CN101801837B - 具有mems惯性感测及内置数字电子元件的集成式移动处理单元(mpu) - Google Patents

具有mems惯性感测及内置数字电子元件的集成式移动处理单元(mpu) Download PDF

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CN101801837B
CN101801837B CN200880101744.5A CN200880101744A CN101801837B CN 101801837 B CN101801837 B CN 101801837B CN 200880101744 A CN200880101744 A CN 200880101744A CN 101801837 B CN101801837 B CN 101801837B
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inertial measurement
substrate
gyroscope
accelerometer
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CN101801837A (zh
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S·S·纳西里
D·萨克斯
B·塔赫里
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5776—Signal processing not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5769—Manufacturing; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0845—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration using a plurality of spring-mass systems being arranged on one common planar substrate, the systems not being mechanically coupled and the sensitive direction of each system being different
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
    • G01P2015/0865—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using integrated signal processing circuitry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
    • G01P2015/088—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system for providing wafer-level encapsulation

Abstract

本发明提供一种可运作以安装至面板的表面上的模块，该模块包含线性加速度计及第一旋转传感器，该线性加速度计提供至少一个轴线上的线性加速度的测量所对应的第一测量输出，而该第一旋转传感器可操作以提供绕着至少一个轴线的旋转的测量所对应的第二测量输出。该加速度计及该第一旋转传感器是形成在第一基板上。该模块还包含专用集成电路(ASIC)，该ASIC接收来自于该线性加速度计的该第一测量输出及来自于该第一旋转传感器的该第二测量输出两者。该ASIC包含模拟数字转换器，并且实施在第二基板上。该第一基板是垂直地接合于该第二基板。

Description

具有MEMS惯性感测及内置数字电子元件的集成式移动处理单元(MPU)
技术领域
本发明是关于微机电系统(microelectronmechanical system，MEMS)装置。
背景技术
微机电系统(MEMs)科技已稳定发展一段时间了，因此，不同的MEMS装置(例如，用来测量线性加速度的加速度计、及用来测量角速度的陀螺仪)也已实施于数种应用中。举例来说，个别的加速度计及陀螺仪传感器目前正被使用在交通工具安全气囊控制、竞赛操控台、数字相机、摄影机及行动电话。
MEMS装置通常产生一个或更多个对应于给定测量的模拟输出信号，并且因此通常需要模拟数字转换器(ADC)来将该模拟输出信号转换成对应的数字信号，以供数字信号处理之用。包含MEMS装置及模拟数字转换器(ADC)的传统应用通常实施多晶片面板级科技，以将该MEMS装置耦接至该模拟数字转换器(ADC)、及/或将该MEMS装置及该模拟数字转换器(ADC)实施在个别的晶片、印刷电路板(PCB)、或模块上。然而，这种使用面板级组装科技以将MEMS装置耦接至模拟数字转换器(ADC)及MEMS装置在个别的晶片或印刷电路板上的实施，需要相当多的空间、更多的能量、及更高的成本，其通常会限制MEMS装置所能使用的应用的数目。
发明内容
一般而言，在一个态样中，本说明书描述一种模块，该模块可操作以安装在面板的表面上。该模块包含线性加速度计及第一旋转传感器，该线性加速度计提供至少一个轴线上的线性加速度的测量所对应的第一测量输出，而该第一旋转传感器可操作以提供绕着至少一个轴线的旋转的测量所对应的第二测量输出。该加速度计及该第一旋转传感器是形成在第一基板上。该模块还包含专用集成电路(ASIC)，该ASIC接收来自于该线性加速度计的该第一测量输出及来自于该第一旋转传感器的该第二测量输出两者。该专用集成电路(ASIC)包含模拟数字转换器(ADC)，并且实施在第二基板上。该第一基板是垂直地接合于该第二基板。
实施可提供一个或更多个以下的优点。提供一种表面可安装的模块，其包含陀螺仪(或其他如以下所描述的装置)及模拟数字转换器(ADC)。在一个实施中，该陀螺仪(实施在MEMS基板上)是通过晶圆接合而接合至CMOS积体电路基板(包含该模拟数字转换器(ADC))。就面积、性能及成本而言，这种实施提供有价值的改善。这种模块可实施在各种应用中，例如，蜂巢式电话、个人数字助理(PDA)、数字相机、或其他提供例如图像稳定功能的手持式装置。该模块提供系统级的解决方案，该解决方案具有将额外的功能整合至晶片上的能力。在一个实施中揭露一种移动处理单元，其提供六个轴线的感测(例如，三个轴线加速度及三个轴线角速度)。该移动处理单元包含内置的处理、及可于多种消费性及非消费性应用中实现移动感测应用的所有相关特征。此外，该说明书揭露一种移动处理单元，其将传感器(其提供例如六个轴线的感测)与相关的晶圆级封装的智慧型电子元件整合在一起。这种移动处理单元为消费性应用提供低成本、小封装、及高性能的解决方案。
一个或更多个实施的详细内容是提出于以下的附随图式及说明中。从该说明及图式，其他特征及优点会很明显。
附图说明
第1图是依据一个实施的模块的方块图，该模块包含陀螺仪及模拟数字转换器(ADC)。
第2图例示依据一个实施的方法，该方法是用来实施及使用陀螺仪及模拟数字转换器(ADC)。
第3图是依据一个实施的模块的方块图，该模块包含陀螺仪、模拟数字转换器(ADC)及微控制器。
第4图是依据一个实施的模块的方块图，该模块包含3轴加速度计、模拟数字转换器(ADC)及微控制器。
第5图是包含陀螺仪、模拟数字转换器(ADC)及微控制器的模块的方块图，该微控制器可使用在图像稳定应用中。
第6图例示第5图的模块依据两个不同实施的两个封装(footprint)。
第7图例示依据一个实施的移动处理单元(MPU)。
第8图例示依据一个实施的MEMS传感器晶圆及电子元件晶圆。
第9图例示依据一个实施的移动处理单元(MPU)。
第10图例示依据一个实施的移动处理单元(MPU)。
第11图例示依据一个实施的移动处理单元(MPU)。
第12图显示第11图的移动处理单元(MCU)中该模块1102的一种范例晶粒区域。
第13A至13E图例示移动处理单元(MCU)的不同实施。
不同图式中相同的参考符号表明相同的元件。
具体实施方式
本发明大致上是关于微机电系统(MEMs)装置。藉由呈现以下的说明，将使该领域中具通常技术者得以制造及使用本发明，并在上下文中提供专利应用及其要求。本发明并无意限制于所显示的实施，而是符合与此处所描述的原理一致的最宽广的范围。
第1图例示依据一个实施的模块100，该模块100包含MEMS感测装置(例如，陀螺仪102)及模拟数字转换器(ADC)104。在一个实施中，该模块100为一种可安装在印刷电路板(PCB)的表面之单一晶片(或封装件)。在一个实施中，该模拟数字转换器(ADC)104是专用集成电路(ASIC)108的组件。如第1图所显示的，该陀螺仪102提供两个模拟输出信号，分别对应于在X轴线与Y轴线上所测量的角速度。一般而言，该陀螺仪102是至少双轴线微机电系统(MEMs)陀螺仪。在一个实施中，该陀螺仪102是如共同拥有(commonly owned)的第6,892,575号美国专利案中所描述的陀螺仪，该专利案的名称为”X-Y Axis Dual-MassTuning Fork Gyroscope With Vertically integrated Electronics andWafer-Scale Hermetic Packaging”，其并入此处以作为参考。相应地，在一个实施中，该陀螺仪102是实施在MEMS基板上，该陀螺仪102是通过晶圆接合而接合至CMOS积体电路基板(包含该ASIC 108及模拟数字转换器(ADC)104)。在一个实施中，该MEMS基板是通过晶圆接合技术而接合至该CMOS积体电路基板，该晶圆接合技术使用如共同拥有的第7,104,129号美国专利案中所揭露的垂直制作程序，该专利案的名称为”Vertically Integrated MEMS Structure with Electronic in aHermetically Sealed Cavity”，其并入于此处以作为参考。虽然该模块100是显示包含陀螺仪，但是该模块100可包含如共同拥有的第11/285,493号美国专利申请案中所描述的多轴线(线性)加速度计(例如，3轴线加速度计)，以取代该陀螺仪，该专利申请案的名称为”Multiple AxisAccelerometer”，其并入于此处以作为参考。更一般而言，该模块可还包含其他类型的MEMS感测装置，例如，诸如速率传感器(或陀螺仪)及/或旋转加速度传感器之第二旋转传感器。
在运作中，该模拟数字转换器(ADC)104将该陀螺仪102的该模拟输出信号转换成对应的数字信号，该对应的数字信号可通过输出106而从该模拟数字转换器(ADC)104输出。在一个实施中，该模块100包含多工器(未显示)，用来选择性地将该陀螺仪102的该模拟输出信号其中一个提供至该模拟数字转换器(ADC)104。该多工器可为该专用集成电路(ASIC)108的组件。
第2图例示依据一个实施的方法200，该方法200是用来实施并使用陀螺仪及模拟数字转换器(ADC)。陀螺仪(例如，陀螺仪102)及模拟数字转换器(ADC)(例如，模拟数字转换器(ADC)104)是实施在表面可安装的晶片(例如，模块100)上(步骤202)。在一个实施中，该陀螺仪是使用垂直制作程序制作在包含该模拟数字转换器(ADC)的该晶片上。至少两个模拟输出信号是由该陀螺仪所产生，其中，该两个模拟输出信号对应于至少两个不同轴线的角速度测量(步骤204)。在运作中，该模拟数字转换器(ADC)将该陀螺仪的该模拟输出信号转换成对应的数字信号(步骤206)。
第3图是依据一个实施的模块300的方块图。该模块300包含陀螺仪302，模拟数字转换器(ADC)304、微控制器306、及接口308。在一个实施中，该模块300为可安装至印刷电路板(PCB)的表面上的单一晶片。在一个实施中，该陀螺仪302是使用垂直制作程序接合至该晶片。相应地，在此实施中，该陀螺仪302，该模拟数字转换器(ADC)304、该微控制器306、及该接口308可实施在相同的基板上，例如，CMOS基板。在一个实施中，该模块300还包含多工器(未显示)，用来选择性地将该陀螺仪302的该模拟输出信号其中一个提供至该模拟数字转换器(ADC)304。在一个实施中，该模拟数字转换器(ADC)304、该微控制器306、该接口308、及该多工器为专用集成电路(ASIC)的组件。
在一个实施中，该陀螺仪302产生两个模拟输出信号，分别对应于X轴线上及Y轴线上所测量的角速度。该模拟输出信号被该模拟数字转换器(ADC)304转换成对应的数字信号。该微控制器306处理该数字信号。该接口308提供至该微控制器306的接口。该接口308可为串行外围接口(SPI)、积体电路间(I2C)接口、或其他适当的接口。在第3图所显示的实施中，该接口308是具有两条控制线(SCLK及CS)和两条资讯线(DIN及DOUT)的SPI接口。一般而言，该模块300可包含除了陀螺仪以外的其他类型的MEMS传感器。举例来说，第4图例示包含3轴线加速度计402的模块400，该3轴线加速度计402将模拟输出发送至模拟数字转换器(ADC)404。该模拟数字转换器(ADC)404将该模拟输出信号转换成对应的数字信号，以供微控制器406处理。类似于该模块300，该模块400还包含耦接至该微控制器406的接口408(例如，串行外围接口(SPI))。
第5图例示依据一个实施的模块500的方块图。在一个实施中，该模块500包含陀螺仪502、多工器(MUX)504、(例如，16位元)模拟数字转换器(ADC)506、微控制器508、接口510、以及脉冲宽度调制器驱动器512、514。在一个实施中，该模块500为可安装在印刷电路板(PCB)的表面上的单一晶片。在一个实施中，该陀螺仪502是使用垂直制作程序接合至该晶片。因此，在此实施中，该陀螺仪502，该多工器(MUX)504、该模拟数字转换器(ADC)506、该微控制器508，该接口510，以及该脉冲宽度调制器驱动器512、514是制作于相同的基板上。在另一个实施中，该陀螺仪502是实施在与该模块500分离的晶片上。在此实施中，该陀螺仪502及该模块500可制作在基板上，该基板可安装在印刷电路板(PCB)的表面上。该模块500提供系统级的解决方案，以将包含控制器功能的多个功能整合至单一晶片上。该模块500在模拟功能及数字功能之间提供有效的分割。在一个实施中，该模块500还包含与该微控制器508进行通讯之存储器(未显示)。该存储器可储存可被该微控制器508所实施的程式指令及/或与功能(例如，如以下所描述的图像稳定计算)相关的资讯。
在一个实施中，该模块500是实施在图像稳定应用中。举例来说，该模块500可实施在例如双筒望远镜、摄远镜片或数字相机，以使这些装置达成光学图像稳定。在这种实施中，该陀螺仪502检测例如镜片的移动，并产生对应于该镜片的该移动的相应的模拟输出信号。该MUX 504可运作以选择性地将来自于该陀螺仪502的模拟测量输出信号(或来自于一个或更多个对应的第二测量装置(未显示)的一个或更多个(模拟)测量输出)提供至该模拟数字转换器506。该微控制器508根据从该模拟数字转换器(ADC)506所接收的数字信号实施一个或更多个光学图像稳定计算，并产生控制信号，该控制信号是发送至脉冲宽度调制器驱动器512、514，以驱动一个或更多个致动器(未显示)抵消该镜片的该移动并维特稳定的图像。可耦接至该MUX 404(除了该陀螺仪502以外)的测量装置的类型包含第二(MEMs)陀螺仪、加速度计，位置传感器、压力传感器、温度传感器、或其他传感器或装置。
第6图例示实施于个别的晶片上的陀螺仪及微控制器的封装600和实施于相同的晶片上的陀螺仪及微控制器的封装602。如第6图所显示的，(实施于个别的晶片上的陀螺仪及微控制器的)该封装600具有实质上6mmx8mm的尺寸，而(实施于相同的晶片上的陀螺仪及微控制器的)该封装602则具有实质上5mmx5mm的尺寸。这种小封装使由以上所讨论的该模块所提供的该系统级解决方案(例如，整合陀螺仪及控制器)得以被实施在其组件的尺寸及能量消耗为关键因素的应用中(例如手持式装置应用中)。
第7图例示组件700的一个实施，该组件700可实施在模块上，以形成例如由加州圣塔克拉拉(Santa Clara)的Invensense公司所提供的移动处理单元(MPUTM)。在一个实施中，移动处理单元(MPU)是一种可测量至少两个轴线旋转及至少一个轴线加速度的装置，其中，该装置的组件是例如通过晶圆级整合而整合至单一封装件中。晶圆级整合包含建构超大积体电路网路，该超大积体电路网路使用整个硅晶圆以产生单一「超级晶片」(“super chip”)-并且，在此说明书的上下文中，(在一个实施中)单一晶片是提供以包含移动处理单元(MPU)，该MPU可运作以测量旋转及加速度两者。在一个实施中，相对于可提供类似测量的传统装置，该晶片占据较小的硅面积。
参考第7图，在一个实施中，该组件700包含3轴线加速度计702、3轴线陀螺仪704、及电子元件706(例如，CMOS电子元件)。该3轴线加速度计702及该3轴线陀螺仪704提供6条轴线的感测(例如，3条轴线的加速度及3条轴线的角速度)。在一个实施中，该组件700是个别地整合至MEMS传感器晶圆800及电子元件晶圆802上，如第8图所显示的。更特定地说，在一个实施中，该3轴线加速度计702及该3轴线陀螺仪704是整合至该MEMS传感器晶圆800上，而该电子元件706则是整合至该电子元件晶圆802上。在一个实施中，该MEMS传感器晶圆800是接合至该电子元件晶圆802。任何适合的接合技术皆可使用来将该MEMS传感器晶圆800接合至该电子元件晶圆802，例如于共同拥有的审查中的第11/084,296号美国专利申请案中所描述的接合技术，该专利申请案的名称为”Method of Fabrication of AL/GEBonding in a Wafer Packaging Environment and a Product ProducedTherefrom”，其并入此处以作为参考。在一个实施中，整合至该MEMS传感器晶圆800的组件是经由电性互连806而电性连接至与该电子元件晶圆802相关的组件(例如，CMOS电子元件)。
在一个实施中，使用遮盖晶圆(cover wafer)804(或覆盖晶圆(capwafer))来将该MEMS传感器晶圆800密封在(该遮盖晶圆804与该电子元件晶圆802之间的)封闭的外壳(hermetic enclosure)中。在一个实施中，(例如，为了符合不同市场对于该移动处理单元的性能规定)在该封闭的外壳中可提供减少的压力(例如，大约1毫托耳(m Torr)，其实质上小于大气压力)。
第9图例示依据一个实施的移动处理单元900。在第9图的该实施中，该移动处理单元900包括由接合至电子元件晶圆904的MEMS传感器晶圆902所形成的封装件。在一个实施中，该MEMS传感器晶圆902包含X轴线陀螺仪906、Y轴线陀螺仪908、Z轴线陀螺仪910及XYZ轴线加速度计912，而该电子元件晶圆904则包含CMOS电子元件914及接合垫916。一般而言，该移动处理单元900包含其他类型的传感器，例如，温度传感器(如以下所详细描述的)、或其他类型的传感器。该接合垫916可使用来将该封装件(包括该移动处理单元900)整合至印刷电路板(未显示)或其他装置上。在一个实施中，该MEMS传感器晶圆902是以封闭的密封环918接合至该电子元件晶圆904。
第10图例示依据一个实施的移动处理单元1000的方块图。该移动处理单元1000包含XYZ陀螺仪1002、3轴线加速度计1004、温度传感器1006、微控制器1008、存储器1010(例如，随机存取存储器(RAM))、及电力管理电路1012。该移动处理单元1000的组件可通过数据汇流排1014及控制汇流排1016而耦接在一起。在一个实施中，该电力管理电路1012包含电压调节器及电荷泵，以将能量供应至该微控制器1008。在一个实施中，该电力管理电路1012可个别地关闭该六个传感器的任何一个、或在可忍受较高杂讯下以低电力运作该等传感器之各者。该电力管理电路1012也可响应于该等传感器其本身，以在例如一段预定时间内未感测到移动下，关闭该等传感器(及该微控制器1008)。该移动处理单元1000还包含一个或更多个模拟数字转换器(ADC)(未显示)，用来将该XYZ陀螺仪1002、该3轴线加速度计1004及该温度传感器1006的模拟输出转换成对应的数字信号，该数字信号接着由该微控制器1008所处理。在一个实施中，该模拟数字转换器提供10个位元的解析度(或更高)ADC，以允许与应用处理器的串列化的资讯接口。
如第10图所显示的，(在一个实施中)该温度传感器1006耦接至一个或更多个模拟输入/输出(I/O)线，而该微控制器1008则耦接至一个或更多个数字I/O线。在一个实施中，该微控制器1008可针对接收自如应用规定所要求的一个或更多个该XYZ陀螺仪1002、该3轴线加速度计1004、或该温度传感器1006中的数字信号实施计算。除了含有该MEMS及温度传感器外，该移动处理单元1000可含有可编程的数字取样系统，该数字取样系统将ADC及弹性的过滤(flexible filtering)予以结合，以符合不同应用的各种频宽、解析度及电力需求。此外，该移动处理单元1000可包含一个或更多个使用者可编程的暂存器(未显示)，通过该暂存器，使用者可设定运作状态，包含例如，该移动处理单元1000中每个传感器及/或该微控制器的测量界限。
第11图例示依据一个实施的移动处理单元1100的方块图。该移动处理单元1100包含两个模块，即模块1102、1104，每个模块皆可分别耦接至该移动处理单元1100。在模块1102、1104两者是耦接至该移动处理单元1100的实施中，该移动处理单元1100可提供高达6条轴线的感测。特别是，(在一个实施中)该模块1102提供由一个Z陀螺仪1106及3轴线(XYZ)加速度计1108所致能的4轴线测量能力，而该模块1104则通过X陀螺仪1110及Y陀螺仪1112而提供2轴线测量能力。该Z陀螺仪1106检测绕着该Z轴线的旋转，而该3轴线加速度计1108则检测沿着该X、Y、Z轴线的线性加速度。
在一个实施中，相关于该Z陀螺仪1106的保证质量(proof mass)是静电性地共振振荡。内部自动增益控制电路(未显示)可精确地控制该保证质量的该振荡。当该Z陀螺仪1106绕着该Z轴线转动时，地球自转(the Coriolis)造成振动，可由电容化检测器(capacitive pickoff)加以检测。该产生的信号被放大、解调制及过滤、以产生正比于该角速度的模拟电压。在一个实施中，该3轴线加速度计1108由三个具有个别保证质量的独立线性加速度计所组成，因此最小化交错轴线耦合(cross-axis coupling)，并减少制作相依性。一内置的内部振荡器(未显示)可用于以电容化地读取任何加速度移动。在运作中，加速度引发于给定保证质量上的位移。在一个实施中，静电性传感器差别化地检测每个保证质量的位移，因此减少对该制作变异以及热漂移的感受性(susceptibility)。
在一个实施中，该模块1102、1104是实施(例如垂直接合)在相同的CMOS基板上-例如，该MEMS晶圆及CMOS电子元件晶圆可使用如共同拥有的第7,104,129号美国专利案(并入于以上的参考文件中)中所描述的晶圆级接合程序而接合在一起，该晶圆级接合程序同时提供电性连接及封闭地密封该MEMS装置。此独特及新颖的制作技术为实现在非常小及经济的封装件中设计及制造高性能、多轴线、内部传感器的关键技术。该晶圆级的整合可最小化寄生电容，故允许相关于离散(discrete)的解决方案的改进信号杂讯比。这种晶圆级的整合也致能并入更多的特征集(feature set)，此可最小化外部放大作用的需求。
如第11图所显示的，在一个实施中，该移动处理单元1100通过SPI或I2C汇流排1116而与微处理器(或应用处理器1114)介接。该移动处理单元1100也可通过该SPI或I2C汇流排1116而耦接至存储器(例如，应用存储器1118)。该I2C或SPI汇流排1116也可用来存取内部暂存器(例如，内部暂存器1120)及传感器输出。在一个实施中，该模块1102控制传感器组件间的所有通讯。在一个实施中，该模块1102包含用于暂存器的内部存储器(未显示)，以控制该功能并储存用于该传感器的消减值(trim value)。如果需要额外的存储器，则可能增加与I2C汇流排相容的存储器至该模块1102的系统汇流排1122内。
在一个实施中，该模块1102具有7个模拟输入(其系由多工器(MUX)1124所接收)，用来介接辅助的传感器。如第11图所显示的，该7个模拟输入中的3个是用来与该模块1104介接，而该剩余的模拟输入则是用以通过信号调节电路(signal conditioning circuit)1130而与其他的传感器(例如，地磁传感器(geomagnetic sensor)1126(或罗盘)及气压计(barometer)1128(例如，用于读取高度))介接。在一个实施中，该模拟输入的电压范围是0.7V加减0.5V。该信号调节电路1130将该地磁传感器1126的输出电压范围调整至该多工器1124可处理的电压位准。
在一个实施中，每个传感器(例如，Z陀螺仪1106及XYZ加速度计1108)皆有专属的14位元精确度的三角积分(sigma-delta)模拟数字转换器(ADC)。此外，也有额外的模拟数字转换器(ADC)耦接至该多工器1124，以转换该辅助模拟输入和来自于温度传感器1132的模拟输出。在一个实施中，该温度传感器1132测量该模块1102的温度。该模块1104也可包含测量该模块1104的温度的温度传感器(例如，温度传感器1134)。该温度读数可通过SPI/I2C接口1136而为使用者所用。在一个实施中，该辅助输入的电压位准的范围是0.7加减0.5V(或0.2V至1.2V)。该ADC(耦接至该多工器1124)可取样该选择的模拟输入或该温度传感器1132的该输出，视该多工器1124的组构而定。该结果可储存在可经由该SPI/I2C接口1136存取的适当的暂存器内。在一个实施中，使用内部时钟来触发ADC转换，该时钟率或该输出数据率可由组构暂存器来加以选择。
该模块1102可还包含电力管理电路1138及校准电路1140，该电力管理电路1138可控制至该等传感器之各者的电力，而该校准电路1140用来校准该等传感器之各者。在一个实施中，该模块1102也包含中断逻辑1142，用来产生中断。举例来说，中断可于在该XYZ加速度计1108之所有轴线上均检测到”零-g”时产生，中断也可在使用者可编程事件发生时产生。使用者可编程事件可包含或结合来自于该XYZ加速度器1108的特定加速度值或来自于该Z陀螺仪1106的特定速率值。中断的来源可通过该SPI/I2C接口1106而确定。
第12图例示依据一个实施的第11图的该移动处理单元1102的晶粒布局1200。在一个实施中，该晶粒布局1200具有大约为1.4mmx2.7mm的尺寸。特定而言，该晶粒布局1200显示Z陀螺仪1202及XYZ加速度计(其包含X加速度计1204、Y加速度计1206及Z加速度计1208)的布局。
第13A至13E图例示移动处理单元的不同实施。除了显示于第13A至13E图的那些，其他的实施和组构亦可基于应用要求而实施。特别是，第13A图例示包含微处理器的模块1102的一个实施，第13B图例示包含微处理器及应用RAM的模块1102的一个实施，第13C图例示包含模块1104的所有传感器(第11图)的模块1102的一个实施，在第13C图的实施中，所有的传感器是形成在相同的基板上，第13D图例示还包含辅助传感器(例如，地磁传感器、气压计、及温度传感器)的模块1102的一个实施，第13E图例示包含无线通讯埠的模块1102的一个实施，该无线通讯埠可运作以发送及接收无线通讯。
移动处理单元的不同应用及以上所描述的模块的其他实施此时将予以描述。
光学图像稳定
在一个实施中，双轴线或三轴线陀螺仪可与计算单元(例如，微控制器)以及ADC相结合，以形成光学图像稳定系统。该计算单元可输出位置补偿值，该位置补偿值是藉由高通滤波(high-pass filtering)、积分、及缩放来自于该陀螺仪的输出而确定。该位置补偿值可用来确定例如照像系统的镜片或图像传感器的位置，以允许于静态图像或视讯撷取期间补偿手振(hand jitter)。在一个实施中，该计算单元可载入缩放因数，该缩放因数对应于每度的像素的数目。该缩放因数可随着该照像系统的变焦(zoom)而改变。此外，该光学图像稳定系统可还包含驱动器，用来驱动能补偿于图像撷取期间所发生的手振的致动器。在一个实施中，该光学图像稳定系统接收来自于位置传感器的输入，该位置传感器确定该致动器现在的位置。该位置传感器可包括霍尔效应(Hall effect)传感器或远红外线传感器。在此案例中，该计算单元也可提供控制系统，以使用来自于该位置传感器的回馈，即时控制该致动器的位置。对该位置传感器的输入可包含放大器、差动放大器、该等放大器的模拟偏移补偿、及ADC。
电子图像稳定
在一个实施中，计算单元可设计用来计算应用于视讯的电子图像稳定的资讯。在这种实施中，该计算单元可载入缩放因数，该缩放因数对应于每度的像素的数目。该缩放因数可随着该照像系统的变焦而改变。
在一个实施中，该计算单元可使用来计算应用于静态图像稳定的资讯，例如，使用连结至机械快门(shutter)或帧有效线(frame valid line)的同步引脚(synchronization pin)，该计算单元可确定曝光时间的开始及结束时间。在曝光时间的期间，该计算单元将该陀螺仪的资讯予以积分，以产生确定该图像的模糊特性(blur characteristics)的点散布函数(point spread function)。
温度补偿
在一个实施中，该计算单元可使用来为该移动传感器提供温度补偿。此可藉由读取与该移动传感器相关的温度传感器的温度、及使用例如厂商校准过的关系来调整偏差或缩放因数之方式来作成。这些关系可以是线性的或多项式的，并且可从查找表(look-up table)推衍出来。在一个实施中，当厂商校准的成本太高时，或当该温度关联性已知会随着时间而改变时，该计算单元可于该移动传感器已知为不移动时，藉由更新温度与移动传感器参数间之关系而调整该关系。此于该移动传感器在含有正在充电的电池的装置中特别有效，因为该传感器将会暴露于一系列不同的温度，使该温度关系得以更新。
移动感测
在一个实施中，该传感器可能与确定给定传感器何时会不移动的内置逻辑(例如，计算单元)相耦接。此可藉由测量该信号的振幅达数秒的期间以作成。如果该传感器不是正在移动，则该信号的振幅会对应于该传感器的该测量杂讯。在陀螺仪的案例中，陀螺仪的偏差此时可设定成零。在一个实施中，如果检测到移动，则该计算单元(包含该整个模块)可在该模块由电池提供电力之情况下，降低电力的提供。此外，该临界值可转化(inverted)并且可用来确定该传感器何时已被选上。对于具有陀螺仪及加速度计两者的模块而言，也许想要于该传感器确定没有移动呈现时降低提供至该陀螺仪的电力。在这种实施中，该加速度计可仍维持电力供应，并且用来确定移动何时会再出现，以及该陀螺仪于何时会再次开启。在一个实施中，可编程无感区(dead zone)可用来于该模块(或包含该模块的驱动器)没有移动的非常快时，减轻漂移的效应。一般而言，该内置的逻辑用以分析来自于传感器的资讯，并实施预定的计算-例如，确定该模块的方位。
在一个实施中，该计算单元可积分该陀螺仪资讯，以提供角位置的计算。该积分可包含重置功能及偏差校正，以作为输入。在一个实施中，可使用感测性调整功能，其中，该计算单元使用线性或多项式转换、或查找表，运作于具有预定功能的该陀螺仪的感测性。如此允许该装置得以用不同的方式对待慢移动及快移动。在一个实施中，峰值检测(peak detection)可使用来确定该传感器信号中的突波(spike)的时间及振幅。此可用于藉由测量突波间之时间来形成步数器(pedometer)，其亦可藉由将突波分开于不同的传感器轴线并将他们映射至不同的触发器，以用来提供输入触发器。在一个实施中，当陀螺仪与加速度器结合时，计算单元可使用来确定该装置何时掉落(dropped)。举例来说，在一个应用中，硬碟头可解开(disengaged)，以防止于检测到膝上型电脑或硬碟已经掉落时对该硬碟上的该数据的损坏。可分析该加速度计以确定自由掉落(freefall)何时发生。由于自由掉落于明显的向心性加速度呈现时很难确定，因此，可使用该陀螺仪资讯来补偿这种向心性加速度。
在一个实施中，该计算单元可包含动作辨识引擎，其中，查找表填满与特定动作有关联的资讯、而该移动传感器信号被分析以确定何时及那些动作已经发生。在一个使用陀螺仪及加速度计的实施中，该陀螺仪及加速度计资讯可予以混合，以提供较佳的方位传感器。可藉由测量肇因于重力的加速度，以使用该加速度计资讯作为倾斜传感器。可使用这种加速度数据来更新该陀螺仪的偏差，以减低该陀螺仪漂移。在一个实施中，该陀螺仪及加速度计资讯可予以混合，以提供3级自由度方位传感器，其使用例如卡尔曼滤波器(Kalman filter)或互补式滤波器。该计算单元会输出使用例如欧拉角(Euler angle)、旋转矩阵或四元数(quaternion)的方向及角速度。在一个实施中，可使用该陀螺仪与加速度计资讯的结合来提供重力的方向的更精确的测量。此资讯可从该加速度计资讯减去，以提供线性及向心性加速度，其可被整合以提供位置。在一个实施中，该计算单元可将磁场作为输入，该磁场传感器数据可与其他的移动传感器资讯混合，以提供先进的罗盘系统或其他方向(direction-based)的系统。
在一个实施中，该装置可与GPS模块结合以用来辅助导航。在具有定位的服务的行动装置中，GPS是使用来追踪位置，但在都市环境(urban setting)中并不可靠。可使用陀螺仪来追踪航向，并可使用加速度计来确定重力的方向及该导航装置的线性加速度。对于行人导航系统而言，可使用加速度计资讯来估计步数及步长。
在一个实施中，可选择外部磁性罗盘与该内部惯性传感器结合。在此案例中，可使用加速度计及陀螺仪来测量俯仰(pitch)及侧滚(roll)，以求得更精确的指引。对于时间测量的高精确性而言，外部引脚可取样出自GPS信号的时钟信号，以使不具有紧密时序控制的还杂系统能有精确的同步性。
包含陀螺仪及模拟数字转换器(ADC)的模块的不同实施已经加以描述。然而，可对该等实施作不同的修正。举例来说，以上讨论的模块可利用在除了图像稳定应用的其他应用中(例如，在双筒望远镜、摄远镜片或数字相机中)。以上讨论的该模拟数字转换器可提供除了16位元解析度的其他位元解析度。此外，关于第9图的移动处理单元900，该X轴线陀螺仪906及该Y轴线陀螺仪908可藉由并入双轴线测量陀螺仪及以另一种类型的传感器元件(例如，压力传感器或磁性传感器、或共振器及或麦克风)取代该自由的方块，而结合成一个单元。全球定位系统(GPS)接收器、天线及放大器可整合至封装件中，以创造具有航位推算(dead-reckoning)的完全整合的AGPS(Assisted GPS)。因此，可在不悖离本发明的范畴下作出许多修正。

Claims (21)

1.一种可操作以被安装至面板的表面上的惯性测量单元(IMU)，该惯性测量单元包括：
3轴线线性加速度计，该3轴线线性加速度计可操作以提供第一测量输出，该第一测量输出对应于三轴线的线性加速度的测量，其中，该三轴线互相垂直且该3轴线线性加速度计配置在一个平面上，其中，该3轴线线性加速度计形成在第一基板上；
3轴线陀螺仪，该3轴线陀螺仪可操作以提供第二测量输出，该第二测量输出对应于绕着三轴线的旋转的测量，其中，该三轴线互相垂直且该3轴线陀螺仪配置在该平面上，其中，该3轴线陀螺仪形成在该第一基板上；以及
专用集成电路(ASIC)，可操作以接收来自于该3轴线线性加速度计的该第一测量输出及来自于该3轴线陀螺仪的该第二测量输出，其中，该专用集成电路包括模拟数字转换器(ADC)且包含微控制器及耦接至该微控制器的存储器，其中，该微控制器接收和处理来自该3轴线线性加速度计和该3轴线陀螺仪的数据以追踪空间中的移动，且该专用集成电路是实施在第二基板上，其中，该第一基板是垂直地接合至该第二基板，且该第一基板实质上与该第二基板平行，以及该第一基板电性连接至该第二基板以形成单一半导体芯片。
2.如权利要求1所述的惯性测量单元，其中，该第一和第二基板包括电子元件晶圆和MEMS传感器晶圆。
3.如权利要求1所述的惯性测量单元，其中，该第一基板是机械地且封闭地接合至该第二基板。
4.如权利要求1所述的惯性测量单元，其中，该模拟数字转换器(ADC)可操作以将该第一测量输出及该第二测量输出从模拟信号转换成对应的数字信号。
5.如权利要求1所述的惯性测量单元，还包括内置逻辑，该内置逻辑用来分析来自于该3轴线加速度计及该3轴线陀螺仪的数据。
6.如权利要求5所述的惯性测量单元，其中，该内置逻辑用以确定该惯性测量单元的方位。
7.如权利要求5所述的惯性测量单元，其中，该内置逻辑用以检测旋转移动或线性移动，并确定该旋转移动或该线性移动的轴线。
8.如权利要求5所述的惯性测量单元，其中，该内置逻辑包含可编程的中断的系统，该中断的系统允许使用者确定哪种类型的移动应提供中断。
9.如权利要求8所述的惯性测量单元，其中，该内置逻辑能够由该使用者修正来检测线性移动或旋转移动，以响应于在预定时间期间该线性移动或该旋转移动超过预定临界值，其中，该预定临界值及该预定时间期间能够由该使用者编程。
10.如权利要求5所述的惯性测量单元，其中，该内置逻辑还用以检测何时该惯性测量单元的移动低于预定临界值，并响应于该惯性测量单元的该移动低于该预定临界值，来重置该3轴线陀螺仪的偏差。
11.如权利要求1所述的惯性测量单元，还包括第三基板，该第三基板垂直地接合至该第一基板，以将该第一基板密封于封闭的外壳中，该外壳在该第三基板及该第二基板之间。
12.如权利要求11所述的惯性测量单元，还包括接合垫，该接合垫用来将该惯性测量单元接合至印刷电路板上。
13.如权利要求1所述的惯性测量单元，其中，该微控制器可操作以接收来自于该模拟数字转换器的该数字信号，并处理该数字信号。
14.如权利要求13所述的惯性测量单元，其中，该微控制器可操作以处理该数字信号，包括依据该数字信号或该微控制器实施光学图像稳定计算。
15.如权利要求1所述的惯性测量单元，其中，该专用集成电路(ASIC)还包括与该微控制器进行通讯的脉冲宽度调制器(PWM)，该脉冲宽度调制器可操作以驱动致动器。
16.如权利要求15所述的惯性测量单元，其中，该专用集成电路(ASIC)还包括与该微控制器进行通讯的通讯接口。
17.如权利要求16所述的惯性测量单元，其中，该通讯接口包括串行外围接口(SPI)或集成电路间(I2C)接口。
18.如权利要求17所述的惯性测量单元，其中，该惯性测量单元的封装实质上是6mm x8mm或更少。
19.如权利要求1所述的惯性测量单元，还包括引脚，该引脚用以使移动数据与外部信号同步化，该外部信号为机械快门信号、帧有效信号、GPS时钟信号或外部时序输入信号其中之一。
20.如权利要求1所述的惯性测量单元，其中，该专用集成电路(ASIC)还包括多工器，该多工器可操作以选择性地提供来自于该3轴线线性加速度计的该第一测量输出或来自于一个或更多个对应的第二测量装置的一个或更多个第二测量输出的至少一个，该对应的第二测量装置耦接至该模拟数字转换器。
21.如权利要求20所述的惯性测量单元，其中，该一个或更多个第二测量装置包含一个或更多个陀螺仪、加速度计、位置传感器、气压计、地磁传感器或温度传感器。
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JP2011503522A (ja) 2011-01-27
US8250921B2 (en) 2012-08-28
WO2009009803A3 (en) 2009-02-26
EP2167419A2 (en) 2010-03-31
WO2009009803A2 (en) 2009-01-15
US20120253738A1 (en) 2012-10-04
US20150192416A1 (en) 2015-07-09
US8997564B2 (en) 2015-04-07
CN101801837A (zh) 2010-08-11
US20190226848A1 (en) 2019-07-25

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