ATE515555T1 - Wärmeleitfähige silikonfettzusammensetzung - Google Patents

Wärmeleitfähige silikonfettzusammensetzung

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Publication number
ATE515555T1
ATE515555T1 AT09706173T AT09706173T ATE515555T1 AT E515555 T1 ATE515555 T1 AT E515555T1 AT 09706173 T AT09706173 T AT 09706173T AT 09706173 T AT09706173 T AT 09706173T AT E515555 T1 ATE515555 T1 AT E515555T1
Authority
AT
Austria
Prior art keywords
designates
groups
thermally conductive
grease composition
silicone grease
Prior art date
Application number
AT09706173T
Other languages
English (en)
Inventor
Kazumi Nakayoshi
Tomoko Kato
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE515555T1 publication Critical patent/ATE515555T1/de

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    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M169/00Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
    • C10M169/02Mixtures of base-materials and thickeners
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
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    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/04Elements
    • C10M2201/041Carbon; Graphite; Carbon black
    • C10M2201/0416Carbon; Graphite; Carbon black used as thickening agents
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    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/04Elements
    • C10M2201/05Metals; Alloys
    • C10M2201/056Metals; Alloys used as thickening agents
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    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06Metal compounds
    • C10M2201/061Carbides; Hydrides; Nitrides
    • C10M2201/0616Carbides; Hydrides; Nitrides used as thickening agents
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    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06Metal compounds
    • C10M2201/062Oxides; Hydroxides; Carbonates or bicarbonates
    • C10M2201/0626Oxides; Hydroxides; Carbonates or bicarbonates used as thickening agents
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    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/10Compounds containing silicon
    • C10M2201/105Silica
    • C10M2201/1056Silica used as thickening agents
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    • C10M2201/00Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/14Inorganic compounds or elements as ingredients in lubricant compositions inorganic compounds surface treated with organic compounds
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    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
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    • C10M2227/00Organic non-macromolecular compounds containing atoms of elements not provided for in groups C10M2203/00, C10M2207/00, C10M2211/00, C10M2215/00, C10M2219/00 or C10M2223/00 as ingredients in lubricant compositions
    • C10M2227/04Organic non-macromolecular compounds containing atoms of elements not provided for in groups C10M2203/00, C10M2207/00, C10M2211/00, C10M2215/00, C10M2219/00 or C10M2223/00 as ingredients in lubricant compositions having a silicon-to-carbon bond, e.g. organo-silanes
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    • C10M2227/00Organic non-macromolecular compounds containing atoms of elements not provided for in groups C10M2203/00, C10M2207/00, C10M2211/00, C10M2215/00, C10M2219/00 or C10M2223/00 as ingredients in lubricant compositions
    • C10M2227/06Organic compounds derived from inorganic acids or metal salts
    • C10M2227/065Organic compounds derived from inorganic acids or metal salts derived from Ti or Zr
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    • C10M2229/00Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04Siloxanes with specific structure
    • C10M2229/041Siloxanes with specific structure containing aliphatic substituents
    • C10M2229/0415Siloxanes with specific structure containing aliphatic substituents used as base material
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    • C10M2229/00Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04Siloxanes with specific structure
    • C10M2229/042Siloxanes with specific structure containing aromatic substituents
    • C10M2229/0425Siloxanes with specific structure containing aromatic substituents used as base material
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    • C10M2229/00Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04Siloxanes with specific structure
    • C10M2229/043Siloxanes with specific structure containing carbon-to-carbon double bonds
    • C10M2229/0435Siloxanes with specific structure containing carbon-to-carbon double bonds used as base material
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    • C10M2229/00Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04Siloxanes with specific structure
    • C10M2229/044Siloxanes with specific structure containing silicon-to-hydrogen bonds
    • C10M2229/0445Siloxanes with specific structure containing silicon-to-hydrogen bonds used as base material
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    • C10M2229/00Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04Siloxanes with specific structure
    • C10M2229/046Siloxanes with specific structure containing silicon-oxygen-carbon bonds
    • C10M2229/0465Siloxanes with specific structure containing silicon-oxygen-carbon bonds used as base material
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    • C10M2229/00Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04Siloxanes with specific structure
    • C10M2229/05Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon
    • C10M2229/051Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon containing halogen
    • C10M2229/0515Siloxanes with specific structure containing atoms other than silicon, hydrogen, oxygen or carbon containing halogen used as base material
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    • C10N2020/00Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/01Physico-chemical properties
    • C10N2020/02Viscosity; Viscosity index
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    • C10N2020/00Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
AT09706173T 2008-01-30 2009-01-22 Wärmeleitfähige silikonfettzusammensetzung ATE515555T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008019864A JP5372388B2 (ja) 2008-01-30 2008-01-30 熱伝導性シリコーングリース組成物
PCT/JP2009/051399 WO2009096436A1 (en) 2008-01-30 2009-01-22 Thermally conductive silicone grease composition

Publications (1)

Publication Number Publication Date
ATE515555T1 true ATE515555T1 (de) 2011-07-15

Family

ID=40756270

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09706173T ATE515555T1 (de) 2008-01-30 2009-01-22 Wärmeleitfähige silikonfettzusammensetzung

Country Status (8)

Country Link
US (1) US8796190B2 (de)
EP (1) EP2257616B1 (de)
JP (1) JP5372388B2 (de)
KR (1) KR101498516B1 (de)
CN (1) CN101932684A (de)
AT (1) ATE515555T1 (de)
TW (1) TWI470070B (de)
WO (1) WO2009096436A1 (de)

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JP6014299B2 (ja) * 2008-09-01 2016-10-25 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物及び半導体装置
JP2011140566A (ja) * 2010-01-07 2011-07-21 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
JP5619487B2 (ja) * 2010-06-24 2014-11-05 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
CN102241965B (zh) * 2011-05-12 2013-08-07 秦如新 一种导热硅脂膏体及其制备方法
CN102585778A (zh) * 2011-12-29 2012-07-18 深圳德邦界面材料有限公司 一种耐高温散热材料及其制备方法
JP5783128B2 (ja) * 2012-04-24 2015-09-24 信越化学工業株式会社 加熱硬化型熱伝導性シリコーングリース組成物
JP5895690B2 (ja) * 2012-05-08 2016-03-30 信越化学工業株式会社 有機修飾無機充填材の製造方法及び有機修飾無機充填材、並びに熱伝導性シリコーン組成物
JP6261603B2 (ja) * 2012-11-28 2018-01-17 ダウ コーニング コーポレーションDow Corning Corporation エネルギー効率の高い一時的剪断減粘シロキサン潤滑剤の使用方法
EP2925838A1 (de) * 2012-11-28 2015-10-07 Dow Corning Corporation Verfahren zur verminderung der reibung und des verschleisses zwischen oberflächen unter hoher belastung
JP2016501935A (ja) * 2012-11-28 2016-01-21 ダウ コーニング コーポレーションDow Corning Corporation 環状分岐構造を有するシロキサントラクション流体及びその使用方法
WO2014115456A1 (ja) 2013-01-22 2014-07-31 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性層及び半導体装置
JP5898139B2 (ja) 2013-05-24 2016-04-06 信越化学工業株式会社 熱伝導性シリコーン組成物
WO2015064240A1 (ja) 2013-10-29 2015-05-07 ポリマテック・ジャパン株式会社 液体封入放熱部材
US9822326B2 (en) * 2014-03-31 2017-11-21 Exxonmobil Research And Engineering Company Low viscosity, low volatility lubricating oil basestocks
JP6468660B2 (ja) * 2014-04-09 2019-02-13 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電気・電子機器
DE102014209670A1 (de) * 2014-05-21 2015-11-26 Wacker Chemie Ag Verfahren zum Betrieb einer Anlage mit Siloxan-Hochtemperaturflüssigkeit
JP6394559B2 (ja) * 2015-10-16 2018-09-26 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN105566920A (zh) * 2015-12-24 2016-05-11 平湖阿莱德实业有限公司 低渗油超软导热硅胶组合物及导热硅胶垫片及其制备方法
US9920231B2 (en) 2016-04-06 2018-03-20 Youngyiel Precision Co., Ltd. Thermal compound composition containing Cu—CuO composite filler
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KR101498516B1 (ko) 2015-03-04
EP2257616A1 (de) 2010-12-08
TW200932884A (en) 2009-08-01
KR20100112637A (ko) 2010-10-19
TWI470070B (zh) 2015-01-21
US20110039738A1 (en) 2011-02-17
JP5372388B2 (ja) 2013-12-18
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