DE19680786T1 - Halbleiterbauelement-Testgerät - Google Patents

Halbleiterbauelement-Testgerät

Info

Publication number
DE19680786T1
DE19680786T1 DE19680786T DE19680786T DE19680786T1 DE 19680786 T1 DE19680786 T1 DE 19680786T1 DE 19680786 T DE19680786 T DE 19680786T DE 19680786 T DE19680786 T DE 19680786T DE 19680786 T1 DE19680786 T1 DE 19680786T1
Authority
DE
Germany
Prior art keywords
semiconductor device
semiconductor
test
test device
device test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19680786T
Other languages
English (en)
Other versions
DE19680786B4 (de
Inventor
Yoshihito Kobayashi
Tsuyoshi Yamashita
Hiroto Nakamura
Shin Nemoto
Yoshiyuki Masuo
Akihiko Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16264901&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE19680786(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE19680786T1 publication Critical patent/DE19680786T1/de
Application granted granted Critical
Publication of DE19680786B4 publication Critical patent/DE19680786B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE19680786T 1995-07-26 1996-07-24 Halbleiterbauelement-Testgerät Expired - Fee Related DE19680786B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP19085595A JP3412114B2 (ja) 1995-07-26 1995-07-26 Ｉｃ試験装置
JP7/190855 1995-07-26
PCT/JP1996/002067 WO1997005495A1 (fr) 1995-07-26 1996-07-24 Testeur de dispositif a semi-conducteurs

Publications (2)

Publication Number Publication Date
DE19680786T1 true DE19680786T1 (de) 1997-10-02
DE19680786B4 DE19680786B4 (de) 2005-09-01

Family

ID=16264901

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19680786T Expired - Fee Related DE19680786B4 (de) 1995-07-26 1996-07-24 Halbleiterbauelement-Testgerät

Country Status (7)

Country Link
US (2) US6104183A (de)
JP (1) JP3412114B2 (de)
KR (1) KR100292831B1 (de)
DE (1) DE19680786B4 (de)
MY (1) MY113610A (de)
TW (1) TW305025B (de)
WO (1) WO1997005495A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19723434C2 (de) * 1996-06-04 2002-10-31 Advantest Corp Halbleiterbauelement-Testgerät
DE19750173C2 (de) * 1996-11-12 2003-02-20 Advantest Corp IC-Testvorrichtung

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3412114B2 (ja) 1995-07-26 2003-06-03 株式会社アドバンテスト Ｉｃ試験装置
US6249132B1 (en) * 1997-02-12 2001-06-19 Tokyo Electron Limited Inspection methods and apparatuses
JP3344548B2 (ja) * 1997-04-16 2002-11-11 株式会社アドバンテスト Ｉｃ試験装置
JP3591679B2 (ja) * 1997-04-17 2004-11-24 株式会社アドバンテスト Ｉｃ用トレイ取出装置及びｉｃ用トレイ収納装置
TW379285B (en) * 1997-07-02 2000-01-11 Advantest Corp Testing device for semiconductor components and the testing trays used in the testing apparatus
TW369692B (en) 1997-12-26 1999-09-11 Samsung Electronics Co Ltd Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
JPH11287843A (ja) * 1998-04-02 1999-10-19 Advantest Corp Ｉｃ試験装置
JP4037962B2 (ja) * 1998-06-24 2008-01-23 株式会社アドバンテスト 部品試験装置
KR100546871B1 (ko) * 1998-09-30 2006-05-23 삼성전자주식회사 테스트 핸들러
JP3567803B2 (ja) * 1999-07-08 2004-09-22 日立ハイテク電子エンジニアリング株式会社 Ｉｃデバイスの試験装置
US6564165B1 (en) * 1999-12-22 2003-05-13 Trw Inc. Apparatus and method for inline testing of electrical components
US6711450B1 (en) * 2000-02-02 2004-03-23 Advanced Micro Devices, Inc. Integration of business rule parameters in priority setting of wafer processing
US6392403B1 (en) * 2000-02-02 2002-05-21 Advanced Micro Devices, Inc. Integrated wafer stocker and sorter apparatus
JP3584845B2 (ja) * 2000-03-16 2004-11-04 日立ハイテク電子エンジニアリング株式会社 Ｉｃデバイスの試験装置及び試験方法
US6521853B1 (en) * 2000-05-08 2003-02-18 Micro Component Technology, Inc. Method and apparatus for sorting semiconductor devices
JP2002286791A (ja) * 2001-03-28 2002-10-03 Ando Electric Co Ltd 半導体デバイスの加熱装置および半導体デバイスの加熱方法
US6781363B2 (en) * 2001-06-21 2004-08-24 Han-Ping Chen Memory sorting method and apparatus
MY131859A (en) * 2001-06-30 2007-09-28 Stmicroelectronics Sdn Bhd Test handler apparatus for smd ( surface mount devices), bga ( ball grid arrays) and csp ( chip scale packages)
KR20030017933A (ko) * 2001-08-25 2003-03-04 엘지.필립스 엘시디 주식회사 액정디스플레이의 선 분류 장비
US6861861B2 (en) * 2002-07-24 2005-03-01 Lg Electronics Inc. Device for compensating for a test temperature deviation in a semiconductor device handler
KR100542126B1 (ko) * 2003-04-29 2006-01-11 미래산업 주식회사 반도체 소자 테스트 핸들러
KR100498496B1 (ko) * 2003-05-07 2005-07-01 삼성전자주식회사 자투리 반도체 소자의 검사 방법
KR100517074B1 (ko) * 2003-06-05 2005-09-26 삼성전자주식회사 트레이 트랜스퍼 유닛 및 그를 포함하는 자동 테스트 핸들러
KR100541546B1 (ko) * 2003-07-14 2006-01-10 삼성전자주식회사 반도체 디바이스 테스트장치
US7339387B2 (en) * 2004-06-30 2008-03-04 Intel Corporation System and method for linked slot-level burn-in
US7292023B2 (en) * 2004-06-30 2007-11-06 Intel Corporation Apparatus and method for linked slot-level burn-in
CN100526896C (zh) * 2004-07-09 2009-08-12 株式会社爱德万测试 推压构件及电子部件处理装置
KR100629262B1 (ko) * 2004-07-20 2006-09-29 삼성전자주식회사 반도체 디바이스 테스트장치의 테스트트레이
US7151388B2 (en) * 2004-09-30 2006-12-19 Kes Systems, Inc. Method for testing semiconductor devices and an apparatus therefor
US7091737B2 (en) * 2004-10-01 2006-08-15 Intel Corporation Apparatus and methods for self-heating burn-in processes
CN101120260B (zh) * 2005-02-15 2010-09-15 株式会社爱德万测试 预烧装置
KR100652417B1 (ko) * 2005-07-18 2006-12-01 삼성전자주식회사 인-트레이(Ｉｎ-ｔｒａｙ) 상태의 반도체 패키지 검사장치및 검사방법
CN101208606B (zh) * 2005-08-31 2011-07-13 平田机工株式会社 工件装卸装置
CN101384913A (zh) * 2006-01-17 2009-03-11 株式会社爱德万测试 电子部件试验装置以及电子部件的试验方法
JP2007192576A (ja) * 2006-01-17 2007-08-02 Nippon Gaataa Kk 電子部品の自動分類機の作動制御方法
US20070180339A1 (en) * 2006-01-31 2007-08-02 Carli Connally Handling mixed-mode content in a stream of test results
KR101042655B1 (ko) * 2006-07-27 2011-06-20 가부시키가이샤 아드반테스트 전자부품 이송방법 및 전자부품 핸들링 장치
KR100825781B1 (ko) * 2006-10-02 2008-04-29 삼성전자주식회사 열 분리기를 구비하는 반도체 소자용 테스트 핸들러 및이를 이용한 반도체 소자 테스트 방법
US7619936B2 (en) * 2006-11-16 2009-11-17 Qimonda North America Corp. System that prevents reduction in data retention
TWI344189B (en) * 2006-11-22 2011-06-21 Mirae Corp Method for transferring test trays in a handler
KR20080046356A (ko) * 2006-11-22 2008-05-27 미래산업 주식회사 핸들러의 테스트 트레이 이송방법
DE102007007529A1 (de) * 2007-02-15 2007-08-16 Hatec Handhabungstechnik Maschinenbau Gmbh Testvorrichtung zum Testen von Prüflingen unter Temperatur
DE102007007528A1 (de) * 2007-02-15 2007-08-30 Hatec Handhabungstechnik Maschinenbau Gmbh Kontaktierstation zum Testen von Prüflingen unter Temperatur
KR100819836B1 (ko) 2007-06-08 2008-04-08 미래산업 주식회사 캐리어모듈, 그를 이용한 테스트 핸들러, 및 그를 이용한반도체 소자 제조방법
US7884631B2 (en) * 2009-02-25 2011-02-08 Kingston Technology Corp. Parking structure memory-module tester that moves test motherboards along a highway for remote loading/unloading
KR101313531B1 (ko) 2009-02-27 2013-10-02 가부시키가이샤 어드밴티스트 시험 장치 및 시험 방법
JP4398513B1 (ja) 2009-04-28 2010-01-13 株式会社アドバンテスト 配線基板ユニットおよび試験装置
WO2011038297A1 (en) 2009-09-26 2011-03-31 Centipede Systems, Inc. Apparatus for holding microelectronic devices
KR20120027580A (ko) * 2010-09-13 2012-03-22 삼성전자주식회사 반도체 장치용 테스트 핸들러 및 이를 이용한 반도체 장치 테스트 방법
WO2013029659A1 (en) * 2011-08-30 2013-03-07 Osram Opto Semiconductors Gmbh Testing device and method for operating a testing device
US9099173B2 (en) * 2012-12-14 2015-08-04 Virtium Technology, Inc. Classifying flash devices using ECC
TWI472778B (zh) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
US9684030B2 (en) * 2014-12-26 2017-06-20 An-Sung Wang Drum-type IC burn-in and test equipment
TWI597508B (zh) * 2016-07-22 2017-09-01 致茂電子股份有限公司 電子元件溫控模組及具備該模組之檢測設備
JP6823534B2 (ja) * 2017-04-28 2021-02-03 株式会社アドバンテスト 電子部品試験装置用のキャリア
US10677842B2 (en) 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
CA3084671A1 (en) * 2017-12-19 2019-06-27 Boston Semi Equipment, Llc Kit-less pick and place handler
KR102037975B1 (ko) * 2018-07-27 2019-10-29 세메스 주식회사 트레이 승강 장치
TWI706148B (zh) * 2019-07-17 2020-10-01 美商第一檢測有限公司 晶片測試方法
KR102270760B1 (ko) * 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
CN111751696B (zh) * 2020-07-05 2022-12-09 深圳市堃联技术有限公司 一种半导体芯片检测设备
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
TWI764340B (zh) 2020-10-23 2022-05-11 美商第一檢測有限公司 抵壓組件及晶片測試設備
US11408931B1 (en) * 2021-03-12 2022-08-09 Nanya Technology Corporation Integrated-circuit-level test system and method
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid

Citations (2)

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US5184068A (en) * 1990-09-24 1993-02-02 Symtek Systems, Inc. Electronic device test handler
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling

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JP2921937B2 (ja) * 1990-07-18 1999-07-19 東京エレクトロン株式会社 Ｉｃ検査装置
JP3009115B2 (ja) * 1991-09-02 2000-02-14 株式会社アドバンテスト Ｉｃ試験装置
JP3254775B2 (ja) * 1992-12-01 2002-02-12 日立電子エンジニアリング株式会社 Ｉｃデバイスの恒温試験装置
JP3372586B2 (ja) * 1993-04-19 2003-02-04 株式会社アドバンテスト Ｉｃ試験装置用ローダ・アンローダ
JP3412114B2 (ja) 1995-07-26 2003-06-03 株式会社アドバンテスト Ｉｃ試験装置
JPH10142293A (ja) * 1996-11-12 1998-05-29 Advantest Corp Ｉｃ試験装置

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US5184068A (en) * 1990-09-24 1993-02-02 Symtek Systems, Inc. Electronic device test handler
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19723434C2 (de) * 1996-06-04 2002-10-31 Advantest Corp Halbleiterbauelement-Testgerät
DE19750173C2 (de) * 1996-11-12 2003-02-20 Advantest Corp IC-Testvorrichtung

Also Published As

Publication number Publication date
DE19680786B4 (de) 2005-09-01
JP3412114B2 (ja) 2003-06-03
JPH0943309A (ja) 1997-02-14
US6384593B1 (en) 2002-05-07
TW305025B (de) 1997-05-11
US6104183A (en) 2000-08-15
KR970706501A (ko) 1997-11-03
KR100292831B1 (ko) 2001-06-15
WO1997005495A1 (fr) 1997-02-13
MY113610A (en) 2002-04-30

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20110201