AU6966391A - High density multichip package - Google Patents
High density multichip packageInfo
- Publication number
- AU6966391A AU6966391A AU69663/91A AU6966391A AU6966391A AU 6966391 A AU6966391 A AU 6966391A AU 69663/91 A AU69663/91 A AU 69663/91A AU 6966391 A AU6966391 A AU 6966391A AU 6966391 A AU6966391 A AU 6966391A
- Authority
- AU
- Australia
- Prior art keywords
- high density
- multichip package
- density multichip
- package
- multichip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/1517—Multilayer substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44054589A | 1989-11-22 | 1989-11-22 | |
US440545 | 1989-11-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6966391A true AU6966391A (en) | 1991-06-13 |
Family
ID=23749188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU69663/91A Abandoned AU6966391A (en) | 1989-11-22 | 1990-11-21 | High density multichip package |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU6966391A (en) |
WO (1) | WO1991007777A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5121293A (en) * | 1991-08-08 | 1992-06-09 | Sun Microsystems, Inc. | Method and apparatus for interconnecting devices using tab in board technology |
GB2292003A (en) * | 1994-07-29 | 1996-02-07 | Ibm Uk | Direct chip attach |
US6404049B1 (en) | 1995-11-28 | 2002-06-11 | Hitachi, Ltd. | Semiconductor device, manufacturing method thereof and mounting board |
TW338180B (en) * | 1996-03-29 | 1998-08-11 | Mitsubishi Electric Corp | Semiconductor and its manufacturing method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4544989A (en) * | 1980-06-30 | 1985-10-01 | Sharp Kabushiki Kaisha | Thin assembly for wiring substrate |
EP0120500B1 (en) * | 1983-03-29 | 1989-08-16 | Nec Corporation | High density lsi package for logic circuits |
KR900001273B1 (en) * | 1983-12-23 | 1990-03-05 | 후지쑤 가부시끼가이샤 | Semiconductor integrated circuit device |
US4677526A (en) * | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
US4835598A (en) * | 1985-06-13 | 1989-05-30 | Matsushita Electric Works, Ltd. | Wiring board |
EP0218796B1 (en) * | 1985-08-16 | 1990-10-31 | Dai-Ichi Seiko Co. Ltd. | Semiconductor device comprising a plug-in-type package |
US4731699A (en) * | 1985-10-08 | 1988-03-15 | Nec Corporation | Mounting structure for a chip |
JPH0777247B2 (en) * | 1986-09-17 | 1995-08-16 | 富士通株式会社 | Method for manufacturing semiconductor device |
US4873615A (en) * | 1986-10-09 | 1989-10-10 | Amp Incorporated | Semiconductor chip carrier system |
US4860165A (en) * | 1988-04-27 | 1989-08-22 | Prime Computer, Inc. | Semiconductor chip carrier package |
US4939570A (en) * | 1988-07-25 | 1990-07-03 | International Business Machines, Corp. | High power, pluggable tape automated bonding package |
-
1990
- 1990-11-21 WO PCT/US1990/006857 patent/WO1991007777A1/en unknown
- 1990-11-21 AU AU69663/91A patent/AU6966391A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1991007777A1 (en) | 1991-05-30 |
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