GB2007911B - Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages - Google Patents

Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages

Info

Publication number
GB2007911B
GB2007911B GB7840121A GB7840121A GB2007911B GB 2007911 B GB2007911 B GB 2007911B GB 7840121 A GB7840121 A GB 7840121A GB 7840121 A GB7840121 A GB 7840121A GB 2007911 B GB2007911 B GB 2007911B
Authority
GB
United Kingdom
Prior art keywords
microwave
circiuted
packages
intergrated
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7840121A
Other versions
GB2007911A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UK Secretary of State for Defence
Original Assignee
UK Secretary of State for Defence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UK Secretary of State for Defence filed Critical UK Secretary of State for Defence
Priority to GB7840121A priority Critical patent/GB2007911B/en
Publication of GB2007911A publication Critical patent/GB2007911A/en
Application granted granted Critical
Publication of GB2007911B publication Critical patent/GB2007911B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
GB7840121A 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages Expired GB2007911B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7840121A GB2007911B (en) 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB4247177 1977-10-12
GB7840121A GB2007911B (en) 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages

Publications (2)

Publication Number Publication Date
GB2007911A GB2007911A (en) 1979-05-23
GB2007911B true GB2007911B (en) 1982-03-24

Family

ID=26264909

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7840121A Expired GB2007911B (en) 1977-10-12 1978-10-11 Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages

Country Status (1)

Country Link
GB (1) GB2007911B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0180906B1 (en) * 1984-11-02 1989-01-18 Siemens Aktiengesellschaft Wave resistance-adapted chip support for a microwave semiconductor
JPH0812887B2 (en) * 1985-04-13 1996-02-07 富士通株式会社 High-speed integrated circuit package
DE3777856D1 (en) * 1986-02-24 1992-05-07 Hewlett Packard Co HERMETIC, MICROELECTRONIC HIGH FREQUENCY PACK FOR SURFACE MOUNTING.
US4925024A (en) * 1986-02-24 1990-05-15 Hewlett-Packard Company Hermetic high frequency surface mount microelectronic package
JPH0870061A (en) * 1994-08-30 1996-03-12 Mitsubishi Electric Corp High frequency integrated circuit and its manufacture
JP6296687B2 (en) 2012-04-27 2018-03-20 キヤノン株式会社 Electronic components, electronic modules, and methods for manufacturing them.
JP5885690B2 (en) * 2012-04-27 2016-03-15 キヤノン株式会社 Electronic components and equipment
JP2013243340A (en) 2012-04-27 2013-12-05 Canon Inc Electronic component, mounting member, electronic apparatus, and manufacturing method of these

Also Published As

Publication number Publication date
GB2007911A (en) 1979-05-23

Similar Documents

Publication Publication Date Title
JPS5317276A (en) Integrated circuit package and method of manufacture thereof
JPS5371982A (en) Sealed container and method of forming same
JPS5421262A (en) Method of producing electronic part package and device used therefor
JPS53134378A (en) Semiconductor and method of forming same
GB1545738A (en) Opening of packages
GB2007911B (en) Methods of packaging microwave intergrated circuits and to microwave intergrated circiuted packages
GB2000744B (en) Packaging of liquids
JPS5492173A (en) Semiconductor* semiconductor device and method of preparing semiconductor
DE2860865D1 (en) Improvements in or relating to microwave integrated circuit packages
JPS5456589A (en) Method of packaging metal package
JPS51120669A (en) Package for electronic circuits and method of making the same
JPS5591665A (en) Package of high sealinggup property
GB2010862B (en) Packaged articles and products thereof
GB1543784A (en) Packaging of articles
GB1545051A (en) Secure packaging of articles
JPS5410089A (en) Method of conveying out package etc*
GB2038103B (en) Packaging of microwave integrated circuits
JPS538294A (en) Package and method of packing product to produce the same
JPS53137774A (en) Bag package and method of producing same
JPS5664911A (en) Shield package of soft and fragile article* its forming method and its device
GB2035888B (en) Band of bags process and device for producing such
JPS5379267A (en) Method of packaging hyb ic
JPS5397569A (en) Packaging container and method of producing same
JPS5449289A (en) Device for wrapping and method of making vacuum or gassfilled package
GB1554209A (en) Packaging of electronics components

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee