CN1444279A - 半导体器件及其制作方法 - Google Patents
半导体器件及其制作方法 Download PDFInfo
- Publication number
- CN1444279A CN1444279A CN02150250A CN02150250A CN1444279A CN 1444279 A CN1444279 A CN 1444279A CN 02150250 A CN02150250 A CN 02150250A CN 02150250 A CN02150250 A CN 02150250A CN 1444279 A CN1444279 A CN 1444279A
- Authority
- CN
- China
- Prior art keywords
- lead
- wire
- semiconductor device
- bottom electrode
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 78
- 238000000034 method Methods 0.000 title description 88
- 239000003990 capacitor Substances 0.000 claims abstract description 64
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000009792 diffusion process Methods 0.000 claims abstract description 15
- 230000008878 coupling Effects 0.000 claims abstract description 5
- 238000010168 coupling process Methods 0.000 claims abstract description 5
- 238000005859 coupling reaction Methods 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims description 109
- 238000004519 manufacturing process Methods 0.000 claims description 58
- 239000011229 interlayer Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 230000007797 corrosion Effects 0.000 claims description 7
- 238000005260 corrosion Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 230000003449 preventive effect Effects 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 52
- 229910052581 Si3N4 Inorganic materials 0.000 description 43
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 40
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 40
- 229910052814 silicon oxide Inorganic materials 0.000 description 27
- 239000010410 layer Substances 0.000 description 26
- 238000001259 photo etching Methods 0.000 description 21
- 238000004380 ashing Methods 0.000 description 14
- 238000010276 construction Methods 0.000 description 14
- 238000001020 plasma etching Methods 0.000 description 14
- 230000004888 barrier function Effects 0.000 description 12
- 239000004411 aluminium Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 238000001312 dry etching Methods 0.000 description 9
- 238000005498 polishing Methods 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 6
- 239000010937 tungsten Substances 0.000 description 6
- IZJSTXINDUKPRP-UHFFFAOYSA-N aluminum lead Chemical compound [Al].[Pb] IZJSTXINDUKPRP-UHFFFAOYSA-N 0.000 description 5
- 230000003667 anti-reflective effect Effects 0.000 description 5
- 239000003550 marker Substances 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/7687—Thin films associated with contacts of capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76808—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving intermediate temporary filling with material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0805—Capacitors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002064239A JP2003264235A (ja) | 2002-03-08 | 2002-03-08 | 半導体装置及びその製造方法 |
JP064239/2002 | 2002-03-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1444279A true CN1444279A (zh) | 2003-09-24 |
CN100401519C CN100401519C (zh) | 2008-07-09 |
Family
ID=28034867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021502501A Expired - Fee Related CN100401519C (zh) | 2002-03-08 | 2002-11-06 | 半导体器件及其制作方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7002201B2 (zh) |
JP (1) | JP2003264235A (zh) |
KR (1) | KR100793475B1 (zh) |
CN (1) | CN100401519C (zh) |
TW (1) | TW580766B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100390929C (zh) * | 2004-06-01 | 2008-05-28 | 国际商业机器公司 | 形成半导体器件的方法和半导体器件 |
CN100461393C (zh) * | 2003-12-30 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 用于将铜与金属-绝缘体-金属电容器结合的方法和结构 |
CN103295957A (zh) * | 2013-06-03 | 2013-09-11 | 上海华力微电子有限公司 | 一种改善金属层-绝缘层-金属层失配参数的方法 |
CN111128957A (zh) * | 2019-12-26 | 2020-05-08 | 华虹半导体(无锡)有限公司 | 嵌入结构的mim电容及其制造方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7230292B2 (en) * | 2003-08-05 | 2007-06-12 | Micron Technology, Inc. | Stud electrode and process for making same |
KR100668957B1 (ko) * | 2003-12-31 | 2007-01-12 | 동부일렉트로닉스 주식회사 | 엠아이엠 캐패시터 제조 방법 |
JP4707330B2 (ja) | 2004-03-30 | 2011-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US8227893B2 (en) | 2004-06-23 | 2012-07-24 | Nec Corporation | Semiconductor device with capacitor element |
KR100731083B1 (ko) * | 2005-07-28 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 구리 금속 배선의 형성 방법 및 그에 의해 형성된 구리금속 배선을 포함하는 반도체 소자 |
JP5038612B2 (ja) | 2005-09-29 | 2012-10-03 | 富士通セミコンダクター株式会社 | 半導体装置 |
US7488643B2 (en) * | 2006-06-21 | 2009-02-10 | International Business Machines Corporation | MIM capacitor and method of making same |
JP5127251B2 (ja) * | 2007-02-01 | 2013-01-23 | パナソニック株式会社 | 半導体装置の製造方法 |
JPWO2009090893A1 (ja) * | 2008-01-18 | 2011-05-26 | 日本電気株式会社 | 容量素子及びこれを備えた半導体装置並びに容量素子の製造方法 |
WO2009122496A1 (ja) * | 2008-03-31 | 2009-10-08 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
KR100955841B1 (ko) | 2008-06-12 | 2010-05-04 | 주식회사 동부하이텍 | 반도체 소자의 제조 방법 |
JP2011155064A (ja) * | 2010-01-26 | 2011-08-11 | Elpida Memory Inc | 半導体装置およびその製造方法 |
CN102420104B (zh) * | 2011-06-07 | 2013-12-04 | 上海华力微电子有限公司 | 一种mim(金属-绝缘层-金属)电容制作方法 |
US8546914B2 (en) * | 2011-07-19 | 2013-10-01 | United Microelectronics Corp. | Embedded capacitor structure and the forming method thereof |
CN111199956A (zh) * | 2018-11-19 | 2020-05-26 | 中芯国际集成电路制造(天津)有限公司 | 一种半导体器件及其形成方法 |
US11894297B2 (en) * | 2021-07-29 | 2024-02-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal-insulator-metal capacitor having electrodes with increasing thickness |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3569112B2 (ja) * | 1997-07-17 | 2004-09-22 | 株式会社東芝 | 半導体集積回路およびその製造方法 |
JP3496576B2 (ja) * | 1999-06-04 | 2004-02-16 | 日本電気株式会社 | 半導体装置 |
JP3967544B2 (ja) * | 1999-12-14 | 2007-08-29 | 株式会社東芝 | Mimキャパシタ |
US6498364B1 (en) * | 2000-01-21 | 2002-12-24 | Agere Systems Inc. | Capacitor for integration with copper damascene processes |
JP3715502B2 (ja) | 2000-03-14 | 2005-11-09 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP2002009248A (ja) | 2000-06-26 | 2002-01-11 | Oki Electric Ind Co Ltd | キャパシタおよびその製造方法 |
US6344964B1 (en) * | 2000-07-14 | 2002-02-05 | International Business Machines Corporation | Capacitor having sidewall spacer protecting the dielectric layer |
US6313003B1 (en) * | 2000-08-17 | 2001-11-06 | Taiwan Semiconductor Manufacturing Company | Fabrication process for metal-insulator-metal capacitor with low gate resistance |
US6492226B1 (en) * | 2001-06-15 | 2002-12-10 | Silicon Integrated Systems Corp. | Method for forming a metal capacitor in a damascene process |
JP3842111B2 (ja) * | 2001-11-13 | 2006-11-08 | 富士通株式会社 | 半導体装置及びその製造方法 |
-
2002
- 2002-03-08 JP JP2002064239A patent/JP2003264235A/ja active Pending
- 2002-10-17 TW TW091123966A patent/TW580766B/zh not_active IP Right Cessation
- 2002-10-21 US US10/274,112 patent/US7002201B2/en not_active Expired - Lifetime
- 2002-10-30 KR KR1020020066499A patent/KR100793475B1/ko active IP Right Grant
- 2002-11-06 CN CNB021502501A patent/CN100401519C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100461393C (zh) * | 2003-12-30 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | 用于将铜与金属-绝缘体-金属电容器结合的方法和结构 |
CN100390929C (zh) * | 2004-06-01 | 2008-05-28 | 国际商业机器公司 | 形成半导体器件的方法和半导体器件 |
CN103295957A (zh) * | 2013-06-03 | 2013-09-11 | 上海华力微电子有限公司 | 一种改善金属层-绝缘层-金属层失配参数的方法 |
CN111128957A (zh) * | 2019-12-26 | 2020-05-08 | 华虹半导体(无锡)有限公司 | 嵌入结构的mim电容及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100793475B1 (ko) | 2008-01-14 |
KR20030074083A (ko) | 2003-09-19 |
JP2003264235A (ja) | 2003-09-19 |
TW580766B (en) | 2004-03-21 |
CN100401519C (zh) | 2008-07-09 |
US7002201B2 (en) | 2006-02-21 |
US20030170962A1 (en) | 2003-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1444279A (zh) | 半导体器件及其制作方法 | |
CN1096116C (zh) | 半导体器件及其制造方法 | |
CN1231970C (zh) | 半导体器件 | |
CN1290186C (zh) | 半导体器件及其制造方法 | |
CN1134840C (zh) | 半导体器件及其制造方法 | |
CN1216419C (zh) | 布线基板、具有布线基板的半导体装置及其制造和安装方法 | |
CN1956173A (zh) | 半导体器件以及其制造方法 | |
CN1917149A (zh) | 半导体器件的制造方法、半导体器件及电子设备 | |
CN1725511A (zh) | 半导体器件及其制造方法 | |
CN1893070A (zh) | 有利于提高抗水性和抗氧化性的半导体器件 | |
CN1135618C (zh) | 半导体装置及其制造方法 | |
CN1452244A (zh) | 半导体器件 | |
CN1701418A (zh) | 半导体器件的制造方法、半导体晶片及半导体器件 | |
CN1155072C (zh) | 具有沟槽隔离结构的半导体器件及其制造方法 | |
CN1670953A (zh) | 半导体装置 | |
CN1416170A (zh) | 半导体装置及其制造方法 | |
CN1601735A (zh) | 半导体器件及其制造方法 | |
CN1819157A (zh) | 半导体器件 | |
CN1426106A (zh) | 半导体装置 | |
CN1716589A (zh) | 半导体器件 | |
CN1510748A (zh) | 具有多层互连结构的半导体器件及其制造方法 | |
CN1542958A (zh) | 半导体器件及其制造方法 | |
CN1722414A (zh) | 半导体器件及其制造方法 | |
CN1841719A (zh) | 多层接线板及其制造方法 | |
CN1862826A (zh) | 电介质隔离型半导体装置及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20081212 Address after: Tokyo, Japan Patentee after: Fujitsu Microelectronics Ltd. Address before: Kanagawa, Japan Patentee before: Fujitsu Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: FUJITSU MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: FUJITSU LIMITED Effective date: 20081212 |
|
C56 | Change in the name or address of the patentee |
Owner name: FUJITSU SEMICONDUCTOR CO., LTD. Free format text: FORMER NAME: FUJITSU MICROELECTRON CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa Patentee before: Fujitsu Microelectronics Ltd. |
|
CP02 | Change in the address of a patent holder |
Address after: Kanagawa Patentee after: Fujitsu Microelectronics Ltd. Address before: Tokyo, Japan Patentee before: Fujitsu Microelectronics Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080709 Termination date: 20201106 |
|
CF01 | Termination of patent right due to non-payment of annual fee |