CN1722414A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
- Publication number
- CN1722414A CN1722414A CNA2004100973214A CN200410097321A CN1722414A CN 1722414 A CN1722414 A CN 1722414A CN A2004100973214 A CNA2004100973214 A CN A2004100973214A CN 200410097321 A CN200410097321 A CN 200410097321A CN 1722414 A CN1722414 A CN 1722414A
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- semiconductor chip
- organic insulator
- semiconductor device
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004207516A JP4265997B2 (ja) | 2004-07-14 | 2004-07-14 | 半導体装置及びその製造方法 |
JP2004207516 | 2004-07-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1722414A true CN1722414A (zh) | 2006-01-18 |
CN100375273C CN100375273C (zh) | 2008-03-12 |
Family
ID=35598592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100973214A Expired - Fee Related CN100375273C (zh) | 2004-07-14 | 2004-11-26 | 半导体器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7247950B2 (zh) |
JP (1) | JP4265997B2 (zh) |
KR (1) | KR100605349B1 (zh) |
CN (1) | CN100375273C (zh) |
TW (1) | TWI244747B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105590918A (zh) * | 2014-11-03 | 2016-05-18 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6348728B1 (en) | 2000-01-28 | 2002-02-19 | Fujitsu Limited | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer |
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JP3938759B2 (ja) | 2002-05-31 | 2007-06-27 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
EP1367645A3 (en) * | 2002-05-31 | 2006-12-27 | Fujitsu Limited | Semiconductor device and manufacturing method thereof |
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Cited By (2)
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CN105590918A (zh) * | 2014-11-03 | 2016-05-18 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
CN105590918B (zh) * | 2014-11-03 | 2019-08-16 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
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US7247950B2 (en) | 2007-07-24 |
TW200603374A (en) | 2006-01-16 |
KR20060005969A (ko) | 2006-01-18 |
CN100375273C (zh) | 2008-03-12 |
JP4265997B2 (ja) | 2009-05-20 |
US20060012017A1 (en) | 2006-01-19 |
KR100605349B1 (ko) | 2006-07-28 |
JP2006032556A (ja) | 2006-02-02 |
TWI244747B (en) | 2005-12-01 |
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