KR100506105B1 - 적층형 반도체 장치 - Google Patents

적층형 반도체 장치 Download PDF

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Publication number
KR100506105B1
KR100506105B1 KR10-2002-0059094A KR20020059094A KR100506105B1 KR 100506105 B1 KR100506105 B1 KR 100506105B1 KR 20020059094 A KR20020059094 A KR 20020059094A KR 100506105 B1 KR100506105 B1 KR 100506105B1
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KR
South Korea
Prior art keywords
chip
semiconductor integrated
integrated circuit
circuit
chips
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR10-2002-0059094A
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English (en)
Korean (ko)
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KR20030028412A (ko
Inventor
마쯔오미에
이마미야겐이찌
Original Assignee
가부시끼가이샤 도시바
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Publication of KR20030028412A publication Critical patent/KR20030028412A/ko
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Publication of KR100506105B1 publication Critical patent/KR100506105B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H10W46/403—Marks applied to devices, e.g. for alignment or identification for identification or tracking for non-wireless electrical read out
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/284—Configurations of stacked chips characterised by structural arrangements for measuring or testing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Static Random-Access Memory (AREA)
  • Read Only Memory (AREA)
  • Dram (AREA)
KR10-2002-0059094A 2001-09-29 2002-09-28 적층형 반도체 장치 Expired - Fee Related KR100506105B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00375022 2001-09-29
JP2001375022A JP3959264B2 (ja) 2001-09-29 2001-09-29 積層型半導体装置

Publications (2)

Publication Number Publication Date
KR20030028412A KR20030028412A (ko) 2003-04-08
KR100506105B1 true KR100506105B1 (ko) 2005-08-04

Family

ID=19183475

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-0059094A Expired - Fee Related KR100506105B1 (ko) 2001-09-29 2002-09-28 적층형 반도체 장치

Country Status (5)

Country Link
US (2) US6791175B2 (https=)
JP (1) JP3959264B2 (https=)
KR (1) KR100506105B1 (https=)
CN (1) CN1224102C (https=)
TW (1) TW564526B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9286950B2 (en) 2011-05-03 2016-03-15 Samsung Electronics Co., Ltd. Semiconductor chip, memory chip, semiconductor package and memory system

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Also Published As

Publication number Publication date
TW564526B (en) 2003-12-01
US6791175B2 (en) 2004-09-14
US6991964B2 (en) 2006-01-31
JP2003110086A (ja) 2003-04-11
KR20030028412A (ko) 2003-04-08
CN1224102C (zh) 2005-10-19
CN1411062A (zh) 2003-04-16
US20030062612A1 (en) 2003-04-03
US20050001306A1 (en) 2005-01-06
JP3959264B2 (ja) 2007-08-15

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