WO2008111615A1 - 異方性導電材料 - Google Patents

異方性導電材料 Download PDF

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Publication number
WO2008111615A1
WO2008111615A1 PCT/JP2008/054517 JP2008054517W WO2008111615A1 WO 2008111615 A1 WO2008111615 A1 WO 2008111615A1 JP 2008054517 W JP2008054517 W JP 2008054517W WO 2008111615 A1 WO2008111615 A1 WO 2008111615A1
Authority
WO
WIPO (PCT)
Prior art keywords
low
electroconductive material
particles
anisotropic
melting particles
Prior art date
Application number
PCT/JP2008/054517
Other languages
English (en)
French (fr)
Inventor
Minoru Ueshima
Original Assignee
Senju Metal Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd. filed Critical Senju Metal Industry Co., Ltd.
Priority to CN2008800148285A priority Critical patent/CN101675558B/zh
Priority to EP08721933.3A priority patent/EP2131450B1/en
Priority to JP2009504071A priority patent/JP4983913B2/ja
Priority to US12/450,126 priority patent/US8343383B2/en
Priority to KR1020097021008A priority patent/KR101221148B1/ko
Publication of WO2008111615A1 publication Critical patent/WO2008111615A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

【課題】導電性粒子として低融点粒子を用いていた従来の異方性導電材料は、良好な導通が必要な上下方向の導体間の導電率が低く、しかも高い絶縁抵抗を必要とする隣接導体間の絶縁抵抗が低いものであった。 【解決手段】本発明の異方性導電材料は、低融点粒子の固相線温度が１２５°C以上、ピーク温度が２００°C以下であり、固相線温度とピーク温度の温度差が１５°C以上である。また混入する低融点粒子のうち大きな低融点粒子の最大径は隣接導体間の１／４よりも小さい。
PCT/JP2008/054517 2007-03-12 2008-03-12 異方性導電材料 WO2008111615A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800148285A CN101675558B (zh) 2007-03-12 2008-03-12 各向异性导电材料
EP08721933.3A EP2131450B1 (en) 2007-03-12 2008-03-12 Anisotropic electroconductive material
JP2009504071A JP4983913B2 (ja) 2007-03-12 2008-03-12 異方性導電材料
US12/450,126 US8343383B2 (en) 2007-03-12 2008-03-12 Anisotropic conductive material
KR1020097021008A KR101221148B1 (ko) 2007-03-12 2008-03-12 이방성 도전 재료

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007061233 2007-03-12
JP2007-061233 2007-03-12

Publications (1)

Publication Number Publication Date
WO2008111615A1 true WO2008111615A1 (ja) 2008-09-18

Family

ID=39759549

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054517 WO2008111615A1 (ja) 2007-03-12 2008-03-12 異方性導電材料

Country Status (6)

Country Link
US (1) US8343383B2 (ja)
EP (2) EP2131450B1 (ja)
JP (1) JP4983913B2 (ja)
KR (1) KR101221148B1 (ja)
CN (2) CN103106951B (ja)
WO (1) WO2008111615A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017115462A1 (ja) * 2015-12-28 2017-07-06 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
JP2017119913A (ja) * 2015-12-28 2017-07-06 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
JP2020047590A (ja) * 2018-09-18 2020-03-26 積水化学工業株式会社 導電フィルム及び接続構造体
WO2020241225A1 (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板
WO2021221145A1 (ja) * 2020-04-30 2021-11-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

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KR102294936B1 (ko) * 2011-08-02 2021-08-27 알파 어셈블리 솔루션스 인크. 고 충격 인성 땜납 합금
JP5389970B2 (ja) * 2012-03-26 2014-01-15 シャープ株式会社 撮像モジュール、および撮像モジュールの製造方法
CN103959567B (zh) * 2012-10-19 2016-03-30 株式会社太阳医疗技术研究所 各向异性导电连接器
CN103065990A (zh) * 2012-12-12 2013-04-24 山西国惠光电科技有限公司 一种晶圆级倒装互联方法
CN103146953B (zh) * 2013-03-22 2015-01-07 天津百瑞杰焊接材料有限公司 185℃保险丝熔断芯无铅低温合金及其制备方法
CN103269563B (zh) * 2013-04-27 2016-03-16 合肥京东方光电科技有限公司 覆晶薄膜柔性电路板及显示装置
US10055327B2 (en) 2014-09-30 2018-08-21 International Business Machines Corporation Evaluating fairness in devices under test
CN110265843B (zh) * 2014-10-28 2021-05-11 迪睿合株式会社 各向异性导电膜
KR101768282B1 (ko) * 2014-10-30 2017-08-14 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 반도체 장치
US9620434B1 (en) * 2016-03-07 2017-04-11 Toyota Motor Engineering & Manufacturing North America, Inc. High temperature bonding processes incorporating metal particles and bonded substrates formed therefrom
JP6587107B2 (ja) * 2016-05-12 2019-10-09 パナソニックＩｐマネジメント株式会社 回路部材の接続方法
WO2020004510A1 (ja) * 2018-06-26 2020-01-02 日立化成株式会社 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法

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JPH10112473A (ja) 1996-10-04 1998-04-28 Oki Electric Ind Co Ltd 半導体素子の接続方法
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Publication number Priority date Publication date Assignee Title
JPH08186156A (ja) 1994-12-30 1996-07-16 Casio Comput Co Ltd 電子部品の接続方法
JPH10112473A (ja) 1996-10-04 1998-04-28 Oki Electric Ind Co Ltd 半導体素子の接続方法
JPH11176879A (ja) 1997-12-12 1999-07-02 Citizen Watch Co Ltd 半導体装置の実装方法およびこれに用いる異方性導電接着剤
JPH11186334A (ja) 1997-12-25 1999-07-09 Toshiba Corp 半導体実装装置及びその製造方法及び異方性導電材料
JP2000217239A (ja) 1999-01-21 2000-08-04 Shirataka Kogyo Kk ケ―ブル収納用地下埋設管及びその連結構造
JP2002026070A (ja) 2000-07-04 2002-01-25 Toshiba Corp 半導体装置およびその製造方法
JP2002117721A (ja) * 2000-10-12 2002-04-19 Sintokogio Ltd 導電性プラスチック
JP2006108523A (ja) 2004-10-08 2006-04-20 Hitachi Chem Co Ltd 異方性導電フィルムを用いた電気部品の接続方法
JP2006199833A (ja) * 2005-01-20 2006-08-03 Sekisui Chem Co Ltd 異方性導電接着剤

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017115462A1 (ja) * 2015-12-28 2017-07-06 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
JP2017119913A (ja) * 2015-12-28 2017-07-06 Ｄｏｗａエレクトロニクス株式会社 銀合金粉末およびその製造方法
JP2020047590A (ja) * 2018-09-18 2020-03-26 積水化学工業株式会社 導電フィルム及び接続構造体
WO2020241225A1 (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板
JP2020192552A (ja) * 2019-05-27 2020-12-03 千住金属工業株式会社 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板
KR20210083367A (ko) * 2019-05-27 2021-07-06 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트, 프리폼 땜납, 땜납 볼, 선 땜납, 수지 플럭스 코어드 땜납, 땜납 이음매, 전자 회로 기판 및 다층 전자 회로 기판
KR102342394B1 (ko) 2019-05-27 2021-12-22 센주긴조쿠고교 가부시키가이샤 땜납 합금, 땜납 페이스트, 프리폼 땜납, 땜납 볼, 선 땜납, 수지 플럭스 코어드 땜납, 땜납 이음매, 전자 회로 기판 및 다층 전자 회로 기판
WO2021221145A1 (ja) * 2020-04-30 2021-11-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Also Published As

Publication number Publication date
CN101675558B (zh) 2013-05-08
KR20090118112A (ko) 2009-11-17
EP2608642B1 (en) 2015-04-29
US20100053924A1 (en) 2010-03-04
EP2131450B1 (en) 2013-08-07
CN103106951A (zh) 2013-05-15
KR101221148B1 (ko) 2013-01-10
US8343383B2 (en) 2013-01-01
CN101675558A (zh) 2010-03-17
EP2131450A4 (en) 2011-08-31
JP4983913B2 (ja) 2012-07-25
CN103106951B (zh) 2015-10-14
EP2131450A1 (en) 2009-12-09
EP2608642A1 (en) 2013-06-26
JPWO2008111615A1 (ja) 2010-06-24

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