CA2264317C - Susceptor for semiconductor manufacturing equipment and process for producing the same - Google Patents
Susceptor for semiconductor manufacturing equipment and process for producing the same Download PDFInfo
- Publication number
- CA2264317C CA2264317C CA002264317A CA2264317A CA2264317C CA 2264317 C CA2264317 C CA 2264317C CA 002264317 A CA002264317 A CA 002264317A CA 2264317 A CA2264317 A CA 2264317A CA 2264317 C CA2264317 C CA 2264317C
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- susceptor
- melting point
- semiconductor manufacturing
- manufacturing equipment
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-049283 | 1998-03-02 | ||
| JP4928398 | 1998-03-02 | ||
| JP11-044544 | 1999-02-23 | ||
| JP04454499A JP4013386B2 (ja) | 1998-03-02 | 1999-02-23 | 半導体製造用保持体およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2264317A1 CA2264317A1 (en) | 1999-09-02 |
| CA2264317C true CA2264317C (en) | 2003-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CA002264317A Expired - Fee Related CA2264317C (en) | 1998-03-02 | 1999-03-02 | Susceptor for semiconductor manufacturing equipment and process for producing the same |
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| Country | Link |
|---|---|
| US (2) | US6423400B1 (https=) |
| EP (1) | EP0940845A3 (https=) |
| JP (1) | JP4013386B2 (https=) |
| KR (1) | KR100554044B1 (https=) |
| CN (1) | CN1163955C (https=) |
| CA (1) | CA2264317C (https=) |
| TW (1) | TW412823B (https=) |
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| JP4529690B2 (ja) * | 2000-01-20 | 2010-08-25 | 住友電気工業株式会社 | 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置 |
| JP4651148B2 (ja) * | 2000-02-29 | 2011-03-16 | 京セラ株式会社 | 耐プラズマ部材及びプラズマ装置 |
| JP2001247382A (ja) | 2000-03-06 | 2001-09-11 | Ibiden Co Ltd | セラミック基板 |
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| JP2001253777A (ja) * | 2000-03-13 | 2001-09-18 | Ibiden Co Ltd | セラミック基板 |
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| EP1233651A1 (en) * | 2000-04-07 | 2002-08-21 | Ibiden Co., Ltd. | Ceramic heater |
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| JP2014507363A (ja) | 2010-12-14 | 2014-03-27 | ヘクサテック,インコーポレイテッド | 多結晶質窒化アルミニウム焼結体の熱膨張処理、および半導体製造へのその応用 |
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| CN102709640A (zh) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 氮化铝陶瓷基板30瓦27dB衰减片 |
| CN102709649A (zh) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 大焊盘氮化铝陶瓷基板100瓦20dB衰减片 |
| KR101616698B1 (ko) | 2015-01-09 | 2016-04-29 | 김이태 | 차량용 냉/온풍 외부 공급 장치 |
| KR20180075667A (ko) * | 2015-11-02 | 2018-07-04 | 컴포넌트 알이-엔지니어링 컴퍼니, 인코포레이티드 | 고온 반도체 프로세싱에서의 클램핑을 위한 정전 척 및 그 제조 방법 |
| KR101762159B1 (ko) * | 2016-02-24 | 2017-08-04 | 엘지전자 주식회사 | 면상 발열장치, 이를 포함하는하는 전기 레인지 및 그 제조방법 |
| JP2017201050A (ja) * | 2016-05-06 | 2017-11-09 | 学校法人早稲田大学 | 圧電体薄膜及びそれを用いた圧電素子 |
| JP2018120978A (ja) * | 2017-01-26 | 2018-08-02 | 株式会社Screenホールディングス | 熱処理装置 |
| US11760694B2 (en) | 2017-10-05 | 2023-09-19 | Coorstek Kk | Alumina sintered body and manufacturing method therefor |
| KR102091251B1 (ko) * | 2018-08-21 | 2020-03-19 | 엘지전자 주식회사 | 전기 히터 |
| KR102026277B1 (ko) * | 2019-01-22 | 2019-09-27 | 강릉원주대학교산학협력단 | 질화알루미늄 판재의 제조방법 |
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| JP2022142151A (ja) * | 2021-03-16 | 2022-09-30 | 株式会社巴川製紙所 | セラミック膜およびその製造方法、静電チャック装置およびその製造方法 |
| JP2022142421A (ja) * | 2021-03-16 | 2022-09-30 | 株式会社巴川製紙所 | 静電チャック装置およびその製造方法 |
| JP7836151B2 (ja) * | 2021-03-31 | 2026-03-26 | 日本特殊陶業株式会社 | 支持部材、基板保持部材、およびその製造方法 |
| JP7777008B2 (ja) * | 2022-03-03 | 2025-11-27 | 株式会社巴川コーポレーション | 静電チャック装置 |
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| CN116276736B (zh) * | 2023-05-23 | 2023-09-01 | 宁波永灵航空科技有限公司 | 一种航空蜂窝板的定位工装及其使用方法 |
| DE102023113513A1 (de) * | 2023-05-24 | 2024-11-28 | Rogers Germany Gmbh | Metall-Keramik-Substrat und Verfahren zur Herstellung eines Metall-Keramik-Substrats |
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| CN120600375B (zh) * | 2025-05-30 | 2025-12-12 | 郑州中瓷科技有限公司 | 一种静电卡盘专用导电浆料及其制备方法和应用 |
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-
1999
- 1999-02-23 JP JP04454499A patent/JP4013386B2/ja not_active Expired - Fee Related
- 1999-03-01 TW TW088103074A patent/TW412823B/zh not_active IP Right Cessation
- 1999-03-02 US US09/260,003 patent/US6423400B1/en not_active Expired - Lifetime
- 1999-03-02 CA CA002264317A patent/CA2264317C/en not_active Expired - Fee Related
- 1999-03-02 CN CNB991024710A patent/CN1163955C/zh not_active Expired - Lifetime
- 1999-03-02 EP EP99301559A patent/EP0940845A3/en not_active Withdrawn
- 1999-03-02 KR KR1019990006817A patent/KR100554044B1/ko not_active Expired - Fee Related
-
2002
- 2002-06-12 US US10/166,778 patent/US6770379B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1227968A (zh) | 1999-09-08 |
| US6423400B1 (en) | 2002-07-23 |
| KR100554044B1 (ko) | 2006-02-22 |
| EP0940845A3 (en) | 2000-12-13 |
| US6770379B2 (en) | 2004-08-03 |
| CN1163955C (zh) | 2004-08-25 |
| EP0940845A2 (en) | 1999-09-08 |
| KR19990077529A (ko) | 1999-10-25 |
| JP4013386B2 (ja) | 2007-11-28 |
| JP2000058631A (ja) | 2000-02-25 |
| TW412823B (en) | 2000-11-21 |
| CA2264317A1 (en) | 1999-09-02 |
| US20030066587A1 (en) | 2003-04-10 |
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