BR112014002504B8 - Liga de solda com alta tenacidade ao impacto, junta soldada e uso da liga - Google Patents

Liga de solda com alta tenacidade ao impacto, junta soldada e uso da liga

Info

Publication number
BR112014002504B8
BR112014002504B8 BR112014002504A BR112014002504A BR112014002504B8 BR 112014002504 B8 BR112014002504 B8 BR 112014002504B8 BR 112014002504 A BR112014002504 A BR 112014002504A BR 112014002504 A BR112014002504 A BR 112014002504A BR 112014002504 B8 BR112014002504 B8 BR 112014002504B8
Authority
BR
Brazil
Prior art keywords
weight
alloy
high impact
welded joint
solder alloy
Prior art date
Application number
BR112014002504A
Other languages
English (en)
Other versions
BR112014002504A2 (pt
BR112014002504B1 (pt
Inventor
Pandher Ranjit
Sinch Bawa
Sarkar Siuli
Chegudi Sujatha
k n kumar Anil
Chattopadhyay Kamanio
Lodge Dominic
De Avila Ribas Morgana
Original Assignee
Alpha Assembly Solutions Inc
Alpha Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Assembly Solutions Inc, Alpha Metals filed Critical Alpha Assembly Solutions Inc
Publication of BR112014002504A2 publication Critical patent/BR112014002504A2/pt
Publication of BR112014002504B1 publication Critical patent/BR112014002504B1/pt
Publication of BR112014002504B8 publication Critical patent/BR112014002504B8/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)

Abstract

LIGA DE SOLDA COM ALTA TENACIDADE AO IMPACTO. A presente invenção propõe uma liga, de preferência uma liga de solda isenta de chumbo, que compreende: de 35% a 59% em peso de Bi; de 0% a 1,0% em peso de Ag; de 0% a 1,0% em peso de Au; de 0% a 1,0% em peso de Cr; de 0% a 2,0% em peso de In; de 0% a 1,0% em peso de P; de 0% a 1,0% em peso de Sb; de 0% a 1,0% em peso de Sc; de 0% a 1,0% em peso de Y; de 0% a 1,0% em peso de Zn; de 0% a 1,0% em peso de elementos terra-rara; um ou mais dentre: de mais que 0% a 1,0% em peso de Al; de 0,01% a 1,0% em peso de Ce; de mais que 0% a 1,0% em peso de Co; de mais que 0% a 1,0% em peso de Cu; de 0,001% a 1,0% em peso de Ge; de mais que 0% a 1,0% em peso de Mg; de mais que 0% a 1,0% em peso de Mn; de 0,01% a 1,0% em peso de Ni; e de mais que 0% a 1,0% em peso de Ti, e o Sn de balanceamento, junto com quaisquer impurezas inevitáveis.
BR112014002504A 2011-08-02 2012-08-02 Liga de solda com alta tenacidade ao impacto, junta soldada e uso da liga BR112014002504B8 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161514303P 2011-08-02 2011-08-02
US61/514,303 2011-08-02
PCT/GB2012/051874 WO2013017883A1 (en) 2011-08-02 2012-08-02 High impact toughness solder alloy

Publications (3)

Publication Number Publication Date
BR112014002504A2 BR112014002504A2 (pt) 2017-03-14
BR112014002504B1 BR112014002504B1 (pt) 2022-09-20
BR112014002504B8 true BR112014002504B8 (pt) 2023-01-31

Family

ID=46826858

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014002504A BR112014002504B8 (pt) 2011-08-02 2012-08-02 Liga de solda com alta tenacidade ao impacto, junta soldada e uso da liga

Country Status (13)

Country Link
US (8) US20140219711A1 (pt)
EP (3) EP2739432B1 (pt)
JP (1) JP6072032B2 (pt)
KR (4) KR102294936B1 (pt)
CN (4) CN110142528A (pt)
BR (1) BR112014002504B8 (pt)
CA (1) CA2843509A1 (pt)
MX (1) MX2014001248A (pt)
MY (1) MY186516A (pt)
PL (1) PL2739432T3 (pt)
RU (1) RU2014107836A (pt)
SI (1) SI2739432T1 (pt)
WO (1) WO2013017883A1 (pt)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI535043B (zh) * 2011-06-29 2016-05-21 國立屏東科技大學 以活性焊料製做的太陽能電池電極及其方法
KR101941831B1 (ko) * 2013-04-18 2019-01-23 센주긴조쿠고교 가부시키가이샤 땜납 조인트 및 기판
CN103273219B (zh) * 2013-06-28 2015-04-15 深圳市富维德电子科技有限公司 一种锡银铜镍焊料及其制备方法
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
CN103406686A (zh) * 2013-08-08 2013-11-27 江苏科技大学 一种含钴Sn-Bi系高强度无铅低温焊料
CN103521762B (zh) * 2013-10-25 2015-10-28 天津大学 用于提高双相钢激光焊焊缝韧性的合金粉末及其应用方法
WO2015103362A1 (en) * 2013-12-31 2015-07-09 Alpha Metals, Inc. Rosin-free thermosetting flux formulations
EP3172349A2 (en) * 2014-07-21 2017-05-31 Alpha Assembly Solutions Inc. Low temperature high reliability tin alloy for soldering
WO2016185673A1 (ja) * 2015-05-20 2016-11-24 日本電気株式会社 はんだ合金
TWI563517B (en) * 2015-05-22 2016-12-21 Chuan Hsi Res Co Ltd Conductive paste composition, conductive structure and method of producing the same
CN104889594B (zh) * 2015-06-08 2017-07-11 哈尔滨工业大学 低温超声SnBi基钎料及其制备方法，及其超声钎焊陶瓷和/或陶瓷基复合材料的方法
CN105171267B (zh) * 2015-07-21 2017-12-01 重庆永林机械设备有限公司 无铅焊料及其制备方法和应用
CN105014254B (zh) * 2015-07-30 2017-07-11 苏州宇邦新型材料股份有限公司 一种光伏焊带用耐腐蚀低温焊料及其制备方法
CN105014255B (zh) * 2015-08-11 2017-03-01 哈尔滨职业技术学院 SnBiNi低温无铅钎料的制备方法
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
CN105215569A (zh) * 2015-10-30 2016-01-06 苏州优诺电子材料科技有限公司 一种无铅焊料合金
CN105269172B (zh) * 2015-11-05 2017-07-28 广东轻工职业技术学院 一种环保焊料合金焊锡膏
CN105583547A (zh) * 2016-03-11 2016-05-18 深圳市同方电子新材料有限公司 一种SnBi系无铅焊料及其制备方法
JP6730833B2 (ja) * 2016-03-31 2020-07-29 株式会社タムラ製作所 はんだ合金およびはんだ組成物
WO2017192517A1 (en) * 2016-05-06 2017-11-09 Alpha Assembly Solutions Inc. High reliability lead-free solder alloy
TWI646203B (zh) * 2016-07-15 2019-01-01 日商Ｊｘ金屬股份有限公司 Solder alloy
CN106216872B (zh) 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
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KR102286739B1 (ko) * 2017-08-17 2021-08-05 현대자동차 주식회사 무연 솔더 조성물
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JP6477965B1 (ja) * 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN108526748A (zh) * 2018-03-28 2018-09-14 云南锡业锡材有限公司 一种SnBiAgSbIn低温无铅焊料合金
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US11999018B2 (en) 2018-08-31 2024-06-04 Indium Corporation SnBi and SnIn solder alloys
CN109175768A (zh) * 2018-09-30 2019-01-11 苏州优诺电子材料科技有限公司 SiC晶须增强的Sn-Bi系焊料及其制备方法
WO2020062199A1 (zh) * 2018-09-30 2020-04-02 苏州优诺电子材料科技有限公司 SiC晶须增强的Sn-Bi系焊料及其制备方法
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KR102198850B1 (ko) * 2018-11-29 2021-01-05 덕산하이메탈(주) 저융점 솔더 합금 및 이를 이용하여 제조된 솔더볼
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EP3718678A1 (de) * 2019-04-03 2020-10-07 Felder GmbH Löttechnik Verfahren zur herstellung eines snbi-lötdrahtes, lötdraht und vorrichtung
EP3973578A1 (en) * 2019-05-23 2022-03-30 Alpha Assembly Solutions Inc. Solder paste for module fabrication of solar cells
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JP7161140B1 (ja) * 2022-07-22 2022-10-26 千住金属工業株式会社 はんだ合金、はんだボール、はんだペーストおよびはんだ継手
CN115647644B (zh) * 2022-10-09 2024-06-25 云南锡业集团（控股）有限责任公司研发中心 一种五元包共晶高韧性低温锡铋系焊料及其制备方法
CN116140862A (zh) * 2023-01-31 2023-05-23 广州金升阳科技有限公司 一种焊锡料及其制备方法
CN116618885A (zh) * 2023-07-12 2023-08-22 云南锡业新材料有限公司 一种高可靠Sn-Bi-Ag系低温无铅焊料合金及其制备方法

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1927525A (en) * 1927-12-07 1933-09-19 Skinner Engine Co Reversing valve gear
BE782668A (fr) * 1971-05-18 1972-08-16 Siemens Ag Matiere premiere de contact pour interrupteurs a vide a grande puissance
DE2712517C2 (de) * 1977-03-22 1979-05-23 Et. Dentaire Ivoclar, Schaan (Liechtenstein) Verwendung einer Wismut-Zinn-Legierung zur Herstellung von Modellen in der Zahntechnik
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5569433A (en) 1994-11-08 1996-10-29 Lucent Technologies Inc. Lead-free low melting solder with improved mechanical properties
DE4443459C2 (de) * 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung
JPH1052791A (ja) * 1996-08-06 1998-02-24 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
JP3592486B2 (ja) * 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置
JP3761678B2 (ja) * 1997-07-17 2006-03-29 松下電器産業株式会社 錫含有鉛フリーはんだ合金及びそのクリームはんだ並びにその製造方法
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
JP3353686B2 (ja) * 1998-02-05 2002-12-03 富士電機株式会社 はんだ合金
JP3386009B2 (ja) * 1998-07-01 2003-03-10 富士電機株式会社 はんだ合金
JP4135268B2 (ja) * 1998-09-04 2008-08-20 株式会社豊田中央研究所 無鉛はんだ合金
JP4359983B2 (ja) * 1999-12-24 2009-11-11 株式会社豊田中央研究所 電子部品の実装構造体およびその製造方法
CA2298158C (en) 2000-02-07 2008-04-15 Itf Optical Technologies Inc.-Technologies Optiques Itf Inc. Bonding optical fibers to substrates
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP2001298270A (ja) * 2000-04-14 2001-10-26 Hitachi Ltd 電子機器およびその接続に用いるはんだ
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Ｓｎ−Ａｇ−Ｂｉ系はんだ
JP2002178191A (ja) * 2000-12-06 2002-06-25 Hitachi Ltd 低温系鉛フリーはんだ組成及びそれを用いた電子部品実装構造体
ATE471224T1 (de) * 2001-03-01 2010-07-15 Senju Metal Industry Co Bleifreie lötpaste
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
JP2003290974A (ja) 2002-03-28 2003-10-14 Fujitsu Ltd 電子回路装置の接合構造及びそれに用いる電子部品
JP2004017093A (ja) * 2002-06-17 2004-01-22 Toshiba Corp 鉛フリーはんだ合金、及びこれを用いた鉛フリーはんだペースト
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
EP1749315B1 (en) * 2004-05-04 2009-12-09 S-Bond Technologies LLC Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
TWI279281B (en) 2004-05-20 2007-04-21 Theresa Inst Co Ltd Lead-free solder alloy and preparation thereof
US20050275096A1 (en) * 2004-06-11 2005-12-15 Kejun Zeng Pre-doped reflow interconnections for copper pads
EP1787741A4 (en) * 2004-07-20 2009-06-24 Senju Metal Industry Co GLOSSARY MATERIAL AND METHOD FOR THE PRODUCTION THEREOF
US20060067852A1 (en) * 2004-09-29 2006-03-30 Daewoong Suh Low melting-point solders, articles made thereby, and processes of making same
US20080159904A1 (en) * 2005-08-24 2008-07-03 Fry's Metals, Inc. Solder alloy
US7749340B2 (en) * 2005-10-24 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of lead-free solders containing silver
US9175368B2 (en) * 2005-12-13 2015-11-03 Indium Corporation MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
US9260768B2 (en) * 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
KR100719905B1 (ko) * 2005-12-29 2007-05-18 삼성전자주식회사 Ｓｎ-Ｂｉ계 솔더 합금 및 이를 이용한 반도체 소자
GB0605883D0 (en) * 2006-03-24 2006-05-03 Pilkington Plc Electrical connector
JP4826630B2 (ja) * 2006-04-26 2011-11-30 千住金属工業株式会社 ソルダペースト
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
CN1927525B (zh) * 2006-08-11 2010-11-24 北京有色金属研究总院 一种无银的锡铋铜系无铅焊料及其制备方法
JP5411503B2 (ja) * 2006-08-28 2014-02-12 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法並びに回路基板
JP2010029868A (ja) * 2006-11-06 2010-02-12 Victor Co Of Japan Ltd 無鉛はんだペースト、それを用いた電子回路基板及びその製造方法
CN1947919A (zh) * 2006-11-16 2007-04-18 苏传猛 一种四元合金无铅软钎焊料
WO2008111615A1 (ja) * 2007-03-12 2008-09-18 Senju Metal Industry Co., Ltd. 異方性導電材料
JP4910876B2 (ja) * 2007-05-17 2012-04-04 株式会社村田製作所 ソルダペースト、および接合物品
CN101402514B (zh) * 2007-10-03 2011-09-07 日立金属株式会社 氧化物接合用焊料合金和使用了它的氧化物接合体
CN101301705A (zh) * 2007-12-05 2008-11-12 东莞市普赛特电子科技有限公司 散热器焊接用针筒注射式无铅焊膏
CN101327554A (zh) * 2008-07-31 2008-12-24 东莞永安科技有限公司 一种低温无卤化物高活性焊锡膏
CN101392337B (zh) * 2008-10-31 2010-09-08 广州有色金属研究院 一种低熔点无铅焊料合金
JP5169871B2 (ja) * 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
JP2012061491A (ja) * 2010-09-15 2012-03-29 Nippon Genma:Kk 鉛フリーはんだ合金
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
CN103406686A (zh) * 2013-08-08 2013-11-27 江苏科技大学 一种含钴Sn-Bi系高强度无铅低温焊料
WO2015103362A1 (en) * 2013-12-31 2015-07-09 Alpha Metals, Inc. Rosin-free thermosetting flux formulations

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