TW305025B - - Google Patents

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Publication number
TW305025B
TW305025B TW085108960A TW85108960A TW305025B TW 305025 B TW305025 B TW 305025B TW 085108960 A TW085108960 A TW 085108960A TW 85108960 A TW85108960 A TW 85108960A TW 305025 B TW305025 B TW 305025B
Authority
TW
Taiwan
Application number
TW085108960A
Inventor
Ito Akihiko
Original Assignee
Adoban Tesuto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16264901&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW305025(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Adoban Tesuto Kk filed Critical Adoban Tesuto Kk
Application granted granted Critical
Publication of TW305025B publication Critical patent/TW305025B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW085108960A 1995-07-26 1996-07-23 TW305025B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19085595A JP3412114B2 (ja) 1995-07-26 1995-07-26 Ｉｃ試験装置

Publications (1)

Publication Number Publication Date
TW305025B true TW305025B (zh) 1997-05-11

Family

ID=16264901

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085108960A TW305025B (zh) 1995-07-26 1996-07-23

Country Status (7)

Country Link
US (2) US6104183A (zh)
JP (1) JP3412114B2 (zh)
KR (1) KR100292831B1 (zh)
DE (1) DE19680786B4 (zh)
MY (1) MY113610A (zh)
TW (1) TW305025B (zh)
WO (1) WO1997005495A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706148B (zh) * 2019-07-17 2020-10-01 美商第一檢測有限公司 晶片測試方法
TWI734002B (zh) * 2017-04-28 2021-07-21 日商阿德潘鐵斯特股份有限公司 電子元件測試裝置用之載具
TWI764340B (zh) * 2020-10-23 2022-05-11 美商第一檢測有限公司 抵壓組件及晶片測試設備

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JP3412114B2 (ja) 1995-07-26 2003-06-03 株式会社アドバンテスト Ｉｃ試験装置
TW358162B (en) * 1996-06-04 1999-05-11 Advantest Corp Semiconductor device testing apparatus
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US6249132B1 (en) * 1997-02-12 2001-06-19 Tokyo Electron Limited Inspection methods and apparatuses
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TW379285B (en) * 1997-07-02 2000-01-11 Advantest Corp Testing device for semiconductor components and the testing trays used in the testing apparatus
TW369692B (en) * 1997-12-26 1999-09-11 Samsung Electronics Co Ltd Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
JPH11287843A (ja) * 1998-04-02 1999-10-19 Advantest Corp Ｉｃ試験装置
JP4037962B2 (ja) * 1998-06-24 2008-01-23 株式会社アドバンテスト 部品試験装置
KR100546871B1 (ko) * 1998-09-30 2006-05-23 삼성전자주식회사 테스트 핸들러
JP3567803B2 (ja) * 1999-07-08 2004-09-22 日立ハイテク電子エンジニアリング株式会社 Ｉｃデバイスの試験装置
US6564165B1 (en) * 1999-12-22 2003-05-13 Trw Inc. Apparatus and method for inline testing of electrical components
US6711450B1 (en) * 2000-02-02 2004-03-23 Advanced Micro Devices, Inc. Integration of business rule parameters in priority setting of wafer processing
US6392403B1 (en) * 2000-02-02 2002-05-21 Advanced Micro Devices, Inc. Integrated wafer stocker and sorter apparatus
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US6521853B1 (en) * 2000-05-08 2003-02-18 Micro Component Technology, Inc. Method and apparatus for sorting semiconductor devices
JP2002286791A (ja) * 2001-03-28 2002-10-03 Ando Electric Co Ltd 半導体デバイスの加熱装置および半導体デバイスの加熱方法
US6781363B2 (en) * 2001-06-21 2004-08-24 Han-Ping Chen Memory sorting method and apparatus
MY131859A (en) * 2001-06-30 2007-09-28 Stmicroelectronics Sdn Bhd Test handler apparatus for smd ( surface mount devices), bga ( ball grid arrays) and csp ( chip scale packages)
KR20030017933A (ko) * 2001-08-25 2003-03-04 엘지.필립스 엘시디 주식회사 액정디스플레이의 선 분류 장비
US6861861B2 (en) * 2002-07-24 2005-03-01 Lg Electronics Inc. Device for compensating for a test temperature deviation in a semiconductor device handler
KR100542126B1 (ko) * 2003-04-29 2006-01-11 미래산업 주식회사 반도체 소자 테스트 핸들러
KR100498496B1 (ko) * 2003-05-07 2005-07-01 삼성전자주식회사 자투리 반도체 소자의 검사 방법
KR100517074B1 (ko) * 2003-06-05 2005-09-26 삼성전자주식회사 트레이 트랜스퍼 유닛 및 그를 포함하는 자동 테스트 핸들러
KR100541546B1 (ko) * 2003-07-14 2006-01-10 삼성전자주식회사 반도체 디바이스 테스트장치
US7292023B2 (en) * 2004-06-30 2007-11-06 Intel Corporation Apparatus and method for linked slot-level burn-in
US7339387B2 (en) * 2004-06-30 2008-03-04 Intel Corporation System and method for linked slot-level burn-in
US7676908B2 (en) * 2004-07-09 2010-03-16 Advantest Corporation Pressing member and electronic device handling apparatus
KR100629262B1 (ko) * 2004-07-20 2006-09-29 삼성전자주식회사 반도체 디바이스 테스트장치의 테스트트레이
US7151388B2 (en) * 2004-09-30 2006-12-19 Kes Systems, Inc. Method for testing semiconductor devices and an apparatus therefor
US7091737B2 (en) * 2004-10-01 2006-08-15 Intel Corporation Apparatus and methods for self-heating burn-in processes
WO2006087772A1 (ja) * 2005-02-15 2006-08-24 Advantest Corporation バーンイン装置
KR100652417B1 (ko) * 2005-07-18 2006-12-01 삼성전자주식회사 인-트레이(Ｉｎ-ｔｒａｙ) 상태의 반도체 패키지 검사장치및 검사방법
WO2007026433A1 (ja) * 2005-08-31 2007-03-08 Hirata Corporation ワークハンドリング装置
JP2007192576A (ja) * 2006-01-17 2007-08-02 Nippon Gaataa Kk 電子部品の自動分類機の作動制御方法
CN101384913A (zh) * 2006-01-17 2009-03-11 株式会社爱德万测试 电子部件试验装置以及电子部件的试验方法
US20070180339A1 (en) * 2006-01-31 2007-08-02 Carli Connally Handling mixed-mode content in a stream of test results
WO2008012889A1 (en) * 2006-07-27 2008-01-31 Advantest Corporation Electronic component transfer method and electronic component handling device
KR100825781B1 (ko) * 2006-10-02 2008-04-29 삼성전자주식회사 열 분리기를 구비하는 반도체 소자용 테스트 핸들러 및이를 이용한 반도체 소자 테스트 방법
US7619936B2 (en) * 2006-11-16 2009-11-17 Qimonda North America Corp. System that prevents reduction in data retention
US20080145203A1 (en) * 2006-11-22 2008-06-19 Yun Hyo-Chul Method of transferring test trays in a handler
KR20080046356A (ko) * 2006-11-22 2008-05-27 미래산업 주식회사 핸들러의 테스트 트레이 이송방법
DE102007007528A1 (de) * 2007-02-15 2007-08-30 Hatec Handhabungstechnik Maschinenbau Gmbh Kontaktierstation zum Testen von Prüflingen unter Temperatur
DE102007007529A1 (de) * 2007-02-15 2007-08-16 Hatec Handhabungstechnik Maschinenbau Gmbh Testvorrichtung zum Testen von Prüflingen unter Temperatur
KR100819836B1 (ko) 2007-06-08 2008-04-08 미래산업 주식회사 캐리어모듈, 그를 이용한 테스트 핸들러, 및 그를 이용한반도체 소자 제조방법
US7884631B2 (en) * 2009-02-25 2011-02-08 Kingston Technology Corp. Parking structure memory-module tester that moves test motherboards along a highway for remote loading/unloading
JP4437508B1 (ja) 2009-02-27 2010-03-24 株式会社アドバンテスト 試験装置
WO2010125605A1 (ja) 2009-04-28 2010-11-04 株式会社アドバンテスト 配線基板ユニットおよび試験装置
WO2011038297A1 (en) * 2009-09-26 2011-03-31 Centipede Systems, Inc. Apparatus for holding microelectronic devices
KR20120027580A (ko) * 2010-09-13 2012-03-22 삼성전자주식회사 반도체 장치용 테스트 핸들러 및 이를 이용한 반도체 장치 테스트 방법
WO2013029659A1 (en) * 2011-08-30 2013-03-07 Osram Opto Semiconductors Gmbh Testing device and method for operating a testing device
US9099173B2 (en) * 2012-12-14 2015-08-04 Virtium Technology, Inc. Classifying flash devices using ECC
TWI472778B (zh) * 2013-08-30 2015-02-11 Chroma Ate Inc System - level IC test machine automatic retest method and the test machine
US9684030B2 (en) * 2014-12-26 2017-06-20 An-Sung Wang Drum-type IC burn-in and test equipment
TWI597508B (zh) * 2016-07-22 2017-09-01 致茂電子股份有限公司 電子元件溫控模組及具備該模組之檢測設備
US10677842B2 (en) 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
US10948534B2 (en) * 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
CN111742232A (zh) * 2017-12-19 2020-10-02 波士顿半导体设备有限公司 无套件取放处理机
KR102037975B1 (ko) * 2018-07-27 2019-10-29 세메스 주식회사 트레이 승강 장치
KR102270760B1 (ko) * 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
CN111751696B (zh) * 2020-07-05 2022-12-09 深圳市堃联技术有限公司 一种半导体芯片检测设备
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11408931B1 (en) * 2021-03-12 2022-08-09 Nanya Technology Corporation Integrated-circuit-level test system and method
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734002B (zh) * 2017-04-28 2021-07-21 日商阿德潘鐵斯特股份有限公司 電子元件測試裝置用之載具
TWI706148B (zh) * 2019-07-17 2020-10-01 美商第一檢測有限公司 晶片測試方法
TWI764340B (zh) * 2020-10-23 2022-05-11 美商第一檢測有限公司 抵壓組件及晶片測試設備
US11366136B2 (en) 2020-10-23 2022-06-21 One Test Systems Pressing assembly and chip testing apparatus

Also Published As

Publication number Publication date
KR970706501A (ko) 1997-11-03
DE19680786T1 (de) 1997-10-02
US6104183A (en) 2000-08-15
WO1997005495A1 (fr) 1997-02-13
KR100292831B1 (ko) 2001-06-15
JPH0943309A (ja) 1997-02-14
DE19680786B4 (de) 2005-09-01
JP3412114B2 (ja) 2003-06-03
US6384593B1 (en) 2002-05-07
MY113610A (en) 2002-04-30

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Legal Events

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MC4A Revocation of granted patent
MM4A Annulment or lapse of patent due to non-payment of fees