JP5782919B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5782919B2 JP5782919B2 JP2011183628A JP2011183628A JP5782919B2 JP 5782919 B2 JP5782919 B2 JP 5782919B2 JP 2011183628 A JP2011183628 A JP 2011183628A JP 2011183628 A JP2011183628 A JP 2011183628A JP 5782919 B2 JP5782919 B2 JP 5782919B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- transformer
- transmission
- semiconductor
- reception
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Transceivers (AREA)
Description
上記のように、本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
2…マイクロプロセッサ
10…基体
11…第1の半導体チップ
12…第2の半導体チップ
13…第3の半導体チップ
31、32…外部素子
40…基板トランス
45…コア材
400…トランス基板
401…絶縁体層
402、403…ソルダーレジスト
405…プラグ
410…第1のトランス基板
411…第1の送信トランス
412…第1の受信トランス
420…第2のトランス基板
421…第2の送信トランス
422…第2の受信トランス
La、Lb…プレーナインダクタ
P1a、P1b、P2a、P2b…パッド
Claims (6)
- 基体と、
前記基体に搭載された第1及び第2の半導体チップと、
前記基体に搭載され、前記第1及び第2の半導体チップの動作を制御する制御信号を出力する第3の半導体チップと、
前記基体に搭載され、受信側端子が前記第3の半導体チップに接続し、送信側端子が前記第1の半導体チップに接続する第1の送信トランスと、
前記基体に搭載され、受信側端子が前記第3の半導体チップに接続し、送信側端子が前記第2の半導体チップに接続する第2の送信トランスと
を備え、
前記第1の送信トランス及び前記第2の送信トランスが、
コア材の対向する2つの主面上にそれぞれ配置され、前記コア材を貫通する貫通部で互いの端部が接続された2つの導電性薄膜パターンによりそれぞれ構成される第1のインダクタ及び第2のインダクタと、
前記第1のインダクタと前記第2のインダクタの間に配置された絶縁体層と
を備える基板トランスであり、
前記第1の送信トランスと前記第2の送信トランスをそれぞれ介して、前記第3の半導体チップから前記第1の半導体チップと前記第2の半導体チップに前記制御信号が送信されることを特徴とする半導体装置。 - 前記第1の送信トランスに隣接して配置され、受信側端子が前記第1の半導体チップに接続し、送信側端子が前記第3の半導体チップに接続する第1の受信トランスを更に備え、前記第1の受信トランスを介して、前記制御信号に対応した戻り信号が前記第1の半導体チップからの前記第3の半導体チップに送信されることを特徴とする請求項1に記載の半導体装置。
- 前記第1の送信トランスと前記第1の受信トランスが、前記基体に搭載された単一の基板に形成されていることを特徴とする請求項2に記載の半導体装置。
- 前記第2の送信トランスに隣接して配置され、受信側端子が前記第2の半導体チップに接続し、送信側端子が前記第3の半導体チップに接続する第2の受信トランスを更に備え、前記第2の受信トランスを介して、前記制御信号に対応した戻り信号が前記第2の半導体チップからの前記第3の半導体チップに送信されることを特徴とする請求項1乃至3のいずれか1項に記載の半導体装置。
- 前記第2の送信トランスと前記第2の受信トランスが、前記基体に搭載された単一の基板に形成されていることを特徴とする請求項4に記載の半導体装置。
- 前記第3の半導体チップが、前記第1の送信トランスと前記第2の送信トランス間に配置されていることを特徴とする請求項1乃至5のいずれか1項に記載の半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011183628A JP5782919B2 (ja) | 2011-08-25 | 2011-08-25 | 半導体装置 |
PCT/JP2012/063466 WO2013027454A1 (ja) | 2011-08-25 | 2012-05-25 | 半導体装置 |
KR1020147005836A KR20140058596A (ko) | 2011-08-25 | 2012-05-25 | 반도체 장치 |
US14/240,453 US20140210047A1 (en) | 2011-08-25 | 2012-05-25 | Semiconductor device |
CN201280041403.XA CN103748680A (zh) | 2011-08-25 | 2012-05-25 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011183628A JP5782919B2 (ja) | 2011-08-25 | 2011-08-25 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013046285A JP2013046285A (ja) | 2013-03-04 |
JP5782919B2 true JP5782919B2 (ja) | 2015-09-24 |
Family
ID=47746209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011183628A Expired - Fee Related JP5782919B2 (ja) | 2011-08-25 | 2011-08-25 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140210047A1 (ja) |
JP (1) | JP5782919B2 (ja) |
KR (1) | KR20140058596A (ja) |
CN (1) | CN103748680A (ja) |
WO (1) | WO2013027454A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017013769A1 (ja) * | 2015-07-22 | 2017-01-26 | サンケン電気株式会社 | 半導体装置 |
WO2017013768A1 (ja) * | 2015-07-22 | 2017-01-26 | サンケン電気株式会社 | 半導体装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09275328A (ja) * | 1996-04-04 | 1997-10-21 | Hitachi Ltd | 可変容量回路及びそれを用いたアナログフィルタ回路 |
JP4109340B2 (ja) * | 1997-12-26 | 2008-07-02 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
JP2004343976A (ja) * | 2003-03-14 | 2004-12-02 | Fuji Electric Holdings Co Ltd | 多出力超小型電力変換装置 |
TWI330863B (en) * | 2005-05-18 | 2010-09-21 | Megica Corp | Semiconductor chip with coil element over passivation layer |
DE102005047055A1 (de) * | 2005-09-30 | 2007-04-05 | Infineon Technologies Austria Ag | Ansteuerschaltung mit einem Transformator für ein Halbleiterschaltelement |
US7852186B2 (en) * | 2006-08-28 | 2010-12-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics |
JP2008277485A (ja) * | 2007-04-27 | 2008-11-13 | Fuji Electric Device Technology Co Ltd | トランスユニットおよび電力変換装置 |
JP4670853B2 (ja) * | 2007-10-16 | 2011-04-13 | 三菱電機株式会社 | 送受信モジュール |
US20090153229A1 (en) * | 2007-12-14 | 2009-06-18 | Andre Hanke | Method for Signal Transmission between Semiconductor Substrates, and Semiconductor Component Comprising Such Semiconductor Substrates |
US7884444B2 (en) * | 2008-07-22 | 2011-02-08 | Infineon Technologies Ag | Semiconductor device including a transformer on chip |
JP5332374B2 (ja) * | 2008-07-25 | 2013-11-06 | サンケン電気株式会社 | 半導体装置 |
-
2011
- 2011-08-25 JP JP2011183628A patent/JP5782919B2/ja not_active Expired - Fee Related
-
2012
- 2012-05-25 CN CN201280041403.XA patent/CN103748680A/zh active Pending
- 2012-05-25 US US14/240,453 patent/US20140210047A1/en not_active Abandoned
- 2012-05-25 KR KR1020147005836A patent/KR20140058596A/ko not_active Application Discontinuation
- 2012-05-25 WO PCT/JP2012/063466 patent/WO2013027454A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN103748680A (zh) | 2014-04-23 |
WO2013027454A1 (ja) | 2013-02-28 |
US20140210047A1 (en) | 2014-07-31 |
JP2013046285A (ja) | 2013-03-04 |
KR20140058596A (ko) | 2014-05-14 |
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