) * 2020-10-28 2024-06-19 Dow Silicones Corporation Trialkoxyfunktionelle verzweigte siloxanzusammensetzungen
WO2022179972A1 (en) 2021-02-23 2022-09-01 Byk-Chemie Gmbh Polysiloxane dispersing agent
WO2023283819A1 (en) * 2021-07-14 2023-01-19 Dow Silicones Corporation Thermal conductive silicone composition
KR20240037182A (ko) 2021-07-29 2024-03-21 세키수이 폴리머텍 가부시키가이샤 열전도성 조성물 및 경화물
KR20240056092A (ko) * 2022-10-21 2024-04-30 부산대학교 산학협력단 방열용 피커링 에멀젼 조성물, 이를 이용한 방열 페이스트 및 이의 제조방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251466A (ja) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
JP2876017B2 (ja) * 1987-10-27 1999-03-31 松下電工株式会社 モニタカメラ用方向調整装置及び人体検出器用方向調整装置
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
JP2550749B2 (ja) * 1990-05-07 1996-11-06 信越化学工業株式会社 硬化性シリコーン組成物及び硬化物
JPH0767784B2 (ja) * 1990-10-11 1995-07-26 信越化学工業株式会社 シリコーンゴム積層体及びその製造方法
JP2741436B2 (ja) * 1991-06-24 1998-04-15 信越化学工業株式会社 表面処理アルミナ及びそれを含有する熱伝導性シリコーン組成物
JP2857725B2 (ja) * 1991-08-05 1999-02-17 株式会社日立製作所 樹脂封止型半導体装置
JP3576639B2 (ja) * 1995-05-29 2004-10-13 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴム組成物
JPH10130504A (ja) * 1996-10-29 1998-05-19 Toray Dow Corning Silicone Co Ltd シリコーンゴム組成物
JP4015722B2 (ja) * 1997-06-20 2007-11-28 東レ・ダウコーニング株式会社 熱伝導性ポリマー組成物
JP3195277B2 (ja) * 1997-08-06 2001-08-06 信越化学工業株式会社 熱伝導性シリコーン組成物
JP3543663B2 (ja) * 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
JP4727017B2 (ja) * 1999-11-15 2011-07-20 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4623244B2 (ja) * 2000-04-11 2011-02-02 信越化学工業株式会社 電磁波吸収性熱伝導性シリコーンゴム組成物
JP4646357B2 (ja) * 2000-06-08 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4144998B2 (ja) * 2000-06-26 2008-09-03 信越化学工業株式会社 放熱用部材
JP3719382B2 (ja) * 2000-10-25 2005-11-24 信越化学工業株式会社 電磁波吸収性シリコーンゴム組成物

Also Published As

Publication number Publication date
US7329706B2 (en) 2008-02-12
EP1403326A4 (de) 2005-06-01
EP1403326B1 (de) 2008-12-03
US20040254275A1 (en) 2004-12-16
EP1403326A1 (de) 2004-03-31
KR20030097869A (ko) 2003-12-31
JPWO2002092693A1 (ja) 2004-08-26
ATE416235T1 (de) 2008-12-15
JP4255287B2 (ja) 2009-04-15
KR100858836B1 (ko) 2008-09-17
WO2002092693A1 (fr) 2002-11-21

Similar Documents

Publication Publication Date Title
DE60230142D1 (de) Wärmeleitende silikonzusammensetzung
DE602004005670D1 (de) Wärmeleitfähige siliconzusammensetzung
KR840000609A (ko) 저온성 실리콘 겔
JP2005523342A5 (de)
AU573348B2 (en) Silicone emulsion
ATE430175T1 (de) Organopolysiloxan und silikonzusammensetzung
EP1213316A3 (de) Mit mehrwertigem Alkohol modifizierte Siloxane und kosmetische Mittel
DE60236946D1 (de) Polysiloxane und deren herstellung
TW200513499A (en) Silicones having improved surface properties and curable silicone compositions for preparing the silicones
DE60017223D1 (de) Schaumregulierungsmittel auf Basis von Silikon
ATE331772T1 (de) Wasserabweisende organosilikonzusammensetzung
JPS57159865A (en) Primer composition for bonding
DE602004026452D1 (de) Silikonelastomerklebefolie
KR890006757A (ko) I성분 폴리실옥산 실온 경화성 조성물
RU2014107697A (ru) Композиция теплопроводящей силиконовой пластичной смазки, загущающейся при комнатной температуре и влажности
KR870006066A (ko) 경화성 폴리오르가노 실옥산 조성물
JP2003026925A5 (de)
EP1505122A4 (de) Härtbare silikonzusammensetzung zur herstellung von weichmagnetischen verbundwerkstoffen und weichmagnetische verbundwerkstoffe
KR900014527A (ko) 오르가노실리콘 수지 피복 조성물
DE60218723D1 (de) Saccharide-enthaltende funktionelle organopolysiloxane und verfahren zu deren herstellung
KR870010124A (ko) 이형 필름용 실리콘 조성물
KR940014725A (ko) 실리콘 압력-민감성 접착제용 오르가노하이드로젠폴리실옥산 가교결합제
JPH0339552B2 (de)
KR890002340A (ko) 폴리오르가노 실록산 조성물
KR890017315A (ko) 경화성 폴리오르가노 실록산 조성물

Legal Events

Date Code Title Description
8364 No opposition during term of opposition