JP2006324543A - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
- Publication number
- JP2006324543A JP2006324543A JP2005147610A JP2005147610A JP2006324543A JP 2006324543 A JP2006324543 A JP 2006324543A JP 2005147610 A JP2005147610 A JP 2005147610A JP 2005147610 A JP2005147610 A JP 2005147610A JP 2006324543 A JP2006324543 A JP 2006324543A
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- Prior art keywords
- solid
- state imaging
- imaging device
- adhesive layer
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
ボンディングパッドとボンディングワイヤとの接続信頼性が向上した固体撮像装置を提供する。
【解決手段】
本発明の固体撮像装置1は、長尺状の金属基板16と、金属基板16表面に接着層18を介して固着された長尺状の固体撮像素子4と、固体撮像素子4の表面に形成され、ボンディングワイヤ14を介してリードフレームと電気的に接続するためのボンディングパッド6と、を備える。接着層18は、第1接着層18aと、第1接着層18aよりも弾性率の高い第2接着層18bとを含み、固体撮像素子4の長手方向両端部に設けられたボンディングパッド6の直下領域において、金属基板16と固体撮像素子4とが、第2接着層18bを介して固着されている。
【選択図】 図1
Description
前記金属基板表面に接着層を介して固着された長尺状の固体撮像素子と、
前記固体撮像素子の表面に形成され、ボンディングワイヤを介してリードフレームと電気的に接続するためのボンディングパッドと、
を備え、
前記接着層は、第1接着層と、該第1接着層よりも弾性率の高い第2接着層とを含み、
前記固体撮像素子の長手方向両端部に設けられた前記ボンディングパッドの直下領域において、前記金属基板と前記固体撮像素子とが、前記第2接着層を介して固着されていることを特徴とする。
[実施例]
図1および2に示した固体撮像装置1を製造し、以下の方法に基づきボンディング性と、固体撮像装置1の反りを確認した。なお、固体撮像装置1を調製する際に用いた材料は以下の通りである。
・ボンディングパッド6:純アルミニウム
・ボンディングワイヤ14:シリコン1%含有アルミニウム
・第1接着層18a:貯蔵弾性率(25℃)0.01GPa、液状の低弾性シリコーン樹脂系付加重合型接着剤(サンプル名:X−35−247N−4(信越化学(株)製)、組成:低弾性シリコーン樹脂 約15重量%、フィラー 約85重量%、触媒(Pt) 1重量%以下)を用いて形成した。なお、動的粘弾性測定による貯蔵弾性率(25℃)の測定は固体粘弾性測定装置YVS−500((株)ヨシミズ製)を用い、)を用い、JIS K7198に準じて行った。
・第2接着層18b:貯蔵弾性率(25℃)9.7GPa、液状の高弾性シリコーン樹脂系付加重合型接着剤(サンプル名:KJR630シリーズ(信越化学(株)製)、組成:高弾性シリコーン樹脂 約100重量%、白金(触媒) 1重量%以下)を用いて形成した。動的粘弾性測定は上記と同様にして行った。
固体撮像素子4面のボンディングパッド6に、ボンディングワイヤ14を押しつけ、超音波を印加した後、接合状態を確認し、以下の基準で評価した。結果を表1に示す。
○:ボンディングパッド6と、ボンディングワイヤ14との接合状態は良好であった。
×:ボンディングパッド6と、ボンディングワイヤ14とが接合しない箇所が多数観察された。
固体撮像装置1を温度可変レーザ3次元変位測定装置LS150−RTH60(ティーテック製)を用いて、固体撮像装置1の表面温度25℃における固体撮像素子4の反りと、表面温度25℃から60℃に変化させた場合の固体撮像素子4の反りの変化を測定し、以下の基準で評価した。結果を表1に示す。長手方向の反りが100μm程度の金属基板16と、モールドケース2と、固体撮像素子4とを備える固体撮像装置1を用いた。
○:固体撮像素子4の反りおよび反り変化が0乃至20μm程度
×:固体撮像素子4の反りまたは反り変化が50乃至100μm程度
固体撮像素子4と金属基板16とを、上記した液状の低弾性シリコーン樹脂系付加重合型接着剤を用いて固着した以外は、実施例1と同様にして固体撮像装置1を製造した。上記方法に従い、ボンディング性と、固体撮像素子の反りを確認した。結果を表1に示す。
固体撮像素子4と金属基板16とを、上記した液状の高弾性シリコーン樹脂系付加重合型接着剤で形成した以外は、実施例1と同様にして固体撮像装置を製造した。上記方法に従い、ボンディング性と、固体撮像装素子の反りを確認した。結果を表1に示す。
2 モールドケース
4 固体撮像素子
6 ボンディングパッド
8 インナーリード
10 アウターリード
12 リード部
14 ボンディングワイヤ
16 金属基板
18 接着層
18a 第1接着層
18b 第2接着層
20 ガラス板
22 リードフレーム
24 モールドケース
26 凹部
100 固体撮像装置
102 モールドケース
104 固体撮像素子
106 ボンディングパッド
108 インナーリード
110 アウターリード
112 リード部
114 ボンディングワイヤ
116 金属基板
118 接着層
120 ガラス板
Claims (7)
- 長尺状の金属基板と、
前記金属基板表面に接着層を介して固着された長尺状の固体撮像素子と、
前記固体撮像素子の表面に形成され、ボンディングワイヤを介してリードフレームと電気的に接続するためのボンディングパッドと、
を備え、
前記接着層は、第1接着層と、該第1接着層よりも弾性率の高い第2接着層とを含み、
前記固体撮像素子の長手方向両端部に設けられた前記ボンディングパッドの直下領域において、前記金属基板と前記固体撮像素子とが、前記第2接着層を介して固着されていることを特徴とする固体撮像装置。 - 請求項1に記載の固体撮像装置において、
前記第2接着層の弾性率が、4GPa以上15GPa以下であることを特徴とする固体撮像装置。 - 請求項1または2に記載の固体撮像装置において、
前記ボンディングパッドの直下領域を除く領域において、前記金属基板と前記固体撮像素子とは、前記第1接着層により固着されていることを特徴とする固体撮像装置。 - 請求項1乃至3のいずれかに記載の固体撮像装置において、
前記ボンディングワイヤが、アルミニウムを主成分とするボンディングワイヤであることを特徴とする固体撮像装置。 - 請求項1乃至4のいずれかに記載の固体撮像装置において、
前記第2接着層は、シリコーン樹脂より構成されていることを特徴とする固体撮像装置。 - 請求項1乃至5のいずれかに記載の固体撮像装置において、
前記第1接着層は、シリコーン樹脂より構成されていることを特徴とする固体撮像装置。 - 請求項1乃至6のいずれかに記載の固体撮像装置において、
前記金属基板は鉄または鉄を主成分とする合金からなることを特徴とする固体撮像装置。
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US11/436,643 US7435948B2 (en) | 2005-05-20 | 2006-05-19 | Adherence of a solid-state image-sensing device to a substrate |
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JP2008218643A (ja) * | 2007-03-02 | 2008-09-18 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US8358447B2 (en) * | 2007-07-31 | 2013-01-22 | Samsung Electronics Co., Ltd. | Scanner module and image scanning apparatus employing the same |
JP2012073233A (ja) * | 2010-08-31 | 2012-04-12 | Mitsumi Electric Co Ltd | センサ装置及び半導体センサ素子の実装方法 |
US11152282B1 (en) * | 2020-06-19 | 2021-10-19 | International Business Machines Corporation | Localized catalyst for enhanced thermal interface material heat transfer |
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