JP4238724B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4238724B2 JP4238724B2 JP2003430049A JP2003430049A JP4238724B2 JP 4238724 B2 JP4238724 B2 JP 4238724B2 JP 2003430049 A JP2003430049 A JP 2003430049A JP 2003430049 A JP2003430049 A JP 2003430049A JP 4238724 B2 JP4238724 B2 JP 4238724B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Description
図1に本発明の第1実施形態に係る半導体装置の断面構造を示し、図2に本発明の第1実施形態に係る半導体装置を収納するパッケージを含めた全体図を示す。
図3に本発明の第2実施形態に係る半導体装置の断面構造を示し、図4に図3におけるA―A’線矢視図を示す。また、図5に本発明の第2実施形態に係るセンサ基板の製造方法を示す。
図6に本発明の第3実施形態に係る半導体装置の断面構造を示す。
図7に本発明の第4実施形態に係る半導体装置の断面構造を示す。
図8に本発明の第5実施形態に係る半導体装置の断面構造を示す。
図9に本発明の第6実施形態に係る半導体装置の断面構造を示す。
尚、本発明は、上記各実施形態に限られるものではなく、様々な態様に適用可能である。
Claims (4)
- 第1の半導体層(2a)上に絶縁層(2b)を介して第2の半導体層(2c)を積層してなる積層体と、前記第2の半導体層(2c)に形成され力学量の印加に応じて変位可能な可動部(MV)とを有し、該可動部の変位を電気信号に変換して出力するセンサ基板(2)と、
第1の半導体層(1a)上に絶縁層(1b)を介して第2の半導体層(1c)を積層してなる積層体を有し、前記センサ基板(2)の前記第2の半導体層(2c)に対向して配設され、前記センサ基板(2)との前記電気信号の授受を、前記可動部(MV)の周囲に配設されたバンプ(11)を通じて行う対向基板(1)と、を備えた半導体装置において、
前記センサ基板(2)における前記第1の半導体層(2a)及び前記対向基板(1)における前記第1の半導体層(1a)を、前記可動部(MV)を外乱から保護するシールド層として用いたことを特徴とする半導体装置。 - 力学量の印加に応じて変位可能な可動部(MV)を有し、該可動部の変位を電気信号に変換して出力するセンサ基板(2)と、
前記センサ基板(2)に対向して配設され、前記センサ基板(2)との前記電気信号の授受を、前記可動部(MV)の周囲に配設されたバンプ(11)を通じて行う対向基板(1)と、を備えた半導体装置において、
前記センサ基板(2)と前記対向基板(1)のうちの少なくとも一方が、第1の半導体層(1a、2a)上に絶縁層(1b、2b)を介して第2の半導体層(1c、2c)を積層してなる積層体によって構成され、前記第1の半導体層(1a、2a)は前記センサ基板(2)と前記対向基板(1)とが向き合う側と反対の面に配置され、この第1の半導体層(1a、2a)によって前記可動部(MV)を外乱から保護するシールド層が構成されていることを特徴とする半導体装置。 - 前記シールド層の電位をグランド電位にしたことを特徴とする請求項1または2に記載の半導体装置。
- 前記対向基板(1)は、前記センサ基板(2)からの前記電気信号に所定の処理を施す信号処理基板であって、前記センサ基板(2)は前記信号処理基板上に配設されることを特徴とする請求項1ないし3のいずれか1つに記載の半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003430049A JP4238724B2 (ja) | 2003-03-27 | 2003-12-25 | 半導体装置 |
US10/806,274 US6979873B2 (en) | 2003-03-27 | 2004-03-23 | Semiconductor device having multiple substrates |
DE102004014444.3A DE102004014444B4 (de) | 2003-03-27 | 2004-03-24 | Halbleiteranordnung mit mehreren Substraten |
US11/268,524 US7466000B2 (en) | 2003-03-27 | 2005-11-08 | Semiconductor device having multiple substrates |
US12/292,068 US8519493B2 (en) | 2003-03-27 | 2008-11-12 | Semiconductor device having multiple substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003088934 | 2003-03-27 | ||
JP2003430049A JP4238724B2 (ja) | 2003-03-27 | 2003-12-25 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004311951A JP2004311951A (ja) | 2004-11-04 |
JP4238724B2 true JP4238724B2 (ja) | 2009-03-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003430049A Expired - Fee Related JP4238724B2 (ja) | 2003-03-27 | 2003-12-25 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (3) | US6979873B2 (ja) |
JP (1) | JP4238724B2 (ja) |
DE (1) | DE102004014444B4 (ja) |
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JP2003084008A (ja) * | 2001-09-10 | 2003-03-19 | Mitsubishi Electric Corp | 半導体デバイス |
US6919884B2 (en) * | 2002-04-10 | 2005-07-19 | Hon Technology Inc. | Simulated fireplace including electronic display |
JP2004227251A (ja) * | 2003-01-22 | 2004-08-12 | Toshiba Corp | 電子機器 |
WO2005108871A2 (en) * | 2004-05-04 | 2005-11-17 | Flue Sentinel, Inc. | Wireless fireplace damper control device |
US20060099565A1 (en) * | 2004-11-05 | 2006-05-11 | Elite Group, Inc. | Artificial fireplace |
-
2003
- 2003-12-25 JP JP2003430049A patent/JP4238724B2/ja not_active Expired - Fee Related
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2004
- 2004-03-23 US US10/806,274 patent/US6979873B2/en not_active Expired - Lifetime
- 2004-03-24 DE DE102004014444.3A patent/DE102004014444B4/de not_active Expired - Fee Related
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2005
- 2005-11-08 US US11/268,524 patent/US7466000B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
US20060055001A1 (en) | 2006-03-16 |
US20090079017A1 (en) | 2009-03-26 |
US20040188782A1 (en) | 2004-09-30 |
DE102004014444A1 (de) | 2004-10-21 |
US8519493B2 (en) | 2013-08-27 |
JP2004311951A (ja) | 2004-11-04 |
US6979873B2 (en) | 2005-12-27 |
US7466000B2 (en) | 2008-12-16 |
DE102004014444B4 (de) | 2018-07-26 |
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