CN1202983A - 半导体器件及其制造方法以及装配基板 - Google Patents

半导体器件及其制造方法以及装配基板 Download PDF

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Publication number
CN1202983A
CN1202983A CN96198629A CN96198629A CN1202983A CN 1202983 A CN1202983 A CN 1202983A CN 96198629 A CN96198629 A CN 96198629A CN 96198629 A CN96198629 A CN 96198629A CN 1202983 A CN1202983 A CN 1202983A
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mentioned
semiconductor device
described semiconductor
semiconductor chip
modulus
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CN96198629A
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Chinese (zh)
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柴本正训
一谷昌弘
春田亮
松本雄行
有田顺一
安生一郎
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Hitachi Ltd
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Hitachi Ltd
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CN96198629A 1995-11-28 1996-09-27 半导体器件及其制造方法以及装配基板 Pending CN1202983A (zh)

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Application Number Priority Date Filing Date Title
JP308761/95 1995-11-28
JP30876195 1995-11-28

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CN1202983A true CN1202983A (zh) 1998-12-23

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CN96198629A Pending CN1202983A (zh) 1995-11-28 1996-09-27 半导体器件及其制造方法以及装配基板

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US (3) US6404049B1 (enExample)
EP (1) EP0865082A4 (enExample)
KR (1) KR19990067623A (enExample)
CN (1) CN1202983A (enExample)
AU (1) AU7096696A (enExample)
TW (1) TW322611B (enExample)
WO (1) WO1997020347A1 (enExample)

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CN1319138C (zh) * 2002-02-07 2007-05-30 自由度半导体公司 封装的半导体器件的形成方法
CN100382298C (zh) * 2002-12-20 2008-04-16 Nxp股份有限公司 电子器件及其制造方法
CN100472739C (zh) * 2004-11-08 2009-03-25 Tel艾派恩有限公司 铜互连布线和形成铜互连布线的方法
CN100583422C (zh) * 2007-02-01 2010-01-20 精材科技股份有限公司 具有电磁干扰屏蔽作用的电子元件及其封装方法
CN102376611A (zh) * 2010-07-28 2012-03-14 日东电工株式会社 半导体背面用膜、半导体背面用切割带集成膜、用于生产半导体器件的方法和半导体器件
CN103021973A (zh) * 2012-12-12 2013-04-03 中国电子科技集团公司第五十八研究所 一种集成电路气密性封装散热结构
CN105428321A (zh) * 2015-12-23 2016-03-23 中国电子科技集团公司第十三研究所 一种气密性芯片倒装安装用陶瓷焊盘阵列外壳结构
CN109390290A (zh) * 2017-08-08 2019-02-26 太阳诱电株式会社 半导体组件

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KR100565962B1 (ko) * 2000-01-06 2006-03-30 삼성전자주식회사 플립 칩 기술을 이용한 피지에이 패키지
JP3874234B2 (ja) * 2000-04-06 2007-01-31 株式会社ルネサステクノロジ 半導体集積回路装置
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US6709898B1 (en) * 2000-10-04 2004-03-23 Intel Corporation Die-in-heat spreader microelectronic package
JP3520039B2 (ja) * 2000-10-05 2004-04-19 三洋電機株式会社 半導体装置および半導体モジュール
CN1184684C (zh) * 2000-10-05 2005-01-12 三洋电机株式会社 半导体装置和半导体模块
US20020070443A1 (en) * 2000-12-08 2002-06-13 Xiao-Chun Mu Microelectronic package having an integrated heat sink and build-up layers
US7259448B2 (en) * 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
US6740959B2 (en) * 2001-08-01 2004-05-25 International Business Machines Corporation EMI shielding for semiconductor chip carriers
DE10137666A1 (de) * 2001-08-01 2003-02-27 Infineon Technologies Ag Schutzvorrichtung für Baugruppen und Verfahren zu ihrer Herstellung
US7045890B2 (en) * 2001-09-28 2006-05-16 Intel Corporation Heat spreader and stiffener having a stiffener extension
US7173329B2 (en) 2001-09-28 2007-02-06 Intel Corporation Package stiffener
US20030183369A1 (en) * 2002-04-02 2003-10-02 John Makaran Heat sink and method of removing heat from power electronics components
JP2003347741A (ja) 2002-05-30 2003-12-05 Taiyo Yuden Co Ltd 複合多層基板およびそれを用いたモジュール
TW554500B (en) * 2002-07-09 2003-09-21 Via Tech Inc Flip-chip package structure and the processing method thereof
US7358618B2 (en) * 2002-07-15 2008-04-15 Rohm Co., Ltd. Semiconductor device and manufacturing method thereof
JP2004104074A (ja) * 2002-07-17 2004-04-02 Sumitomo Electric Ind Ltd 半導体装置用部材
JP3915630B2 (ja) * 2002-08-26 2007-05-16 日立電線株式会社 Ｔａｂテープ及びその製造方法並びにそれを用いた半導体装置
TWI221664B (en) * 2002-11-07 2004-10-01 Via Tech Inc Structure of chip package and process thereof
JP3811120B2 (ja) * 2002-11-08 2006-08-16 株式会社巴川製紙所 半導体装置用接着テープ
US6949404B1 (en) * 2002-11-25 2005-09-27 Altera Corporation Flip chip package with warpage control
DE10259746B3 (de) * 2002-12-19 2004-06-24 Testo Ag Temperaturstabile und flüssigkeitsdichte Verbindung eines ersten Bauteils aus Keramik, Metall oder Kunststoff mit einem zweiten Bauteil aus Keramik, Metall oder Kunststoff und Verwendung einer solchen Verbindung
JP3891123B2 (ja) * 2003-02-06 2007-03-14 セイコーエプソン株式会社 半導体装置、電子デバイス、電子機器、及び半導体装置の製造方法
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US6621160B2 (en) 2003-09-16
US20020105070A1 (en) 2002-08-08
US6563212B2 (en) 2003-05-13
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AU7096696A (en) 1997-06-19
US20020066955A1 (en) 2002-06-06

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