JP6266167B2 - ダイボンディング装置およびダイボンディング方法 - Google Patents
ダイボンディング装置およびダイボンディング方法 Download PDFInfo
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- JP6266167B2 JP6266167B2 JP2017511792A JP2017511792A JP6266167B2 JP 6266167 B2 JP6266167 B2 JP 6266167B2 JP 2017511792 A JP2017511792 A JP 2017511792A JP 2017511792 A JP2017511792 A JP 2017511792A JP 6266167 B2 JP6266167 B2 JP 6266167B2
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Description
図1は、実施形態に係るダイボンディング装置の模式的な一部切欠側面図である。図2は、図1に示すダイボンディング装置の模式的な平面図である。ダイボンディング装置100は、後述するように、第1部品であるサブマウントに第2部品である半導体レーザ素子のチップ(以下、半導体チップと記載する場合がある)をボンディングし、チップオンサブマウントを製造するものである。
図6は、ガス供給管の他の配置例である配置例1を説明する模式図である。図6に示す配置例1では、ガス供給管7は、加熱ガスGが、ダイボンディング装置100を蓋4側から見た場合に、蓋4の孔4aを避けるような方向に噴射するように設けられている。この配置例1によれば、ガス供給管7から噴射された加熱ガスGは、直線的に孔4aに到達してそこから加熱空間HSの外部に流出せず、加熱空間HS内に長く滞留しやすくなる。その結果、加熱空間HSを効果的に加熱できる。
図8は、コレットの他の構成例を説明する模式図である。図8(a)は側面から見た図であり、図8(b)は、図5と同様に半導体チップとコレットの先端部との関係を説明する模式図である。コレット5Aは、金属からなる本体部5aとポリイミド樹脂からなる先端部5Abとを有しており、先端部5Abの先端面が長方形状である平コレットである。コレット5と同様に、コレット5Aには、先端部5Abの先端面に開口し、真空ポンプに繋がっている吸引孔5Acが形成されている。コレット5Aは、半導体チップCを吸引孔5Acで吸引して真空チャックすることにより、先端部5Abにて半導体チップCを保持可能である。
図9は、蓋の他の構成例を説明する模式図である。孔4Aaを有する蓋4Aは、ステンレス鋼からなる板状部材4A1と、ガラスからなる板状部材4A2とを貼り合わせた2層構造となっている。このように、蓋は、赤外線輻射を反射もしくは吸収・再輻射することができる材料からなる層を含む構成としてもよく、当該材料を含む構成としてもよい。なお、赤外線輻射を反射もしくは吸収・再輻射することができる材料としては、金属、セラミック、各種耐熱樹脂材料およびカーボンの少なくとも一つである。また、蓋は、これらの材料のうち2種以上を含む構成としてもよい。
実施例1として、実施形態に係るダイボンディング装置100の構成においてコレットを平コレットとしたダイボンディング装置を用いて、長さが1mm〜5mmの半導体チップをサブマウントにダイボンディングし、チップオンサブマウントをそれぞれ複数サンプル作製した。一方、比較例として、実施例1のダイボンディング装置の構成において蓋をガラス板としたダイボンディング装置を用いて、長さが1mm〜5mmの半導体チップをサブマウントにダイボンディングし、チップオンサブマウントを複数サンプル作製した。その後、作製したチップオンサブマウントのサブマウントから半導体チップを剥がし、ボンディング状態を確認した。比較例と実施例1の差は蓋の材質のみである。その結果を表1に示す。なお、加熱空間内の温度(予備加熱温度)は100℃〜440℃の間で変更したが、表1では420℃の結果を示している。
1a 載置領域
1b 吸引孔
2 ヒータ
3 側壁
3a、3b 金属板材
4、4A 蓋
4A1、4A2 板状部材
4a、4Aa 孔
5、5A コレット
5b、5Ab 先端部
5c、5Ac、6a 吸引孔
5a 本体部
6 移動機構
7 ガス供給管
8、9 位置調整用アーム
100 ダイボンディング装置
C 半導体チップ
G 加熱ガス
HS 加熱空間
M サブマウント
M1 基板
M2 電極層
M3 ロウ材層
Claims (16)
- 第1部品に第2部品をボンディングするダイボンディング装置であって、
前記第1部品が載置領域に載置される載置台と、
前記載置台の下側に設けられたヒータと、
前記載置台の載置領域を囲むように設けられた側壁と、
前記第1および第2部品が通過可能な大きさの孔を有し、前記側壁に載置される蓋と、
前記第2部品を先端部にて真空チャックすることにより保持可能なコレットと、
前記コレットを、前記コレットが保持した前記第2部品が前記孔を通過して前記第1部品にボンディングされるように移動させる移動機構と、
前記側壁に設けられ、前記側壁と前記蓋とで形成される加熱空間に加熱ガスを供給するガス供給管と、
を備え、
前記蓋は、前記ヒータおよび前記加熱ガスにより生じる赤外線輻射を反射、もしくは吸収・再輻射することができる材料を含むことを特徴とするダイボンディング装置。 - 前記蓋は前記材料からなることを特徴とする請求項1に記載のダイボンディング装置。
- 前記蓋は前記材料からなる層を含むことを特徴とする請求項1に記載のダイボンディング装置。
- 前記材料は、金属、セラミック、耐熱樹脂およびカーボンの少なくとも一つであることを特徴とする請求項1〜3のいずれか一つに記載のダイボンディング装置。
- 前記側壁は多層構造を有することを特徴とする請求項1〜4のいずれか一つに記載のダイボンディング装置。
- 前記ガス供給管は、前記蓋側からみて前記ガス供給管の延長線と前記蓋の孔とが重ならないように延びており、前記加熱ガスが、前記蓋側からみて前記蓋の孔を避けるような方向に噴射するように設けられていることを特徴とする請求項1〜5のいずれか一つに記載のダイボンディング装置。
- 前記ガス供給管は、前記加熱ガスが、前記載置台側に向けて噴射するように設けられていることを特徴とする請求項1〜5のいずれか一つに記載のダイボンディング装置。
- 前記加熱ガスは、不活性ガス、還元性ガス、または不活性ガスと還元性ガスとの混合ガスであることを特徴とする請求項1〜7のいずれか一つに記載のダイボンディング装置。
- 前記コレットは、真空チャックする面積が、前記第2部品が真空チャックされる面の面積よりも小さいことを特徴とする請求項1〜8のいずれか一つに記載のダイボンディング装置。
- 前記コレットは丸コレットであることを特徴とする請求項9に記載のダイボンディング装置。
- 前記コレットの先端部が樹脂からなることを特徴とする請求項1〜10のいずれか一つに記載のダイボンディング装置。
- 前記第2部品は、前記コレットにより保持される側からみて長方形状であり、該長方形の長手方向のサイズが4mm以上であることを特徴とする請求項1〜11のいずれか一つに記載のダイボンディング装置。
- 第1部品に第2部品をボンディングするダイボンディング方法であって、
前記第1部品を載置台の載置領域に載置する載置工程と、
前記第1部品をヒータで加熱する加熱工程と、
前記載置台と、前記載置台の載置領域を囲むように設けられた側壁と、前記第1および第2部品が通過可能な大きさの孔を有し前記側壁に載置される蓋と、で形成される加熱空間に加熱ガスを供給するガス供給工程と、
前記蓋の孔に、コレットで保持した前記第2部品を通過させて前記加熱空間内に導入し、前記第2部品を前記第1部品に接触させてボンディングを行うボンディング工程と、
を含み、
前記蓋は、前記ヒータおよび前記加熱ガスにより生じる赤外線輻射を反射、もしくは吸収・再輻射することができる材料を含むことを特徴とするダイボンディング方法。 - 前記加熱空間内で前記第2部品を第1速度で移動させ、その後、前記第1速度より速い第2速度で前記第2部品を移動させて前記第1部品に接触させることを特徴とする請求項13に記載のダイボンディング方法。
- 前記加熱空間内で前記第2部品を停止させ、その後、前記第2部品を移動させて前記第1部品に接触させることを特徴とする請求項13に記載のダイボンディング方法。
- 前記第2部品は、前記コレットにより保持される側からみて長方形状であり、該長方形の長手方向のサイズが4mm以上であることを特徴とする請求項13〜15のいずれか一つに記載のダイボンディング方法。
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2016
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2017
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