ES2142523T3 - Manipulador de pruebas de ic. - Google Patents

Manipulador de pruebas de ic.

Info

Publication number
ES2142523T3
ES2142523T3 ES96110820T ES96110820T ES2142523T3 ES 2142523 T3 ES2142523 T3 ES 2142523T3 ES 96110820 T ES96110820 T ES 96110820T ES 96110820 T ES96110820 T ES 96110820T ES 2142523 T3 ES2142523 T3 ES 2142523T3
Authority
ES
Spain
Prior art keywords
planetary
rotation
axis
sun
rotate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96110820T
Other languages
English (en)
Inventor
Masato Itoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinano Electronics Co Ltd
Original Assignee
Sinano Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinano Electronics Co Ltd filed Critical Sinano Electronics Co Ltd
Application granted granted Critical
Publication of ES2142523T3 publication Critical patent/ES2142523T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

ESTA INVENCION SE RELACIONA CON UN MANIPULADOR DE PRUEBA DE IC CON UNA CAMARA DE TEMPERATURA CONSTANTE QUE COMPRENDE SEIS PORTADORES DE IC PLANETARIOS (71), UN MECANISMO DE MONTAJE DE LOS PORTADORES PLANETARIOS (72) Y UN MECANISMO DE ARRASTRE DE ROTACION PERMANENTE PARA ROTAR INTERMITENTEMENTE EL MECANISMO (72). CADA PORTADOR DE IC PLANETARIO TIENE CUATRO SUPERFICIES (S) DE ROTACION SIMETRICA CON RESPECTO A UN EJE (71A) DEL PLANETA, ACTUANDO LAS CUATRO SUPERFICIES (S) CONO UNAS PARTES DE SOPORTE DE IC. LOS PORTADORES DE IC PLANETARIOS ESTAN COLOCADOS EN UN SISTEMA ANULAR SOBRE EL MECANISMO DE MONTAJE DEL PORTADOR PLANETARIO (72) QUE PUEDE ROTAR ALREDEDOR DE UN EJE (72A) DE UN SOL. LOS SEIS PORTADORES DE IC DE LOS PLANETAS (71) PUEDEN DAR VUELTAS ALREDEDOR DEL EJE (72A) PARA EL SOL MIENTRAS QUE EL MECANISMO (72) DA SOLO UNA VUELTA. EL MECANISMO DE ARRASTRE DE ROTACION INTERMITENTE ROTA INTERMITENTEMENTE EL MECANISMO DE MONTAJE DE LOS PORTADORES DE PLANETAS (72) EN UN ANGULO DE 60 (GRADOS) DEFORMA QUE, CUANDO CADA PORTADOR DE IC PLANETARIO (71) DA UNA VUELTA EN DIRECCION DE LAS AGUJAS DEL RELOJ, ROTA 90 (GRADOS) SOBRE SU PROPIO EJE. CUANDO LA TRANSMISION DE ARRASTRE (73E) Y LA TRANSMISION SOLAR (73B) ROTAN, LAS TRANSMISIONES DE LOS SEIS PLANETAS (73D) DAN VUELTAS LENTAMENTE ALREDEDOR DEL EJE DEL SOL ACOMPAÑADAS POR LA ROTACION DE UNA PLACA DE ROTACION (73C) AL TIEMPO QUE ROTAN SOBRE SU PROPIO EJE EN DIRECCION DE LAS AGUJAS DEL RELOJ. DESPUES (24) DE LAS OPERACIONES INTERMITENTES, EL IC (4C) UNIDO A UNA PARTE PORTADORA DE IC (H) ES DEVUELTA A SU POSICION INICIAL. DURANTE ESTE PERIODO, LA TEMPERATURA DEL IC (4C) EN LA PARTE DEL SOPORTE DEL IC ES MANTENIDA CONSTANTE. POR ELLO, SE PUEDE AUMENTAR EL NUMERO DE IC PRECALENTADOS EN LA CAMARA DE TEMPERATURA CONSTANTE DE IC, SE PUEDE ALARGAR EL TIEMPO DE PERMANENCIA DEL PRECALENTAMIENTO, Y SE PUEDE MEJORAR EL ESPACIO EFICIENTE EN LA CAMARA.
ES96110820T 1995-12-22 1996-07-04 Manipulador de pruebas de ic. Expired - Lifetime ES2142523T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07335365A JP3138201B2 (ja) 1995-12-22 1995-12-22 Ｉｃテストハンドラ

Publications (1)

Publication Number Publication Date
ES2142523T3 true ES2142523T3 (es) 2000-04-16

Family

ID=18287723

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96110820T Expired - Lifetime ES2142523T3 (es) 1995-12-22 1996-07-04 Manipulador de pruebas de ic.

Country Status (10)

Country Link
US (1) US5742158A (es)
EP (1) EP0780696B1 (es)
JP (1) JP3138201B2 (es)
KR (1) KR100287467B1 (es)
CN (1) CN1118707C (es)
DE (1) DE69605757T2 (es)
ES (1) ES2142523T3 (es)
MY (1) MY115397A (es)
SG (1) SG64938A1 (es)
TW (1) TW366425B (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593761B1 (en) * 1997-11-28 2003-07-15 Kabushiki Kaisha Toshiba Test handler for semiconductor device
JP4090117B2 (ja) * 1998-06-15 2008-05-28 株式会社アドバンテスト Ｉｃ吸着装置およびこれを用いたｉｃ搬送装置並びにｉｃ試験装置
US6607071B1 (en) * 1998-10-19 2003-08-19 Mirae Corporation Sealed test chamber for module IC handler
KR100349217B1 (ko) 1999-11-19 2002-08-14 미래산업 주식회사 모듈 아이씨 핸들러의 냉각 시스템
US6420864B1 (en) * 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
WO2004106953A1 (ja) * 2003-05-30 2004-12-09 Advantest Corporation 電子部品試験装置
JP5521232B2 (ja) * 2011-12-19 2014-06-11 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品検査装置
CN103063961B (zh) * 2012-12-28 2016-04-06 中国科学院微电子研究所 一种单粒子效应测试装置及系统
CN104624526B (zh) * 2015-02-12 2017-05-03 邵阳学院 一种手机电池电压分级检测装置
CN106697916A (zh) * 2016-12-05 2017-05-24 东莞市普华精密机械有限公司 一种ict自动供料设备
CN107511752B (zh) * 2017-10-25 2024-03-15 安徽宝维智能科技有限公司 一种用于正多边形晶片研磨的游星轮
CN109654711B (zh) * 2018-11-12 2020-09-15 武城县冠智信息产业技术有限公司 一种行星轮式出风口调风装置及调风方法
JP6719784B2 (ja) * 2018-12-21 2020-07-08 株式会社 Ｓｙｎａｘ ハンドラ
CN111878075B (zh) * 2020-09-14 2022-02-11 西南石油大学 一种倾斜油藏气水协同注入分区采出程度的测试方法
WO2024069209A1 (en) * 2022-09-28 2024-04-04 Nomadd Desert Solar Solutions Limited Company System and method of cycling testing of samples

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546404A (en) * 1983-05-23 1985-10-08 Daymarc Corporation Storage unit for an integrated circuit tester
US4790921A (en) * 1984-10-12 1988-12-13 Hewlett-Packard Company Planetary substrate carrier method and apparatus
US5310039A (en) * 1992-08-19 1994-05-10 Intel Corporation Apparatus for efficient transfer of electronic devices
JP2641020B2 (ja) * 1993-07-13 1997-08-13 株式会社しなのエレクトロニクス 吸着挟持機構及びそれを用いた温度試験装置
US5445064A (en) * 1994-12-01 1995-08-29 Lopata; Ira L. Skewer for rotiesserie
US5598769A (en) * 1995-04-26 1997-02-04 Foodservice Equipment, Engineering & Consulting, Inc. Cooking oven

Also Published As

Publication number Publication date
KR100287467B1 (ko) 2001-04-16
DE69605757T2 (de) 2000-05-31
JP3138201B2 (ja) 2001-02-26
MY115397A (en) 2003-05-31
KR970053280A (ko) 1997-07-31
US5742158A (en) 1998-04-21
EP0780696B1 (en) 1999-12-22
CN1118707C (zh) 2003-08-20
DE69605757D1 (de) 2000-01-27
EP0780696A1 (en) 1997-06-25
JPH09174478A (ja) 1997-07-08
CN1153308A (zh) 1997-07-02
TW366425B (en) 1999-08-11
SG64938A1 (en) 1999-05-25

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