JP6104518B2 - 半導体装置の製造方法、断熱荷重治具及び断熱荷重治具の設置方法 - Google Patents
半導体装置の製造方法、断熱荷重治具及び断熱荷重治具の設置方法 Download PDFInfo
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- JP6104518B2 JP6104518B2 JP2012102954A JP2012102954A JP6104518B2 JP 6104518 B2 JP6104518 B2 JP 6104518B2 JP 2012102954 A JP2012102954 A JP 2012102954A JP 2012102954 A JP2012102954 A JP 2012102954A JP 6104518 B2 JP6104518 B2 JP 6104518B2
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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Description
本発明に係る断熱荷重治具を用いた半導体装置の製造方法の第1実施例を、図1〜図4を参照して説明する。尚、これら図は、本発明を容易に理解するために模式的に示した図面であって、厚さと平面寸法との関係や各層の厚さの比率などは誇張して記載されている。
本発明で使用する高温はんだ接合形成装置の全体の構成を説明する。
次に、図4を参照して、上述した高温はんだ接合装置で用いる断熱荷重治具の設置方法を説明する。
次に、上述した断熱荷重治具11の設置が完了したら、図1のリフロー装置1のチャンバ2aを閉じてリフロー工程を実行する。
図6は、本実施例によって作製した高温はんだ(AuGe)接合半導体装置と、第1従来技術(錘を使わない方法)による高温はんだ接合半導体装置とを比較した典型的なマイクロフォーカス透過X線写真である。正方形に見えているSiCチップの寸法は2×2mm2である。写真上で相対的に白く見えているコントラストが高温はんだ層に内在するボイド(空隙)である。
次に、本発明の第2実施例について説明する。第2実施例は前記第1実施例の断熱荷重治具11の改良に関する発明なので、断熱荷重治具に関する説明のみ行い、他の部分の説明は省略する。
図7は、第2実施例に係る断熱荷重治具31の要部断面を示している。図2と同じ構成要素に対しては、図2と同じ番号を付しているので、冗長を避けるため説明を省略する。符号39は錘支持板、37は棒状の熱絶縁体、36は金属錘である。
次に、図8を参照して高温はんだ接合断熱荷重治具31の設置方法を説明する。
第1実施例と第2実施例の断熱荷重治具では、比較的重量の軽いチップアライメント板や錘支持板、連結柱の上に、重量が重い金属荷重が突き出る構成になっていたため、重心が高くなり、金属錘の重量が重い場合や1枚のSiN基板に金属錘を複数取り付ける場合には、断熱荷重治具やSiN基板12が転倒しないように細心の注意をしなければならない。この性質は、大量生産するときに、サセプタ5がコンベヤのように移動する形態になっている量産装置や、ロボットで断熱荷重治具を設置する量産装置では、コンベヤの速度やロボットのアームの速度を上げられないという難点として現れる。
図10を参照して、本実施例に係る断熱荷重治具の設置方法を説明する。
第1実施例〜第3実施例では、単純化していたので、1個のSiCパワーチップを接合する場合について説明していた。しかし、前記各実施例は1個のパワーチップの接合に限定されるものではなく、複数のチップを接合させる場合でも当然適用可能である。これを証明するために、第4実施例では、第3実施例を複数チップの接合に適用する場合について説明するとともに、生産性を向上させるために断熱荷重治具に改良を施している。断熱荷重治具の構成と断熱荷重治具の設置方法以外は前記実施例と同じなので、説明を省略する。
次に、実施例4に係る断熱荷重治具の設置方法を説明する。尚、本実施例のフローチャートは、図10に示す第3実施例のフローチャートと同じであるため省略する。
上記した第1実施例〜第4実施例の断熱荷重治具では、チップアライメント板の上に連結柱を介して錘支持板を設置する構成になっていたが、連結柱を使用しないで断熱荷重治具を構成することも可能である。第5実施例では、このような構成の断熱荷重治具を提供する。
次に、図13を参照して、実施例5に係る断熱荷重治具の設置方法を説明する。
2a、2b チャンバ
3 排気装置
4 ガス供給装置
5 サセプタ
6 ランプヒータ
7 プログラム制御装置
10 接合試料
11、31、41、45、60 断熱荷重治具
12 SiN基板
13 SiCパワーチップ
14 AuGeはんだ
15a、15b Cu回路板
16、36 金属錘
17、37 熱絶縁体
18、46 チップアライメント板
19、39、47、61 錘支持板
20a、21b、49、50 連結柱
42、62 重心安定化枠
70 熱絶縁体荷重
Claims (18)
- 回路基板と半導体チップとの間に、前記半導体チップの耐熱温度から100℃以下の範囲内に融点または固相線温度を有するはんだ材料を挟み、
前記回路基板に照準させて前記回路基板の上にチップアライメント板を載置して前記チップアライメント板に形成されたチップ貫通口に前記はんだ材料と前記半導体チップとを順に載置し、
前記半導体チップの上部から熱絶縁体を介して荷重を加えた状態で、前記はんだ材料を融解させて固化させることにより、前記回路基板と前記半導体チップとを接合させることを特徴とする半導体装置の製造方法。 - 回路基板と半導体チップとを接合するときに荷重を加える断熱荷重治具であって、
前記回路基板に対するアライメント機能を備え、前記回路基板の所定の位置にはんだ材料と前記半導体チップとを配置するためのチップ貫通口を有するチップアライメント板と、
前記半導体チップの耐熱温度から100℃以下の範囲内に融点または固相線温度を有するはんだ材料と前記半導体チップとを前記チップ貫通口に順に載置して、前記はんだ材料を前記回路基板と前記半導体チップとの間に挟み、前記はんだ材料を挟んだ状態の前記半導体チップの上部に設置される熱絶縁体と、
前記熱絶縁体の上部に設置されて前記はんだ材料を融解させて固化させている間に前記半導体チップに荷重を加える金属荷重と
を備えたことを特徴とする断熱荷重治具。 - 回路基板と半導体チップとを接合するときに荷重を加える断熱荷重治具であって、
前記回路基板に対するアライメント機能を備え、前記回路基板の所定の位置にはんだシートと前記半導体チップとを配置するためのチップ貫通口を有するチップアライメント板と、
前記チップアライメント板から所定距離だけ上方に配置され、前記チップアライメント板又は前記回路基板に対するアライメント機能を備え、前記チップ貫通口の位置に対応した位置に錘貫通口を有する錘支持板と、
前記錘貫通口を貫通して前記半導体チップ上に設置され、前記半導体チップに接して配置される熱絶縁体と前記熱絶縁体の上部に配置される金属荷重とが一体化した熱絶縁体荷重と
を備えたことを特徴とする断熱荷重治具。 - 前記チップアライメント板と前記錘支持板との間を脱着自在で連結する連結柱をさらに備えたことを特徴とする請求項3に記載の断熱荷重治具。
- 前記連結柱は、前記チップアライメント板または前記錘支持板に固定されていることを特徴とする請求項4に記載の断熱荷重治具。
- 前記錘支持板と前記回路基板と前記チップアライメント板の外縁に配置され、内壁が前記錘支持板と前記回路基板と前記チップアライメント板の少なくとも一つと内接する重心安定化枠をさらに備えたことを特徴とする請求項4又は5に記載の断熱荷重治具。
- 前記錘支持板を前記チップアライメント板の上方の所定位置で支持し、前記回路基板と前記チップアライメント板の外縁に配置され、内壁が前記回路基板または前記チップアライメント板の少なくとも一つと内接する重心安定化枠をさらに備えたことを特徴とする請求項3に記載の断熱荷重治具。
- 前記熱絶縁体は、前記半導体チップから前記金属荷重に通じる熱伝導経路において、少なくとも1箇所で細芯構造を備えたことを特徴とする請求項2乃至7のいずれか1項に記載の断熱荷重治具。
- 前記熱絶縁体は、多孔質構造を備えたことを特徴とする請求項2乃至8のいずれか1項に記載の断熱荷重治具。
- 前記熱絶縁体は、前記半導体チップまたは前記金属荷重の少なくとも一方の接触面において粗面構造を備えたことを特徴とする請求項2乃至9のいずれか1項に記載の断熱荷重治具。
- 前記金属荷重は、前記半導体チップのはんだ接合面に少なくとも0.1g/cm2以上の圧力を生じる質量であることを特徴とする請求項2乃至10のいずれか1項に記載の断熱荷重治具。
- 前記金属荷重は、前記半導体チップのはんだ接合面に0.3g/cm2以上の圧力を生じる質量であることを特徴とする請求項11に記載の断熱荷重治具。
- 前記チップアライメント板のチップ貫通口は、上方に向かって広がるように傾斜したテーパ構造を備えていることを特徴とする請求項3乃至12のいずれか1項に記載の断熱荷重治具。
- 前記錘支持板の錘貫通口に、前記錘貫通口と同じ断面を有する鞘構造を付設したことを特徴とする請求項3乃至13のいずれか1項に記載の断熱荷重治具。
- 昇温加熱体サセプタの上に回路基板を載置する工程と、
前記回路基板に照準させて前記回路基板の上にチップアライメント板を載置する工程と、
前記チップアライメント板に形成されたチップ貫通口にはんだシートと半導体チップとを順に載置する工程と、
前記半導体チップの上に熱絶縁体を配置する工程と、
前記チップアライメント板の上方の所定位置に錘支持板を設置する工程と、
前記チップ貫通口に対応した位置に形成された前記錘支持板の錘貫通口を介して金属荷重を前記熱絶縁体上に付設する工程と
を含むことを特徴とする断熱荷重治具の設置方法。 - 前記錘支持板を設置する工程では、連結柱によって前記錘支持板を設置することを特徴とする請求項15に記載の断熱荷重治具の設置方法。
- 前記回路基板及び前記チップアライメント板の外縁に重心安定化枠を設置する工程をさらに含むことを特徴とする請求項15又は16に記載の断熱荷重治具の設置方法。
- 前記回路基板及び前記チップアライメント板の外縁に重心安定化枠を設置する工程をさらに含み、
前記錘支持板を設置する工程では、前記重心安定化枠に前記錘支持板を設置することを特徴とする請求項15に記載の断熱荷重治具の設置方法。
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