CN101510548B - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
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- CN101510548B CN101510548B CN2009100022194A CN200910002219A CN101510548B CN 101510548 B CN101510548 B CN 101510548B CN 2009100022194 A CN2009100022194 A CN 2009100022194A CN 200910002219 A CN200910002219 A CN 200910002219A CN 101510548 B CN101510548 B CN 101510548B
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Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2008032666A JP5259211B2 (ja) | 2008-02-14 | 2008-02-14 | 半導体装置 |
JP2008032666 | 2008-02-14 | ||
JP2008-032666 | 2008-02-14 |
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Publication Number | Publication Date |
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CN101510548A CN101510548A (zh) | 2009-08-19 |
CN101510548B true CN101510548B (zh) | 2013-10-02 |
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CN2009100022194A Active CN101510548B (zh) | 2008-02-14 | 2009-01-08 | 半导体器件及其制造方法 |
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US (9) | US8008788B2 (zh) |
JP (1) | JP5259211B2 (zh) |
KR (1) | KR101660527B1 (zh) |
CN (1) | CN101510548B (zh) |
TW (2) | TWI470770B (zh) |
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