DE69921903D1 - Elektrisch leitfähige Silikonzusammensetzungen - Google Patents
Elektrisch leitfähige SilikonzusammensetzungenInfo
- Publication number
- DE69921903D1 DE69921903D1 DE69921903T DE69921903T DE69921903D1 DE 69921903 D1 DE69921903 D1 DE 69921903D1 DE 69921903 T DE69921903 T DE 69921903T DE 69921903 T DE69921903 T DE 69921903T DE 69921903 D1 DE69921903 D1 DE 69921903D1
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- conductive silicone
- silicone compositions
- compositions
- electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US112392 | 1993-08-27 | ||
US09/112,392 US6017587A (en) | 1998-07-09 | 1998-07-09 | Electrically conductive silicone compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69921903D1 true DE69921903D1 (de) | 2004-12-23 |
DE69921903T2 DE69921903T2 (de) | 2005-11-03 |
Family
ID=22343647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1999621903 Expired - Fee Related DE69921903T2 (de) | 1998-07-09 | 1999-07-06 | Elektrisch leitfähige Silikonzusammensetzungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6017587A (de) |
EP (1) | EP0971367B1 (de) |
JP (1) | JP2000038510A (de) |
DE (1) | DE69921903T2 (de) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69407137T2 (de) * | 1993-10-06 | 1998-04-09 | Dow Corning Toray Silicone | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
US6277941B1 (en) * | 1997-09-12 | 2001-08-21 | Shin-Etsu Chemical Co., Ltd. | Organopolysiloxane composition |
DE60031436T2 (de) | 1999-08-25 | 2007-08-30 | Hitachi Chemical Co., Ltd. | Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur |
JP3603945B2 (ja) * | 1999-10-06 | 2004-12-22 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
US6433057B1 (en) * | 2000-03-28 | 2002-08-13 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6534581B1 (en) * | 2000-07-20 | 2003-03-18 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6361716B1 (en) * | 2000-07-20 | 2002-03-26 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6433055B1 (en) * | 2000-09-13 | 2002-08-13 | Dow Corning Corporation | Electrically conductive hot-melt silicone adhesive composition |
CN1273994C (zh) * | 2001-04-06 | 2006-09-06 | 世界财产股份有限公司 | 导电性有机硅及其制造方法 |
US7393547B2 (en) * | 2001-04-11 | 2008-07-01 | Helix Medical, Llc | Antimicrobial elastomer composition and method for making |
US8317861B2 (en) * | 2001-04-11 | 2012-11-27 | Helix Medical, Llc | Antimicrobial indwelling voice prosthesis |
US7520897B2 (en) * | 2001-04-11 | 2009-04-21 | Helix Medical, Llc | Medical devices having antimicrobial properties |
DE60122475T2 (de) * | 2001-04-12 | 2007-04-19 | Dow Corning Corp., Midland | Silikonzusammensetzung und daraus erhältlicher elektrisch leitender Silikonklebstoff |
JP4872166B2 (ja) * | 2001-06-28 | 2012-02-08 | 日立化成工業株式会社 | 導電ペーストを用いた電気回路とその製造方法及び導電ペーストの製造方法 |
JP3999994B2 (ja) * | 2002-04-03 | 2007-10-31 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物 |
US6945783B2 (en) * | 2002-05-21 | 2005-09-20 | The University Of Iowa Research Foundation | Interactive breast examination training model |
US6942824B1 (en) | 2002-05-22 | 2005-09-13 | Western Digital (Fremont), Inc. | UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
JP3846575B2 (ja) * | 2002-06-27 | 2006-11-15 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
TWI287562B (en) * | 2002-07-25 | 2007-10-01 | Shinetsu Chemical Co | Silicone coating composition and release sheet |
JP4568472B2 (ja) * | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
US20050059754A1 (en) * | 2003-07-31 | 2005-03-17 | Lunt Michael S. | Electrically conductive, flame retardant fillers, method of manufacture, and use thereof |
US20050062024A1 (en) * | 2003-08-06 | 2005-03-24 | Bessette Michael D. | Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof |
WO2005095520A1 (ja) * | 2004-04-01 | 2005-10-13 | Three Bond Co., Ltd. | 硬化性組成物およびシール方法 |
US20090162651A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
US20100183814A1 (en) * | 2005-08-02 | 2010-07-22 | Victor Rios | Silicone compositions, methods of manufacture, and articles formed therefrom |
US20090162596A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
WO2007016617A2 (en) * | 2005-08-02 | 2007-02-08 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
JP4839041B2 (ja) * | 2005-08-29 | 2011-12-14 | 東レ・ダウコーニング株式会社 | 絶縁性液状ダイボンディング剤および半導体装置 |
US7309734B2 (en) * | 2005-09-30 | 2007-12-18 | Industrial Control Development, Inc. | Silicone-coated architectural glass |
US7838116B2 (en) * | 2005-09-30 | 2010-11-23 | Industrial Control Development, Inc. | Silicone-coated architectural and decorative glass |
US7531242B2 (en) * | 2005-09-30 | 2009-05-12 | Industrial Control Development, Inc. | Silicone-coated architectural glass |
WO2007086987A1 (en) * | 2006-01-17 | 2007-08-02 | Dow Corning Corporation | Thermally stable transparent silicone resin compositions and methods for their preparation and use |
JP2007265801A (ja) * | 2006-03-28 | 2007-10-11 | Sumitomo Bakelite Co Ltd | 導電性粉末及び導電性粉末の作製方法 |
JP4946130B2 (ja) * | 2006-03-28 | 2012-06-06 | 住友ベークライト株式会社 | 導電性ペースト及び導電性ペーストを使用して作製した半導体装置 |
US10072181B2 (en) * | 2006-07-25 | 2018-09-11 | Hewlett-Packard Development Company, L.P. | Laser printer systems, intermediate transfer members, primer layers for intermediate transfer members, and primer layer compositions |
US20080053153A1 (en) * | 2006-09-01 | 2008-03-06 | Shin-Etsu Chemical Co., Ltd. | Method of producing inorganic molded item, and inorganic molded item obtained using the method |
US8243358B2 (en) * | 2006-11-24 | 2012-08-14 | The Hong Kong University Of Science & Technology | Constructing planar and three-dimensional microstructures with PDMS-based conducting composite |
US8431647B2 (en) * | 2006-12-27 | 2013-04-30 | Bluestar Silicones France Sas | Adhesive silicone compositions and adhesive bonding/seaming therewith |
JP4739301B2 (ja) * | 2007-09-12 | 2011-08-03 | 信越化学工業株式会社 | 金属光沢を示す金属−セラミック複合材料の製造方法 |
WO2009131913A2 (en) * | 2008-04-21 | 2009-10-29 | Honeywell International Inc. | Thermal interconnect and interface materials, methods of production and uses thereof |
WO2011019719A1 (en) * | 2009-08-12 | 2011-02-17 | Parker-Hannifin Corporation | Fully-cured thermally or electrically-conductive form-in-place gap filler |
JP5539689B2 (ja) * | 2009-09-14 | 2014-07-02 | 東レ・ダウコーニング株式会社 | エマルジョン、その製造方法、および架橋性シリコーン組成物 |
JP5402910B2 (ja) * | 2010-11-22 | 2014-01-29 | 日立化成株式会社 | 導電ペースト及びその製造方法 |
JP5751214B2 (ja) * | 2012-03-13 | 2015-07-22 | 信越化学工業株式会社 | 硬化性シリコーン樹脂組成物、その硬化物及び光半導体デバイス |
CN104662098A (zh) * | 2012-08-02 | 2015-05-27 | 汉高股份有限公司 | 用于led封装剂的包含聚碳硅烷和含氢聚硅氧烷的可固化组合物 |
KR102025529B1 (ko) * | 2012-10-15 | 2019-09-27 | 다우 글로벌 테크놀로지스 엘엘씨 | 전도성 조성물 |
DE102012220700A1 (de) * | 2012-11-13 | 2014-05-15 | Wacker Chemie Ag | Füllstoffhaltige Siliconzusammensetzungen |
CN104854176B (zh) * | 2012-12-20 | 2017-06-06 | 道康宁公司 | 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置 |
WO2014150302A1 (en) | 2013-03-14 | 2014-09-25 | Dow Corning Corporation | Conductive silicone materials and uses |
WO2014159792A1 (en) * | 2013-03-14 | 2014-10-02 | Dow Corning Corporation | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same |
KR102250406B1 (ko) * | 2013-03-14 | 2021-05-12 | 다우 실리콘즈 코포레이션 | 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스 |
JP2014201627A (ja) * | 2013-04-02 | 2014-10-27 | 三菱化学株式会社 | 熱硬化性シリコーン樹脂組成物、シリコーン樹脂成形体の製造方法、およびシリコーン樹脂成形体 |
KR20180019106A (ko) * | 2015-06-17 | 2018-02-23 | 바스프 에스이 | 윤활유를 포함하는 전도성 페이스트 및 반도체 소자 |
EP3150672B1 (de) * | 2015-10-02 | 2018-05-09 | Shin-Etsu Chemical Co., Ltd. | Wärmeleitende und silikonzusammensetzung und halbleiterbauelement |
JP6729143B2 (ja) | 2015-10-29 | 2020-07-22 | 三菱マテリアル株式会社 | 樹脂組成物、接合体及び半導体装置 |
WO2017073393A1 (ja) * | 2015-10-29 | 2017-05-04 | 三菱マテリアル株式会社 | 樹脂組成物、接合体及び半導体装置 |
WO2017144555A1 (en) * | 2016-02-23 | 2017-08-31 | Basf Se | Conductive paste comprising a silicone oil |
GB201603107D0 (en) * | 2016-02-23 | 2016-04-06 | Dow Corning | Low temperature cure silicone elastomer |
JP6610491B2 (ja) * | 2016-10-03 | 2019-11-27 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
US10590042B2 (en) * | 2017-06-29 | 2020-03-17 | Hrl Laboratories, Llc | Photopolymer resins with solid and liquid phases for polymer-derived ceramics |
KR20200035408A (ko) * | 2017-07-31 | 2020-04-03 | 다우 글로벌 테크놀로지스 엘엘씨 | 아이스-포빅 코팅 |
US11320323B2 (en) | 2017-09-06 | 2022-05-03 | Regents Of The University Of Minnesota | Additively manufactured flexible electronic sensors and conductive compositions used therein |
WO2019047093A1 (en) | 2017-09-07 | 2019-03-14 | Dow Global Technologies Llc | THERMALLY CONDUCTIVE GLACIOPHOBIC COATINGS |
JP7436857B2 (ja) * | 2018-05-15 | 2024-02-22 | 株式会社スリーボンド | 導電性シリコーン組成物およびその硬化物 |
WO2020203304A1 (ja) * | 2019-03-29 | 2020-10-08 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
FR3103820B1 (fr) * | 2019-11-29 | 2022-08-05 | Michelin & Cie | Membrane expansible pour moule de cuisson revêtue d’une composition de caoutchouc silicone |
US20210189188A1 (en) * | 2019-12-18 | 2021-06-24 | Fuji Polymer Industries Co., Ltd. | Thermally conductive composition, thermally conductive sheet and method for producing the same |
CN116507678A (zh) * | 2020-12-23 | 2023-07-28 | 陶氏环球技术有限责任公司 | 有机硅组合物 |
CN114058326B (zh) * | 2021-11-22 | 2023-05-23 | 烟台德邦科技股份有限公司 | 一种粘接及可靠性优异的有机聚硅氧烷组合物及其制备方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL131800C (de) * | 1965-05-17 | |||
US3609104A (en) * | 1968-02-15 | 1971-09-28 | Ercon Inc | Electrically conductive gasket and material thereof |
US4087585A (en) * | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
JPS61108661A (ja) * | 1984-11-02 | 1986-05-27 | Shin Etsu Polymer Co Ltd | 導電性シリコ−ンゴム組成物 |
US4659851A (en) * | 1986-03-26 | 1987-04-21 | Dow Corning Corporation | Novel organosilicon compounds |
JPS62257939A (ja) * | 1986-05-02 | 1987-11-10 | Shin Etsu Chem Co Ltd | シリコ−ンエラストマ−球状微粉末の製造方法 |
US4766176A (en) * | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
JP2618663B2 (ja) * | 1987-11-30 | 1997-06-11 | 東レ・ダウコーニング・シリコーン株式会社 | 磁性シリコーンゴム粉状物の製造方法 |
JPH02102263A (ja) * | 1988-10-11 | 1990-04-13 | Shin Etsu Chem Co Ltd | 導電性シリコーンゴム組成物 |
CA2000787A1 (en) * | 1988-11-04 | 1990-05-04 | Richard L. Cole | Electrically conductive silicone compositions |
JPH0791464B2 (ja) * | 1989-10-31 | 1995-10-04 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物およびその硬化物 |
JP2608484B2 (ja) * | 1990-05-24 | 1997-05-07 | 東レ・ダウコーニング・シリコーン株式会社 | ヒドロシリル化反応用触媒含有熱可塑性樹脂微粒子の製造方法 |
US5371139A (en) * | 1991-06-21 | 1994-12-06 | Dow Corning Toray Silicone Co., Ltd. | Silicone rubber microsuspension and method for its preparation |
US5227093A (en) * | 1991-11-29 | 1993-07-13 | Dow Corning Corporation | Curable organosiloxane compositions yielding electrically conductive materials |
JPH05271548A (ja) * | 1992-03-27 | 1993-10-19 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物及びその硬化物の形成方法 |
JPH05314812A (ja) * | 1992-05-06 | 1993-11-26 | Sumitomo Metal Mining Co Ltd | 導電性樹脂ペースト |
JPH06157996A (ja) * | 1992-11-19 | 1994-06-07 | Shin Etsu Chem Co Ltd | 接着方法 |
DE4414653A1 (de) * | 1993-05-13 | 1994-11-17 | Gen Electric | Schneller klebende Silicon-Klebstoffzusammensetzungen |
DE69407137T2 (de) * | 1993-10-06 | 1998-04-09 | Dow Corning Toray Silicone | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
JP2819444B2 (ja) * | 1993-11-08 | 1998-10-30 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
US5424384A (en) * | 1994-05-10 | 1995-06-13 | Dow Corning Corporation | Curable organosiloxane compositions containing low temperature reactive adhesion additives |
DE19528225A1 (de) * | 1995-08-01 | 1997-02-06 | Wacker Chemie Gmbh | Beschichtete Airbags, Beschichtungsmaterial und Beschichtungsverfahren |
JP3950493B2 (ja) * | 1996-04-26 | 2007-08-01 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
JP3436464B2 (ja) * | 1996-10-31 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 |
-
1998
- 1998-07-09 US US09/112,392 patent/US6017587A/en not_active Expired - Fee Related
-
1999
- 1999-07-06 EP EP99113542A patent/EP0971367B1/de not_active Expired - Lifetime
- 1999-07-06 DE DE1999621903 patent/DE69921903T2/de not_active Expired - Fee Related
- 1999-07-06 JP JP19212599A patent/JP2000038510A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE69921903T2 (de) | 2005-11-03 |
US6017587A (en) | 2000-01-25 |
EP0971367B1 (de) | 2004-11-17 |
JP2000038510A (ja) | 2000-02-08 |
EP0971367A1 (de) | 2000-01-12 |
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