CN100561602C - 聚热元件 - Google Patents

聚热元件 Download PDF

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CN100561602C
CN100561602C CNB2004100281891A CN200410028189A CN100561602C CN 100561602 C CN100561602 C CN 100561602C CN B2004100281891 A CNB2004100281891 A CN B2004100281891A CN 200410028189 A CN200410028189 A CN 200410028189A CN 100561602 C CN100561602 C CN 100561602C
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heat
thermal insulation
insulation material
aggregation element
concentration
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CN1722309A (zh
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林志泉
陈杰良
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US11/175,772 priority patent/US7493943B2/en
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Abstract

本发明涉及一种聚热元件，该聚热元件为一多面体，其包括两个相对表面及周围侧壁，其以一导热材料为基体，该导热材料基体中掺杂有绝热材料，其中绝热材料分布为：从一表面至另一表面绝热材料浓度逐渐增大，从周围侧壁至中心绝热材料浓度逐渐减小。该聚热元件适合应用于集成电路电子元件的散热装置中导热，并将电子元件散发的热量汇聚，为热量回收利用提供准备。

Description

聚热元件
【技术领域】
本发明是关于一种聚热元件，特别是关于一种应用于电子元件散热装置中便于热能回收的聚热元件。
【背景技术】
近年来电子技术迅速发展，电子元件的高频、高速以及集成电路的密集及微型化，使得单位容积电子元件发热量剧增，因此在电子元件上贴附一散热装置，将电子元件工作时所产生的热量传导至空气中，以确保电子元件能稳定运转。
如，现有用于辅助电子元件散发热量的相关散热装置构造，可参考1989年12月5日公告的美国专利第4,884,331号。该散热装置是在基座顶面上凸设若干散热鳍片，工作时，该基座贴附在电子元件表面将热量导出，再经散热鳍片将热量散出。
又如，2004年2月18日公告的中国专利第99117239号揭露一种采用热管导热的散热装置，利用热管的高导热效率，将电子元件产生的热量迅速导出。
另，可使用风扇加速散热装置附近空气对流，将电子元件散发的热量迅速散发至空气中，可参考2004年6月8日公告的美国专利第6,745,824号。
再如，2004年6月2日公开的中国专利申请第02152003号揭露一种热接口材料，用于散热装置与电子元件之间，接合二者的接口，提高散热装置的散热效率，其中该热接口材料中包括碳纳米管阵列，利用碳纳米管这种导热能力极强的材料，增强导热效率。
但是，现有技术仅考虑将热量迅速从电子元件上传导出去，而未考虑将热转换成其它形式的能量加以利用。如果将热量转换成电能或光能，不仅节约能源，且同样可达到散热目的。
然而，热能的扩散性使得热的再次利用效果有限，因此，提供一种便于电子元件散发的热能汇聚回收的聚热元件非常必要。
【发明内容】
为解决先前技术中由于热的扩散性，使得电子器件散发的热能汇聚并回收利用有困难的技术问题，本发明提供一种能将电子器件散发的热能汇聚、便于热能回收的聚热器件。
本发明所提供的聚热器件包括两个相对表面及周围侧壁，其以一导热材料为基体，该导热材料基体中掺杂有绝热材料，其中绝热材料分布为：从一表面至另一表面绝热材料浓度逐渐增大，从周围侧壁至中心绝热材料浓度逐渐减小。
本发明技术方案进一步包括该导热材料为导热系数大于0.6w/(m.k)，优选为软性导热材料，其中，“.”表示乘号；绝热材料为导热系数小于0.1w/(m.k)；绝热材料浓度范围为0～100％。
本发明所提供的聚热器件具有以下优点：聚热器件以导热材料为基体，绝热材料掺杂在其中，且绝热材料在导热材料基体中以一定规律分布，阻碍热量均匀扩散，控制热量朝聚热器件中心汇聚，从而便于热能收集并利用。
【附图说明】
图1是本发明第一实施例聚热元件示意图。
图2是本发明第一实施例聚热元件中绝热材料沿X轴或Y轴方向浓度变化示意图。
图3是本发明第一实施例聚热元件中绝热材料沿Z轴方向浓度变化示意图。
图4是本发明第二实施例聚热元件示意图。
图5是图4中聚热元件沿VI-VI方向剖面示意图。
【具体实施方式】
下面结合图式说明本发明实施例所提供的聚热元件：
请参阅图1，本发明第一实施例提供的聚热元件10为一长方体，其包括一聚热面11，一与聚热面11相对的吸热面12，及聚热面11与吸热面12之间连接聚热面11与吸热面12的四个周围侧壁13，该聚热元件10以导热材料为基体，绝热材料掺杂在导热材料中，其中导热材料的导热系数一般大于0.6w/(m.k)，绝热材料的导热系数一般小于0.1w/(m.k)。绝热材料在导热材料基体中的浓度分布情况如图2及图3所示：
请参阅图2，绝热材料在导热材料基体中的含量沿X轴或Y轴方向上的变化趋势如图中所示，聚热元件10的边缘处绝热材料浓度最大，接近聚热元件中心，绝热材料浓度逐渐减小。优选地，聚热元件10中心轴上绝热材料浓度为零。
请参阅图3，绝热材料在导热材料基体中的含量沿Z轴方向上的变化趋势如图所示，接近吸热面12，绝热材料浓度为零，沿Z轴方向距吸热面12一定距离处，绝热材料浓度从零逐渐增加，接近聚热面11，绝热材料浓度达到最大，可以为100％纯绝热材料。
本发明聚热元件应用于发热电子元件与热能回收装置之间，其功能是将电子元件散发的热量传导汇聚给热能回收装置，为贴合电子元件发热表面或热能回收装置的表面，该聚热元件的基体导热材料优选为软性导热材料，包括银质软膏、普通硅胶及非硅性材料，其中银质软膏是在普通胶性物质中掺入高导热率的银颗粒或其它高导热效率的金属或碳材料微粒，使软膏导热能力大幅度提升的材料。
聚热元件形状不限于长方体，可为正方体、其它棱柱体、圆柱体、圆台等多面体。该聚热元件一般具有相对且相互平行的两个平面表面，其中一表面贴合电子元件发热面，如图1中所示的吸热面12，另一表面接触热能回收装置表面，如图1中所示的聚热面11。
请参阅图4，本发明第二实施例所提供的聚热元件20为一圆柱体，其包括一聚热面21，与聚热面21相对且平行的吸热面22，以及聚热面21与吸热面22间连接聚热面21与吸热面22的侧壁23，该聚热元件20以导热材料24为基体，绝热材料25掺杂在导热材料24基体中，绝热材料25在导热材料24基体中的浓度分布情况如图5所示。
请参阅图5，其为聚热元件20沿图4中所示的VI-VI方向的剖面示意图，即沿其直径的轴向截面图，绝热材料25在导热材料24中关于聚热元件20的中心轴对称分布。沿其轴方向越接近聚热面21，绝热材料25浓度逐渐增大；沿其径向方向越接近中心轴，绝热材料25浓度逐渐减小。其中心轴周围一定区域内导热材料24中绝热材料25浓度为零，接近吸热面22处绝热材料25浓度为零。
聚热元件20工作时，其吸热面22贴合在散热电子元件上，由于吸热面22为导热材料24，故电子元件散发的热量能迅速扩散并传导给聚热元件20，由于聚热元件20轴方向上一定高度处掺杂有绝热材料25，且接近中心轴该绝热材料25浓度逐渐减小甚至减为零，因此在绝热材料25作用下，将热导向轴中心汇聚，并可从聚热面21的中心汇出，从而便于将热量收集回收利用。

Claims (10)

1.一种聚热元件，其包括二相对表面及周围侧壁，其以一导热材料为基体，其特征在于该导热材料基体中掺杂有绝热材料，绝热材料分布为：从一表面至另一表面绝热材料浓度逐渐增大，从周围侧壁至中心轴绝热材料浓度逐渐减小。
2.如权利要求1所述的聚热元件，其特征在于该聚热元件形状包括圆柱体、棱柱体、圆台或棱台。
3.如权利要求1所述的聚热元件，其特征在于导热材料的导热系数大于0.6w/(m.k)。
4.如权利要求1所述的聚热元件，其特征在于导热材料为软性导热材料。
5.如权利要求4所述的聚热元件，其特征在于导热材料包括银质软膏、硅胶及非硅性材料。
6.如权利要求1所述的聚热元件，其特征在于绝热材料的导热系数小于0.1w/(m.k)。
7.如权利要求1所述的聚热元件，其特征在于绝热材料浓度范围为0～100％。
8.如权利要求1项所述的聚热元件，其特征在于二表面中绝热材料浓度较小的表面为吸热面，吸热面上绝热材料浓度为零。
9.如权利要求1项所述的聚热元件，其特征在于二表面中绝热材料浓度较大的表面中心处绝热材料浓度为零，边缘处绝热材料浓度为100％。
10.如权利要求1项所述的聚热元件，其特征在于该聚热元件中心轴上绝热材料浓度为零。
CNB2004100281891A 2004-07-16 2004-07-16 聚热元件 Expired - Fee Related CN100561602C (zh)

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US20090120614A1 (en) 2009-05-14

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