KR910020066A - 오가노하이드로겐폴리실록산 및 이를 함유하는 경화성 오가노실록산 조성물 - Google Patents

오가노하이드로겐폴리실록산 및 이를 함유하는 경화성 오가노실록산 조성물 Download PDF

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KR910020066A
KR910020066A KR1019910008529A KR910008529A KR910020066A KR 910020066 A KR910020066 A KR 910020066A KR 1019910008529 A KR1019910008529 A KR 1019910008529A KR 910008529 A KR910008529 A KR 910008529A KR 910020066 A KR910020066 A KR 910020066A
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integer
group
organohydrogenpolysiloxane
silicon
bonded
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KR1019910008529A
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KR0175320B1 (ko
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아츠시 토가시
아키라 가스야
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아오키 가즈미
다우 코닝 토레이 실리콘 캄파니, 리미티드
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Priority claimed from JP14280790A external-priority patent/JP3178827B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/485—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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Abstract

내용 없음

Description

오가노하이드로겐폴리실록산 및 이를 함유하는 경화성 오가노실록산 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. 5개 이상의 실리콘 원자의 선형 서열을 함유하고 : 분자당 3개 이상의 실리콘-결합한 수소원자, 하나 이상의 에폭시-함유 그룹 및 하나 이상의 트리알콕시실릴 알킬 그룹을 함유하는 [여기에서 에폭시-함유 그룹 및 트리알콕시실릴알킬 그룹이 2개 이상의 탄소원자를 통해 각기 다른 실리콘 원자에 결합하며, 실리콘에 결합한 유기그룹이 일가 탄화수소 또는 할로겐화된 탄화수소 라디칼이다]오가노하이드로겐폴리실록산.
  2. 제1항에 있어서, 유기 그룹의 50%이상이 메틸이고, 나머지는 페닐 및 3,3,3-트리플루오로프로필로 구성된 그룹으로부터 선택된 오가노하이드로겐폴리실록산.
  3. 제2항에 있어서, 하기 그룹으로부터 선택된 오가노하이드로겐폴리실록산.
    상기식에서, m 및 p는 1이상의 정수이고, n은 0또는 1이상의 정수이며, q는 3이상의 정수이고, r 및 u는 1이상의 정수이며, s는 0 또는 1이상의 정수이고, t는 3이상의 정수이며, v는 0 또는 1이상의 정수이고, w는 3이상의 정수이다.
  4. A)분자당 2개 이상의 실리콘-결합된 알케닐 라디칼을 함유하며, 평균 단위 일반식 RaSiO(4-a)/2(여기에서,R은 일가 탄화수소 또는 할로겐화 탄화수소 라디칼을 나타내며, a값은 1.0내지 2.3이다)로 표시되는 오가노플리실록산, B)1차 분자 구조로서 5개 이상의 실록산 단위의 선형 서열 및 3개 이상의 실리콘-결합된 수소원자를함유하는 오가노하이드로겐플리실록산, 및 C)하이드로실릴화-반응 촉매를 함유하는 경화성 오가노실록산 조성물에 있어서, 상기 오가노하이드로겐플리실록산중에 하나 이상의 트리알콕시실릴알킬 그룹 및 하나 이상의에폭시 그룹-함유 유기 그룹(여기에서, 트리알콕시실릴알킬 및 에폭시-함유 그룹은 2개 이상의 탄소원자를통하여 각기 다른 실리콘 원자에 결합된다)이 추가로 함유된 개성물 조성물.
  5. 제4항에 있어서, 알케닐 라디칼이 비닐이고, R로 나타낸 나머지 라디칼이 메틸, 페닐 및 3,3,3-트리플루오로프로필로 구성된 그룹으로부터 선택되고, 하이드로실릴화-반응 촉매가 백금-함유 화합물 또는 착물이며, 오가노하이드로겐폴리 실록산이 하기 그룹중에서 선택된 조성물.
    상기식에서, m 및 p는 1이상의 정수이고, n은 0또는 1이상의 정수이며, q는 3이상의 정수이며, r 및 u는 1이상의 정수이고, s는 0또는 1이상의 정수이고, t는 3이상의 정수이며, v는 0또는 1이상의 정수이고, w는 3이상의 정수이다.
  6. 제4항에 있어서, 하이드로실릴화 반응촉매가 0.01중량%이상의 촉매를 함유하는 미립자 열가소성 수지 형태이고, 열가소성 수지가 50내지 200℃의 연화점을 가지며, 미립자 열가소성 수지의 평균 입자 직경이 0.01내지 100마이크로미터인 조성물.
  7. 제6항에 있어서, 열가소성 수지가 실리콘 수지인 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910008529A 1990-05-25 1991-05-25 오가노하이드로겐폴리실록산 및 이를 함유하는 경화성 오가노실록산 조성물 KR0175320B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP136839/90 1990-05-25
JP13683990A JP3178825B2 (ja) 1990-05-25 1990-05-25 硬化性オルガノポリシロキサン組成物
JP14280790A JP3178827B2 (ja) 1990-05-31 1990-05-31 加熱硬化性オルガノポリシロキサン組成物
JP142807/90 1990-05-31

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KR0175320B1 KR0175320B1 (ko) 1999-04-01

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US (1) US5232959A (ko)
EP (1) EP0458355B1 (ko)
KR (1) KR0175320B1 (ko)
CA (1) CA2043134C (ko)
DE (1) DE69110548T2 (ko)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069362B2 (ja) * 1990-06-08 2000-07-24 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性オルガノポリシロキサン組成物
JP2511348B2 (ja) * 1991-10-17 1996-06-26 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
JP3161786B2 (ja) * 1991-11-20 2001-04-25 東レ・ダウコーニング・シリコーン株式会社 オルガノポリシロキサンおよびその製造方法
US5494750A (en) * 1993-05-10 1996-02-27 Shin-Etsu Chemical Co., Ltd. Heat-curable silicone elastomer composition
JP2967900B2 (ja) * 1993-11-04 1999-10-25 矢崎総業株式会社 コネクタ防水用シール部品
US5399651A (en) 1994-05-10 1995-03-21 Dow Corning Corporation Adhesion promoting additives and low temperature curing organosiloxane compositions containing same
US5516823A (en) * 1994-05-10 1996-05-14 Dow Corning Corporation Adhesion promoting compositions and curable organosiloxane compositions containing same
US5492994A (en) * 1995-01-12 1996-02-20 Dow Corning Corporation Adhesion additives and curable organosiloxane compositions containing same
JPH08325381A (ja) * 1995-05-31 1996-12-10 Toray Dow Corning Silicone Co Ltd 有機ケイ素化合物およびその製造方法
JP3239717B2 (ja) * 1995-09-29 2001-12-17 信越化学工業株式会社 硬化性組成物
FR2749850B1 (fr) * 1996-06-12 1998-09-04 Rhone Poulenc Chimie Procede d'hydrosilylation avec des huiles silicones et des motifs contenant au moins un cycle hydrocarbone dans lequel est inclus un atome d'oxygene en presence d'une composition catalytique
US6077892A (en) * 1998-09-04 2000-06-20 Dow Corning Corporation Curable polyolefin compositions containing organosilicon compounds as adhesion additives
US6270897B1 (en) 1999-07-29 2001-08-07 Owens Corning Fiberglas Technology, Inc. Coupling-agent system for composite fibers
US6284861B1 (en) * 1999-12-13 2001-09-04 Dow Corning Toray Silicone, Ltd. Silicone rubber composition
ATE430178T1 (de) * 2001-12-06 2009-05-15 Jamaak Fabrication Tex Llc Verbesserter scheibenwischer mit verbesserten reibungseigenschaften
US7090923B2 (en) * 2003-02-12 2006-08-15 General Electric Corporation Paper release compositions having improved adhesion to paper and polymeric films
US7997439B2 (en) * 2003-06-06 2011-08-16 Jamak Fabrication-Tex, Llc Flexible bakeware having a multi-piece carrier system
US20050247212A1 (en) * 2003-06-06 2005-11-10 Steve Meeks Flexible bakeware having an improved carrier system with tabs and attachment apertures
US20050199131A1 (en) * 2003-06-06 2005-09-15 Steve Meeks Flexible bakeware having a carrier system disposed within a wall of the bakeware
US7282532B2 (en) * 2003-06-06 2007-10-16 M Management-Tex, Ltd. Flexible bakeware
US20050193899A1 (en) * 2003-06-06 2005-09-08 Deblassie Russell T. Flexible bakeware having a clam shell carrier system
US7966970B2 (en) 2005-07-19 2011-06-28 M Management-Tex, Llc Dairy inflation
KR20090031892A (ko) * 2006-06-06 2009-03-30 애브리 데니슨 코포레이션 접착 촉진 첨가제
US20090247680A1 (en) * 2006-06-06 2009-10-01 Avery Dennison Corporation Adhesion promoting additive
US8017246B2 (en) * 2007-11-08 2011-09-13 Philips Lumileds Lighting Company, Llc Silicone resin for protecting a light transmitting surface of an optoelectronic device
JP5748512B2 (ja) * 2011-03-07 2015-07-15 信越化学工業株式会社 付加硬化型自己接着性シリコーンゴム組成物
US20150259584A1 (en) * 2014-03-11 2015-09-17 Randall D. Lowe, JR. Integrated heat spreader sealants for microelectronic packaging

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3761444A (en) * 1969-08-18 1973-09-25 Union Carbide Corp Equilibration of epoxy substituted siloxanes in presence of water andsilanol
JPS5128310B2 (ko) * 1973-08-13 1976-08-18
JPS5133540B2 (ko) * 1973-10-08 1976-09-20
JPS5224258A (en) * 1975-08-19 1977-02-23 Toray Silicone Co Ltd Curable organopolysiloxane composition
JPS52146499A (en) * 1976-05-31 1977-12-06 Shin Etsu Chem Co Ltd Curable organopolysiloxane composition
US4245079A (en) * 1979-02-16 1981-01-13 Toshiba Silicone Co., Ltd. Curable organopolysiloxane composition
DE3131734A1 (de) * 1981-08-11 1983-02-24 Bayer Ag, 5090 Leverkusen Hitzehaertbare organopolysiloxan-mischungen
JPS61200129A (ja) * 1985-02-28 1986-09-04 Toray Silicone Co Ltd 新規なオルガノポリシロキサン化合物およびその製造方法
JPS61296749A (ja) * 1985-06-25 1986-12-27 Toray Silicone Co Ltd 半導体装置用リードフレームの製造方法
JPS62240360A (ja) * 1986-04-02 1987-10-21 Shin Etsu Chem Co Ltd 硬化可能なオルガノポリシロキサン組成物
JPS63295768A (ja) * 1987-05-26 1988-12-02 東レ・ダウコーニング・シリコーン株式会社 繊維用処理剤
US4874667A (en) * 1987-07-20 1989-10-17 Dow Corning Corporation Microencapsulated platinum-group metals and compounds thereof
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JPH02298549A (ja) * 1989-05-12 1990-12-10 Shin Etsu Chem Co Ltd 接着性組成物

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US5232959A (en) 1993-08-03
DE69110548T2 (de) 1995-11-23
CA2043134A1 (en) 1991-11-26
EP0458355B1 (en) 1995-06-21
DE69110548D1 (de) 1995-07-27
CA2043134C (en) 1998-08-25
EP0458355A3 (en) 1992-04-29
KR0175320B1 (ko) 1999-04-01
EP0458355A2 (en) 1991-11-27

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