CN103378118B - 电子元器件、安装部件、电子装置和它们的制造方法 - Google Patents

电子元器件、安装部件、电子装置和它们的制造方法 Download PDF

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Publication number
CN103378118B
CN103378118B CN201310150932.XA CN201310150932A CN103378118B CN 103378118 B CN103378118 B CN 103378118B CN 201310150932 A CN201310150932 A CN 201310150932A CN 103378118 B CN103378118 B CN 103378118B
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China
Prior art keywords
frame body
section
electronic device
base body
electronic component
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Expired - Fee Related
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CN201310150932.XA
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English (en)
Chinese (zh)
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CN103378118A (zh
Inventor
都筑幸司
铃木隆典
小坂忠志
松木康浩
长谷川真
伊藤富士雄
小森久种
栗原康
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Canon Inc
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Canon Inc
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Publication of CN103378118A publication Critical patent/CN103378118A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201310150932.XA 2012-04-27 2013-04-27 电子元器件、安装部件、电子装置和它们的制造方法 Expired - Fee Related CN103378118B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012-103829 2012-04-27
JP2012103829 2012-04-27
JP2013-039450 2013-02-28
JP2013039450A JP2013243340A (ja) 2012-04-27 2013-02-28 電子部品、実装部材、電子機器およびこれらの製造方法

Publications (2)

Publication Number Publication Date
CN103378118A CN103378118A (zh) 2013-10-30
CN103378118B true CN103378118B (zh) 2016-03-16

Family

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CN201310150932.XA Expired - Fee Related CN103378118B (zh) 2012-04-27 2013-04-27 电子元器件、安装部件、电子装置和它们的制造方法

Country Status (3)

Country Link
US (1) US9155212B2 (enExample)
JP (1) JP2013243340A (enExample)
CN (1) CN103378118B (enExample)

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JP6144578B2 (ja) * 2013-08-30 2017-06-07 京セラ株式会社 撮像素子搭載用基板及び撮像装置
JP6214337B2 (ja) * 2013-10-25 2017-10-18 キヤノン株式会社 電子部品、電子機器および電子部品の製造方法。
JP6141760B2 (ja) * 2013-12-19 2017-06-07 京セラ株式会社 撮像素子搭載用基板及び撮像装置
KR20150101571A (ko) * 2014-02-27 2015-09-04 천병태 이미지센서 칩 패키지
KR101627135B1 (ko) * 2014-06-24 2016-06-03 삼성전기주식회사 이미지 센서 모듈 및 이를 포함하는 카메라 모듈
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EP3505216B1 (de) * 2018-01-02 2020-07-22 Heraeus Deutschland GmbH & Co. KG Elektrische kontaktierungsvorrichtungsvorrichtung für eine implantierbare medizinische vorrichtung und verfahren zur herstellung
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JP7134763B2 (ja) 2018-07-23 2022-09-12 キヤノン株式会社 モジュール及びその製造方法
JP2020108004A (ja) * 2018-12-27 2020-07-09 パナソニックＩｐマネジメント株式会社 電子機器の放熱構造及び放熱方法
JP2020150207A (ja) * 2019-03-15 2020-09-17 キヤノン株式会社 電子部品およびその製造方法、機器
CN111863843B (zh) * 2019-04-30 2024-03-01 同欣电子工业股份有限公司 感测器封装结构及其感测模块
US10832993B1 (en) * 2019-05-09 2020-11-10 Texas Instruments Incorporated Packaged multichip device with stacked die having a metal die attach
JP7406314B2 (ja) * 2019-06-24 2023-12-27 キヤノン株式会社 電子モジュール及び機器
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US20130286566A1 (en) 2013-10-31
CN103378118A (zh) 2013-10-30
US9155212B2 (en) 2015-10-06
JP2013243340A (ja) 2013-12-05

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