JP5904957B2 - 電子部品および電子機器。 - Google Patents
電子部品および電子機器。 Download PDFInfo
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- JP5904957B2 JP5904957B2 JP2013039448A JP2013039448A JP5904957B2 JP 5904957 B2 JP5904957 B2 JP 5904957B2 JP 2013039448 A JP2013039448 A JP 2013039448A JP 2013039448 A JP2013039448 A JP 2013039448A JP 5904957 B2 JP5904957 B2 JP 5904957B2
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- Prior art keywords
- electronic device
- electronic component
- conductor
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- component according
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48229—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad protruding from the surface of the item
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- H01L2224/732—Location after the connecting process
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/151—Die mounting substrate
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
20 基体
30 蓋体
40 枠体
44 強磁性体
88 導電体
Claims (15)
- 電子デバイスを備える電子部品であって、
前記電子デバイスは、仮想的な平面である基準面の一方の側に前記電子デバイスの表面が位置し、前記基準面の他方の側に前記電子デバイスの裏面が位置し、前記基準面が前記電子デバイスの側面を貫くように配置されており、
前記基準面に対して前記一方の側には、前記基準面に垂直な方向において前記電子デバイスに重なる蓋体が設けられており、
前記基準面に対して前記他方の側には、前記基準面に垂直な方向において前記電子デバイスに重なる基体が設けられており、
前記基準面に対して前記他方の側には、前記基準面に垂直な方向において前記基体に重なり、前記電子デバイスに重ならず、かつ、前記電子デバイスの電極へ内部端子を介して電気的に接続された外部端子が設けられており、
前記基準面に対して前記他方の側には、前記基準面に垂直な方向において前記電子デバイスに重なる導電体が配されており、
前記基準面に対して前記一方の側には、前記基準面に垂直な方向において前記蓋体に重なり、かつ、前記基準面に垂直な方向において前記電子デバイスの少なくとも一部に重ならない強磁性体が設けられており、
前記強磁性体は前記基体と前記蓋体との間から前記基体に重なる領域の外に延在していることを特徴とする電子部品。 - 前記導電体は前記強磁性体に重なる領域に延在している、請求項1に記載の電子部品。
- 前記強磁性体は、前記蓋体と前記電子デバイスとの間の空間を囲む枠体であり、前記基準面に平行な面内における前記枠体の内縁から前記枠体の外縁までの距離は、前記基準面に垂直な方向における前記枠体の寸法よりも大きい、請求項1または2に記載の電子部品。
- 前記強磁性体は、接合材を介して前記蓋体および前記基体に接着されている、請求項1乃至3のいずれか1項に記載の電子部品。
- 前記蓋体は可視光に対して透明である、請求項1乃至4のいずれか1項に記載の電子部品。
- 前記導電体は常磁性または反磁性を有し、前記導電体の透磁率は前記強磁性体の透磁率よりも低い、請求項1乃至5のいずれか1項に記載の電子部品。
- 前記導電体の導電率は1×106(S/m)以上である、請求項1乃至6のいずれか1項に記載の電子部品。
- 前記導電体は、前記電子デバイスに重なる領域において、前記電子デバイスの面積の1/2以上の範囲にわたって連続している、請求項1乃至7のいずれか1項に記載の電子部品。
- 前記導電体が前記電子デバイスから離れており、前記導電体と前記電子デバイスとの距離が1.0mm以下である、請求項1乃至8のいずれか1項に記載の電子部品。
- 前記基体は、前記基準面に垂直な方向において前記電子デバイスに重なる配置領域を含む下段部と、前記基準面に平行な方向において前記下段部の周辺に位置し、前記基準面に垂直な方向において前記下段部よりも前記蓋体の側に位置する上段部とを有し、前記強磁性体は、前記上段部と前記蓋体との間に位置する部分を有する、請求項1乃至9のいずれか1項に記載の電子部品。
- 前記基体は、前記上段部と前記下段部との間に、前記内部端子が配された中段部を有する、請求項10に記載の電子部品。
- 前記導電体と前記電子デバイスとの距離が、前記外部端子と前記電子デバイスとの距離よりも小さい、請求項1乃至11のいずれか1項に記載の電子部品。
- 前記強磁性体はステンレスである、請求項1乃至12のいずれか1項に記載の電子部品。
- 前記電子デバイスは撮像デバイスまたは表示デバイスである、請求項1乃至13のいずれか1項に記載の電子部品。
- 請求項1乃至14のいずれか1項に記載の電子部品と、コイルと、を備える電子機器。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013039448A JP5904957B2 (ja) | 2013-02-28 | 2013-02-28 | 電子部品および電子機器。 |
GB1402986.2A GB2512479B (en) | 2013-02-28 | 2014-02-20 | Electronic component and electronic apparatus |
US14/189,854 US9225882B2 (en) | 2013-02-28 | 2014-02-25 | Electronic component packaging that can suppress noise and electronic apparatus |
BR102014004628A BR102014004628A2 (pt) | 2013-02-28 | 2014-02-26 | componente eletrônico e aparelho eletrônico |
DE102014203427.2A DE102014203427A1 (de) | 2013-02-28 | 2014-02-26 | Elektronisches Bauteil und elektronische Vorrichtung |
RU2014107542/28A RU2575944C2 (ru) | 2013-02-28 | 2014-02-27 | Электронный компонент и электронное устройство |
CN201410072283.0A CN104022131B (zh) | 2013-02-28 | 2014-02-28 | 电子组件和电子设备 |
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JP2013039448A JP5904957B2 (ja) | 2013-02-28 | 2013-02-28 | 電子部品および電子機器。 |
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JP2014167991A JP2014167991A (ja) | 2014-09-11 |
JP2014167991A5 JP2014167991A5 (ja) | 2015-02-19 |
JP5904957B2 true JP5904957B2 (ja) | 2016-04-20 |
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US (1) | US9225882B2 (ja) |
JP (1) | JP5904957B2 (ja) |
CN (1) | CN104022131B (ja) |
BR (1) | BR102014004628A2 (ja) |
DE (1) | DE102014203427A1 (ja) |
GB (1) | GB2512479B (ja) |
RU (1) | RU2575944C2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5885690B2 (ja) | 2012-04-27 | 2016-03-15 | キヤノン株式会社 | 電子部品および電子機器 |
JP6296687B2 (ja) * | 2012-04-27 | 2018-03-20 | キヤノン株式会社 | 電子部品、電子モジュールおよびこれらの製造方法。 |
JP2013243340A (ja) * | 2012-04-27 | 2013-12-05 | Canon Inc | 電子部品、実装部材、電子機器およびこれらの製造方法 |
JP6111284B2 (ja) * | 2015-04-28 | 2017-04-05 | エムテックスマツムラ株式会社 | 中空パッケージの製造方法、固体撮像素子の製造方法、中空パッケージおよび固体撮像素子 |
WO2016181874A1 (ja) * | 2015-05-14 | 2016-11-17 | ソニー株式会社 | 回路基板、撮像素子、並びに電子機器 |
US10764478B2 (en) * | 2015-10-28 | 2020-09-01 | Kyocera Corporation | Camera module includes a lens unit that is fixed to a holding member having an image sensor via an engaging member of cured resin and manufacturing method thereof |
US20170290170A1 (en) * | 2016-03-30 | 2017-10-05 | Delphi Technologies, Inc. | Method Of Making A Camera For Use On A Vehicle |
FR3060851B1 (fr) * | 2016-12-20 | 2018-12-07 | 3D Plus | Module optoelectronique 3d d'imagerie |
JP2018157074A (ja) * | 2017-03-17 | 2018-10-04 | キヤノン株式会社 | 電子部品、電子部品の製造方法及び電子機器 |
WO2019146492A1 (ja) * | 2018-01-29 | 2019-08-01 | 富士フイルム株式会社 | 撮像ユニット及び撮像装置 |
CN111748763A (zh) * | 2019-03-26 | 2020-10-09 | Oppo广东移动通信有限公司 | 增强不锈钢被磁铁吸附能力的方法、支撑装置及电子设备 |
US10832993B1 (en) * | 2019-05-09 | 2020-11-10 | Texas Instruments Incorporated | Packaged multichip device with stacked die having a metal die attach |
CN113315893B (zh) * | 2021-05-17 | 2023-10-27 | 杭州海康威视数字技术股份有限公司 | 摄像机及视频设备 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01299094A (ja) * | 1988-05-28 | 1989-12-01 | Ibiden Co Ltd | Icカード |
FI117224B (fi) | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti |
US5639989A (en) * | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
JPH11284163A (ja) | 1998-03-31 | 1999-10-15 | Sony Corp | 固体撮像装置 |
JP2003101042A (ja) * | 2001-09-25 | 2003-04-04 | Kyocera Corp | 光半導体素子収納用容器 |
US6906396B2 (en) * | 2002-01-15 | 2005-06-14 | Micron Technology, Inc. | Magnetic shield for integrated circuit packaging |
JP2003282754A (ja) | 2002-03-27 | 2003-10-03 | Kyocera Corp | 光デバイス収納用パッケージ |
US20030231093A1 (en) * | 2002-06-13 | 2003-12-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Microelectronic inductor structure with annular magnetic shielding layer |
JP2004022955A (ja) | 2002-06-19 | 2004-01-22 | Kyocera Corp | 赤外線センサ素子収納用パッケージおよび赤外線センサ装置 |
JP2004031815A (ja) | 2002-06-27 | 2004-01-29 | Kyocera Corp | 蓋体およびこれを用いた光デバイス収納用パッケージ |
JP4073821B2 (ja) * | 2003-05-06 | 2008-04-09 | セイコーインスツル株式会社 | 通信用デバイスパッケージおよびその製造方法 |
JP4418720B2 (ja) | 2003-11-21 | 2010-02-24 | キヤノン株式会社 | 放射線撮像装置及び方法、並びに放射線撮像システム |
JP2005353911A (ja) * | 2004-06-11 | 2005-12-22 | Toshiba Corp | 半導体装置 |
JP4578312B2 (ja) * | 2005-04-27 | 2010-11-10 | 京セラ株式会社 | 電子部品収納容器 |
US7778039B2 (en) | 2006-05-08 | 2010-08-17 | Micron Technology, Inc. | Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise |
US7795708B2 (en) * | 2006-06-02 | 2010-09-14 | Honeywell International Inc. | Multilayer structures for magnetic shielding |
JP2008245244A (ja) | 2007-02-26 | 2008-10-09 | Sony Corp | 撮像素子パッケージ、撮像素子モジュールおよびレンズ鏡筒並びに撮像装置 |
JP5392533B2 (ja) | 2008-10-10 | 2014-01-22 | ソニー株式会社 | 固体撮像素子、光学装置、信号処理装置及び信号処理システム |
WO2010146863A1 (ja) * | 2009-06-17 | 2010-12-23 | 日本電気株式会社 | Icパッケージ |
JP5277105B2 (ja) * | 2009-07-29 | 2013-08-28 | 富士フイルム株式会社 | カメラモジュール |
JP5570163B2 (ja) | 2009-08-31 | 2014-08-13 | キヤノン株式会社 | 固体撮像装置 |
JP5550380B2 (ja) | 2010-02-25 | 2014-07-16 | キヤノン株式会社 | 固体撮像装置及び撮像装置 |
JP5407936B2 (ja) * | 2010-03-02 | 2014-02-05 | 日本電気株式会社 | 電磁ノイズ抑制体 |
KR101855294B1 (ko) * | 2010-06-10 | 2018-05-08 | 삼성전자주식회사 | 반도체 패키지 |
KR20110135757A (ko) * | 2010-06-11 | 2011-12-19 | 삼성전자주식회사 | 이미지 센서 칩 및 이를 포함하는 카메라 모듈 |
JP2012220419A (ja) * | 2011-04-12 | 2012-11-12 | Panasonic Corp | 検知装置 |
JP2013222772A (ja) * | 2012-04-13 | 2013-10-28 | Sony Corp | 撮像素子パッケージおよび撮像装置 |
JP6296687B2 (ja) * | 2012-04-27 | 2018-03-20 | キヤノン株式会社 | 電子部品、電子モジュールおよびこれらの製造方法。 |
JP5574508B2 (ja) | 2012-11-27 | 2014-08-20 | マルホン工業株式会社 | パチンコ遊技機 |
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- 2014-02-26 DE DE102014203427.2A patent/DE102014203427A1/de not_active Ceased
- 2014-02-26 BR BR102014004628A patent/BR102014004628A2/pt not_active Application Discontinuation
- 2014-02-27 RU RU2014107542/28A patent/RU2575944C2/ru active
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Also Published As
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JP2014167991A (ja) | 2014-09-11 |
US9225882B2 (en) | 2015-12-29 |
GB2512479A (en) | 2014-10-01 |
GB201402986D0 (en) | 2014-04-09 |
RU2014107542A (ru) | 2015-09-10 |
GB2512479B (en) | 2015-11-04 |
CN104022131A (zh) | 2014-09-03 |
RU2575944C2 (ru) | 2016-02-27 |
BR102014004628A2 (pt) | 2015-10-20 |
US20140240588A1 (en) | 2014-08-28 |
DE102014203427A1 (de) | 2014-08-28 |
CN104022131B (zh) | 2017-04-12 |
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