CN1866518A - 线路元件 - Google Patents
线路元件 Download PDFInfo
- Publication number
- CN1866518A CN1866518A CNA200610080849XA CN200610080849A CN1866518A CN 1866518 A CN1866518 A CN 1866518A CN A200610080849X A CNA200610080849X A CN A200610080849XA CN 200610080849 A CN200610080849 A CN 200610080849A CN 1866518 A CN1866518 A CN 1866518A
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Classifications
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
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- H—ELECTRICITY
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
- H01L23/53295—Stacked insulating layers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
- H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
- H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
微粒/ft3 | |||||
级数 | 0.1micron | 0.2micron | 0.3micron | 0.5micron | 5micron |
1 | 3.50×10 | 7.70 | 4.00 | 1.00 | |
10 | 3.50×102 | 7.50×10 | 3.00×10 | 1.00×10 | |
100 | 7.50×102 | 3.00×102 | 1.00×102 | ||
1,000 | 1.00×103 | 7.00 | |||
10,000 | 1.00×104 | 7.00×10 | |||
100,000 | 1.00×105 | 7.00×102 |
Claims (10)
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US68272105P | 2005-05-18 | 2005-05-18 | |
US60/682,721 | 2005-05-18 |
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CN1866518A true CN1866518A (zh) | 2006-11-22 |
CN100438030C CN100438030C (zh) | 2008-11-26 |
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CNB2006100808466A Active CN100521087C (zh) | 2005-05-18 | 2006-05-18 | 一种线路元件的制作方法 |
CNB200610080849XA Active CN100438030C (zh) | 2005-05-18 | 2006-05-18 | 线路元件 |
CN2009101453027A Active CN101572244B (zh) | 2005-05-18 | 2006-05-18 | 线路组件制作方法 |
CNB2006100808485A Active CN100438029C (zh) | 2005-05-18 | 2006-05-18 | 线路元件 |
CNB2006100808470A Active CN100454484C (zh) | 2005-05-18 | 2006-05-18 | 一种线路元件的制作方法 |
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CNB2006100808466A Active CN100521087C (zh) | 2005-05-18 | 2006-05-18 | 一种线路元件的制作方法 |
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CN2009101453027A Active CN101572244B (zh) | 2005-05-18 | 2006-05-18 | 线路组件制作方法 |
CNB2006100808485A Active CN100438029C (zh) | 2005-05-18 | 2006-05-18 | 线路元件 |
CNB2006100808470A Active CN100454484C (zh) | 2005-05-18 | 2006-05-18 | 一种线路元件的制作方法 |
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CN (5) | CN100521087C (zh) |
TW (1) | TWI330863B (zh) |
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CN107644847A (zh) * | 2016-07-20 | 2018-01-30 | 台湾积体电路制造股份有限公司 | 半导体封装 |
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CN111213214A (zh) * | 2017-10-13 | 2020-05-29 | 罗姆股份有限公司 | 电子组件及电子组件模块 |
JP2021132232A (ja) * | 2017-10-13 | 2021-09-09 | ローム株式会社 | 絶縁型部品およびモジュール |
US11545299B2 (en) | 2017-10-13 | 2023-01-03 | Rohm Co., Ltd. | Electronic component and electronic component module |
JP7220743B2 (ja) | 2017-10-13 | 2023-02-10 | ローム株式会社 | 絶縁型部品およびモジュール |
CN111213214B (zh) * | 2017-10-13 | 2023-07-21 | 罗姆股份有限公司 | 电子组件及电子组件模块 |
US11923128B2 (en) | 2017-10-13 | 2024-03-05 | Rohm Co., Ltd. | Electronic component and electronic component module |
CN109524216A (zh) * | 2019-01-10 | 2019-03-26 | 广西芯百特微电子有限公司 | 一种分布式绕线电感器件及装置 |
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TWI330863B (en) | 2010-09-21 |
US20090104769A1 (en) | 2009-04-23 |
TW200710929A (en) | 2007-03-16 |
CN100438029C (zh) | 2008-11-26 |
CN100521087C (zh) | 2009-07-29 |
US7470927B2 (en) | 2008-12-30 |
US8362588B2 (en) | 2013-01-29 |
CN100454484C (zh) | 2009-01-21 |
US20110233776A1 (en) | 2011-09-29 |
CN100438030C (zh) | 2008-11-26 |
CN1866517A (zh) | 2006-11-22 |
CN101572244A (zh) | 2009-11-04 |
CN101572244B (zh) | 2011-07-06 |
US20060263727A1 (en) | 2006-11-23 |
CN1866467A (zh) | 2006-11-22 |
CN1866468A (zh) | 2006-11-22 |
US7985653B2 (en) | 2011-07-26 |
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