DE69605757D1 - IC-Test-Gerät - Google Patents

IC-Test-Gerät

Info

Publication number
DE69605757D1
DE69605757D1 DE69605757T DE69605757T DE69605757D1 DE 69605757 D1 DE69605757 D1 DE 69605757D1 DE 69605757 T DE69605757 T DE 69605757T DE 69605757 T DE69605757 T DE 69605757T DE 69605757 D1 DE69605757 D1 DE 69605757D1
Authority
DE
Germany
Prior art keywords
test device
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69605757T
Other languages
English (en)
Other versions
DE69605757T2 (de
Inventor
Masato Itoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinano Electronics Co Ltd
Original Assignee
Sinano Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinano Electronics Co Ltd filed Critical Sinano Electronics Co Ltd
Publication of DE69605757D1 publication Critical patent/DE69605757D1/de
Application granted granted Critical
Publication of DE69605757T2 publication Critical patent/DE69605757T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)
  • Other Air-Conditioning Systems (AREA)
DE69605757T 1995-12-22 1996-07-04 IC-Test-Gerät Expired - Fee Related DE69605757T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07335365A JP3138201B2 (ja) 1995-12-22 1995-12-22 Ｉｃテストハンドラ

Publications (2)

Publication Number Publication Date
DE69605757D1 true DE69605757D1 (de) 2000-01-27
DE69605757T2 DE69605757T2 (de) 2000-05-31

Family

ID=18287723

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69605757T Expired - Fee Related DE69605757T2 (de) 1995-12-22 1996-07-04 IC-Test-Gerät

Country Status (10)

Country Link
US (1) US5742158A (de)
EP (1) EP0780696B1 (de)
JP (1) JP3138201B2 (de)
KR (1) KR100287467B1 (de)
CN (1) CN1118707C (de)
DE (1) DE69605757T2 (de)
ES (1) ES2142523T3 (de)
MY (1) MY115397A (de)
SG (1) SG64938A1 (de)
TW (1) TW366425B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
JP4090117B2 (ja) * 1998-06-15 2008-05-28 株式会社アドバンテスト Ｉｃ吸着装置およびこれを用いたｉｃ搬送装置並びにｉｃ試験装置
US6607071B1 (en) * 1998-10-19 2003-08-19 Mirae Corporation Sealed test chamber for module IC handler
KR100349217B1 (ko) 1999-11-19 2002-08-14 미래산업 주식회사 모듈 아이씨 핸들러의 냉각 시스템
US6420864B1 (en) * 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
WO2004106953A1 (ja) * 2003-05-30 2004-12-09 Advantest Corporation 電子部品試験装置
JP5521232B2 (ja) * 2011-12-19 2014-06-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品検査装置
CN103063961B (zh) * 2012-12-28 2016-04-06 中国科学院微电子研究所 一种单粒子效应测试装置及系统
CN104624526B (zh) * 2015-02-12 2017-05-03 邵阳学院 一种手机电池电压分级检测装置
CN106697916A (zh) * 2016-12-05 2017-05-24 东莞市普华精密机械有限公司 一种ict自动供料设备
CN107511752B (zh) * 2017-10-25 2024-03-15 安徽宝维智能科技有限公司 一种用于正多边形晶片研磨的游星轮
CN109654711B (zh) * 2018-11-12 2020-09-15 武城县冠智信息产业技术有限公司 一种行星轮式出风口调风装置及调风方法
JP6719784B2 (ja) * 2018-12-21 2020-07-08 株式会社 Ｓｙｎａｘ ハンドラ
CN111878075B (zh) * 2020-09-14 2022-02-11 西南石油大学 一种倾斜油藏气水协同注入分区采出程度的测试方法
WO2024069209A1 (en) * 2022-09-28 2024-04-04 Nomadd Desert Solar Solutions Limited Company System and method of cycling testing of samples

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546404A (en) * 1983-05-23 1985-10-08 Daymarc Corporation Storage unit for an integrated circuit tester
US4790921A (en) * 1984-10-12 1988-12-13 Hewlett-Packard Company Planetary substrate carrier method and apparatus
US5310039A (en) * 1992-08-19 1994-05-10 Intel Corporation Apparatus for efficient transfer of electronic devices
JP2641020B2 (ja) * 1993-07-13 1997-08-13 株式会社しなのエレクトロニクス 吸着挟持機構及びそれを用いた温度試験装置
US5445064A (en) * 1994-12-01 1995-08-29 Lopata; Ira L. Skewer for rotiesserie
US5598769A (en) * 1995-04-26 1997-02-04 Foodservice Equipment, Engineering & Consulting, Inc. Cooking oven

Also Published As

Publication number Publication date
US5742158A (en) 1998-04-21
JPH09174478A (ja) 1997-07-08
CN1153308A (zh) 1997-07-02
ES2142523T3 (es) 2000-04-16
CN1118707C (zh) 2003-08-20
MY115397A (en) 2003-05-31
EP0780696B1 (de) 1999-12-22
DE69605757T2 (de) 2000-05-31
KR970053280A (ko) 1997-07-31
JP3138201B2 (ja) 2001-02-26
KR100287467B1 (ko) 2001-04-16
EP0780696A1 (de) 1997-06-25
TW366425B (en) 1999-08-11
SG64938A1 (en) 1999-05-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee