ATE358699T1 - Wärmeleitfähige siliconzusammensetzung - Google Patents

Wärmeleitfähige siliconzusammensetzung

Info

Publication number
ATE358699T1
ATE358699T1 AT04709348T AT04709348T ATE358699T1 AT E358699 T1 ATE358699 T1 AT E358699T1 AT 04709348 T AT04709348 T AT 04709348T AT 04709348 T AT04709348 T AT 04709348T AT E358699 T1 ATE358699 T1 AT E358699T1
Authority
AT
Austria
Prior art keywords
sup
silicone composition
thermally conductive
conductive silicone
integer
Prior art date
Application number
AT04709348T
Other languages
English (en)
Inventor
H Fukui
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE358699T1 publication Critical patent/ATE358699T1/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
AT04709348T 2003-02-13 2004-02-09 Wärmeleitfähige siliconzusammensetzung ATE358699T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003034744A JP4646496B2 (ja) 2003-02-13 2003-02-13 熱伝導性シリコーン組成物

Publications (1)

Publication Number Publication Date
ATE358699T1 true ATE358699T1 (de) 2007-04-15

Family

ID=32866278

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04709348T ATE358699T1 (de) 2003-02-13 2004-02-09 Wärmeleitfähige siliconzusammensetzung

Country Status (9)

Country Link
US (1) US7291671B2 (de)
EP (1) EP1592749B1 (de)
JP (1) JP4646496B2 (de)
KR (1) KR100997372B1 (de)
AT (1) ATE358699T1 (de)
DE (1) DE602004005670T2 (de)
MY (1) MY135170A (de)
TW (1) TWI332518B (de)
WO (1) WO2004072181A2 (de)

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TWI419931B (zh) * 2006-06-16 2013-12-21 信越化學工業股份有限公司 導熱聚矽氧潤滑脂組成物
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GB0616021D0 (en) 2006-08-14 2006-09-20 Dow Corning Silicone release coating compositions
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JP5507059B2 (ja) * 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP5300408B2 (ja) * 2008-10-21 2013-09-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
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JP5365572B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5619487B2 (ja) 2010-06-24 2014-11-05 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP2012077256A (ja) * 2010-10-06 2012-04-19 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5733087B2 (ja) * 2011-07-29 2015-06-10 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5699901B2 (ja) * 2011-10-24 2015-04-15 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2012052137A (ja) * 2011-11-28 2012-03-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物
EP2882821B1 (de) 2012-07-30 2020-06-03 Dow Silicones Corporation Wärmeleitende, durch kondensationsreaktion härtbare polyorganosiloxanzusammensetzung und verfahren zur herstellung und verwendung der zusammensetzung
WO2014049102A1 (en) * 2012-09-28 2014-04-03 Danmarks Tekniske Universitet Mechanically invisible polymer coatings
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物
WO2014129805A1 (ko) * 2013-02-21 2014-08-28 제일모직주식회사 열전도성 수지 조성물
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CN106519700A (zh) * 2015-09-09 2017-03-22 中兴通讯股份有限公司 一种高导热复合界面材料及其制备方法
JP6553520B2 (ja) * 2016-01-14 2019-07-31 信越化学工業株式会社 熱伝導性硬化物、該硬化物を有する粘着テープ及び粘着シート
CN108250752A (zh) * 2016-12-28 2018-07-06 上海邦中新材料有限公司 一种高分子导热复合材料及其制备方法
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JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
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JP7140040B2 (ja) * 2019-04-17 2022-09-21 信越化学工業株式会社 アルコキシシリル基含有有機シラザン化合物及びその製造方法並びにこれを含む組成物及び硬化物
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Also Published As

Publication number Publication date
WO2004072181A3 (en) 2005-02-24
TW200427781A (en) 2004-12-16
DE602004005670D1 (de) 2007-05-16
MY135170A (en) 2008-02-29
DE602004005670T2 (de) 2007-12-27
JP4646496B2 (ja) 2011-03-09
KR100997372B1 (ko) 2010-11-30
JP2004262972A (ja) 2004-09-24
WO2004072181A2 (en) 2004-08-26
US7291671B2 (en) 2007-11-06
TWI332518B (en) 2010-11-01
EP1592749B1 (de) 2007-04-04
KR20050106009A (ko) 2005-11-08
US20060135687A1 (en) 2006-06-22
EP1592749A2 (de) 2005-11-09

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