CN100334706C - 半导体器件以及半导体器件的制造方法 - Google Patents
半导体器件以及半导体器件的制造方法 Download PDFInfo
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- CN100334706C CN100334706C CNB038036231A CN03803623A CN100334706C CN 100334706 C CN100334706 C CN 100334706C CN B038036231 A CNB038036231 A CN B038036231A CN 03803623 A CN03803623 A CN 03803623A CN 100334706 C CN100334706 C CN 100334706C
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- semiconductor chip
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
Description
Claims (7)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP65428/2002 | 2002-03-11 | ||
JP2002065428A JP2003264203A (ja) | 2002-03-11 | 2002-03-11 | 半導体装置の製造方法 |
JP2002350631A JP2004186352A (ja) | 2002-12-03 | 2002-12-03 | 半導体装置及び半導体装置の製造方法 |
JP350631/2002 | 2002-12-03 | ||
PCT/JP2003/002799 WO2003077310A1 (fr) | 2002-03-11 | 2003-03-10 | Dispositif a semi-conducteur et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1630943A CN1630943A (zh) | 2005-06-22 |
CN100334706C true CN100334706C (zh) | 2007-08-29 |
Family
ID=27806961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038036231A Expired - Fee Related CN100334706C (zh) | 2002-03-11 | 2003-03-10 | 半导体器件以及半导体器件的制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7265035B2 (zh) |
KR (1) | KR100638760B1 (zh) |
CN (1) | CN100334706C (zh) |
AU (1) | AU2003211888A1 (zh) |
TW (1) | TWI225279B (zh) |
WO (1) | WO2003077310A1 (zh) |
Families Citing this family (56)
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JP3933118B2 (ja) * | 2003-10-02 | 2007-06-20 | ソニー株式会社 | 半導体装置の製造方法および半導体装置の製造装置 |
JP2006054390A (ja) * | 2004-08-16 | 2006-02-23 | Toshiba Corp | ウェハの製造方法および半導体装置の製造方法 |
US20060121698A1 (en) * | 2004-12-07 | 2006-06-08 | Chih-Ming Hsu | Plastic film and heat-dissipating ring for chip cutting |
JP2006338721A (ja) * | 2005-05-31 | 2006-12-14 | Shinka Jitsugyo Kk | 磁気ヘッドスライダの製造方法 |
CN100565831C (zh) * | 2005-08-31 | 2009-12-02 | 芝浦机械电子株式会社 | 半导体芯片的拾取装置及拾取方法 |
JP2007095780A (ja) * | 2005-09-27 | 2007-04-12 | Oki Electric Ind Co Ltd | 半導体装置製造用治具と半導体装置製造方法 |
JP2007250598A (ja) * | 2006-03-14 | 2007-09-27 | Renesas Technology Corp | 半導体装置の製造方法 |
US7456498B2 (en) * | 2006-08-18 | 2008-11-25 | Lsi Logic Corporation | Integrated circuit package and system interface |
JP4693805B2 (ja) * | 2007-03-16 | 2011-06-01 | 株式会社東芝 | 半導体装置の製造装置及び製造方法 |
JP5196838B2 (ja) * | 2007-04-17 | 2013-05-15 | リンテック株式会社 | 接着剤付きチップの製造方法 |
US7749810B2 (en) * | 2007-06-08 | 2010-07-06 | Analog Devices, Inc. | Method of packaging a microchip having a footprint that is larger than that of the integrated circuit |
TWI463580B (zh) * | 2007-06-19 | 2014-12-01 | Renesas Electronics Corp | Manufacturing method of semiconductor integrated circuit device |
JP4864816B2 (ja) * | 2007-06-19 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
US20090008032A1 (en) * | 2007-07-03 | 2009-01-08 | Assembleon B.V. | Method for picking up a component as well as a device suitable for carrying out such a method |
NL1034087C2 (nl) * | 2007-07-03 | 2009-01-06 | Assembleon Bv | Werkwijze voor het opnemen van een component alsmede inrichting geschikt voor het uitvoeren van een dergelijke werkwijze. |
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JP5122893B2 (ja) * | 2007-09-14 | 2013-01-16 | 株式会社ディスコ | デバイスの製造方法 |
MY150953A (en) * | 2008-11-05 | 2014-03-31 | Esec Ag | Die-ejector |
MY155371A (en) * | 2008-11-12 | 2015-10-15 | Esec Ag | Method for detaching and removing a semiconductor chip from a foil |
WO2011036751A1 (ja) * | 2009-09-24 | 2011-03-31 | 株式会社 東芝 | 電子機器および損傷検出方法 |
CN102044404B (zh) * | 2009-10-12 | 2015-12-09 | 桑迪士克科技公司 | 用于使经切分的半导体裸片与裸片贴胶带分离的系统 |
JP2011216529A (ja) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | 半導体装置の製造方法 |
KR101083346B1 (ko) * | 2010-12-09 | 2011-11-15 | 주식회사 이노비즈 | 엘이디 칩 검사장치 |
DE102011087388A1 (de) * | 2011-02-17 | 2012-08-23 | Semikron Elektronik Gmbh & Co. Kg Ip-Department | Vorrichtung und Verfahren zur Abnahme mindestens eines chipförmigen Halbleiterbauelements von einer Folie |
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JP5805411B2 (ja) | 2011-03-23 | 2015-11-04 | ファスフォードテクノロジ株式会社 | ダイボンダのピックアップ方法およびダイボンダ |
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JP5472275B2 (ja) * | 2011-12-14 | 2014-04-16 | 株式会社村田製作所 | エキスパンド装置及び部品の製造方法 |
CN103219224B (zh) * | 2012-01-20 | 2016-03-09 | 陈志豪 | 具有环保加工的晶圆制造工艺 |
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CN103208451B (zh) * | 2013-03-15 | 2015-10-28 | 日月光半导体制造股份有限公司 | 芯片顶起的方法及模块 |
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JP6301203B2 (ja) * | 2014-06-02 | 2018-03-28 | 株式会社ディスコ | チップの製造方法 |
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KR102366826B1 (ko) * | 2020-03-06 | 2022-02-24 | 세메스 주식회사 | 다이 이젝터 및 이를 포함하는 다이 본딩 장치 |
KR20220100149A (ko) * | 2021-01-07 | 2022-07-15 | 삼성디스플레이 주식회사 | 표시 장치의 제조장치 및 표시 장치의 제조방법 |
US11955355B2 (en) * | 2021-02-25 | 2024-04-09 | Applied Materials, Inc. | Isolated volume seals and method of forming an isolated volume within a processing chamber |
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- 2003-03-05 TW TW092104711A patent/TWI225279B/zh not_active IP Right Cessation
- 2003-03-10 US US10/503,972 patent/US7265035B2/en not_active Expired - Fee Related
- 2003-03-10 KR KR1020047012278A patent/KR100638760B1/ko not_active IP Right Cessation
- 2003-03-10 CN CNB038036231A patent/CN100334706C/zh not_active Expired - Fee Related
- 2003-03-10 AU AU2003211888A patent/AU2003211888A1/en not_active Abandoned
- 2003-03-10 WO PCT/JP2003/002799 patent/WO2003077310A1/ja active Application Filing
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JPH02230754A (ja) * | 1989-03-03 | 1990-09-13 | Furukawa Electric Co Ltd:The | 粘着シートからの薄膜チップの剥離方法 |
JPH0311649A (ja) * | 1989-06-07 | 1991-01-18 | Nec Yamagata Ltd | 半導体ペレット剥離方法 |
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Also Published As
Publication number | Publication date |
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AU2003211888A1 (en) | 2003-09-22 |
US7265035B2 (en) | 2007-09-04 |
WO2003077310A1 (fr) | 2003-09-18 |
KR100638760B1 (ko) | 2006-10-30 |
CN1630943A (zh) | 2005-06-22 |
KR20040086359A (ko) | 2004-10-08 |
TWI225279B (en) | 2004-12-11 |
TW200306632A (en) | 2003-11-16 |
US20060252233A1 (en) | 2006-11-09 |
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