DE602004005670D1 - Wärmeleitfähige siliconzusammensetzung - Google Patents

Wärmeleitfähige siliconzusammensetzung

Info

Publication number
DE602004005670D1
DE602004005670D1 DE602004005670T DE602004005670T DE602004005670D1 DE 602004005670 D1 DE602004005670 D1 DE 602004005670D1 DE 602004005670 T DE602004005670 T DE 602004005670T DE 602004005670 T DE602004005670 T DE 602004005670T DE 602004005670 D1 DE602004005670 D1 DE 602004005670D1
Authority
DE
Germany
Prior art keywords
sup
silicone composition
heat
resistant silicone
integer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004005670T
Other languages
English (en)
Other versions
DE602004005670T2 (de
Inventor
H Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of DE602004005670D1 publication Critical patent/DE602004005670D1/de
Application granted granted Critical
Publication of DE602004005670T2 publication Critical patent/DE602004005670T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
DE602004005670T 2003-02-13 2004-02-09 Wärmeleitfähige siliconzusammensetzung Expired - Lifetime DE602004005670T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003034744A JP4646496B2 (ja) 2003-02-13 2003-02-13 熱伝導性シリコーン組成物
JP2003034744 2003-02-13
PCT/JP2004/001356 WO2004072181A2 (en) 2003-02-13 2004-02-09 Thermoconductive silicone composition

Publications (2)

Publication Number Publication Date
DE602004005670D1 true DE602004005670D1 (de) 2007-05-16
DE602004005670T2 DE602004005670T2 (de) 2007-12-27

Family

ID=32866278

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004005670T Expired - Lifetime DE602004005670T2 (de) 2003-02-13 2004-02-09 Wärmeleitfähige siliconzusammensetzung

Country Status (9)

Country Link
US (1) US7291671B2 (de)
EP (1) EP1592749B1 (de)
JP (1) JP4646496B2 (de)
KR (1) KR100997372B1 (de)
AT (1) ATE358699T1 (de)
DE (1) DE602004005670T2 (de)
MY (1) MY135170A (de)
TW (1) TWI332518B (de)
WO (1) WO2004072181A2 (de)

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JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN101375395B (zh) 2006-01-26 2012-10-03 迈图高新材料日本合同公司 散热材料以及使用该材料的半导体装置
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JP4495749B2 (ja) * 2006-06-16 2010-07-07 信越化学工業株式会社 熱伝導性シリコーングリース組成物
TWI419931B (zh) * 2006-06-16 2013-12-21 Shinetsu Chemical Co 導熱聚矽氧潤滑脂組成物
EP1878767A1 (de) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Wärmeleitende Silikonfettzusammensetzung und gehärtetes Produkt daraus
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CN102648501A (zh) 2009-12-04 2012-08-22 Abb研究有限公司 高压电涌避雷器
JP5534837B2 (ja) * 2010-01-28 2014-07-02 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5365572B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5619487B2 (ja) 2010-06-24 2014-11-05 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP2012077256A (ja) * 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5733087B2 (ja) * 2011-07-29 2015-06-10 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5699901B2 (ja) * 2011-10-24 2015-04-15 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2012052137A (ja) * 2011-11-28 2012-03-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
WO2014021980A1 (en) 2012-07-30 2014-02-06 Dow Corning Corporation Thermally conductive condensation reaction curable polyorganosiloxane composition and methods for the preparation and use of the composition
CN104684971A (zh) * 2012-09-28 2015-06-03 丹麦技术大学 机械不可见的聚合物涂层
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物
WO2014129805A1 (ko) * 2013-02-21 2014-08-28 제일모직주식회사 열전도성 수지 조성물
EP3191549A4 (de) * 2014-08-06 2018-03-28 Dow Corning Corporation Organosiloxanzusammensetzungen und deren verwendungen
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CN104887109A (zh) * 2015-05-21 2015-09-09 蚌埠市耀得保温容器有限公司 一种使用寿命长耐热耐腐蚀保温瓶
CN106519700A (zh) * 2015-09-09 2017-03-22 中兴通讯股份有限公司 一种高导热复合界面材料及其制备方法
JP6553520B2 (ja) * 2016-01-14 2019-07-31 信越化学工業株式会社 熱伝導性硬化物、該硬化物を有する粘着テープ及び粘着シート
CN108250752A (zh) * 2016-12-28 2018-07-06 上海邦中新材料有限公司 一种高分子导热复合材料及其制备方法
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EP3688097B1 (de) * 2017-09-29 2024-05-15 Dow Silicones Corporation Silikonzusammensetzung mit füllstoff
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JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
JP7170450B2 (ja) * 2018-07-31 2022-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物及び半導体装置
CN109909494B (zh) * 2019-03-14 2021-05-04 昆山市中迪新材料技术有限公司 一种高导热粉体及其制备方法和应用
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Also Published As

Publication number Publication date
EP1592749B1 (de) 2007-04-04
US7291671B2 (en) 2007-11-06
US20060135687A1 (en) 2006-06-22
MY135170A (en) 2008-02-29
DE602004005670T2 (de) 2007-12-27
JP2004262972A (ja) 2004-09-24
KR100997372B1 (ko) 2010-11-30
EP1592749A2 (de) 2005-11-09
JP4646496B2 (ja) 2011-03-09
KR20050106009A (ko) 2005-11-08
TW200427781A (en) 2004-12-16
ATE358699T1 (de) 2007-04-15
WO2004072181A3 (en) 2005-02-24
WO2004072181A2 (en) 2004-08-26
TWI332518B (en) 2010-11-01

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