FR2794571B1 - Dispositif dissipateur de chaleur pour composants electroniques - Google Patents

Dispositif dissipateur de chaleur pour composants electroniques

Info

Publication number
FR2794571B1
FR2794571B1 FR9907171A FR9907171A FR2794571B1 FR 2794571 B1 FR2794571 B1 FR 2794571B1 FR 9907171 A FR9907171 A FR 9907171A FR 9907171 A FR9907171 A FR 9907171A FR 2794571 B1 FR2794571 B1 FR 2794571B1
Authority
FR
France
Prior art keywords
electronic components
heat dissipator
dissipator device
heat
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9907171A
Other languages
English (en)
Other versions
FR2794571A1 (fr
Inventor
Bernard Ambrosino
Arno Thiele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
POSSEHL ELECTRONIC FRANCE SA
Original Assignee
POSSEHL ELECTRONIC FRANCE SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by POSSEHL ELECTRONIC FRANCE SA filed Critical POSSEHL ELECTRONIC FRANCE SA
Priority to FR9907171A priority Critical patent/FR2794571B1/fr
Publication of FR2794571A1 publication Critical patent/FR2794571A1/fr
Application granted granted Critical
Publication of FR2794571B1 publication Critical patent/FR2794571B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9907171A 1999-06-03 1999-06-03 Dispositif dissipateur de chaleur pour composants electroniques Expired - Fee Related FR2794571B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9907171A FR2794571B1 (fr) 1999-06-03 1999-06-03 Dispositif dissipateur de chaleur pour composants electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9907171A FR2794571B1 (fr) 1999-06-03 1999-06-03 Dispositif dissipateur de chaleur pour composants electroniques

Publications (2)

Publication Number Publication Date
FR2794571A1 FR2794571A1 (fr) 2000-12-08
FR2794571B1 true FR2794571B1 (fr) 2003-07-04

Family

ID=9546476

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9907171A Expired - Fee Related FR2794571B1 (fr) 1999-06-03 1999-06-03 Dispositif dissipateur de chaleur pour composants electroniques

Country Status (1)

Country Link
FR (1) FR2794571B1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3678995A (en) * 1970-06-22 1972-07-25 Rca Corp Support for electrical components and method of making the same
JPS63271944A (ja) * 1987-04-28 1988-11-09 Sumitomo Electric Ind Ltd 半導体装置
JPH02265265A (ja) * 1989-04-05 1990-10-30 Fujitsu Ltd 集積回路装置
JPH02266557A (ja) * 1989-04-06 1990-10-31 Mitsubishi Electric Corp 半導体装置
US5283467A (en) * 1992-06-05 1994-02-01 Eaton Corporation Heat sink mounting system for semiconductor devices
AU7096696A (en) * 1995-11-28 1997-06-19 Hitachi Limited Semiconductor device, process for producing the same, and packaged substrate

Also Published As

Publication number Publication date
FR2794571A1 (fr) 2000-12-08

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060228