CN1224102C - 层叠型半导体装置 - Google Patents

层叠型半导体装置 Download PDF

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Publication number
CN1224102C
CN1224102C CNB021440697A CN02144069A CN1224102C CN 1224102 C CN1224102 C CN 1224102C CN B021440697 A CNB021440697 A CN B021440697A CN 02144069 A CN02144069 A CN 02144069A CN 1224102 C CN1224102 C CN 1224102C
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CN
China
Prior art keywords
integrated circuit
semiconductor integrated
chip
stacked
semiconductor device
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Expired - Fee Related
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CNB021440697A
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English (en)
Chinese (zh)
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CN1411062A (zh
Inventor
松尾美惠
今宫贤一
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Toshiba Corp
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Toshiba Corp
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Publication of CN1411062A publication Critical patent/CN1411062A/zh
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Publication of CN1224102C publication Critical patent/CN1224102C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H10W46/403—Marks applied to devices, e.g. for alignment or identification for identification or tracking for non-wireless electrical read out
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/284—Configurations of stacked chips characterised by structural arrangements for measuring or testing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Semiconductor Integrated Circuits (AREA)
  • Static Random-Access Memory (AREA)
  • Read Only Memory (AREA)
  • Dram (AREA)
CNB021440697A 2001-09-29 2002-09-29 层叠型半导体装置 Expired - Fee Related CN1224102C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP375022/2001 2001-09-29
JP2001375022A JP3959264B2 (ja) 2001-09-29 2001-09-29 積層型半導体装置

Publications (2)

Publication Number Publication Date
CN1411062A CN1411062A (zh) 2003-04-16
CN1224102C true CN1224102C (zh) 2005-10-19

Family

ID=19183475

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB021440697A Expired - Fee Related CN1224102C (zh) 2001-09-29 2002-09-29 层叠型半导体装置

Country Status (5)

Country Link
US (2) US6791175B2 (https=)
JP (1) JP3959264B2 (https=)
KR (1) KR100506105B1 (https=)
CN (1) CN1224102C (https=)
TW (1) TW564526B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102315204A (zh) * 2010-07-01 2012-01-11 张孟凡 三维芯片装置及三维芯片之递减式层识别编号检测电路

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Also Published As

Publication number Publication date
TW564526B (en) 2003-12-01
US6791175B2 (en) 2004-09-14
US6991964B2 (en) 2006-01-31
JP2003110086A (ja) 2003-04-11
KR20030028412A (ko) 2003-04-08
CN1411062A (zh) 2003-04-16
US20030062612A1 (en) 2003-04-03
US20050001306A1 (en) 2005-01-06
JP3959264B2 (ja) 2007-08-15
KR100506105B1 (ko) 2005-08-04

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