CN1320101A - 将气密盖密封到半导体管芯的方法和装置 - Google Patents

将气密盖密封到半导体管芯的方法和装置 Download PDF

Info

Publication number
CN1320101A
CN1320101A CN99811548A CN99811548A CN1320101A CN 1320101 A CN1320101 A CN 1320101A CN 99811548 A CN99811548 A CN 99811548A CN 99811548 A CN99811548 A CN 99811548A CN 1320101 A CN1320101 A CN 1320101A
Authority
CN
China
Prior art keywords
lid
welding material
seal area
layer
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN99811548A
Other languages
English (en)
Inventor
J·G·舒克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ECHELLE Inc
Silicon Light Machines Inc
Original Assignee
ECHELLE Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ECHELLE Inc filed Critical ECHELLE Inc
Publication of CN1320101A publication Critical patent/CN1320101A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0233—Structure of the redistribution layers
    • H01L2224/02335—Free-standing redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Die Bonding (AREA)

Abstract

一种气密地钝化半导体器件的方法和装置包括将盖直接密封到半导体衬底上。有源器件形成在衬底的表面上,并由基本上平坦的盖密封区环绕,进而由键合焊盘环绕。第一层可焊接材料形成在盖密封区上。提供盖,盖具有结构上对应于第一层的第二层可焊接材料。焊料层提供在可焊接材料的第一层和第二层之间。在优选实施例中,焊料形成在第二层上。加热以将盖气密地结合到半导体器件上同时不需要常规的封装。优选第一和第二层为使用常规半导体技术处理的常规已知可焊接材料的多层结构。通过调节一层或两层可焊接材料的相对宽度可以控制盖和半导体器件之间的角度。

Description

将气密盖密封到半导体管芯的方法和装置
本发明涉及钝化半导体管芯，特别是气密地钝化半导体管芯的领域。具体地，本发明涉及将透光盖安装并密封到光激活的半导体集成电路。
在集成电路(芯片)的制造中，众所周知需要密封芯片以防止机械损伤和污染。这些称为钝化芯片。现有多种密封芯片的公知技术。这些技术包括将芯片安装到封装的腔体内，将芯片引线键合到引线框架，然后用盖密封封装。另一公知技术包括将芯片安装到引线框架，将芯片引线键合到引线框架，然后将芯片和引线框架钝化在模制塑料或塑料环氧体中。钝化芯片的第三个常见技术包括将芯片倒装到印制电路板然后用塑料树脂覆盖芯片。
EPROM为只读存储器件。仅能通过使或允许光学辐射(紫外线和可见光)照射到EPROM的表面删除存储在EPROM中的程序或数据。因此，常规的芯片封装技术不合适是由于它们不能透过光辐射。要解决该问题，EPROM的制造商将EPROM芯片安装在陶瓷封装的腔体内并用透光盖气密地密封组件。
微电机械器件(MEM)为公知的另一种硅半导体器件。MEM对多种应用都非常有用，包括应变仪、加速仪、电子水准仪，并且也用于显示器或其它光学装置。由于它们极小的活动元件，MEM特别易受环境条件影响。因此，MEM通常密封在气密封装的腔体内，然后气密地密封以控制MEM的环境。
当MEM用在显示应用中时，要求光能(光)能够透过封装，照射到MEM的表面进行调制，然后透过封装形成显示图像。对于其它光学器件也要求光进入并离开封装的能力。虽然常规的陶瓷封装气密密封，然而由于它们不透明，因此它们不适合与显示器或光学MEM一起使用。在一些显示器或光学MEM的应用中，MEM安装在陶瓷封装的腔体内。通过将透明盖附加到陶瓷封装上用与EPROM封装相同气密密封的方式气密密封组件。
众所周知制造硅半导体器件的大多数成本都与封装技术有关。这特别适用于全密封陶瓷封装。包括光学透明窗口的封装成本仍然相当昂贵。
在有些情况下当制造显示器或其它光学MEM组件时，重要的是MEM和透明盖相互之间有精确的物理关系。对于一些应用，重要的是MEM和透明盖要精确地相互平行。对于其它一些应用，重要的是MEM和透明盖作为结构之间精确的角度。常规的硅半导体芯片封装技术不会考虑控制芯片和封装盖之间角度的能力。
需要一种气密地密封计划用在显示器应用中的MEM的方法和装置。需要一种气密地密封计划用在光学应用中的MEM的方法和装置。还需要一种密封具有高引脚数的MEM的方法和装置。此外需要一种较便宜地保护MEM的方法和装置。需要一种气密地密封可以通过不复杂的制造工艺安装到MEM的显示MEM的方法和装置。进一步需要一种密封显示MEM的方法和装置，其中可以通过组装工艺精确地控制盖相对于MEM的角度。
气密地钝化半导体器件的方法和装置包括将盖直接密封到半导体衬底上。有源器件形成在衬底的表面上，并由基本上平坦的盖密封区环绕，进而由键合焊盘环绕。第一层可焊接材料形成在盖密封区上。所提供的盖具有结构上与第一层的相对应第二层可焊接材料。焊料层提供在可焊接材料的第一层和第二层之间。在优选实施例中，焊料形成在第二层上。加热以将盖气密地结合到半导体器件上同时不需要常规的封装。优选第一和第二层为使用常规半导体技术处理的常规已知可焊接材料的多层结构。通过调节一层或两层可焊接材料的相对宽度可以控制盖和半导体器件之间的角度。
此外，可以使用其它的技术将盖密封到衬底。在第一备选方案中，使用环氧树脂。可选择的第一间隔材料形成在盖密封区中。以对应于盖密封区的结构形成环氧树脂。盖和半导体器件对准并加热以气密地将它们结合在一起。
在第二备选方案中，使用玻璃熔块(frit)。可选择的第二间隔材料形成在盖密封区中。以对应于盖密封区的结构形成玻璃熔块。盖和半导体器件对准并加热以气密地将它们结合在一起。
图1示出了优选实施例的简化截面图。
图2示出了根据本发明的半导体器件的示例性的平面方框图。
图3示出了密封盖之前盖和半导体器件的简化示意性截面图。
图4示出了根据本发明盖密封到半导体器件的简化示意性截面图，比图3略微详细。
图5示出了根据本发明盖的简化示意性截面图，比图3略微详细。
图6示出了根据本发明盖的备选实施例的简化示意性截面图，比图3略微详细。
图7示出了根据本发明半导体器件盖的简化示意性截面图，比图3略微详细。
图8示出了根据本发明半导体器件的备选实施例的简化示意性截面图，比图3略微详细。
图9示出了盖密封到半导体器件之前产生预定倾斜角的一个实施例的示意性截面图。
图10示出了盖密封到半导体器件之后图9的实施例在原位倾斜的放大示意性截面图。
图11示出了将盖与半导体器件对准的定位器的平面图。
图12示出了图11定位器的侧视图。
图13示出了根据本发明密封盖到半导体器件的工艺中温度与时间关系的曲线图。
图14示出了根据本发明密封盖到半导体器件的工艺中压力与时间关系的曲线图。
图15示出了同时分离盖和半导体器件的晶片锯的示意性截面图。
研制本发明以气密地密封用于显示器件的MEM的机械操作部分。具体地，MEM为衍射光栅光阀(GLV)。GLV的例子可以在U.S.专利No.5,311,360中找到，也可以在U.S.专利申请No.08/482,188中找到。该技术的研制者发现如果环境湿气沉积在带形结构上，发生表面放电，妨碍了GLV的适当操作。要避免这种问题，优选在气密封装中钝化MEM结构的机械操作部分。此外，重要的是玻璃型或具有合适光学特性的其它透明材料的密封。
与用于硅半导体器件的其它气密钝化技术的现有技术相比，本发明的气密盖直接密封到硅半导体器件的表面上。对于本领域中的普通技术人员来说很显然本发明的钝化技术也可用于气密密封包括非硅或非半导体器件的其它类型器件或用于不透明盖结构。
图1示出了透明盖气密地密封到硅半导体器件的代表性截面图。优选实施例的硅半导体器件为用于形成显示器的GLV。图1的剖面图没有按比例画，也没有包括在工作的GLV中可找到的所有必须的元件。所述省略不是为了限定，在本文件中这样做是为了避免不必要和无关的细节混淆本发明。
包括金属性导电和反射覆盖物102的导电带100形成在半导体衬底104上，气隙106位于带100和衬底104之间。电极108形成在衬底104的表面上，并由绝缘层110覆盖。电极108位于在带100下，并且也位于气隙106下。反射覆盖物102在机械操作的带100的区域上延伸，并构形成常规的键合焊盘112和它的末端。器件也用常规的覆盖绝缘钝化层114钝化。钝化层114不覆盖键合焊盘112，也不覆盖带形结构100/102。使用常规的焊线键合结构116将控制和电源信号耦合到半导体器件。
根据常规的半导体制造技术，器件尽可能地密集地组装到半导体衬底的表面上。然而，这里由于光学玻璃直接气密地密封到半导体器件上，键合焊盘112要远离带形结构100/102相当一段距离以提供盖密封区118。使用常规的半导体处理技术将可焊接材料120形成在盖密封区118上。
由于本发明的优选应用是气密密封用于显示器应用的GLV，因此盖122优选由光学特性材料形成。本领域中的普通技术人员应该理解盖122可以由光敏材料覆盖，用于多种目的，包括但不限于，过滤掉不希望的辐射、增加反射率、或降低反射率。此外，也可以使盖122具有光学特性。换句话说，盖122可以为任何合适类型的透镜。
一旦形成适合安装到盖密封区118上的尺寸的盖，使用常规的半导体处理技术，形成环形可焊接材料124，环绕盖122一个表面的外周边。接下来，焊料126淀积在可焊接材料124上，由此盖结合到半导体器件上。虽然没有按比例显示，但从图1的图中可以清楚地看出，盖122和带形结构100/102可远离安装(mounted away)，以避免相互干扰。以此方式，所述结构100/102可自由地上下移动。
图2示出了根据本发明的示例性器件的平面图，其中各区域显示为方框。对于本领域中的普通技术人员来说，可以显著地更改各结构之间的精确尺寸和比例，但仍落入这些教导的精神和范围内。根据本发明的盖的优选实施例，盖为光学元件，计划安装在用做显示器(display engine)的GLV上。GLV的带形结构包括机械操作区140。在机械操作区140周围设置有盖密封区118。如果合适，在几个图中相同的参考数字用于表示相同的元件。如前所述，钝化盖密封区118，不包括如通常能在MEM器件中找到的机械操作元件。类似地，盖密封区118也不包括键合焊盘或其它芯片外接口结构，是由于盖会干扰象这样的有效操作。盖密封区118可以包括有源电子元件。然而，当盖密封区118包括有源电子元件时，必须尝试平面化该区域以提供盖合适匹配的表面。
键合区142环绕盖密封区118。键合区142包括使半导体器件与芯片外电路和系统电连接所需要的一些键合焊盘。在本发明如GLV的显示元件中，需要一千多个键合焊盘。其它类型的半导体器件根据它们预计的应用需要或多或少的键合焊盘。
图3示出了本发明第一实施例的代表性示意截面图。如前所述，可焊接材料150形成在半导体器件154的盖密封区152上。可焊接材料156也形成在透明盖158的外周边周围。焊料层160形成在可焊接材料层156上。对于本领域中的普通技术人员显然焊料也可以施加到第一层可焊接材料上。然而，本发明人优选将焊料附加到盖上以避免焊料污染晶片。
透明盖158接触并对准半导体器件154。加热组件以使焊料160流动。变成液体之后焊料160’的表面张力使它保留在半导体器件154上的可焊接材料150和透明盖158上的可焊接材料156之间。焊料160’在参考数字上标有上标(’)，以表示由于流动和重新固化结构已改变。加热组件足够的时间以使焊料160流动并润湿所有可焊接表面。一旦除去热源焊料160’重新固化，并且透明盖158气密地密封到半导体器件154，如图4的截面图所示。
图5示出了盖和金属层的截面图。根据优选实施例，可焊接材料156实际包括多层结构。在优选实施例中，可焊接层156包括靠着透明盖158形成的第一层156A。第二层156B形成在第一层156A上，然后焊料层160形成在第二层156B上。在使用这些层的优选实施例中，第一层156A使用300埃的铬层，第二层156B为10,000埃的金层。焊料层160为50微米厚的80Au/20Sn焊料。
根据优选实施例，在其上形成金属层之前，将透明盖158分段(segmented)。本发明通过实验发现掩蔽透明盖158侧边的成本超过了材料的成本。由此，在实践中，金和铬也形成在透明盖158的侧边。虽然这不是首选的，但也不会产生有害影响。随着制造工艺的发展，也可以去除透明盖158侧边上的金铬。
图6示出了盖和金属层的另一实施例的截面图。在该实施例中，可焊接材料156也包括多层结构。这里，可焊接材料包括靠着透明盖158形成的第一层156C。第二层156D形成在第一层156C上，第三层156E形成在第二层156D上。然后焊料层160形成在第三层156E上。在该实施例中，第一层156C是300埃的铬层，第二层156D为500埃的镍层，第三层156E为10,000埃的金层。焊料层160为50微米厚的80Au/20Sn焊料。
图7示出了半导体器件154的可焊接区152的一个实施例的截面图。为简化起见，没有显示半导体器件154的有源部分。可焊接材料层实际由多层结构形成。使用常规的剥离半导体处理技术形成多层结构。换句话说，光致抗蚀剂层淀积在半导体晶片的表面上。使用常规的掩蔽技术，穿过光致抗蚀剂形成开口。然后可焊接材料层淀积在晶片上，并进入穿过光致抗蚀剂形成的开口内。除去光致抗蚀剂之后，可焊接材料层仅保留在盖密封区152中的半导体晶片的表面上。
第一层150A形成在半导体器件154的盖密封区152中。第二层150B形成在第一层150A上。在本实施例中，第一层150A为500埃的铬层，第二层150B为10,000埃的钯层。
图8示出了可焊接区152的另一实施例的截面图。在本实施例中，可焊接层150包括三层结构。第一层150C形成在半导体器件154的盖密封区152中。第二层150D形成在第一层150C上，使用常规的剥离技术，第三层150E形成在第二层150D上。在该实施例中，第一层150C使用300埃的钛层，第二层150D为1000埃的镍层，第三层150E为1000埃的铂层。
显然，透明盖158和半导体器件154之间的角度会影响组件的光学特性。例如，半导体器件154的表面和透明盖158的下面之间的光能反射会产生有益或破坏性的干扰。有一些应用需要透明盖158与半导体器件154平行，有一些应用需要这些元件之间有预定的角度。本发明也为用户提供了控制和选择透明盖158与半导体器件154之间预定角度的技术和能力。
一旦融化，焊料160将在所有的润湿表面上流动。然而，焊料160的表面张力会阻止它流到可焊接层150和156的边界外。由于焊料的粘性，焊料不会在环形结构的周边环形地流动，例如本发明介绍的。
由于使用常规的半导体处理技术同时形成所有的层，因此几层的每一层的厚度在整个层中都是均匀的。要控制透明盖158和半导体器件154之间的相对角度，可调节可焊接层150一侧的相对宽度。图9示出了本实施例的简化截面图。如前所述半导体器件154的盖覆盖区152基本上为矩形环。沿矩形环的一个边改变形成可焊接层150的掩模，形成较宽层150’。
图10示出了一旦盖158与半导体器件154对准并且加热组件气密地密封结构的图9实施例的截面图。将焊料168加热到熔点以上后，它流到所有的润湿表面。由于层150’比层150宽，焊料160”必须扩展得比焊料宽160”’。此外，由于焊料不会在环形结构的周边环形地流动，因此宽焊料层150’上的透明盖158比常规的可焊接层150上的透明盖158更靠近半导体器件154。
对于本领域中的普通技术人员来说通过改变连接到透明盖158的可焊接层156的宽度，也可以调节所得焊料的厚度以及透明盖158和半导体器件154之间的角度。通过同时改变可焊接层150和它对应的可焊接层156的宽度，也可以调节角度。然而，由于半导体器件154的晶片用一系列的晶片掩模制成，并由于盖分别与晶片对准，因此仅通过适当地调节可焊接层150的宽度，就可以容易地调节角度。
图11示出了将透明盖与晶片上的半导体器件对准的定位器200的平面图。图12示出了同一定位器200的截面的部分侧视图。在图11和12中共同的参考数字用于表示相同的元件。定位器200包括石墨基座202。基座202包括适当尺寸的切口204(cut-out)以接收半导体晶片。四个螺纹锁紧元件206(螺钉)向上穿过基座202并穿过多个孔208。
中间板210包括对准以接收螺纹锁紧元件206的孔214。中间板210还包括37个开口212，大小可接收透明盖158(图3)。中间板210还包括三个槽216，设置以便随后的加热操作期间使湿气从半导体器件154(图3)排出。对准针218安装到基座202并穿过中间板210。一对压板220也包括孔222，设置以接收螺纹锁紧元件206。
在使用中，晶片对准并安装在基座202的断路器204内，半导体器件154(图3)背向基座202。然后中间板210安装到晶片上的基座202。然后透明盖158插到每个开口212内。显然可以对仍然为晶片形式的半导体器件154进行测试操作，标出坏器件以便透明盖158不需要密封这些坏器件。加负荷的盖板224搁在透明盖158上，由于重力向下施加适量的压力。
一旦针对图11和12介绍的组件完全构成，它将被放入环境室内。图13示出了以℃为单位的温度与时间的曲线图。图14示出了以tort和/或atm为单位的气压与时间的曲线图。一旦从环境大气移走，组件暴露到回充(back fill)气体，包括10％的He、10％的H和80％的N，至少1ppm的水。结合一个时间线显示了图13和14两个曲线图，这里介绍本发明的形成气密密封的工艺。
组件放入初始条件为环境温度和气氛的环境室内。马上，气氛抽空到0.1torr的真空压力。该周期持续约1分钟。然后组件受到2atm压力的回充气体约15到30秒，然后气氛抽空到0.0001torr的真空压力。所述第一次抽空持续约5分钟，在抽空期间，室加热到190℃。这小于焊料的熔点。所述加热步骤烘干了半导体器件154(图3)以及盖158(图3)上的残留湿气，称为干燥真空烘焙。在约7.5分钟的干燥真空烘焙期间，将气氛再次抽空到0.0001torr约1分钟。因此，在约9.5分钟，用回充气体将压力增加到2atm。一旦约10分钟压力达到2atm，加热室超过焊料的熔点，并保持该温度约3分钟。然后温度返回到室温。返回经过熔点之后，由此焊料固化并气密半导体器件，气压返回到环境压力。通过辐射热源进行加热步骤，当然也可以使用其它任何方便的加热方式。
如前所述必须首先形成可焊接材料层以便焊料适当地粘接到盖和半导体器件。这样做有一些有利之处。对于MEM，重要的是盖不影响机械MEM结构的自由移动。可焊接材料层可用于增加盖和半导体器件之间的距离。然而，除焊料之外的其它材料也可以用于密封半导体器件。结构的材料也可以如下所述适当地替换。
可以在盖密封区中或盖周边的周围，或两者中形成聚合环氧树脂环。之后盖和半导体器件接触在一起，加热和冷却以钝化半导体器件。根据环氧层的厚度和它的相对粘度，盖和半导体器件充分远离，以避免盖干扰MEM的操作。除非其它简单的实验指出，任何合适的材料可以首先淀积在盖密封区中、盖周边的周围，或两者中以增加盖和半导体器件之间的间距。隔离材料可以是在常规的半导体制造设备中容易制造的材料，例如SiO2。
可以代替聚合环氧树脂的其它材料是玻璃熔块。对于所述置换，可以与以上介绍的聚合环氧相同的方式使用玻璃材料。
对于本领域中的普通技术人员来说显然盖和它们的可焊接层的各环以及焊料的覆盖层可以形成在晶片的透明材料上。然后，在结合图13和14中指示的温度周期变化之前，透明晶片和半导体晶片仅需要固定和对准。要将器件分成分立的器件，仅需要使用窄晶片锯条并切入透明晶片仅预定深度以形成分离的盖，然后在第二操作中，使用相同的窄条锯分开各半导体器件。在另一实施例中，可以使用一个带小搁板(berm)的窄条锯在一次操作中分开这些器件。如图1 5所示，盖158被搁板300分开，半导体器件154同时被锯条302的顶端分开。
当盖158都同时形成在晶片中然后与半导体器件154的晶片结合在一起时，对于本领域中的普通技术人员来说显然半导体器件154和盖158需要相互平行。要在半导体器件154和盖158之间形成预定的角度，那么如前所述半导体器件154和/或盖158要具有不均匀的周边区域。一旦使用以上介绍的一种技术将半导体器件154和盖158最初结合在一起，切割组件形成分立的单元。因此，这些单元可重新加热以使密封回流并在半导体器件154和盖158之间提供需要的角度。
依照具体的实施例结合细节介绍了本发明，以便于理解本发明的构成和操作的基本原理。这里提到的具体实施例及其细节不是为了限定附带的权利要求书的范围。对于本领域中的普通技术人员来说显然可以对为了说明选择的实施例进行修改同时不脱离本发明的精神和范围。

Claims (50)

1．一种具有气密密封的微电子机械(MEM)，包括：
a．其上形成有有源MEM器件的衬底；
b．环绕有源MEM器件的盖密封区；
c．形成在盖密封区上的第一层可焊接材料；
d．形成在第一层可焊接材料上的焊料层；
e．形成在焊料层上的第二层可焊接材料；
f．形成第二层可焊接材料上的盖，由此形成气密密封。
2．根据权利要求1的MEM，其中第一层可焊接材料为包括与盖密封区邻接的铬和与焊料邻接的钯的多层结构。
3．根据权利要求1的MEM，其中第一层可焊接材料为包括与盖密封区邻接的钛、与钛邻接的镍以及镍和焊料之间的铂的多层结构。
4．根据权利要求1的MEM，其中第二层可焊接材料为包括与焊料邻接的金和与盖邻接的铬的多层结构。
5．根据权利要求1的MEM，其中第二层可焊接材料为包括与焊料邻接的金、与金邻接的镍以及镍和盖之间的铬。
6．一种显示器件，包括：
a．形成在半导体衬底上的调光器；
b．环绕调光器的盖密封区；
c．与盖密封区相邻并远离调光器设置的多个键合焊盘；
d．形成在盖密封区上的第一层可焊接材料；
e．形成在第一层可焊接材料上的焊料层；
f．形成在焊料层上的第二层可焊接材料；
g．形成第二层可焊接材料上的透明盖，由此形成气密密封。
7．根据权利要求6的显示器件，其中调光器为衍射栅光阀。
8．根据权利要求6的显示器件，其中第一层可焊接材料为包括与盖密封区邻接的铬和与焊料邻接的钯的多层结构。
9．根据权利要求6的显示器件，其中第一层可焊接材料为包括与盖密封区邻接的钛、与钛邻接的镍以及镍和焊料之间的铂的多层结构。
10．根据权利要求6的显示器件，其中第二层可焊接材料为包括与焊料邻接的金和与盖邻接的铬的多层结构。
11．根据权利要求6的显示器件，其中第二层可焊接材料为包括与焊料邻接的金、与金邻接的镍以及镍和盖之间的铬。
12．一种使半导体器件形成气密密封的方法，包括以下步骤：
a．在半导体衬底上形成有源半导体器件；
b．环绕有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和盖密封区外形成电连接到有源半导体器件的装置；
d．在盖密封区上形成第一层可焊接材料；
e．在透光盖上形成第二层可焊接材料，图形与第一层可焊接材料一致；
f．使第一层可焊接材料与第二层可焊接材料对准，同时在两者之间提供焊料层；以及
g．施加热熔化焊料并将盖密封到盖密封区。
13．一种在盖和半导体器件之间形成气密密封的方法，其中盖和半导体器件相互平行，包括以下步骤：
a．在半导体衬底上形成有源半导体器件；
b．环绕有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和盖密封区外形成电连接到有源半导体器件的装置；
d．在盖密封区上形成第一层可焊接材料；
e．在透光盖上形成第二层可焊接材料，图形与第一层可焊接材料一致；
f．使第一层可焊接材料与第二层可焊接材料对准，同时在两者之间提供焊料层；以及
g．施加热熔化焊料并将盖密封到盖密封区，
其中第一层可焊接材料和第二层可焊接材料每个在它们各长度周围具有基本上均匀的截面。
14．一种在盖和半导体器件之间形成气密密封的方法，其中盖和半导体器件相互不平行，包括以下步骤：
a．在半导体衬底上形成有源半导体器件；
b．环绕有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和盖密封区外形成电连接到有源半导体器件的装置；
d．在盖密封区上形成第一层可焊接材料；
e．在透光盖上形成第二层可焊接材料，图形与第一层可焊接材料一致；
f．使第一层可焊接材料与第二层可焊接材料对准，同时在两者之间提供焊料层；以及
g．施加热熔化焊料并将盖密封到盖密封区，
其中第一层可焊接材料和第二层可焊接材料中的至少一个在它们各长度周围具有基本上不均匀的截面。
15．根据权利要求14的方法，其中盖密封区和第一层可焊接材料具有基本上矩形的构形，具有基本上以直角接合的四个支柱，第一层可焊接材料的一个支柱具有与其它三个支柱基本上不同的截面面积。
16．一种使多个半导体器件的每一个同时形成气密密封的方法，所述多个半导体器件都形成在单个半导体晶片上，包括以下步骤：
a．在半导体衬底上形成多个有源半导体器件；
b．环绕每个有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和每个有源半导体器件的盖密封区外形成电连接到每个有源半导体器件的装置；
d．在每个盖密封区上形成第一层可焊接材料；
e．在透光晶片上形成第二层可焊接材料，图形与第一层可焊接材料一致；
f．使第一层可焊接材料与第二层可焊接材料对准，同时在两者之间提供焊料层；以及
g．施加热熔化焊料并将晶片密封到盖密封区。
17．一种在透明晶片和具有多个半导体器件的半导体晶片之间形成气密密封的方法，其中透明晶片和半导体晶片相互平行，包括以下步骤：
a．在半导体衬底上形成具有多个有源半导体器件的晶片；
b．环绕每个有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和每个盖密封区外形成电连接到每个有源半导体器件的装置；
d．在每个盖密封区上形成第一层可焊接材料；
e．在透光晶片上形成第二层可焊接材料，图形与第一层可焊接材料一致；
f．使第一层可焊接材料与第二层可焊接材料对准，同时在两者之间提供焊料层；以及
g．施加热熔化焊料并将透光晶片密封到盖密封区，
其中第一层可焊接材料和第二层可焊接材料每个在它们各长度周围具有基本上均匀的截面。
18．在多个透明晶片的盖和半导体器件的晶片之间形成气密密封的方法，其中至少一个盖和对应的半导体晶片相互不平行，包括以下步骤：
a．在半导体衬底上形成多个有源半导体器件；
b．环绕每个有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和每个盖密封区外形成电连接到每个有源半导体器件的装置；
d．在盖密封区上同时形成第一层可焊接材料；
e．在透光晶片上形成第二层可焊接材料，图形与第一层可焊接材料一致；
f．使第一层可焊接材料与第二层可焊接材料对准，同时在两者之间提供焊料层；以及
g．施加热熔化焊料并将晶片密封到盖密封区，
其中第一层可焊接材料和第二层可焊接材料中的至少一个在它们各长度周围具有基本上不均匀的截面；
h．同时将半导体器件与盖分开形成单元；以及
I．重新加热单元在盖和各半导体器件之间形成不平行关系。
19．根据权利要求1 8的方法，盖密封区和第一层可焊接材料具有基本上矩形的构形，具有基本上以直角接合的四个支柱，第一层可焊接材料的一个支柱具有与其它三个支柱基本上不同的截面面积。
20．一种具有气密密封的微电子机械(MEM)，包括：
a．其上形成有有源MEM器件的衬底；
b．环绕有源MEM器件的盖密封区；
c．形成在盖密封区上的聚合环氧树脂层；
d．形成在聚合环氧树脂层上的盖，由此形成气密密封。
21．根据权利要求20的MEM，还包括形成在聚合环氧树脂层和有源MEM器件之间的隔离层。
22．根据权利要求20的MEM，还包括形成在聚合环氧树脂层和盖之间的隔离层。
23．一种显示器件，包括：
a．形成在半导体衬底上的调光器；
b．环绕调光器的盖密封区；
c．与盖密封区相邻并远离调光器设置的多个键合焊盘；
d．形成在盖密封区上的聚合环氧树脂层；
e．形成在聚合环氧树脂层上的透明盖，由此形成气密密封。
24．根据权利要求23的显示器件，其中调光器为衍射栅光阀。
25．根据权利要求23的显示器件，还包括形成在聚合环氧树脂层和显示器件之间的隔离层。
26．根据权利要求23的显示器件，还包括形成在聚合环氧树脂层和盖之间的隔离层。
27．一种使半导体器件形成气密密封的方法，包括以下步骤：
a．在半导体衬底上形成有源半导体器件；
b．环绕有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和盖密封区外形成电连接到有源半导体器件的装置；
d．在盖密封区上形成聚合环氧树脂层；
e．提供透光盖上尺寸与盖密封区一致；
f．使盖与聚合环氧树脂层对准；以及
g．施加热熔化聚合环氧树脂并将盖密封到盖密封区。
28．根据权利要求27的方法，还包括形成在聚合环氧树脂层和显示器件之间的隔离层。
29．根据权利要求27的显示器件，还包括形成在聚合环氧树脂层和盖之间的隔离层。
30．一种具有气密密封的微电子机械(MEM)，包括：
a．其上形成有有源MEM器件的衬底；
b．环绕有源MEM器件的盖密封区；
c．形成在盖密封区上的玻璃熔块层；
d．形成在玻璃熔块上的盖，由此形成气密密封。
31．根据权利要求30的MEM，还包括形成在玻璃熔块层和有源MEM器件之间的隔离层。
32．根据权利要求30的MEM，还包括形成在玻璃熔块层和盖之间的隔离层。
33．一种显示器件，包括：
a．形成在半导体衬底上的调光器；
b．环绕调光器的盖密封区；
c．与盖密封区相邻并远离调光器设置的多个键合焊盘；
d．形成在盖密封区上的玻璃熔块层；
e．形成在玻璃熔块层上的透明盖，由此形成气密密封。
34．根据权利要求33的显示器件，其中调光器为衍射栅光阀。
35．根据权利要求33的显示器件，还包括形成在玻璃熔块层和显示器件之间的隔离层。
36．根据权利要求33的显示器件，还包括形成在玻璃熔块层和盖之间的隔离层。
37．一种使半导体器件形成气密密封的方法，包括以下步骤：
a．在半导体衬底上形成有源半导体器件；
b．环绕有源半导体器件形成基本上平面化的盖密封区；
c．在衬底的表面上和盖密封区外形成电连接到有源半导体器件的装置；
d．在盖密封区上形成玻璃熔块层；
e．提供透光盖上尺寸与盖密封区一致；
f．使盖与玻璃熔块层对准；以及
g．施加热熔化玻璃熔块并将盖密封到盖密封区。
38．根据权利要求37的方法，还包括形成在玻璃熔块层和显示器件之间的隔离层。
39．根据权利要求37的显示器件，还包括形成在玻璃熔块层和盖之间的隔离层。
40．一种光学器件，包括：
a．形成在半导体衬底上的MEM；
b．环绕MEM的盖密封区；
c．与盖密封区相邻并远离MEM设置的多个键合焊盘；
d．形成在盖密封区上的第一层可焊接材料；
e．形成在第一层可焊接材料上的焊料层；
f．形成在焊料层上的第二层可焊接材料；
g．形成第二层可焊接材料上的透明盖，由此形成气密密封。
41．根据权利要求40的光学器件，其中第一层可焊接材料为包括与盖密封区邻接的铬和与焊料邻接的钯的多层结构。
42．根据权利要求40的光学器件，其中第一层可焊接材料为包括与盖密封区邻接的钛、与钛邻接的镍以及镍和焊料之间的铂的多层结构。
43．根据权利要求40的光学器件，其中第二层可焊接材料为包括与焊料邻接的金和与盖邻接的铬的多层结构。
44．根据权利要求40的光学器件，其中第二层可焊接材料为包括与焊料邻接的金、与金邻接的镍以及镍和盖之间的铬。
45．一种光学器件，包括：
a．形成在半导体衬底上的MEM；
b．环绕MEM的盖密封区；
c．与盖密封区相邻并远离MEM设置的多个键合焊盘；
d．形成在盖密封区上的聚合环氧树脂层；
e．形成在聚合环氧树脂层上的透明盖，由此形成气密密封。
46．根据权利要求45的先学器件，还包括形成在聚合环氧树脂层和MEM之间的隔离层。
47．根据权利要求45的光学器件，还包括形成在聚合环氧树脂层和盖之间的隔离层。
48．一种光学器件，包括：
a．形成在半导体衬底上的MEM；
b．环绕MEM的盖密封区；
c．与盖密封区相邻并远离MEM设置的多个键合焊盘；
d．形成在盖密封区上的玻璃熔块层；
e．形成在玻璃熔块层上的透明盖，由此形成气密密封。
49．根据权利要求48的光学器件，还包括形成在玻璃熔块层和MEM之间的隔离层。
50．根据权利要求48的显示器件，还包括形成在玻璃熔块层和盖之间的隔离层。
CN99811548A 1998-07-29 1999-07-28 将气密盖密封到半导体管芯的方法和装置 Pending CN1320101A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/124,710 US6303986B1 (en) 1998-07-29 1998-07-29 Method of and apparatus for sealing an hermetic lid to a semiconductor die
US09/124710 1998-07-29

Publications (1)

Publication Number Publication Date
CN1320101A true CN1320101A (zh) 2001-10-31

Family

ID=22416401

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99811548A Pending CN1320101A (zh) 1998-07-29 1999-07-28 将气密盖密封到半导体管芯的方法和装置

Country Status (8)

Country Link
US (2) US6303986B1 (zh)
EP (1) EP1113982A2 (zh)
JP (1) JP2002521837A (zh)
KR (1) KR20010053615A (zh)
CN (1) CN1320101A (zh)
AU (1) AU5134899A (zh)
CA (1) CA2338691A1 (zh)
WO (1) WO2000007225A2 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100458538C (zh) * 2004-09-27 2009-02-04 Idc公司 在mems装置中提供一再生保护涂层的系统和方法
CN101828435B (zh) * 2007-10-19 2012-07-18 巴润电子株式会社 具有多个层的凸块结构及其制造方法
CN102951594A (zh) * 2011-08-26 2013-03-06 昆山光微电子有限公司 用于微光机电系统真空封装的管壳及其制作方法
CN105358473A (zh) * 2013-07-11 2016-02-24 雷神公司 用作真空吸气剂的晶片级封装焊料阻挡物
CN109553062A (zh) * 2018-12-25 2019-04-02 合肥芯福传感器技术有限公司 一种薄型芯片真空封装结构
CN112996745A (zh) * 2018-09-17 2021-06-18 应美盛股份有限公司 集成有加热器的传感器

Families Citing this family (145)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969635B2 (en) 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
US6586841B1 (en) * 2000-02-23 2003-07-01 Onix Microsystems, Inc. Mechanical landing pad formed on the underside of a MEMS device
US6521970B1 (en) * 2000-09-01 2003-02-18 National Semiconductor Corporation Chip scale package with compliant leads
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
US6932519B2 (en) 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
JP2001176999A (ja) * 2000-11-27 2001-06-29 Tanaka Kikinzoku Kogyo Kk 電子部品の気密封止方法
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
US20050048688A1 (en) * 2000-12-07 2005-03-03 Patel Satyadev R. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US7307775B2 (en) 2000-12-07 2007-12-11 Texas Instruments Incorporated Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6883977B2 (en) * 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
AUPR245601A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM09)
US6387723B1 (en) 2001-01-19 2002-05-14 Silicon Light Machines Reduced surface charging in silicon-based devices
KR100396551B1 (ko) * 2001-02-03 2003-09-03 삼성전자주식회사 웨이퍼 레벨 허메틱 실링 방법
US7183633B2 (en) * 2001-03-01 2007-02-27 Analog Devices Inc. Optical cross-connect system
EP1370497B1 (en) * 2001-03-09 2007-08-22 Datec Coating Corporation Sol-gel derived resistive and conductive coating
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6511866B1 (en) * 2001-07-12 2003-01-28 Rjr Polymers, Inc. Use of diverse materials in air-cavity packaging of electronic devices
US6771859B2 (en) 2001-07-24 2004-08-03 3M Innovative Properties Company Self-aligning optical micro-mechanical device package
US6798954B2 (en) 2001-07-24 2004-09-28 3M Innovative Properties Company Packaged optical micro-mechanical device
US6834154B2 (en) 2001-07-24 2004-12-21 3M Innovative Properties Co. Tooling fixture for packaged optical micro-mechanical devices
US6646778B2 (en) * 2001-08-01 2003-11-11 Silicon Light Machines Grating light valve with encapsulated dampening gas
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US7135768B2 (en) * 2001-09-06 2006-11-14 Silicon Bandwidth Inc. Hermetic seal
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6818464B2 (en) 2001-10-17 2004-11-16 Hymite A/S Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
US6893574B2 (en) * 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US7132736B2 (en) * 2001-10-31 2006-11-07 Georgia Tech Research Corporation Devices having compliant wafer-level packages with pillars and methods of fabrication
JP4095300B2 (ja) * 2001-12-27 2008-06-04 セイコーエプソン株式会社 光デバイス及びその製造方法、光モジュール、回路基板並びに電子機器
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6639313B1 (en) * 2002-03-20 2003-10-28 Analog Devices, Inc. Hermetic seals for large optical packages and the like
US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
TW574537B (en) * 2002-05-17 2004-02-01 Advanced Semiconductor Eng Liquid crystal display device with bump and method for manufacturing the same
US6661090B1 (en) * 2002-05-17 2003-12-09 Silicon Light Machines, Inc. Metal adhesion layer in an integrated circuit package
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6829258B1 (en) 2002-06-26 2004-12-07 Silicon Light Machines, Inc. Rapidly tunable external cavity laser
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US6885107B2 (en) * 2002-08-29 2005-04-26 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabrication
US6964882B2 (en) * 2002-09-27 2005-11-15 Analog Devices, Inc. Fabricating complex micro-electromechanical systems using a flip bonding technique
US20040063237A1 (en) * 2002-09-27 2004-04-01 Chang-Han Yun Fabricating complex micro-electromechanical systems using a dummy handling substrate
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US6933163B2 (en) 2002-09-27 2005-08-23 Analog Devices, Inc. Fabricating integrated micro-electromechanical systems using an intermediate electrode layer
US7405860B2 (en) * 2002-11-26 2008-07-29 Texas Instruments Incorporated Spatial light modulators with light blocking/absorbing areas
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US20040232535A1 (en) * 2003-05-22 2004-11-25 Terry Tarn Microelectromechanical device packages with integral heaters
US20040252179A1 (en) * 2003-06-11 2004-12-16 Leonard Kraicer Method and apparatus for reducing contamination in a grating light valve imaging system
TWI223422B (en) * 2003-07-24 2004-11-01 Advanced Semiconductor Eng Micromachine package and method for manufacturing the same
TWI251712B (en) * 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
TW593127B (en) * 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
CN100363775C (zh) * 2003-08-26 2008-01-23 高通Mems科技公司 光干涉式显示面板及其制造方法
US20050077342A1 (en) * 2003-10-10 2005-04-14 Chien-Hua Chen Securing a cover for a device
US7276398B2 (en) * 2003-10-23 2007-10-02 Hewlett-Packard Development Company, L.P. System and method for hermetically sealing a package
US7303645B2 (en) 2003-10-24 2007-12-04 Miradia Inc. Method and system for hermetically sealing packages for optics
US20050093134A1 (en) 2003-10-30 2005-05-05 Terry Tarn Device packages with low stress assembly process
US6930367B2 (en) * 2003-10-31 2005-08-16 Robert Bosch Gmbh Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
US6936918B2 (en) * 2003-12-15 2005-08-30 Analog Devices, Inc. MEMS device with conductive path through substrate
US20050170609A1 (en) * 2003-12-15 2005-08-04 Alie Susan A. Conductive bond for through-wafer interconnect
US6947229B2 (en) * 2003-12-19 2005-09-20 Intel Corporation Etalon positioning using solder balls
US20050132803A1 (en) * 2003-12-23 2005-06-23 Baldwin David J. Low cost integrated MEMS hybrid
WO2005078458A1 (en) * 2004-02-05 2005-08-25 Analog Devices, Inc. Capped sensor
US7681306B2 (en) 2004-04-28 2010-03-23 Hymite A/S Method of forming an assembly to house one or more micro components
US7012328B2 (en) 2004-05-14 2006-03-14 Intevac, Inc. Semiconductor die attachment for high vacuum tubes
US7607560B2 (en) * 2004-05-14 2009-10-27 Intevac, Inc. Semiconductor die attachment for high vacuum tubes
KR100733242B1 (ko) * 2004-05-19 2007-06-27 삼성전기주식회사 측면 밀봉부재가 형성된 ｍｅｍｓ 패키지 및 그 제조 방법
KR100754069B1 (ko) * 2004-06-02 2007-08-31 삼성전기주식회사 플립칩 실장 기술을 이용한 반도체 패키지 및 패키징 방법
US7608534B2 (en) * 2004-06-02 2009-10-27 Analog Devices, Inc. Interconnection of through-wafer vias using bridge structures
US7102240B2 (en) 2004-06-11 2006-09-05 Samsung Electro-Mechanics Co., Ltd. Embedded integrated circuit packaging structure
KR100584972B1 (ko) * 2004-06-11 2006-05-29 삼성전기주식회사 밀봉용 스페이서가 형성된 ｍｅｍｓ 패키지 및 그 제조 방법
US7141870B2 (en) * 2004-07-28 2006-11-28 Miradia Inc. Apparatus for micro-electro mechanical system package
US7405924B2 (en) * 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US7701631B2 (en) 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US7446926B2 (en) * 2004-09-27 2008-11-04 Idc, Llc System and method of providing a regenerating protective coating in a MEMS device
US7573547B2 (en) * 2004-09-27 2009-08-11 Idc, Llc System and method for protecting micro-structure of display array using spacers in gap within display device
US7061099B2 (en) * 2004-09-30 2006-06-13 Intel Corporation Microelectronic package having chamber sealed by material including one or more intermetallic compounds
KR100807484B1 (ko) * 2004-10-07 2008-02-25 삼성전기주식회사 소수성 물질층을 구비한 ｍｅｍｓ 패키지
KR100815358B1 (ko) * 2004-10-08 2008-03-19 삼성전기주식회사 경사진 광투과성 덮개를 가진 광변조기 패키지
KR100855817B1 (ko) * 2004-10-08 2008-09-01 삼성전기주식회사 측면 이중 밀봉부재가 형성된 ｍｅｍｓ 패키지 및 그 제조방법
KR100855819B1 (ko) * 2004-10-08 2008-09-01 삼성전기주식회사 금속 밀봉부재가 형성된 ｍｅｍｓ 패키지
TWI278090B (en) * 2004-10-21 2007-04-01 Int Rectifier Corp Solderable top metal for SiC device
US7812441B2 (en) 2004-10-21 2010-10-12 Siliconix Technology C.V. Schottky diode with improved surge capability
US7300812B2 (en) 2004-10-29 2007-11-27 Hewlett-Packard Development Coompany, L.P. Micro electrical mechanical system
US7344956B2 (en) * 2004-12-08 2008-03-18 Miradia Inc. Method and device for wafer scale packaging of optical devices using a scribe and break process
US7821129B2 (en) * 2004-12-08 2010-10-26 Agilent Technologies, Inc. Low cost hermetic ceramic microcircuit package
US7307773B2 (en) * 2005-01-04 2007-12-11 Hewlett-Packard Development Company, L.P. Micro-optoelectromechanical system packages for a light modulator and methods of making the same
KR100707179B1 (ko) * 2005-02-07 2007-04-13 삼성전자주식회사 광스캐너 패키지 및 그 제조방법
US9419092B2 (en) 2005-03-04 2016-08-16 Vishay-Siliconix Termination for SiC trench devices
US7834376B2 (en) 2005-03-04 2010-11-16 Siliconix Technology C. V. Power semiconductor switch
KR100789545B1 (ko) * 2005-03-07 2007-12-28 삼성전기주식회사 플립칩 실장 기술을 이용한 광변조기 모듈 패키지
US7408250B2 (en) * 2005-04-05 2008-08-05 Texas Instruments Incorporated Micromirror array device with compliant adhesive
US7508063B2 (en) * 2005-04-05 2009-03-24 Texas Instruments Incorporated Low cost hermetically sealed package
US7449355B2 (en) * 2005-04-27 2008-11-11 Robert Bosch Gmbh Anti-stiction technique for electromechanical systems and electromechanical device employing same
US7349140B2 (en) * 2005-05-31 2008-03-25 Miradia Inc. Triple alignment substrate method and structure for packaging devices
US7417307B2 (en) * 2005-07-29 2008-08-26 Hewlett-Packard Development Company, L.P. System and method for direct-bonding of substrates
US8368165B2 (en) 2005-10-20 2013-02-05 Siliconix Technology C. V. Silicon carbide Schottky diode
CN100422071C (zh) * 2005-10-27 2008-10-01 中国科学院上海微系统与信息技术研究所 微机械加速度计器件的圆片级封装工艺
US7471439B2 (en) * 2005-11-23 2008-12-30 Miradia, Inc. Process of forming a micromechanical system containing an anti-stiction gas-phase lubricant
US7580174B2 (en) 2005-11-23 2009-08-25 Miradia, Inc. Anti-stiction gas-phase lubricant for micromechanical systems
US7491567B2 (en) * 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
US20070114643A1 (en) * 2005-11-22 2007-05-24 Honeywell International Inc. Mems flip-chip packaging
US7616370B2 (en) * 2005-11-23 2009-11-10 Miradia, Inc. Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
US7723812B2 (en) * 2005-11-23 2010-05-25 Miradia, Inc. Preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
US7463404B2 (en) * 2005-11-23 2008-12-09 Miradia, Inc. Method of using a preferentially deposited lubricant to prevent anti-stiction in micromechanical systems
JP4467506B2 (ja) * 2005-11-24 2010-05-26 三菱電機株式会社 パッケージおよびそれを用いた電子装置
CN100445195C (zh) * 2006-01-13 2008-12-24 中国科学院上海微系统与信息技术研究所 一种圆片级微机械器件或光电器件的低温气密性封装方法
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
WO2007120887A2 (en) 2006-04-13 2007-10-25 Qualcomm Mems Technologies, Inc Packaging a mems device using a frame
JP5092462B2 (ja) * 2006-06-13 2012-12-05 株式会社デンソー 力学量センサ
US9627552B2 (en) 2006-07-31 2017-04-18 Vishay-Siliconix Molybdenum barrier metal for SiC Schottky diode and process of manufacture
DE102006037538B4 (de) * 2006-08-10 2016-03-10 Infineon Technologies Ag Elektronisches Bauteil, elektronischer Bauteilstapel und Verfahren zu deren Herstellung sowie Verwendung einer Kügelchenplatziermaschine zur Durchführung eines Verfahrens zum Herstellen eines elektronischen Bauteils bzw. Bauteilstapels
US8096665B2 (en) * 2006-10-11 2012-01-17 Miradia, Inc. Spatially offset multi-imager-panel architecture for projecting an image
US20080087979A1 (en) * 2006-10-13 2008-04-17 Analog Devices, Inc. Integrated Circuit with Back Side Conductive Paths
US8604605B2 (en) 2007-01-05 2013-12-10 Invensas Corp. Microelectronic assembly with multi-layer support structure
JP5330697B2 (ja) * 2007-03-19 2013-10-30 株式会社リコー 機能素子のパッケージ及びその製造方法
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
US8304274B2 (en) * 2009-02-13 2012-11-06 Texas Instruments Incorporated Micro-electro-mechanical system having movable element integrated into substrate-based package
KR100941446B1 (ko) * 2009-03-03 2010-02-11 주식회사 바른전자 복층 범프 구조물 및 그 제조 방법
DE102009042479A1 (de) 2009-09-24 2011-03-31 Msg Lithoglas Ag Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug
US8379392B2 (en) 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
TWI397157B (zh) 2009-12-28 2013-05-21 矽品精密工業股份有限公司 具微機電元件之封裝結構及其製法
TWI395312B (zh) 2010-01-20 2013-05-01 矽品精密工業股份有限公司 具微機電元件之封裝結構及其製法
WO2012074775A1 (en) 2010-11-19 2012-06-07 Analog Devices, Inc. Packaged integrated device with electrically conductive lid
TWI455266B (zh) 2010-12-17 2014-10-01 矽品精密工業股份有限公司 具微機電元件之封裝結構及其製法
US8660164B2 (en) 2011-03-24 2014-02-25 Axsun Technologies, Inc. Method and system for avoiding package induced failure in swept semiconductor source
TW201250947A (en) 2011-05-12 2012-12-16 Siliconware Precision Industries Co Ltd Package structure having a micromechanical electronic component and method of making same
DE102012206858B4 (de) * 2012-04-25 2021-05-20 Robert Bosch Gmbh Verfahren zum Herstellen einer optischen Fenstervorrichtung für eine MEMS-Vorrichtung
US8791557B2 (en) * 2012-05-02 2014-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. Microelectromechanical device with integrated package
US9967546B2 (en) 2013-10-29 2018-05-08 Vefxi Corporation Method and apparatus for converting 2D-images and videos to 3D for consumer, commercial and professional applications
US20150116458A1 (en) 2013-10-30 2015-04-30 Barkatech Consulting, LLC Method and apparatus for generating enhanced 3d-effects for real-time and offline appplications
US9162874B2 (en) * 2014-01-22 2015-10-20 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and method forming the same
CN103985642B (zh) * 2014-06-03 2017-06-23 杭州大立微电子有限公司 晶圆级封装方法及封装结构
US10158847B2 (en) 2014-06-19 2018-12-18 Vefxi Corporation Real—time stereo 3D and autostereoscopic 3D video and image editing
DE102016105440A1 (de) 2016-03-23 2017-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Komponenten unter Verwendung von Funktionselementen
US9868632B2 (en) 2016-03-24 2018-01-16 Infineon Technologies Ag Molded cavity package with embedded conductive layer and enhanced sealing

Family Cites Families (752)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE16757E (en) 1922-10-31 1927-10-04 knight
US1548262A (en) 1924-07-02 1925-08-04 Freedman Albert Manufacture of bicolored spectacles
US1814701A (en) 1930-05-31 1931-07-14 Perser Corp Method of making viewing gratings for relief or stereoscopic pictures
US2415226A (en) 1943-11-29 1947-02-04 Rca Corp Method of and apparatus for producing luminous images
US2920529A (en) 1952-05-23 1960-01-12 Blythe Richard Electronic control of optical and near-optical radiation
US2991690A (en) 1953-09-04 1961-07-11 Polaroid Corp Stereoscopic lens-prism optical system
US2783406A (en) 1954-02-09 1957-02-26 John J Vanderhooft Stereoscopic television means
US3256465A (en) 1962-06-08 1966-06-14 Signetics Corp Semiconductor device assembly with true metallurgical bonds
US3388301A (en) 1964-12-09 1968-06-11 Signetics Corp Multichip integrated circuit assembly with interconnection structure
US3443871A (en) 1965-12-07 1969-05-13 Optomechanisms Inc Single optical block interferometer means
US3553364A (en) 1968-03-15 1971-01-05 Texas Instruments Inc Electromechanical light valve
US3576394A (en) 1968-07-03 1971-04-27 Texas Instruments Inc Apparatus for display duration modulation
US3792916A (en) 1969-02-25 1974-02-19 Us Army Anti-laser optical filter assembly
US3600798A (en) 1969-02-25 1971-08-24 Texas Instruments Inc Process for fabricating a panel array of electromechanical light valves
JPS4831507B1 (zh) 1969-07-10 1973-09-29
US3693239A (en) 1969-07-25 1972-09-26 Sidney Dix A method of making a micromodular package
US3871014A (en) 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
BE757764A (fr) 1969-10-21 1971-04-21 Itt Systeme d'exploration a l'etat solide
US3743507A (en) 1970-10-23 1973-07-03 Rca Corp Recording of a continuous tone focused image on a diffraction grating
US3752563A (en) 1971-09-01 1973-08-14 Sperry Rand Corp Magnetic film stripe domain diffraction
US3942245A (en) 1971-11-20 1976-03-09 Ferranti Limited Related to the manufacture of lead frames and the mounting of semiconductor devices thereon
US3781465A (en) 1972-03-08 1973-12-25 Hughes Aircraft Co Field sequential color television systems
US3783184A (en) 1972-03-08 1974-01-01 Hughes Aircraft Co Electronically switched field sequential color television
US3802769A (en) 1972-08-28 1974-04-09 Harris Intertype Corp Method and apparatus for unaided stereo viewing
US3811186A (en) 1972-12-11 1974-05-21 Ibm Method of aligning and attaching circuit devices on a substrate
DE2315658C3 (de) 1973-03-29 1980-11-20 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren und Vorrichtung zur Verminderung oder Beseitigung der bei Laserstrahlprojektionen auftretenden Granulation
US3862360A (en) 1973-04-18 1975-01-21 Hughes Aircraft Co Liquid crystal display system with integrated signal storage circuitry
US4103273A (en) 1973-04-26 1978-07-25 Honeywell Inc. Method for batch fabricating semiconductor devices
US3915548A (en) 1973-04-30 1975-10-28 Hughes Aircraft Co Holographic lens and liquid crystal image source for head-up display
US3861784A (en) 1973-06-29 1975-01-21 Sperry Rand Corp Programmable diffraction grating
US4093346A (en) 1973-07-13 1978-06-06 Minolta Camera Kabushiki Kaisha Optical low pass filter
US3886310A (en) 1973-08-22 1975-05-27 Westinghouse Electric Corp Electrostatically deflectable light valve with improved diffraction properties
US3947105A (en) 1973-09-21 1976-03-30 Technical Operations, Incorporated Production of colored designs
US3896338A (en) 1973-11-01 1975-07-22 Westinghouse Electric Corp Color video display system comprising electrostatically deflectable light valves
US3969611A (en) 1973-12-26 1976-07-13 Texas Instruments Incorporated Thermocouple circuit
US3943281A (en) 1974-03-08 1976-03-09 Hughes Aircraft Company Multiple beam CRT for generating a multiple raster display
JPS5742849B2 (zh) 1974-06-05 1982-09-10
US4001663A (en) 1974-09-03 1977-01-04 Texas Instruments Incorporated Switching regulator power supply
US4012835A (en) 1974-09-17 1977-03-22 E. I. Du Pont De Nemours And Co. Method of forming a dual in-line package
US4100579A (en) 1974-09-24 1978-07-11 Hughes Aircraft Company AC Operated flat panel liquid crystal display
US3938881A (en) 1974-11-25 1976-02-17 Xerox Corporation Acousto-optic modulation device
US4090219A (en) 1974-12-09 1978-05-16 Hughes Aircraft Company Liquid crystal sequential color display
US3935500A (en) 1974-12-09 1976-01-27 Texas Instruments Incorporated Flat CRT system
US4020381A (en) 1974-12-09 1977-04-26 Texas Instruments Incorporated Cathode structure for a multibeam cathode ray tube
US3935499A (en) 1975-01-03 1976-01-27 Texas Instruments Incorporated Monolythic staggered mesh deflection systems for use in flat matrix CRT's
US3980476A (en) 1975-01-27 1976-09-14 Xerox Corporation Imaging system
US4017158A (en) 1975-03-17 1977-04-12 E. I. Du Pont De Nemours And Company Spatial frequency carrier and process of preparing same
US4006968A (en) 1975-05-02 1977-02-08 Hughes Aircraft Company Liquid crystal dot color display
US4011009A (en) 1975-05-27 1977-03-08 Xerox Corporation Reflection diffraction grating having a controllable blaze angle
US4012116A (en) 1975-05-30 1977-03-15 Personal Communications, Inc. No glasses 3-D viewer
US4034211A (en) 1975-06-20 1977-07-05 Ncr Corporation System and method for providing a security check on a credit card
US4035068A (en) 1975-06-25 1977-07-12 Xerox Corporation Speckle minimization in projection displays by reducing spatial coherence of the image light
US4021766A (en) 1975-07-28 1977-05-03 Aine Harry E Solid state pressure transducer of the leaf spring type and batch method of making same
US3991416A (en) 1975-09-18 1976-11-09 Hughes Aircraft Company AC biased and resonated liquid crystal display
US4084437A (en) 1975-11-07 1978-04-18 Texas Instruments Incorporated Thermocouple circuit
CH595664A5 (zh) 1975-11-17 1978-02-15 Landis & Gyr Ag
US4184700A (en) 1975-11-17 1980-01-22 Lgz Landis & Gyr Zug Ag Documents embossed with optical markings representing genuineness information
US4127322A (en) 1975-12-05 1978-11-28 Hughes Aircraft Company High brightness full color image light valve projection system
US4004849A (en) 1975-12-08 1977-01-25 International Business Machines Corporation Display apparatus and process
US4034399A (en) 1976-02-27 1977-07-05 Rca Corporation Interconnection means for an array of majority carrier microwave devices
CH594495A5 (zh) 1976-05-04 1978-01-13 Landis & Gyr Ag
JPS5321771A (en) 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
US4135502A (en) 1976-09-07 1979-01-23 Donald Peck Stereoscopic patterns and method of making same
US4139257A (en) 1976-09-28 1979-02-13 Canon Kabushiki Kaisha Synchronizing signal generator
US4067129A (en) 1976-10-28 1978-01-10 Trans-World Manufacturing Corporation Display apparatus having means for creating a spectral color effect
CH604279A5 (zh) 1976-12-21 1978-08-31 Landis & Gyr Ag
US4143943A (en) 1977-02-17 1979-03-13 Xerox Corporation Rear projection screen system
US4093922A (en) 1977-03-17 1978-06-06 Texas Instruments Incorporated Microcomputer processing approach for a non-volatile TV station memory tuning system
US4093921A (en) 1977-03-17 1978-06-06 Texas Instruments Incorporated Microcomputer processing approach for a non-volatile TV station memory tuning system
CH616253A5 (zh) 1977-06-21 1980-03-14 Landis & Gyr Ag
US4126380A (en) 1977-06-30 1978-11-21 International Business Machines Corporation Probe with contact indicating means
US4185891A (en) 1977-11-30 1980-01-29 Grumman Aerospace Corporation Laser diode collimation optics
US4389096A (en) 1977-12-27 1983-06-21 Matsushita Electric Industrial Co., Ltd. Image display apparatus of liquid crystal valve projection type
US4205428A (en) 1978-02-23 1980-06-03 The United States Of America As Represented By The Secretary Of The Air Force Planar liquid crystal matrix array chip
CH622896A5 (zh) 1978-03-20 1981-04-30 Landis & Gyr Ag
US4256787A (en) 1978-05-03 1981-03-17 Massachusetts Institute Of Technology Orientation of ordered liquids and their use in devices
US4195915A (en) 1978-05-05 1980-04-01 Hughes Aircraft Company Liquid crystal image projector system
US4225913A (en) 1978-09-19 1980-09-30 Texas Instruments Incorporated Self-referencing power converter
US4331972A (en) 1978-11-09 1982-05-25 Rajchman Jan A Light valve, light valve display, and method
US4295145A (en) 1978-12-29 1981-10-13 International Business Machines Corporation Acousto-optically modulated laser scanning arrangement for correcting for interference appearing therein
US4257053A (en) 1979-02-09 1981-03-17 Geosource, Inc. High-resolution laser plotter
US4257016A (en) 1979-02-21 1981-03-17 Xerox Corporation Piezo-optic, total internal reflection modulator
US4338660A (en) 1979-04-13 1982-07-06 Relational Memory Systems, Inc. Relational break signal generating device
US4249796A (en) 1979-06-21 1981-02-10 International Business Machines Corporation Projection display device
US4290672A (en) 1979-06-29 1981-09-22 International Business Machines Corporation Plural line acousto-optically modulated laser scanning system
US4343535A (en) 1979-12-14 1982-08-10 Hughes Aircraft Company Liquid crystal light valve
DE3001613C2 (de) 1980-01-17 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Befestigung eines, eine monolithisch integrierte Halbleiterschaltung enthaltenden Halbleiterkörpers aus Silicium an einer Unterlage mit einem entsprechenden Verfahren hierzu
US4311999A (en) 1980-02-07 1982-01-19 Textron, Inc. Vibratory scan optical display
US4327966A (en) 1980-02-25 1982-05-04 Bell Telephone Laboratories, Incorporated Variable attenuator for laser radiation
US4327411A (en) 1980-03-04 1982-04-27 Bell Telephone Laboratories, Incorporated High capacity elastic store having continuously variable delay
US4355463A (en) 1980-03-24 1982-10-26 National Semiconductor Corporation Process for hermetically encapsulating semiconductor devices
US4348079A (en) 1980-04-08 1982-09-07 Xerox Corporation Acousto-optic device utilizing Fresnel zone plate electrode array
US4346965A (en) 1980-05-27 1982-08-31 Xerox Corporation Light modulator/deflector using acoustic surface waves
US4447881A (en) 1980-05-29 1984-05-08 Texas Instruments Incorporated Data processing system integrated circuit having modular memory add-on capacity
US4454591A (en) 1980-05-29 1984-06-12 Texas Instruments Incorporated Interface system for bus line control
US4430584A (en) 1980-05-29 1984-02-07 Texas Instruments Incorporated Modular input/output system
US4418397A (en) 1980-05-29 1983-11-29 Texas Instruments Incorporated Address decode system
US4503494A (en) 1980-06-26 1985-03-05 Texas Instruments Incorporated Non-volatile memory system
US4443845A (en) 1980-06-26 1984-04-17 Texas Instruments Incorporated Memory system having a common interface
US4361384A (en) 1980-06-27 1982-11-30 The United States Of America As Represented By The Secretary Of The Army High luminance miniature display
US4336982A (en) 1980-08-04 1982-06-29 Xerox Corporation MgF2 Coating for promoting adherence of thin films to single crystal materials
US4396246A (en) 1980-10-02 1983-08-02 Xerox Corporation Integrated electro-optic wave guide modulator
US4420717A (en) 1980-10-06 1983-12-13 Texas Instruments Incorporated Use of motor winding as integrator to generate sawtooth for switch mode current regulator
US4594501A (en) 1980-10-09 1986-06-10 Texas Instruments Incorporated Pulse width modulation of printhead voltage
US4369524A (en) 1980-10-14 1983-01-18 Xerox Corporation Single component transceiver device for linear fiber optical network
US4398798A (en) 1980-12-18 1983-08-16 Sperry Corporation Image rotating diffraction grating
JPS57122981U (zh) 1981-01-27 1982-07-31
US4456338A (en) 1981-03-05 1984-06-26 Macdonald Dettwiler & Associates Ltd. Electronically tuneable light source
US4440839A (en) 1981-03-18 1984-04-03 United Technologies Corporation Method of forming laser diffraction grating for beam sampling device
US4391490A (en) 1981-04-02 1983-07-05 Xerox Corporation Interface for proximity coupled electro-optic devices
US4374397A (en) 1981-06-01 1983-02-15 Eastman Kodak Company Light valve devices and electronic imaging/scan apparatus with locationally-interlaced optical addressing
US4408884A (en) 1981-06-29 1983-10-11 Rca Corporation Optical measurements of fine line parameters in integrated circuit processes
US4400740A (en) 1981-08-24 1983-08-23 Xerox Corporation Intensity control for raster output scanners
US4414583A (en) 1981-11-02 1983-11-08 International Business Machines Corporation Scanned light beam imaging method and apparatus
US4571603A (en) 1981-11-03 1986-02-18 Texas Instruments Incorporated Deformable mirror electrostatic printer
US4426768A (en) 1981-12-28 1984-01-24 United Technologies Corporation Ultra-thin microelectronic pressure sensors
US4571041A (en) 1982-01-22 1986-02-18 Gaudyn Tad J Three dimensional projection arrangement
US4422099A (en) 1982-02-03 1983-12-20 International Business Machines Corporation Optical communication on variable power beam
US4483596A (en) 1982-03-01 1984-11-20 Xerox Corporation Interface suppression apparatus and method for a linear modulator
JPS58158950A (ja) 1982-03-16 1983-09-21 Nec Corp 半導体装置
US4484188A (en) 1982-04-23 1984-11-20 Texas Instruments Incorporated Graphics video resolution improvement apparatus
US4435041A (en) 1982-05-28 1984-03-06 Sperry Corporation Chromatic aberration correction in a multiwavelength light beam deflection system
US4588957A (en) 1982-06-09 1986-05-13 International Business Machines Corporation Optical pulse compression apparatus and method
US4460907A (en) 1982-06-15 1984-07-17 Minnesota Mining And Manufacturing Company Electrographic imaging apparatus
US4468725A (en) 1982-06-18 1984-08-28 Texas Instruments Incorporated Direct AC converter for converting a balanced AC polyphase input to an output voltage
US4462046A (en) 1982-07-02 1984-07-24 Amaf Industries Incorporated Machine vision system utilizing programmable optical parallel processing
US4492435A (en) 1982-07-02 1985-01-08 Xerox Corporation Multiple array full width electro mechanical modulator
US4467342A (en) 1982-07-15 1984-08-21 Rca Corporation Multi-chip imager
US4561011A (en) 1982-10-05 1985-12-24 Mitsubishi Denki Kabushiki Kaisha Dimensionally stable semiconductor device
US4511220A (en) 1982-12-23 1985-04-16 The United States Of America As Represented By The Secretary Of The Air Force Laser target speckle eliminator
JPS59117876A (ja) 1982-12-24 1984-07-07 Seiko Epson Corp パ−ソナル液晶映像表示器
JPS602073A (ja) 1983-04-06 1985-01-08 テキサス・インスツルメンツ・インコ−ポレイテツド 交流変換装置及び方法
US4724467A (en) 1983-04-11 1988-02-09 Xerox Corporation Light blocking stop for electro-optic line printers
US4487677A (en) 1983-04-11 1984-12-11 Metals Production Research, Inc. Electrolytic recovery system for obtaining titanium metal from its ore
US4655539A (en) 1983-04-18 1987-04-07 Aerodyne Products Corporation Hologram writing apparatus and method
US4538883A (en) 1983-05-26 1985-09-03 Xerox Corporation Conformable electrodes for proximity coupled electro-optic devices
JPS603164A (ja) 1983-06-21 1985-01-09 Sanyo Electric Co Ltd 光起電力装置の製造方法
CH661683A5 (de) 1983-09-19 1987-08-14 Landis & Gyr Ag Einrichtung zum praegen von reliefmustern hoher aufloesung.
US4561044A (en) 1983-09-22 1985-12-24 Citizen Watch Co., Ltd. Lighting device for a display panel of an electronic device
US4809078A (en) 1983-10-05 1989-02-28 Casio Computer Co., Ltd. Liquid crystal television receiver
FR2553893B1 (fr) 1983-10-19 1986-02-07 Texas Instruments France Procede et dispositif de detection d'une transition de la composante continue d'un signal periodique, notamment pour joncteur telephonique
US4567585A (en) 1983-10-31 1986-01-28 Daniel Gelbart Optical tape recorder using linear scanning
US4545610A (en) 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
US4577933A (en) 1983-12-15 1986-03-25 Xerox Corporation Gap modulator for high speed scanners
JPS60127888A (ja) 1983-12-15 1985-07-08 Citizen Watch Co Ltd 液晶表示装置
JPS60158780A (ja) 1984-01-27 1985-08-20 Sony Corp 表示装置
JPS60185918A (ja) 1984-03-05 1985-09-21 Canon Inc 光変調方法
JPS60214684A (ja) 1984-04-10 1985-10-26 Citizen Watch Co Ltd 液晶テレビ装置
US4577932A (en) 1984-05-08 1986-03-25 Creo Electronics Corporation Multi-spot modulator using a laser diode
US4797918A (en) 1984-05-09 1989-01-10 Communications Satellite Corporation Subscription control for television programming
CH664030A5 (de) 1984-07-06 1988-01-29 Landis & Gyr Ag Verfahren zur erzeugung eines makroskopischen flaechenmusters mit einer mikroskopischen struktur, insbesondere einer beugungsoptisch wirksamen struktur.
US4963012A (en) 1984-07-20 1990-10-16 The United States Of America As Represented By The United States Department Of Energy Passivation coating for flexible substrate mirrors
US4710732A (en) 1984-07-31 1987-12-01 Texas Instruments Incorporated Spatial light modulator and method
US4566935A (en) 1984-07-31 1986-01-28 Texas Instruments Incorporated Spatial light modulator and method
US4709995A (en) 1984-08-18 1987-12-01 Canon Kabushiki Kaisha Ferroelectric display panel and driving method therefor to achieve gray scale
US4649085A (en) * 1984-08-29 1987-03-10 The United States Of America As Represented By The Secretary Of The Air Force Cryogenic glass-to-metal seal
US4662746A (en) 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
US4596992A (en) 1984-08-31 1986-06-24 Texas Instruments Incorporated Linear spatial light modulator and printer
US5096279A (en) 1984-08-31 1992-03-17 Texas Instruments Incorporated Spatial light modulator and method
US5061049A (en) 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
JPS6188676A (ja) 1984-10-05 1986-05-06 Citizen Watch Co Ltd 液晶テレビ装置
US4615595A (en) 1984-10-10 1986-10-07 Texas Instruments Incorporated Frame addressed spatial light modulator
US4558171A (en) 1984-10-12 1985-12-10 General Electric Company Hermetic enclosure for electronic components with an optionally transparent cover and a method of making the same
US5281957A (en) 1984-11-14 1994-01-25 Schoolman Scientific Corp. Portable computer and head mounted display
US4641193A (en) 1984-12-07 1987-02-03 New York Institute Of Technology Video display apparatus and method
JPH0752762B2 (ja) 1985-01-07 1995-06-05 株式会社日立製作所 半導体樹脂パッケージ
US4772094A (en) 1985-02-05 1988-09-20 Bright And Morning Star Optical stereoscopic system and prism window
DE3605516A1 (de) 1985-02-21 1986-09-04 Canon K.K., Tokio/Tokyo Optisches funktionselement sowie optische funktionsvorrichtung
US4660938A (en) 1985-03-11 1987-04-28 Xerox Corporation Optical display device
US4661828A (en) 1985-03-20 1987-04-28 Miller Jr Verelyn A Optical imaging head
US4866488A (en) 1985-03-29 1989-09-12 Texas Instruments Incorporated Ballistic transport filter and device
US4636039A (en) 1985-04-12 1987-01-13 Xerox Corporation Nonuniformity of fringe field correction for electro-optic devices
US4623219A (en) 1985-04-15 1986-11-18 The United States Of America As Represented By The Secretary Of The Navy Real-time high-resolution 3-D large-screen display using laser-activated liquid crystal light valves
US4719507A (en) 1985-04-26 1988-01-12 Tektronix, Inc. Stereoscopic imaging system with passive viewing apparatus
US4751509A (en) 1985-06-04 1988-06-14 Nec Corporation Light valve for use in a color display unit with a diffraction grating assembly included in the valve
US4728185A (en) 1985-07-03 1988-03-01 Texas Instruments Incorporated Imaging system
US4836649A (en) 1985-07-12 1989-06-06 Hughes Aircraft Company Optical layout for a three light valve full-color projector employing a dual relay lens system and a single projection lens
CA1250170A (en) 1985-07-16 1989-02-21 Jerzy A. Dobrowolski Optical mixing/demixing device
JPH0535388Y2 (zh) 1985-07-29 1993-09-08
US5299037A (en) 1985-08-07 1994-03-29 Canon Kabushiki Kaisha Diffraction grating type liquid crystal display device in viewfinder
DE3677455D1 (de) 1985-09-30 1991-03-14 Siemens Ag Verfahren zur begrenzung von ausbruechen beim saegen einer halbleiterscheibe.
US4698602A (en) 1985-10-09 1987-10-06 The United States Of America As Represented By The Secretary Of The Air Force Micromirror spatial light modulator
US5172262A (en) 1985-10-30 1992-12-15 Texas Instruments Incorporated Spatial light modulator and method
US4687326A (en) 1985-11-12 1987-08-18 General Electric Company Integrated range and luminance camera
JPS62119521A (ja) 1985-11-19 1987-05-30 Canon Inc 光学変調装置
GB2186708B (en) 1985-11-26 1990-07-11 Sharp Kk A variable interferometric device and a process for the production of the same
US4811210A (en) 1985-11-27 1989-03-07 Texas Instruments Incorporated A plurality of optical crossbar switches and exchange switches for parallel processor computer
US4700276A (en) 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
JPS6323105A (ja) 1986-02-06 1988-01-30 Fujitsu Ltd 光合分波器
US4744633A (en) 1986-02-18 1988-05-17 Sheiman David M Stereoscopic viewing system and glasses
US4803560A (en) 1986-02-21 1989-02-07 Casio Computer Co., Ltd. Liquid-crystal television receiver with cassette tape recorder
US4717066A (en) 1986-02-24 1988-01-05 American Telephone And Telegraph Company, At&T Bell Laboratories Method of bonding conductors to semiconductor devices
US4829365A (en) 1986-03-07 1989-05-09 Dimension Technologies, Inc. Autostereoscopic display with illuminating lines, light valve and mask
US4807021A (en) 1986-03-10 1989-02-21 Kabushiki Kaisha Toshiba Semiconductor device having stacking structure
US4856869A (en) 1986-04-08 1989-08-15 Canon Kabushiki Kaisha Display element and observation apparatus having the same
US5835255A (en) 1986-04-23 1998-11-10 Etalon, Inc. Visible spectrum modulator arrays
US5189404A (en) 1986-06-18 1993-02-23 Hitachi, Ltd. Display apparatus with rotatable display screen
US4711526A (en) 1986-07-07 1987-12-08 Coherent, Inc. Attenuating beam splitter
US4897708A (en) 1986-07-17 1990-01-30 Laser Dynamics, Inc. Semiconductor wafer array
US5354416A (en) 1986-09-05 1994-10-11 Sadayuki Okudaira Dry etching method
US4743091A (en) 1986-10-30 1988-05-10 Daniel Gelbart Two dimensional laser diode array
US4811082A (en) 1986-11-12 1989-03-07 International Business Machines Corporation High performance integrated circuit packaging structure
GB2198867A (en) 1986-12-17 1988-06-22 Philips Electronic Associated A liquid crystal display illumination system
US4882683B1 (en) 1987-03-16 1995-11-07 Fairchild Semiconductor Cellular addrssing permutation bit map raster graphics architecture
US4940309A (en) 1987-04-20 1990-07-10 Baum Peter S Tessellator
US4763975A (en) 1987-04-28 1988-08-16 Spectra Diode Laboratories, Inc. Optical system with bright light output
US4765865A (en) 1987-05-04 1988-08-23 Ford Motor Company Silicon etch rate enhancement
US4807965A (en) 1987-05-26 1989-02-28 Garakani Reza G Apparatus for three-dimensional viewing
US4924413A (en) 1987-05-29 1990-05-08 Hercules Computer Technology Color conversion apparatus and method
KR970003915B1 (ko) 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
US4814759A (en) 1987-07-08 1989-03-21 Clinicom Incorporated Flat panel display monitor apparatus
US5003300A (en) 1987-07-27 1991-03-26 Reflection Technology, Inc. Head mounted display for miniature video display system
US4934773A (en) 1987-07-27 1990-06-19 Reflection Technology, Inc. Miniature video display system
US4859012A (en) 1987-08-14 1989-08-22 Texas Instruments Incorporated Optical interconnection networks
US5155812A (en) 1989-05-04 1992-10-13 Texas Instruments Incorporated Devices and method for generating and using systems, software waitstates on address boundaries in data processing
US5142677A (en) 1989-05-04 1992-08-25 Texas Instruments Incorporated Context switching devices, systems and methods
US5072418A (en) 1989-05-04 1991-12-10 Texas Instruments Incorporated Series maxium/minimum function computing devices, systems and methods
US4797694A (en) 1987-09-23 1989-01-10 Eastman Kodak Company Scan-multiplexed light valve printer with band-reducing construction
US4801194A (en) 1987-09-23 1989-01-31 Eastman Kodak Company Multiplexed array exposing system having equi-angular scan exposure regions
US5024494A (en) 1987-10-07 1991-06-18 Texas Instruments Incorporated Focussed light source pointer for three dimensional display
HU197469B (en) 1987-10-23 1989-03-28 Laszlo Holakovszky Spectacle like, wearable on head stereoscopic reproductor of the image
US5155604A (en) 1987-10-26 1992-10-13 Van Leer Metallized Products (Usa) Limited Coated paper sheet embossed with a diffraction or holographic pattern
US4968354A (en) 1987-11-09 1990-11-06 Fuji Electric Co., Ltd. Thin film solar cell array
US5040052A (en) 1987-12-28 1991-08-13 Texas Instruments Incorporated Compact silicon module for high density integrated circuits
US4952925A (en) 1988-01-25 1990-08-28 Bernd Haastert Projectable passive liquid-crystal flat screen information centers
US5310624A (en) 1988-01-29 1994-05-10 Massachusetts Institute Of Technology Integrated circuit micro-fabrication using dry lithographic processes
US5039628A (en) 1988-02-19 1991-08-13 Microelectronics & Computer Technology Corporation Flip substrate for chip mount
US4956619A (en) 1988-02-19 1990-09-11 Texas Instruments Incorporated Spatial light modulator
US4926241A (en) 1988-02-19 1990-05-15 Microelectronics And Computer Technology Corporation Flip substrate for chip mount
US4961633A (en) 1988-02-22 1990-10-09 Xerox Corporation VLSI optimized modulator
DE3866230D1 (de) 1988-03-03 1991-12-19 Landis & Gyr Betriebs Ag Dokument.
US4817850A (en) 1988-03-28 1989-04-04 Hughes Aircraft Company Repairable flip-chip bumping
JPH01265293A (ja) 1988-04-15 1989-10-23 Sharp Corp 小型表示装置
JPH01296214A (ja) 1988-05-25 1989-11-29 Canon Inc 表示装置
US5009473A (en) 1988-05-31 1991-04-23 Reflection Technology, Inc. Low vibration resonant scanning unit for miniature optical display apparatus
US4902083A (en) 1988-05-31 1990-02-20 Reflection Technology, Inc. Low vibration resonant scanning unit for miniature optical display apparatus
US4827391A (en) 1988-06-01 1989-05-02 Texas Instruments Incorporated Apparatus for implementing output voltage slope in current mode controlled power supplies
JPH01306886A (ja) 1988-06-03 1989-12-11 Canon Inc 体積位相型回折格子
JP2585717B2 (ja) 1988-06-03 1997-02-26 キヤノン株式会社 表示装置
US4856863A (en) 1988-06-22 1989-08-15 Texas Instruments Incorporated Optical fiber interconnection network including spatial light modulator
JP2612475B2 (ja) 1988-06-24 1997-05-21 日本航空電子工業株式会社 カラー表示パネルの表示制御装置
US4950890A (en) 1988-07-13 1990-08-21 Creo Electronics Corp. Method and apparatus for correcting position errors using writable encoders
JPH0225057A (ja) 1988-07-13 1990-01-26 Mitsubishi Electric Corp 半導体装置の製造方法
US5023905A (en) 1988-07-25 1991-06-11 Reflection Technology, Inc. Pocket data receiver with full page visual display
US5048077A (en) 1988-07-25 1991-09-10 Reflection Technology, Inc. Telephone handset with full-page visual display
US4896325A (en) 1988-08-23 1990-01-23 The Regents Of The University Of California Multi-section tunable laser with differing multi-element mirrors
US5028939A (en) 1988-08-23 1991-07-02 Texas Instruments Incorporated Spatial light modulator system
US5216544A (en) 1988-08-26 1993-06-01 Fuji Photo Film Co., Ltd. Beam-combining laser beam source device
US5058992A (en) 1988-09-07 1991-10-22 Toppan Printing Co., Ltd. Method for producing a display with a diffraction grating pattern and a display produced by the method
EP0360969B1 (de) 1988-09-30 1993-12-15 Landis & Gyr Business Support AG Beugungselement
US4915463A (en) 1988-10-18 1990-04-10 The United States Of America As Represented By The Department Of Energy Multilayer diffraction grating
JPH07121097B2 (ja) 1988-11-18 1995-12-20 株式会社日立製作所 液晶テレビおよびその製造方法
US5066614A (en) 1988-11-21 1991-11-19 Honeywell Inc. Method of manufacturing a leadframe having conductive elements preformed with solder bumps
US5184207A (en) 1988-12-07 1993-02-02 Tribotech Semiconductor die packages having lead support frame
US5191405A (en) 1988-12-23 1993-03-02 Matsushita Electric Industrial Co., Ltd. Three-dimensional stacked lsi
US4893509A (en) 1988-12-27 1990-01-16 General Motors Corporation Method and product for fabricating a resonant-bridge microaccelerometer
US4982184A (en) 1989-01-03 1991-01-01 General Electric Company Electrocrystallochromic display and element
US4949148A (en) 1989-01-11 1990-08-14 Bartelink Dirk J Self-aligning integrated circuit assembly
US4896948A (en) 1989-02-21 1990-01-30 International Business Machines Corporation Simplified double-cavity tunable optical filter using voltage-dependent refractive index
US5079544A (en) 1989-02-27 1992-01-07 Texas Instruments Incorporated Standard independent digitized video system
US5446479A (en) 1989-02-27 1995-08-29 Texas Instruments Incorporated Multi-dimensional array video processor system
US5868854A (en) 1989-02-27 1999-02-09 Hitachi, Ltd. Method and apparatus for processing samples
US5287096A (en) 1989-02-27 1994-02-15 Texas Instruments Incorporated Variable luminosity display system
US5192946A (en) 1989-02-27 1993-03-09 Texas Instruments Incorporated Digitized color video display system
US5214419A (en) 1989-02-27 1993-05-25 Texas Instruments Incorporated Planarized true three dimensional display
US5206629A (en) 1989-02-27 1993-04-27 Texas Instruments Incorporated Spatial light modulator and memory for digitized video display
US5272473A (en) 1989-02-27 1993-12-21 Texas Instruments Incorporated Reduced-speckle display system
US5162787A (en) 1989-02-27 1992-11-10 Texas Instruments Incorporated Apparatus and method for digitized video system utilizing a moving display surface
US5214420A (en) 1989-02-27 1993-05-25 Texas Instruments Incorporated Spatial light modulator projection system with random polarity light
KR100202246B1 (ko) 1989-02-27 1999-06-15 윌리엄 비. 켐플러 디지탈화 비디오 시스템을 위한 장치 및 방법
US5128660A (en) 1989-02-27 1992-07-07 Texas Instruments Incorporated Pointer for three dimensional display
US5170156A (en) 1989-02-27 1992-12-08 Texas Instruments Incorporated Multi-frequency two dimensional display system
US4930043A (en) 1989-02-28 1990-05-29 United Technologies Closed-loop capacitive accelerometer with spring constraint
US4945773A (en) 1989-03-06 1990-08-07 Ford Motor Company Force transducer etched from silicon
FR2645680B1 (fr) 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
US5188280A (en) 1989-04-28 1993-02-23 Hitachi Ltd. Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
US4895291A (en) 1989-05-04 1990-01-23 Eastman Kodak Company Method of making a hermetic seal in a solid-state device
US4978202A (en) 1989-05-12 1990-12-18 Goldstar Co., Ltd. Laser scanning system for displaying a three-dimensional color image
US5068205A (en) 1989-05-26 1991-11-26 General Signal Corporation Header mounted chemically sensitive ISFET and method of manufacture
US5060058A (en) 1989-06-07 1991-10-22 U.S. Philips Corporation Modulation system for projection display
US5153773A (en) 1989-06-08 1992-10-06 Canon Kabushiki Kaisha Illumination device including amplitude-division and beam movements
US4943815A (en) 1989-06-29 1990-07-24 International Business Machines Corporation Laser printer with light-exposure prevention
US5022750A (en) 1989-08-11 1991-06-11 Raf Electronics Corp. Active matrix reflective projection system
US5399898A (en) 1992-07-17 1995-03-21 Lsi Logic Corporation Multi-chip semiconductor arrangements using flip chip dies
JPH0343682U (zh) 1989-09-06 1991-04-24
US5107372A (en) 1989-09-06 1992-04-21 Daniel Gelbart Focus servo actuator for moving lens scanners
GB8921722D0 (en) 1989-09-26 1989-11-08 British Telecomm Micromechanical switch
US4954789A (en) 1989-09-28 1990-09-04 Texas Instruments Incorporated Spatial light modulator
JPH03116857A (ja) 1989-09-29 1991-05-17 Mitsui Petrochem Ind Ltd 発光または受光装置
US5251058A (en) 1989-10-13 1993-10-05 Xerox Corporation Multiple beam exposure control
US5251057A (en) 1989-10-13 1993-10-05 Xerox Corporation Multiple beam optical modulation system
JP2508387B2 (ja) 1989-10-16 1996-06-19 凸版印刷株式会社 回折格子パタ―ンを有するディスプレイの作製方法
US5126836A (en) 1989-11-01 1992-06-30 Aura Systems, Inc. Actuated mirror optical intensity modulation
US5185660A (en) 1989-11-01 1993-02-09 Aura Systems, Inc. Actuated mirror optical intensity modulation
US5260798A (en) 1989-11-01 1993-11-09 Aura Systems, Inc. Pixel intensity modulator
US5150205A (en) 1989-11-01 1992-09-22 Aura Systems, Inc. Actuated mirror optical intensity modulation
US5077598A (en) 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5136695A (en) 1989-11-13 1992-08-04 Reflection Technology, Inc. Apparatus and method for updating a remote video display from a host computer
US5037173A (en) 1989-11-22 1991-08-06 Texas Instruments Incorporated Optical interconnection network
US5074947A (en) 1989-12-18 1991-12-24 Epoxy Technology, Inc. Flip chip technology using electrically conductive polymers and dielectrics
US5105369A (en) 1989-12-21 1992-04-14 Texas Instruments Incorporated Printing system exposure module alignment method and apparatus of manufacture
US5041851A (en) 1989-12-21 1991-08-20 Texas Instruments Incorporated Spatial light modulator printer and method of operation
US5237340A (en) 1989-12-21 1993-08-17 Texas Instruments Incorporated Replaceable elements for xerographic printing process and method of operation
US5101236A (en) 1989-12-21 1992-03-31 Texas Instruments Incorporated Light energy control system and method of operation
US5072239A (en) 1989-12-21 1991-12-10 Texas Instruments Incorporated Spatial light modulator exposure unit and method of operation
US5142303A (en) 1989-12-21 1992-08-25 Texas Instruments Incorporated Printing system exposure module optic structure and method of operation
DE4000903C1 (zh) 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
DE4001448C1 (zh) 1990-01-19 1991-07-11 Mercedes-Benz Aktiengesellschaft, 7000 Stuttgart, De
AU645283B2 (en) 1990-01-23 1994-01-13 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
AU637874B2 (en) 1990-01-23 1993-06-10 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
US5260718A (en) 1990-01-24 1993-11-09 Xerox Corporation Liquid crystal shutter xerographic printer with offset configuration lamp aperture and copier/printer with optically aligned lamps, image bars, and lenses
JPH03217814A (ja) 1990-01-24 1991-09-25 Canon Inc 液晶プロジェクター
US5428259A (en) 1990-02-02 1995-06-27 Nec Corporation Micromotion mechanical structure and a process for the production thereof
US5113272A (en) 1990-02-12 1992-05-12 Raychem Corporation Three dimensional semiconductor display using liquid crystal
US5126812A (en) 1990-02-14 1992-06-30 The Charles Stark Draper Laboratory, Inc. Monolithic micromechanical accelerometer
US5031144A (en) 1990-02-28 1991-07-09 Hughes Aircraft Company Ferroelectric memory with non-destructive readout including grid electrode between top and bottom electrodes
US5085497A (en) 1990-03-16 1992-02-04 Aura Systems, Inc. Method for fabricating mirror array for optical projection system
GB9006471D0 (en) 1990-03-22 1990-05-23 Surface Tech Sys Ltd Loading mechanisms
JPH0787171B2 (ja) 1990-04-06 1995-09-20 ローム株式会社 固体電解コンデンサの製造方法
US5121231A (en) 1990-04-06 1992-06-09 University Of Southern California Incoherent/coherent multiplexed holographic recording for photonic interconnections and holographic optical elements
JP2938568B2 (ja) 1990-05-02 1999-08-23 フラウンホファー・ゲゼルシャフト・ツール・フォルデルング・デル・アンゲバンテン・フォルシュング・アインゲトラーゲネル・フェライン 照明装置
US5147815A (en) 1990-05-14 1992-09-15 Motorola, Inc. Method for fabricating a multichip semiconductor device having two interdigitated leadframes
US5144472A (en) 1990-05-17 1992-09-01 Xerox Corporation Electrical contacts for an electro-optic modulator
US5291473A (en) 1990-06-06 1994-03-01 Texas Instruments Incorporated Optical storage media light beam positioning system
US5502481A (en) 1992-11-16 1996-03-26 Reveo, Inc. Desktop-based projection display system for stereoscopic viewing of displayed imagery over a wide field of view
US5165013A (en) 1990-09-26 1992-11-17 Faris Sadeg M 3-D stereo pen plotter
JP2622185B2 (ja) 1990-06-28 1997-06-18 シャープ株式会社 カラー液晶表示装置
US5099353A (en) 1990-06-29 1992-03-24 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5216537A (en) 1990-06-29 1993-06-01 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5018256A (en) 1990-06-29 1991-05-28 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
DE69113150T2 (de) 1990-06-29 1996-04-04 Texas Instruments Inc Deformierbare Spiegelvorrichtung mit aktualisiertem Raster.
US5083857A (en) 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
US5142405A (en) 1990-06-29 1992-08-25 Texas Instruments Incorporated Bistable dmd addressing circuit and method
US5049901A (en) 1990-07-02 1991-09-17 Creo Products Inc. Light modulator using large area light sources
JPH0739935B2 (ja) 1990-07-02 1995-05-01 株式会社東芝 撮像素子
US5291317A (en) 1990-07-12 1994-03-01 Applied Holographics Corporation Holographic diffraction grating patterns and methods for creating the same
US5121343A (en) 1990-07-19 1992-06-09 Faris Sadeg M 3-D stereo computer output printer
GB2249450A (en) 1990-09-05 1992-05-06 Marconi Gec Ltd A display arrangement including linear array of light emitting elements
US5182665A (en) 1990-09-07 1993-01-26 Displaytech, Inc. Diffractive light modulator
US5081617A (en) 1990-09-24 1992-01-14 Creo Products Inc. Optical system for simultaneous reading of multiple data tracks
US5148157A (en) 1990-09-28 1992-09-15 Texas Instruments Incorporated Spatial light modulator with full complex light modulation capability
US5113285A (en) 1990-09-28 1992-05-12 Honeywell Inc. Full color three-dimensional flat panel display
US5115344A (en) 1990-10-03 1992-05-19 Motorola, Inc. Tunable diffraction grating
US5206829A (en) 1990-10-24 1993-04-27 Sarita Thakoor Thin film ferroelectric electro-optic memory
US5239806A (en) 1990-11-02 1993-08-31 Ak Technology, Inc. Thermoplastic semiconductor package and method of producing it
US5103334A (en) 1990-11-06 1992-04-07 Xerox Corporation Resolution improvement in flying spot scanner
US5331454A (en) 1990-11-13 1994-07-19 Texas Instruments Incorporated Low reset voltage process for DMD
US5602671A (en) 1990-11-13 1997-02-11 Texas Instruments Incorporated Low surface energy passivation layer for micromechanical devices
US5231363A (en) 1990-11-26 1993-07-27 Texas Instruments Incorporated Pulse width modulating producing signals centered in each cycle interval
US5181231A (en) 1990-11-30 1993-01-19 Texas Instruments, Incorporated Non-volatile counting method and apparatus
US5493177A (en) 1990-12-03 1996-02-20 The Regents Of The University Of California Sealed micromachined vacuum and gas filled devices
US5216278A (en) 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5220200A (en) 1990-12-10 1993-06-15 Delco Electronics Corporation Provision of substrate pillars to maintain chip standoff
US5221400A (en) 1990-12-11 1993-06-22 Delco Electronics Corporation Method of making a microaccelerometer having low stress bonds and means for preventing excessive z-axis deflection
US5185823A (en) 1990-12-13 1993-02-09 Japan Aviation Electronics Industry Limited Waveguide type optical device
US5157304A (en) * 1990-12-17 1992-10-20 Motorola, Inc. Field emission device display with vacuum seal
US5112436A (en) 1990-12-24 1992-05-12 Xerox Corporation Method of forming planar vacuum microelectronic devices with self aligned anode
US5105299A (en) 1990-12-31 1992-04-14 Texas Instruments Incorporated Unfolded optics for multiple row deformable mirror device
US5105207A (en) 1990-12-31 1992-04-14 Texas Instruments Incorporated System and method for achieving gray scale DMD operation
US5258325A (en) 1990-12-31 1993-11-02 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5376979A (en) 1990-12-31 1994-12-27 Kopin Corporation Slide projector mountable light valve display
US5172161A (en) 1990-12-31 1992-12-15 Texas Instruments Incorporated Unibody printing system and process
US5159485A (en) 1990-12-31 1992-10-27 Texas Instruments Incorporated System and method for uniformity of illumination for tungsten light
US5151718A (en) 1990-12-31 1992-09-29 Texas Instruments Incorporated System and method for solid state illumination for dmd devices
CA2060057C (en) 1991-01-29 1997-12-16 Susumu Takahashi Display having diffraction grating pattern
US5151724A (en) 1991-01-30 1992-09-29 Dan Kikinis Dynamic holographic display with cantilever
JP3150351B2 (ja) 1991-02-15 2001-03-26 株式会社東芝 電子装置及びその製造方法
US5212115A (en) 1991-03-04 1993-05-18 Motorola, Inc. Method for microelectronic device packaging employing capacitively coupled connections
US5219794A (en) 1991-03-14 1993-06-15 Hitachi, Ltd. Semiconductor integrated circuit device and method of fabricating same
US5178728A (en) 1991-03-28 1993-01-12 Texas Instruments Incorporated Integrated-optic waveguide devices and method
CA2063744C (en) 1991-04-01 2002-10-08 Paul M. Urbanus Digital micromirror device architecture and timing for use in a pulse-width modulated display system
US5347378A (en) 1991-04-04 1994-09-13 Displaytech, Inc. Fast switching color filters for frame-sequential video using ferroelectric liquid crystal color-selective filters
US5226099A (en) 1991-04-26 1993-07-06 Texas Instruments Incorporated Digital micromirror shutter device
US5148506A (en) 1991-04-26 1992-09-15 Texas Instruments Incorporated Optical crossbar switch
US5329289A (en) 1991-04-26 1994-07-12 Sharp Kabushiki Kaisha Data processor with rotatable display
US5168401A (en) 1991-05-07 1992-12-01 Spectra Diode Laboratories, Inc. Brightness conserving optical system for modifying beam symmetry
US5137836A (en) 1991-05-23 1992-08-11 Atmel Corporation Method of manufacturing a repairable multi-chip module
US5149405A (en) 1991-05-28 1992-09-22 Lehr Precision Inc. Four-axis ECM machine and method of operation
US5170269A (en) 1991-05-31 1992-12-08 Texas Instruments Incorporated Programmable optical interconnect system
US5299289A (en) 1991-06-11 1994-03-29 Matsushita Electric Industrial Co., Ltd. Polymer dispersed liquid crystal panel with diffraction grating
US5153770A (en) 1991-06-27 1992-10-06 Xerox Corporation Total internal reflection electro-optic modulator
US5155778A (en) 1991-06-28 1992-10-13 Texas Instruments Incorporated Optical switch using spatial light modulators
US5221982A (en) 1991-07-05 1993-06-22 Faris Sadeg M Polarizing wavelength separator
US5179274A (en) 1991-07-12 1993-01-12 Texas Instruments Incorporated Method for controlling operation of optical systems and devices
US5287215A (en) 1991-07-17 1994-02-15 Optron Systems, Inc. Membrane light modulation systems
US5170283A (en) 1991-07-24 1992-12-08 Northrop Corporation Silicon spatial light modulator
US5240818A (en) 1991-07-31 1993-08-31 Texas Instruments Incorporated Method for manufacturing a color filter for deformable mirror device
US5168406A (en) 1991-07-31 1992-12-01 Texas Instruments Incorporated Color deformable mirror device and method for manufacture
US5164019A (en) 1991-07-31 1992-11-17 Sunpower Corporation Monolithic series-connected solar cells having improved cell isolation and method of making same
CA2075026A1 (en) 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
JP2538456B2 (ja) 1991-08-12 1996-09-25 浜松ホトニクス株式会社 光学的変位量測定装置
US5233874A (en) 1991-08-19 1993-08-10 General Motors Corporation Active microaccelerometer
US5198895A (en) 1991-08-29 1993-03-30 Rockwell International Corporation Holographic head-up display
JPH0563029A (ja) 1991-09-02 1993-03-12 Fujitsu Ltd 半導体素子
US5132723A (en) 1991-09-05 1992-07-21 Creo Products, Inc. Method and apparatus for exposure control in light valves
US5307056A (en) 1991-09-06 1994-04-26 Texas Instruments Incorporated Dynamic memory allocation for frame buffer for spatial light modulator
US5254980A (en) 1991-09-06 1993-10-19 Texas Instruments Incorporated DMD display system controller
US5255100A (en) 1991-09-06 1993-10-19 Texas Instruments Incorporated Data formatter with orthogonal input/output and spatial reordering
US5245686A (en) 1991-09-06 1993-09-14 Faris Sadeg M Method of fabricating an image plane translator device and apparatus incorporating such device
US5208891A (en) 1991-10-07 1993-05-04 The United State Of America As Represented By The Secretary Of The Navy Fiber-optic viewgraph projector
US5177724A (en) 1991-10-08 1993-01-05 Crea Products Inc. Optical tape recorder using a resonant flexure scanner
US5239448A (en) 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
DE69221987T2 (de) 1991-11-01 1998-02-05 Sega Enterprises Kk Am Kopf befestigte Abbildungsvorrichtung
US5230005A (en) 1991-11-05 1993-07-20 The United States Of America As Represented By The Secretary Of The Navy Electronic tuning of a broadband laser
US5210637A (en) 1991-11-12 1993-05-11 International Business Machines Corp. High speed light modulation
CA2081753C (en) 1991-11-22 2002-08-06 Jeffrey B. Sampsell Dmd scanner
JPH05142490A (ja) 1991-11-25 1993-06-11 Fuji Xerox Co Ltd 非線形周波数特性を有するレーザ走査光学系
US5231432A (en) 1991-12-03 1993-07-27 Florida Atlantic University Projector utilizing liquid crystal light-valve and color selection by diffraction
EP0545412A3 (en) 1991-12-05 1993-11-03 Texas Instruments Inc Method and apparatus to improve a video signal
US5208818A (en) 1991-12-12 1993-05-04 Creo Products Inc. Laser system for recording data patterns on a planar substrate
US5323051A (en) * 1991-12-16 1994-06-21 Motorola, Inc. Semiconductor wafer level package
US5231388A (en) 1991-12-17 1993-07-27 Texas Instruments Incorporated Color display system using spatial light modulators
US5212555A (en) 1991-12-17 1993-05-18 Texas Instruments Incorporated Image capture with spatial light modulator and single-cell photosensor
US5311349A (en) 1991-12-18 1994-05-10 Texas Instruments Incorporated Unfolded optics for multiple row spatial light modulators
US5247593A (en) 1991-12-18 1993-09-21 Texas Instruments Incorporated Programmable optical crossbar switch
US5313835A (en) 1991-12-19 1994-05-24 Motorola, Inc. Integrated monolithic gyroscopes/accelerometers with logic circuits
US5233456A (en) 1991-12-20 1993-08-03 Texas Instruments Incorporated Resonant mirror and method of manufacture
US5202785A (en) 1991-12-20 1993-04-13 Texas Instruments Incorporated Method and device for steering light
CA2084923A1 (en) 1991-12-20 1993-06-21 Ronald E. Stafford Slm spectrometer
CA2085961A1 (en) 1991-12-23 1993-06-24 William E. Nelson Method and apparatus for steering light
US5247180A (en) 1991-12-30 1993-09-21 Texas Instruments Incorporated Stereolithographic apparatus and method of use
US5285407A (en) 1991-12-31 1994-02-08 Texas Instruments Incorporated Memory circuit for spatial light modulator
US5296950A (en) 1992-01-31 1994-03-22 Texas Instruments Incorporated Optical signal free-space conversion board
US5233460A (en) 1992-01-31 1993-08-03 Regents Of The University Of California Method and means for reducing speckle in coherent laser pulses
US5224088A (en) 1992-02-10 1993-06-29 Creo Products Inc. High resolution optical scanner
US5504514A (en) 1992-02-13 1996-04-02 Texas Instruments Incorporated System and method for solid state illumination for spatial light modulators
US5315423A (en) 1992-02-18 1994-05-24 Rockwell International Corporation Wavelength multiplexed two dimensional image transmission through single mode optical fiber
US5300813A (en) 1992-02-26 1994-04-05 International Business Machines Corporation Refractory metal capped low resistivity metal conductor lines and vias
US5212582A (en) 1992-03-04 1993-05-18 Texas Instruments Incorporated Electrostatically controlled beam steering device and method
EP0562424B1 (en) 1992-03-25 1997-05-28 Texas Instruments Incorporated Embedded optical calibration system
US5312513A (en) 1992-04-03 1994-05-17 Texas Instruments Incorporated Methods of forming multiple phase light modulators
US5319214A (en) 1992-04-06 1994-06-07 The United States Of America As Represented By The Secretary Of The Army Infrared image projector utilizing a deformable mirror device spatial light modulator
US5357803A (en) 1992-04-08 1994-10-25 Rochester Institute Of Technology Micromachined microaccelerometer for measuring acceleration along three axes
JPH05303348A (ja) 1992-04-24 1993-11-16 Nec Eng Ltd Ｌｃｄビデオ信号インタフェース装置
US5459592A (en) 1992-04-24 1995-10-17 Sharp Kabushiki Kaisha Projection display system including a collimating tapered waveguide or lens with the normal to optical axis angle increasing toward the lens center
US6219015B1 (en) 1992-04-28 2001-04-17 The Board Of Directors Of The Leland Stanford, Junior University Method and apparatus for using an array of grating light valves to produce multicolor optical images
US5311360A (en) 1992-04-28 1994-05-10 The Board Of Trustees Of The Leland Stanford, Junior University Method and apparatus for modulating a light beam
GB2267579A (en) 1992-05-15 1993-12-08 Sharp Kk Optical device comprising facing lenticular or parallax screens of different pitch
US5334991A (en) 1992-05-15 1994-08-02 Reflection Technology Dual image head-mounted display
US5307185A (en) 1992-05-19 1994-04-26 Raychem Corporation Liquid crystal projection display with complementary color dye added to longest wavelength imaging element
US5347433A (en) 1992-06-11 1994-09-13 Sedlmayr Steven R Collimated beam of light and systems and methods for implementation thereof
US5281887A (en) 1992-06-15 1994-01-25 Engle Craig D Two independent spatial variable degree of freedom wavefront modulator
US5315418A (en) 1992-06-17 1994-05-24 Xerox Corporation Two path liquid crystal light valve color display with light coupling lens array disposed along the red-green light path
US5486841A (en) 1992-06-17 1996-01-23 Sony Corporation Glasses type display apparatus
US5256869A (en) 1992-06-30 1993-10-26 Texas Instruments Incorporated Free-space optical interconnection using deformable mirror device
FR2693033B1 (fr) 1992-06-30 1994-08-19 Commissariat Energie Atomique Dispositif d'imagerie de grande dimension.
JPH0637143A (ja) 1992-07-15 1994-02-10 Toshiba Corp 半導体装置および半導体装置の製造方法
US5340772A (en) 1992-07-17 1994-08-23 Lsi Logic Corporation Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die
US5430524A (en) 1992-07-22 1995-07-04 Texas Instruments Incorporated Unibody printing and copying system and process
US5321416A (en) 1992-07-27 1994-06-14 Virtual Research Systems Head-mounted visual display apparatus
US5313479A (en) 1992-07-29 1994-05-17 Texas Instruments Incorporated Speckle-free display system using coherent light
US5605406A (en) 1992-08-24 1997-02-25 Bowen; James H. Computer input devices with light activated switches and light emitter protection
US5327286A (en) 1992-08-31 1994-07-05 Texas Instruments Incorporated Real time optical correlation system
US5249245A (en) 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
US5303043A (en) 1992-09-01 1994-04-12 Florida Atlantic University Projection television display utilizing Bragg diffraction cell for producing horizontal scan
US5348619A (en) 1992-09-03 1994-09-20 Texas Instruments Incorporated Metal selective polymer removal
JP3105089B2 (ja) 1992-09-11 2000-10-30 株式会社東芝 半導体装置
HUT73312A (en) 1992-09-14 1996-07-29 Badehi Method and apparatus for producing integrated circuit devices, and integrated circuit device
US5325116A (en) 1992-09-18 1994-06-28 Texas Instruments Incorporated Device for writing to and reading from optical storage media
GB9220412D0 (en) 1992-09-28 1992-11-11 Texas Instruments Holland Transponder systems for automatic identification purposes
US5493439A (en) 1992-09-29 1996-02-20 Engle; Craig D. Enhanced surface deformation light modulator
US5319668A (en) 1992-09-30 1994-06-07 New Focus, Inc. Tuning system for external cavity diode laser
US5661593A (en) 1992-10-01 1997-08-26 Engle; Craig D. Linear electrostatic modulator
US5285196A (en) 1992-10-15 1994-02-08 Texas Instruments Incorporated Bistable DMD addressing method
JP2934357B2 (ja) 1992-10-20 1999-08-16 富士通株式会社 半導体装置
US5289172A (en) 1992-10-23 1994-02-22 Texas Instruments Incorporated Method of mitigating the effects of a defective electromechanical pixel
GB2272555A (en) 1992-11-11 1994-05-18 Sharp Kk Stereoscopic display using a light modulator
DE59309409D1 (de) 1992-11-20 1999-04-08 Ascom Tech Ag Lichtmodulator
US5450088A (en) 1992-11-25 1995-09-12 Texas Instruments Deutschland Gmbh Transponder arrangement
US5410315A (en) 1992-12-08 1995-04-25 Texas Instruments Incorporated Group-addressable transponder arrangement
US5420655A (en) 1992-12-16 1995-05-30 North American Philips Corporation Color projection system employing reflective display devices and prism illuminators
JPH06260470A (ja) 1992-12-16 1994-09-16 Texas Instr Inc <Ti> パターンに作成された金属層の清浄化法
EP0608440A1 (en) 1992-12-18 1994-08-03 Fujitsu Limited Semiconductor device having a plurality of chips having identical circuit arrangements sealed in package
US5357369A (en) 1992-12-21 1994-10-18 Geoffrey Pilling Wide-field three-dimensional viewing system
FR2699690B1 (fr) 1992-12-22 1995-01-27 Thomson Csf Projecteur d'images mobiles à faible champ.
US5296408A (en) 1992-12-24 1994-03-22 International Business Machines Corporation Fabrication method for vacuum microelectronic devices
US5418584A (en) 1992-12-31 1995-05-23 Honeywell Inc. Retroreflective array virtual image projection screen
US5315429A (en) 1993-01-04 1994-05-24 Xerox Corporation Micromechanical light modulator with optically interlaced output
US5352926A (en) 1993-01-04 1994-10-04 Motorola, Inc. Flip chip package and method of making
US5371618A (en) 1993-01-05 1994-12-06 Brite View Technologies Color liquid crystal display employing dual cells driven with an EXCLUSIVE OR relationship
AU5306494A (en) 1993-01-08 1994-07-14 Richard A Vasichek Magnetic keeper accessory for wrench sockets
JP3457348B2 (ja) 1993-01-15 2003-10-14 株式会社東芝 半導体装置の製造方法
US5426072A (en) 1993-01-21 1995-06-20 Hughes Aircraft Company Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate
US5359451A (en) 1993-01-29 1994-10-25 Creo Products Inc. High efficiency acousto-optic modulator
JPH06244359A (ja) 1993-02-19 1994-09-02 Takashi Murai 多層チップ
US5320709A (en) 1993-02-24 1994-06-14 Advanced Chemical Systems International Incorporated Method for selective removal of organometallic and organosilicon residues and damaged oxides using anhydrous ammonium fluoride solution
US5371543A (en) 1993-03-03 1994-12-06 Texas Instruments Incorporated Monolithic color wheel
US5404485A (en) 1993-03-08 1995-04-04 M-Systems Flash Disk Pioneers Ltd. Flash file system
US5903098A (en) 1993-03-11 1999-05-11 Fed Corporation Field emission display device having multiplicity of through conductive vias and a backside connector
US5293511A (en) 1993-03-16 1994-03-08 Texas Instruments Incorporated Package for a semiconductor device
US5435876A (en) 1993-03-29 1995-07-25 Texas Instruments Incorporated Grid array masking tape process
US5461411A (en) 1993-03-29 1995-10-24 Texas Instruments Incorporated Process and architecture for digital micromirror printer
US5461410A (en) 1993-03-29 1995-10-24 Texas Instruments Incorporated Gray scale printing using spatial light modulators
US5455602A (en) 1993-03-29 1995-10-03 Texas Instruments Incorporated Combined modulation schemes for spatial light modulators
JPH06281988A (ja) 1993-03-30 1994-10-07 Nikon Corp 防振光学装置
US5451103A (en) 1993-04-06 1995-09-19 Sony Corporation Projector system
US5510758A (en) 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
US5539422A (en) 1993-04-12 1996-07-23 Virtual Vision, Inc. Head mounted display system
US5427975A (en) 1993-05-10 1995-06-27 Delco Electronics Corporation Method of micromachining an integrated sensor on the surface of a silicon wafer
US5321450A (en) 1993-05-11 1994-06-14 Proxima Corporation Low profile liquid crystal projector and method of using same
US5485172A (en) 1993-05-21 1996-01-16 Sony Corporation Automatic image regulating arrangement for head-mounted image display apparatus
KR970003007B1 (ko) 1993-05-21 1997-03-13 대우전자 주식회사 투사형 화상표시장치용 광로조절장치 및 그 구동방법
US5445559A (en) 1993-06-24 1995-08-29 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
US5491715A (en) 1993-06-28 1996-02-13 Texas Instruments Deutschland Gmbh Automatic antenna tuning method and circuit
US5453747A (en) 1993-06-28 1995-09-26 Texas Instruments Deutschland Gmbh Transponder systems for automatic identification purposes
US5345521A (en) 1993-07-12 1994-09-06 Texas Instrument Incorporated Architecture for optical switch
US5513198A (en) 1993-07-14 1996-04-30 Corning Incorporated Packaging of high power semiconductor lasers
US5489952A (en) 1993-07-14 1996-02-06 Texas Instruments Incorporated Method and device for multi-format television
US5673139A (en) 1993-07-19 1997-09-30 Medcom, Inc. Microelectromechanical television scanning device and method for making the same
US5365283A (en) 1993-07-19 1994-11-15 Texas Instruments Incorporated Color phase control for projection display using spatial light modulator
US5461547A (en) 1993-07-20 1995-10-24 Precision Lamp, Inc. Flat panel display lighting system
US5510824A (en) 1993-07-26 1996-04-23 Texas Instruments, Inc. Spatial light modulator array
US5453778A (en) 1993-07-30 1995-09-26 Texas Instruments Incorporated Method and apparatus for spatial modulation in the cross-process direction
JP3185831B2 (ja) 1993-07-30 2001-07-11 富士写真フイルム株式会社 偏光コヒーレント合波レーザ
US5389182A (en) 1993-08-02 1995-02-14 Texas Instruments Incorporated Use of a saw frame with tape as a substrate carrier for wafer level backend processing
US5438477A (en) 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5459492A (en) 1993-08-30 1995-10-17 Texas Instruments Incorporated Method and apparatus for printing stroke and contone data together
US5485354A (en) 1993-09-09 1996-01-16 Precision Lamp, Inc. Flat panel display lighting system
US5457493A (en) 1993-09-15 1995-10-10 Texas Instruments Incorporated Digital micro-mirror based image simulation system
EP0657760A1 (en) 1993-09-15 1995-06-14 Texas Instruments Incorporated Image simulation and projection system
KR970003466B1 (ko) 1993-09-28 1997-03-18 대우전자 주식회사 투사형 화상 표시 장치의 광로 조절 장치 제조 방법
US5347321A (en) 1993-09-30 1994-09-13 Texas Instruments Incorporated Color separator for digital television
US5815126A (en) 1993-10-22 1998-09-29 Kopin Corporation Monocular portable communication and display system
US5420722A (en) 1993-10-25 1995-05-30 Creo Products Inc. Self-registering microlens for laser diodes
US5497197A (en) 1993-11-04 1996-03-05 Texas Instruments Incorporated System and method for packaging data into video processor
US5367585A (en) 1993-10-27 1994-11-22 General Electric Company Integrated microelectromechanical polymeric photonic switch
US5508558A (en) 1993-10-28 1996-04-16 Digital Equipment Corporation High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion
US5734224A (en) * 1993-11-01 1998-03-31 Canon Kabushiki Kaisha Image forming apparatus and method of manufacturing the same
US5452024A (en) 1993-11-01 1995-09-19 Texas Instruments Incorporated DMD display system
US5398071A (en) 1993-11-02 1995-03-14 Texas Instruments Incorporated Film-to-video format detection for digital television
US5523619A (en) 1993-11-03 1996-06-04 International Business Machines Corporation High density memory structure
CA2134370A1 (en) 1993-11-04 1995-05-05 Robert J. Gove Video data formatter for a digital television system
US5508561A (en) 1993-11-15 1996-04-16 Nec Corporation Apparatus for forming a double-bump structure used for flip-chip mounting
US5450219A (en) 1993-11-17 1995-09-12 Hughes Aircraft Company Raster following telecentric illumination scanning system for enhancing light throughout in light valve projection systems
US5412501A (en) 1993-11-17 1995-05-02 Xerox Corporation System for controlling spot power in a raster output scanner
GB2294350A (en) 1994-10-21 1996-04-24 Sharp Kk Light source and display
US5517347A (en) 1993-12-01 1996-05-14 Texas Instruments Incorporated Direct view deformable mirror device
US5491510A (en) 1993-12-03 1996-02-13 Texas Instruments Incorporated System and method for simultaneously viewing a scene and an obscured object
US5454160A (en) 1993-12-03 1995-10-03 Ncr Corporation Apparatus and method for stacking integrated circuit devices
CA2179052C (en) * 1993-12-13 2001-02-13 Robert E. Higashi Integrated silicon vacuum micropackage for infrared devices
US5473512A (en) 1993-12-16 1995-12-05 At&T Corp. Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
JP2722314B2 (ja) 1993-12-20 1998-03-04 日本信号株式会社 プレーナー型ガルバノミラー及びその製造方法
US5523920A (en) 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
US5442411A (en) 1994-01-03 1995-08-15 Texas Instruments Incorporated Displaying video data on a spatial light modulator with line doubling
US5499060A (en) 1994-01-04 1996-03-12 Texas Instruments Incorporated System and method for processing video data
US5448314A (en) 1994-01-07 1995-09-05 Texas Instruments Method and apparatus for sequential color imaging
KR970005712B1 (ko) 1994-01-11 1997-04-19 삼성전자 주식회사 고 열방출용 반도체 패키지
CA2139794C (en) 1994-01-18 2006-11-07 Robert John Gove Frame pixel data generation
US5455445A (en) 1994-01-21 1995-10-03 Kulite Semiconductor Products, Inc. Multi-level semiconductor structures having environmentally isolated elements
US5500761A (en) 1994-01-27 1996-03-19 At&T Corp. Micromechanical modulator
US5658698A (en) * 1994-01-31 1997-08-19 Canon Kabushiki Kaisha Microstructure, process for manufacturing thereof and devices incorporating the same
US5467106A (en) 1994-02-10 1995-11-14 Hughes-Avicom International, Inc. Retractable face-up LCD monitor with off-monitor power supply and back-EMF braking
US5412186A (en) 1994-02-23 1995-05-02 Texas Instruments Incorporated Elimination of sticking of micro-mechanical devices
US5444566A (en) 1994-03-07 1995-08-22 Texas Instruments Incorporated Optimized electronic operation of digital micromirror devices
US5439731A (en) 1994-03-11 1995-08-08 Cornell Research Goundation, Inc. Interconnect structures containing blocked segments to minimize stress migration and electromigration damage
US5380681A (en) 1994-03-21 1995-01-10 United Microelectronics Corporation Three-dimensional multichip package and methods of fabricating
US5447600A (en) 1994-03-21 1995-09-05 Texas Instruments Polymeric coatings for micromechanical devices
US6097352A (en) 1994-03-23 2000-08-01 Kopin Corporation Color sequential display panels
JP3537881B2 (ja) 1994-03-29 2004-06-14 株式会社リコー Ｌｅｄアレイヘッド
US5576878A (en) 1994-03-30 1996-11-19 Texas Instruments Incorporated Use of incompatible materials to eliminate sticking of micro-mechanical devices
US5459528A (en) 1994-03-31 1995-10-17 Texas Instruments Incorporated Video signal processor and method for secondary images
US5467146A (en) 1994-03-31 1995-11-14 Texas Instruments Incorporated Illumination control unit for display system with spatial light modulator
US5640216A (en) 1994-04-13 1997-06-17 Hitachi, Ltd. Liquid crystal display device having video signal driving circuit mounted on one side and housing
US5486698A (en) 1994-04-19 1996-01-23 Texas Instruments Incorporated Thermal imaging system with integrated thermal chopper
US5544306A (en) 1994-05-03 1996-08-06 Sun Microsystems, Inc. Flexible dram access in a frame buffer memory and system
US6040937A (en) 1994-05-05 2000-03-21 Etalon, Inc. Interferometric modulation
US5512374A (en) 1994-05-09 1996-04-30 Texas Instruments Incorporated PFPE coatings for micro-mechanical devices
US5442414A (en) 1994-05-10 1995-08-15 U. S. Philips Corporation High contrast illumination system for video projector
US5458716A (en) 1994-05-25 1995-10-17 Texas Instruments Incorporated Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
US5497172A (en) 1994-06-13 1996-03-05 Texas Instruments Incorporated Pulse width modulation for spatial light modulator with split reset addressing
US5534107A (en) 1994-06-14 1996-07-09 Fsi International UV-enhanced dry stripping of silicon nitride films
US5521748A (en) 1994-06-16 1996-05-28 Eastman Kodak Company Light modulator with a laser or laser array for exposing image data
US5482564A (en) 1994-06-21 1996-01-09 Texas Instruments Incorporated Method of unsticking components of micro-mechanical devices
US5454906A (en) 1994-06-21 1995-10-03 Texas Instruments Inc. Method of providing sacrificial spacer for micro-mechanical devices
US5920418A (en) 1994-06-21 1999-07-06 Matsushita Electric Industrial Co., Ltd. Diffractive optical modulator and method for producing the same, infrared sensor including such a diffractive optical modulator and method for producing the same, and display device including such a diffractive optical modulator
US5499062A (en) 1994-06-23 1996-03-12 Texas Instruments Incorporated Multiplexed memory timing with block reset and secondary memory
US5523878A (en) 1994-06-30 1996-06-04 Texas Instruments Incorporated Self-assembled monolayer coating for micro-mechanical devices
US5504504A (en) 1994-07-13 1996-04-02 Texas Instruments Incorporated Method of reducing the visual impact of defects present in a spatial light modulator display
WO1996002941A1 (en) 1994-07-19 1996-02-01 Johnson Matthey Electronics, Inc. Metal cover for ceramic package and method of making same
US5704700A (en) 1994-07-25 1998-01-06 Proxima Corporation Laser illuminated image projection system and method of using same
US5696560A (en) 1994-07-25 1997-12-09 Magma, Inc. Motion picture distribution system
US5512748A (en) 1994-07-26 1996-04-30 Texas Instruments Incorporated Thermal imaging system with a monolithic focal plane array and method
US5485304A (en) 1994-07-29 1996-01-16 Texas Instruments, Inc. Support posts for micro-mechanical devices
US5523628A (en) 1994-08-05 1996-06-04 Hughes Aircraft Company Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips
JP3233535B2 (ja) 1994-08-15 2001-11-26 株式会社東芝 半導体装置及びその製造方法
US5903395A (en) 1994-08-31 1999-05-11 I-O Display Systems Llc Personal visual display system
US5483307A (en) 1994-09-29 1996-01-09 Texas Instruments, Inc. Wide field of view head-mounted display
US5995303A (en) 1994-09-30 1999-11-30 Kabushiki Kaisha Toshiba Optical element and optical device
US5490009A (en) 1994-10-31 1996-02-06 Texas Instruments Incorporated Enhanced resolution for digital micro-mirror displays
JP3707084B2 (ja) 1994-10-31 2005-10-19 ソニー株式会社 表示装置及び表示方法
US5519450A (en) 1994-11-14 1996-05-21 Texas Instruments Incorporated Graphics subsystem for digital television
US5516125A (en) 1994-11-30 1996-05-14 Texas Instruments Incorporated Baffled collet for vacuum pick-up of a semiconductor die
US5463347A (en) 1994-12-12 1995-10-31 Texas Instruments Incorporated MOS uni-directional, differential voltage amplifier capable of amplifying signals having input common-mode voltage beneath voltage of lower supply and integrated circuit substrate
US5486946A (en) 1994-12-21 1996-01-23 Motorola Integrated electro-optic package for reflective spatial light modulators
US5668611A (en) 1994-12-21 1997-09-16 Hughes Electronics Full color sequential image projection system incorporating pulse rate modulated illumination
US5524155A (en) 1995-01-06 1996-06-04 Texas Instruments Incorporated Demultiplexer for wavelength-multiplexed optical signal
US5623361A (en) 1995-01-09 1997-04-22 Engle; Craig D. Enhanced wavefront phase modulator device
US5517359A (en) 1995-01-23 1996-05-14 Gelbart; Daniel Apparatus for imaging light from a laser diode onto a multi-channel linear light valve
US5726480A (en) 1995-01-27 1998-03-10 The Regents Of The University Of California Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making the same
JPH08201757A (ja) 1995-01-30 1996-08-09 A G Technol Kk 投射型カラー表示装置
US5517340A (en) 1995-01-30 1996-05-14 International Business Machines Corporation High performance projection display with two light valves
US5504614A (en) 1995-01-31 1996-04-02 Texas Instruments Incorporated Method for fabricating a DMD spatial light modulator with a hardened hinge
US5508750A (en) 1995-02-03 1996-04-16 Texas Instruments Incorporated Encoding data converted from film format for progressive display
DE19549395A1 (de) 1995-02-07 1996-10-31 Ldt Gmbh & Co Bilderzeugungssysteme zur Bestimmung von Sehfehlern an Probanden und für deren Therapie
US5491612A (en) 1995-02-21 1996-02-13 Fairchild Space And Defense Corporation Three-dimensional modular assembly of integrated circuits
US5610438A (en) 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
DE19511593C2 (de) 1995-03-29 1997-02-13 Siemens Ag Mikrooptische Vorrichtung
JP3209877B2 (ja) 1995-03-31 2001-09-17 アルプス電気株式会社 光学読み取り装置
JP2987750B2 (ja) 1995-05-26 1999-12-06 日本信号株式会社 プレーナ型電磁アクチュエータ
US5744752A (en) 1995-06-05 1998-04-28 International Business Machines Corporation Hermetic thin film metallized sealband for SCM and MCM-D modules
US5629801A (en) 1995-06-07 1997-05-13 Silicon Light Machines Diffraction grating light doubling collection system
US5661592A (en) * 1995-06-07 1997-08-26 Silicon Light Machines Method of making and an apparatus for a flat diffraction grating light valve
US5798743A (en) 1995-06-07 1998-08-25 Silicon Light Machines Clear-behind matrix addressing for display systems
US5841579A (en) 1995-06-07 1998-11-24 Silicon Light Machines Flat diffraction grating light valve
US6046840A (en) 1995-06-19 2000-04-04 Reflectivity, Inc. Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements
US5835256A (en) 1995-06-19 1998-11-10 Reflectivity, Inc. Reflective spatial light modulator with encapsulated micro-mechanical elements
US5949570A (en) 1995-06-20 1999-09-07 Matsushita Electric Industrial Co., Ltd. Diffractive optical modulator and method for producing the same, infrared sensor including such a diffractive optical modulator and method for producing the same, and display device including such a diffractive optical modulator
JP3135107B2 (ja) 1995-06-27 2001-02-13 シャープ株式会社 ３次元ディスプレイ装置
US5886675A (en) 1995-07-05 1999-03-23 Physical Optics Corporation Autostereoscopic display system with fan-out multiplexer
US5837562A (en) 1995-07-07 1998-11-17 The Charles Stark Draper Laboratory, Inc. Process for bonding a shell to a substrate for packaging a semiconductor
US5691836A (en) 1995-07-11 1997-11-25 Sy Technology, Inc. Optically addressed spatial light modulator and method
JP3435925B2 (ja) * 1995-08-25 2003-08-11 ソニー株式会社 半導体装置
US5742373A (en) 1995-10-13 1998-04-21 Massachusetts Institute Of Technology Color microdisplays and methods of manufacturing same
US5757536A (en) 1995-08-30 1998-05-26 Sandia Corporation Electrically-programmable diffraction grating
US5963788A (en) 1995-09-06 1999-10-05 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US6012336A (en) 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
US5907425A (en) 1995-12-19 1999-05-25 The Board Of Trustees Of The Leland Stanford Junior University Miniature scanning confocal microscope
US5832148A (en) 1995-12-20 1998-11-03 California Institute Of Technology Electrically controlled wavelength multiplexing waveguide filter
JP2765545B2 (ja) 1995-12-26 1998-06-18 日本電気株式会社 光波長弁別回路およびその製造方法
US6025859A (en) 1995-12-27 2000-02-15 Sharp Kabushiki Kaisha Electrostatic printer having an array of optical modulating grating valves
US5689361A (en) 1996-01-22 1997-11-18 Lucent Technologies Inc. Apparatus and method for femtosecond pulse compression based on selective attenuation of a portion of an input power spectrum
US5801074A (en) * 1996-02-20 1998-09-01 Kim; Jong Tae Method of making an air tight cavity in an assembly package
JPH09230321A (ja) 1996-02-20 1997-09-05 Denso Corp カラー液晶表示装置
US5942791A (en) 1996-03-06 1999-08-24 Gec-Marconi Limited Micromachined devices having microbridge structure
US5694740A (en) 1996-03-15 1997-12-09 Analog Devices, Inc. Micromachined device packaged to reduce stiction
US6090717A (en) 1996-03-26 2000-07-18 Lam Research Corporation High density plasma etching of metallization layer using chlorine and nitrogen
US5731802A (en) 1996-04-22 1998-03-24 Silicon Light Machines Time-interleaved bit-plane, pulse-width-modulation digital display system
US5699740A (en) 1996-06-17 1997-12-23 Creo Products Inc. Method of loading metal printing plates on a vacuum drum
US5862164A (en) 1996-07-26 1999-01-19 Zygo Corporation Apparatus to transform with high efficiency a single frequency, linearly polarized laser beam into beams with two orthogonally polarized frequency components orthogonally polarized
US5745271A (en) 1996-07-31 1998-04-28 Lucent Technologies, Inc. Attenuation device for wavelength multiplexed optical fiber communications
US6140144A (en) 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
US5798557A (en) * 1996-08-29 1998-08-25 Harris Corporation Lid wafer bond packaging and micromachining
US5914801A (en) 1996-09-27 1999-06-22 Mcnc Microelectromechanical devices including rotating plates and related methods
US5919548A (en) 1996-10-11 1999-07-06 Sandia Corporation Chemical-mechanical polishing of recessed microelectromechanical devices
US6064404A (en) 1996-11-05 2000-05-16 Silicon Light Machines Bandwidth and frame buffer size reduction in a digital pulse-width-modulated display system
US5793519A (en) 1996-11-15 1998-08-11 Eastman Kodak Company Micromolded integrated ceramic light reflector
JP3604844B2 (ja) 1996-11-20 2004-12-22 キヤノン株式会社 カラー画像読取装置
US5898515A (en) 1996-11-21 1999-04-27 Eastman Kodak Company Light reflecting micromachined cantilever
US6154259A (en) 1996-11-27 2000-11-28 Photera Technologies, Inc. Multi-beam laser scanning display system with speckle elimination
US5923475A (en) 1996-11-27 1999-07-13 Eastman Kodak Company Laser printer using a fly's eye integrator
JPH10189822A (ja) 1996-12-06 1998-07-21 Texas Instr Inc <Ti> 表面実装形基板構造および方法
US5986634A (en) 1996-12-11 1999-11-16 Silicon Light Machines Display/monitor with orientation dependent rotatable image
US5844711A (en) 1997-01-10 1998-12-01 Northrop Grumman Corporation Tunable spatial light modulator
US5920411A (en) 1997-02-14 1999-07-06 Duck; Gary S. Optical multiplexing/demultiplexing device
US6177980B1 (en) 1997-02-20 2001-01-23 Kenneth C. Johnson High-throughput, maskless lithography system
US5892505A (en) 1997-03-17 1999-04-06 Tropper Technologies, Inc. Image viewing apparatus and method
US5982553A (en) 1997-03-20 1999-11-09 Silicon Light Machines Display device incorporating one-dimensional grating light-valve array
US5764280A (en) 1997-03-20 1998-06-09 Silicon Light Machines Inc. Display system including an image generator and movable scanner for same
US6071652A (en) 1997-03-21 2000-06-06 Digital Optics Corporation Fabricating optical elements using a photoresist formed from contact printing of a gray level mask
US6069392A (en) 1997-04-11 2000-05-30 California Institute Of Technology Microbellows actuator
US5768009A (en) 1997-04-18 1998-06-16 E-Beam Light valve target comprising electrostatically-repelled micro-mirrors
CH691559A5 (fr) 1997-04-21 2001-08-15 Asulab Sa Micro-contacteur magnétique et son procédé de fabrication.
US6421179B1 (en) 1997-05-02 2002-07-16 Interscience, Inc. Wavelength division multiplexing system and method using a reconfigurable diffraction grating
US5999319A (en) 1997-05-02 1999-12-07 Interscience, Inc. Reconfigurable compound diffraction grating
US5912094A (en) 1997-05-15 1999-06-15 Lucent Technologies, Inc. Method and apparatus for making a micro device
US6096576A (en) 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US5978127A (en) 1997-09-09 1999-11-02 Zilog, Inc. Light phase grating device
US6088102A (en) 1997-10-31 2000-07-11 Silicon Light Machines Display apparatus including grating light-valve array and interferometric optical system
US6018065A (en) 1997-11-10 2000-01-25 Advanced Technology Materials, Inc. Method of fabricating iridium-based materials and structures on substrates, iridium source reagents therefor
US5955771A (en) 1997-11-12 1999-09-21 Kulite Semiconductor Products, Inc. Sensors for use in high vibrational applications and methods for fabricating same
US6075632A (en) 1997-11-26 2000-06-13 Hewlett-Packard Company Optical noise monitor
US6122299A (en) 1997-12-31 2000-09-19 Sdl, Inc. Angled distributed reflector optical device with enhanced light confinement
US6124145A (en) 1998-01-23 2000-09-26 Instrumentarium Corporation Micromachined gas-filled chambers and method of microfabrication
US6396789B1 (en) 1998-02-27 2002-05-28 Calimetrics, Inc. Data storage system and methods using diffractive near-field optics
US6195196B1 (en) 1998-03-13 2001-02-27 Fuji Photo Film Co., Ltd. Array-type exposing device and flat type display incorporating light modulator and driving method thereof
US6163402A (en) 1998-06-11 2000-12-19 3M Innovative Properties Company Rear projection screen
US6163026A (en) 1998-03-31 2000-12-19 Intel Corporation Chemically stabilized light selective element for imaging applications
US6359333B1 (en) * 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
US5926318A (en) 1998-04-06 1999-07-20 Optimize Incorporated Biocular viewing system with intermediate image planes for an electronic display device
US5910856A (en) 1998-04-16 1999-06-08 Eastman Kodak Company Integrated hybrid silicon-based micro-reflector
US6084626A (en) 1998-04-29 2000-07-04 Eastman Kodak Company Grating modulator array
US6147789A (en) 1998-05-04 2000-11-14 Gelbart; Daniel High speed deformable mirror light valve
JPH11326826A (ja) 1998-05-13 1999-11-26 Sony Corp 照明方法及び照明装置
US5953161A (en) 1998-05-29 1999-09-14 General Motors Corporation Infra-red imaging system using a diffraction grating array
US6062461A (en) * 1998-06-03 2000-05-16 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
US6004912A (en) 1998-06-05 1999-12-21 Silicon Light Machines Vapor phase low molecular weight lubricants
US6271808B1 (en) 1998-06-05 2001-08-07 Silicon Light Machines Stereo head mounted display using a single display device
US6101036A (en) 1998-06-23 2000-08-08 Silicon Light Machines Embossed diffraction grating alone and in combination with changeable image display
US6130770A (en) 1998-06-23 2000-10-10 Silicon Light Machines Electron gun activated grating light valve
US6215579B1 (en) 1998-06-24 2001-04-10 Silicon Light Machines Method and apparatus for modulating an incident light beam for forming a two-dimensional image
US6268952B1 (en) 1998-07-14 2001-07-31 Lightconnect, Inc. Micromechanical light steering optical switch
US6303986B1 (en) 1998-07-29 2001-10-16 Silicon Light Machines Method of and apparatus for sealing an hermetic lid to a semiconductor die
JP2000091818A (ja) 1998-09-11 2000-03-31 Toyota Motor Corp フィルム型伝送線路の製造方法および該線路の接続方法
US6282213B1 (en) 1998-09-14 2001-08-28 Interscience, Inc. Tunable diode laser with fast digital line selection
US6300148B1 (en) 1998-10-05 2001-10-09 Advanced Micro Devices Semiconductor structure with a backside protective layer and backside probes and a method for constructing the structure
US6061166A (en) 1998-10-15 2000-05-09 Eastman Kodak Company Diffractive light modulator
JP3919954B2 (ja) 1998-10-16 2007-05-30 富士フイルム株式会社 アレイ型光変調素子及び平面ディスプレイの駆動方法
US6091521A (en) 1998-10-16 2000-07-18 Digilens, Inc. Light collection from diffractive displays
US6261494B1 (en) 1998-10-22 2001-07-17 Northeastern University Method of forming plastically deformable microstructures
US6220713B1 (en) 1998-10-23 2001-04-24 Compaq Computer Corporation Projection lens and system
US6123985A (en) 1998-10-28 2000-09-26 Solus Micro Technologies, Inc. Method of fabricating a membrane-actuated charge controlled mirror (CCM)
US6115168A (en) 1998-10-29 2000-09-05 Advanced Optical Technologies, Inc. Integrated optical retroreflecting modulator
US6252697B1 (en) 1998-12-18 2001-06-26 Eastman Kodak Company Mechanical grating device
US6181458B1 (en) 1998-12-18 2001-01-30 Eastman Kodak Company Mechanical grating device with optical coating and method of making mechanical grating device with optical coating
US6038057A (en) 1998-12-18 2000-03-14 Eastman Kodak Company Method and system for actuating electro-mechanical ribbon elements in accordance to a data stream
US6342960B1 (en) 1998-12-18 2002-01-29 The Boeing Company Wavelength division multiplex transmitter
US6172796B1 (en) 1998-12-18 2001-01-09 Eastman Kodak Company Multilevel electro-mechanical grating device and a method for operating a multilevel mechanical and electro-mechanical grating device
US6144481A (en) 1998-12-18 2000-11-07 Eastman Kodak Company Method and system for actuating electro-mechanical ribbon elements in accordance to a data stream
US6188519B1 (en) 1999-01-05 2001-02-13 Kenneth Carlisle Johnson Bigrating light valve
JP4511739B2 (ja) 1999-01-15 2010-07-28 ザ リージェンツ オブ ザ ユニヴァーシティ オブ カリフォルニア マイクロ電子機械システムを形成するための多結晶シリコンゲルマニウム膜
JP3399432B2 (ja) 1999-02-26 2003-04-21 セイコーエプソン株式会社 電気光学装置の製造方法及び電気光学装置
JP4316050B2 (ja) 1999-05-31 2009-08-19 ボールセミコンダクター株式会社 マイクロマシンの製造方法
US6096656A (en) 1999-06-24 2000-08-01 Sandia Corporation Formation of microchannels from low-temperature plasma-deposited silicon oxynitride
US6057520A (en) 1999-06-30 2000-05-02 Mcnc Arc resistant high voltage micromachined electrostatic switch
US6229683B1 (en) 1999-06-30 2001-05-08 Mcnc High voltage micromachined electrostatic switch
US6356577B1 (en) 1999-07-15 2002-03-12 Silicon Light Machines Method and apparatus for combining light output from multiple laser diode bars
US6169624B1 (en) 1999-08-11 2001-01-02 Asif A. Godil Achromatic optical modulators
US6313901B1 (en) 1999-09-01 2001-11-06 National Semiconductor Corporation Liquid crystal display fabrication process using a final rapid thermal anneal
US6222954B1 (en) 1999-09-17 2001-04-24 Light Bytes, Inc. Fault-tolerant fiber-optical beam control modules
US6563974B2 (en) 1999-09-17 2003-05-13 Nuonics, Inc. High resolution fault-tolerant fiber-optical beam control modules
US6153927A (en) 1999-09-30 2000-11-28 Intel Corporation Packaged integrated processor and spatial light modulator
US6229650B1 (en) 1999-10-18 2001-05-08 Agfa Corporation Optical imaging head having a multiple writing bean source
US6290864B1 (en) 1999-10-26 2001-09-18 Reflectivity, Inc. Fluoride gas etching of silicon with improved selectivity
US6290859B1 (en) 1999-11-12 2001-09-18 Sandia Corporation Tungsten coating for improved wear resistance and reliability of microelectromechanical devices
US6497490B1 (en) 1999-12-14 2002-12-24 Silicon Light Machines Laser beam attenuator and method of attenuating a laser beam
US6197610B1 (en) 2000-01-14 2001-03-06 Ball Semiconductor, Inc. Method of making small gaps for small electrical/mechanical devices
US6663790B2 (en) 2000-01-26 2003-12-16 Eastman Kodak Company Method for manufacturing a mechanical conformal grating device with improved contrast and lifetime
US6274469B1 (en) 2000-01-26 2001-08-14 Advanced Micro Devices, Inc. Process using a plug as a mask for a gate
US6418152B1 (en) 2000-02-18 2002-07-09 Trw Inc. Multi-amplifier, high power mode locked laser
US6525863B1 (en) 2000-02-25 2003-02-25 Nuonics, Inc. Multi-technology multi-beam-former platform for robust fiber-optical beam control modules
US6479811B1 (en) 2000-03-06 2002-11-12 Eastman Kodak Company Method and system for calibrating a diffractive grating modulator
US6356689B1 (en) 2000-03-25 2002-03-12 Lucent Technologies, Inc. Article comprising an optical cavity
US6310018B1 (en) 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride
US6480634B1 (en) 2000-05-18 2002-11-12 Silicon Light Machines Image projector including optical fiber which couples laser illumination to light modulator
EP1172686A3 (en) 2000-07-03 2004-07-14 Creo IL. Ltd. Controllable diffractive grating array with perpendicular diffraction
CA2352729A1 (en) 2000-07-13 2002-01-13 Creoscitex Corporation Ltd. Blazed micro-mechanical light modulator and array thereof
US6943950B2 (en) 2000-08-07 2005-09-13 Texas Instruments Incorporated Two-dimensional blazed MEMS grating
US6466354B1 (en) 2000-09-19 2002-10-15 Silicon Light Machines Method and apparatus for interferometric modulation of light
US6323984B1 (en) 2000-10-11 2001-11-27 Silicon Light Machines Method and apparatus for reducing laser speckle
US6565222B1 (en) 2000-11-17 2003-05-20 Sony Corporation High performance, low cost mirror for a rear projection television
NO20005980L (no) 2000-11-27 2002-05-28 Thin Film Electronics Ab Ferroelektrisk minnekrets og fremgangsmåte ved dens fremstilling
US20020105725A1 (en) 2000-12-18 2002-08-08 Sweatt William C. Electrically-programmable optical processor with enhanced resolution
US6384959B1 (en) 2001-01-09 2002-05-07 Eastman Kodak Company Optical data modulation system with self-damped electromechanical conformal grating
US6387723B1 (en) 2001-01-19 2002-05-14 Silicon Light Machines Reduced surface charging in silicon-based devices
US6445502B1 (en) 2001-02-02 2002-09-03 Celeste Optics, Inc. Variable blazed grating
US6613157B2 (en) 2001-02-15 2003-09-02 Micell Technologies, Inc. Methods for removing particles from microelectronic structures
WO2002073673A1 (en) 2001-03-13 2002-09-19 Rochester Institute Of Technology A micro-electro-mechanical switch and a method of using and making thereof
WO2002073671A1 (en) 2001-03-13 2002-09-19 Rochester Institute Of Technology A micro-electro-mechanical varactor and a method of making and using
GB0107404D0 (en) 2001-03-23 2001-05-16 Koninkl Philips Electronics Nv Display substrate and display device
CA2443356A1 (en) 2001-04-03 2002-10-17 Cidra Corporation Dynamic optical filter having a spatial light modulator
US6438954B1 (en) 2001-04-27 2002-08-27 3M Innovative Properties Company Multi-directional thermal actuator
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100458538C (zh) * 2004-09-27 2009-02-04 Idc公司 在mems装置中提供一再生保护涂层的系统和方法
CN101828435B (zh) * 2007-10-19 2012-07-18 巴润电子株式会社 具有多个层的凸块结构及其制造方法
CN102951594A (zh) * 2011-08-26 2013-03-06 昆山光微电子有限公司 用于微光机电系统真空封装的管壳及其制作方法
CN102951594B (zh) * 2011-08-26 2015-06-10 昆山光微电子有限公司 用于微光机电系统真空封装的管壳及其制作方法
CN105358473A (zh) * 2013-07-11 2016-02-24 雷神公司 用作真空吸气剂的晶片级封装焊料阻挡物
CN105358473B (zh) * 2013-07-11 2020-02-14 雷神公司 用作真空吸气剂的晶片级封装焊料阻挡物
CN112996745A (zh) * 2018-09-17 2021-06-18 应美盛股份有限公司 集成有加热器的传感器
CN109553062A (zh) * 2018-12-25 2019-04-02 合肥芯福传感器技术有限公司 一种薄型芯片真空封装结构

Also Published As

Publication number Publication date
WO2000007225A2 (en) 2000-02-10
EP1113982A2 (en) 2001-07-11
JP2002521837A (ja) 2002-07-16
CA2338691A1 (en) 2000-02-10
US6303986B1 (en) 2001-10-16
KR20010053615A (ko) 2001-06-25
WO2000007225A3 (en) 2000-04-27
AU5134899A (en) 2000-02-21
US20010022382A1 (en) 2001-09-20
US6764875B2 (en) 2004-07-20

Similar Documents

Publication Publication Date Title
CN1320101A (zh) 将气密盖密封到半导体管芯的方法和装置
CN101675498B (zh) 用于微镜器件的倒装芯片封装的方法和系统
CN101156242B (zh) 封装电子组件的生产方法和封装电子组件
US6571466B1 (en) Flip chip image sensor package fabrication method
US7787170B2 (en) Micromirror array assembly with in-array pillars
US8203190B2 (en) MEMS device including a chip carrier
US6964886B2 (en) Methods of fabrication for flip-chip image sensor packages
US8288851B2 (en) Method and system for hermetically sealing packages for optics
US7466018B2 (en) MEMS device wafer-level package
US7285478B2 (en) Method for micro-electromechanical system package
US20050157374A1 (en) Microelectromechanical device packages with integral heaters
US20060091486A1 (en) Solid image-pickup device and method for manufacturing the solid image pickup device
US6465281B1 (en) Method of manufacturing a semiconductor wafer level package
KR200473633Y1 (ko) 챔버 개구를 가지는 이미지 센서 구조
JP2007522648A (ja) 一体型上側真空パッケージ
US6958529B2 (en) Acceleration sensor and method of manufacture thereof
CN103288038A (zh) 耐水分封装件
CN100416802C (zh) 晶片级封装方法及结构
JPH03155671A (ja) 固体撮像装置
JP2003133452A (ja) 電子装置の製造方法
CN1577875A (zh) 水平控制的影像感测晶片封装结构及其封装方法
CN1232437C (zh) 一种用毛细管法气密封装微机电系统器件的方法
JP7542738B2 (ja) 気密パッケージ素子および素子モジュール
JP7505421B2 (ja) 紫外発光装置とその製造方法
KR20240031527A (ko) 이미지 센서 패키지 및 그 패키지 제조방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication