JPWO2008111615A1 - 異方性導電材料 - Google Patents
異方性導電材料 Download PDFInfo
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- JPWO2008111615A1 JPWO2008111615A1 JP2009504071A JP2009504071A JPWO2008111615A1 JP WO2008111615 A1 JPWO2008111615 A1 JP WO2008111615A1 JP 2009504071 A JP2009504071 A JP 2009504071A JP 2009504071 A JP2009504071 A JP 2009504071A JP WO2008111615 A1 JPWO2008111615 A1 JP WO2008111615A1
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- conductive material
- anisotropic conductive
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- 239000004020 conductor Substances 0.000 title claims abstract description 159
- 239000002245 particle Substances 0.000 claims abstract description 162
- 238000002844 melting Methods 0.000 claims abstract description 94
- 230000008018 melting Effects 0.000 claims abstract description 85
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 48
- 229920001187 thermosetting polymer Polymers 0.000 claims description 40
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 description 27
- 238000010438 heat treatment Methods 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229910020830 Sn-Bi Inorganic materials 0.000 description 7
- 229910018728 Sn—Bi Inorganic materials 0.000 description 7
- 230000005496 eutectics Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229910000846 In alloy Inorganic materials 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 3
- 229910002058 ternary alloy Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- 229910017980 Ag—Sn Inorganic materials 0.000 description 1
- 229910016334 Bi—In Inorganic materials 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
2 導電体
3 上部基板
4 導電体
5 異方性導電材料
6 熱硬化性樹脂
7 導電性粒子
エポキシ樹脂(熱硬化性樹脂)85質量%、硬化促進剤5質量%、低融点粒子10質量%を混練して厚さ40μmの異方性導電フィルムを作製。
低融点粒子:所定粒径が10μm(最大粒径35μm)であり、下記の粒子からなる。
6μm未満粒子(10μmに対して−40%径):8%(個数)
14μm超粒子(10μmに対して+40%径):8%(個数)
6〜14μmの粒子:残部
※3の環境試験後の導体間接続抵抗
○10Ω以下:一般の電子機器において機能を悪化させない接続抵抗値
○10Ω超〜1KΩ:1箇所の導体間内で部分的に接続がなされていない状態
○1KΩ超:1箇所の導体間内でほとんど接続がなされていない状態
※4の環境試験後の隣接導体間絶縁抵抗
○106Ω以上:一般の電子機器において機能を悪化させない絶縁抵抗値
○106Ω未満〜0.1Ω:部分的に絶縁抵抗が下がっている状態
○0.1Ω未満:絶縁性が非常に悪い状態
Claims (7)
- 熱硬化性樹脂中に多数の導電性粒子を含む異方性導電材料において、導電性粒子は固相線温度が125℃以上であり、ピーク温度が200℃以下であるとともに、固相線温度とピーク温度間の温度差が15℃以上の低融点粒子であることを特徴とする異方性導電材料。
- 前記低融点粒子は、Inが13〜22質量%、Agが1〜9質量%、残部Snからなる組成範囲の中で、固相線温度が125℃以上であり、ピーク温度が200℃以下であるとともに、固相線温度とピーク温度間の温度差が15℃以上の特性を有する合金であることを特徴とする請求項1記載の異方性導電材料。
- 前記低融点粒子には、Cu、Ni、Co、P、Ge、Znから選ばれた1種以上が合計で1質量%以下含有されていることを特徴とする請求項1、2記載の異方性導電材料。
- 前記低融点粒子は、Biが25〜75質量%、残部Snからなる組成範囲の中で、固相線温度が125℃以上であり、ピーク温度が200℃以下であるとともに、固相線温度とピーク温度間の温度差が15℃以上の特性を有する合金であることを特徴とする請求項1記載の異方性導電材料。
- 前記低融点粒子には、Ag、Cu、Ni、Co、P、Ge、Znから選ばれた1種以上が合計で2質量%以下含有されていることを特徴とする請求項1、4記載の異方性導電材料。
- 前記導電性粒子に混入する粒径の大きな導電性粒子は、最大粒径が導体と該導体に隣接する導体との間隔の1/4よりも小さいことを特徴とする請求項1記載の異方性導電材料。
- 前記導電性粒子は、所定粒径よりも40%小さい径の導電性粒子の含有量が全個数に対して10%以下であり、また所定粒径よりも40%大きいの導電性粒子の含有量が全個数に対して10%以下であることを特徴とする請求項1記載の異方性導電材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009504071A JP4983913B2 (ja) | 2007-03-12 | 2008-03-12 | 異方性導電材料 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007061233 | 2007-03-12 | ||
JP2007061233 | 2007-03-12 | ||
JP2009504071A JP4983913B2 (ja) | 2007-03-12 | 2008-03-12 | 異方性導電材料 |
PCT/JP2008/054517 WO2008111615A1 (ja) | 2007-03-12 | 2008-03-12 | 異方性導電材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008111615A1 true JPWO2008111615A1 (ja) | 2010-06-24 |
JP4983913B2 JP4983913B2 (ja) | 2012-07-25 |
Family
ID=39759549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009504071A Active JP4983913B2 (ja) | 2007-03-12 | 2008-03-12 | 異方性導電材料 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8343383B2 (ja) |
EP (2) | EP2131450B1 (ja) |
JP (1) | JP4983913B2 (ja) |
KR (1) | KR101221148B1 (ja) |
CN (2) | CN101675558B (ja) |
WO (1) | WO2008111615A1 (ja) |
Families Citing this family (17)
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EP3907037A1 (en) * | 2011-08-02 | 2021-11-10 | Alpha Assembly Solutions Inc. | High impact toughness solder alloy |
JP5389970B2 (ja) | 2012-03-26 | 2014-01-15 | シャープ株式会社 | 撮像モジュール、および撮像モジュールの製造方法 |
CN103959567B (zh) * | 2012-10-19 | 2016-03-30 | 株式会社太阳医疗技术研究所 | 各向异性导电连接器 |
CN103065990A (zh) * | 2012-12-12 | 2013-04-24 | 山西国惠光电科技有限公司 | 一种晶圆级倒装互联方法 |
CN103146953B (zh) * | 2013-03-22 | 2015-01-07 | 天津百瑞杰焊接材料有限公司 | 185℃保险丝熔断芯无铅低温合金及其制备方法 |
CN103269563B (zh) * | 2013-04-27 | 2016-03-16 | 合肥京东方光电科技有限公司 | 覆晶薄膜柔性电路板及显示装置 |
US10055327B2 (en) | 2014-09-30 | 2018-08-21 | International Business Machines Corporation | Evaluating fairness in devices under test |
KR102240963B1 (ko) * | 2014-10-28 | 2021-04-16 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 그 제조 방법, 및 접속 구조체 |
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JP6804286B2 (ja) * | 2015-12-28 | 2020-12-23 | Dowaエレクトロニクス株式会社 | 銀合金粉末およびその製造方法 |
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JP6587107B2 (ja) * | 2016-05-12 | 2019-10-09 | パナソニックIpマネジメント株式会社 | 回路部材の接続方法 |
CN112313032A (zh) * | 2018-06-26 | 2021-02-02 | 昭和电工材料株式会社 | 各向异性导电膜及其制造方法以及连接结构体的制造方法 |
JP2020047590A (ja) * | 2018-09-18 | 2020-03-26 | 積水化学工業株式会社 | 導電フィルム及び接続構造体 |
JP6708942B1 (ja) * | 2019-05-27 | 2020-06-10 | 千住金属工業株式会社 | はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板 |
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WO2003035308A1 (fr) * | 2001-10-26 | 2003-05-01 | Miyazaki Prefecture | Particule metallique spherique pour monodispersion et procede permettant de produire celles-ci |
US6802446B2 (en) * | 2002-02-01 | 2004-10-12 | Delphi Technologies, Inc. | Conductive adhesive material with metallurgically-bonded conductive particles |
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TW200730288A (en) * | 2005-08-11 | 2007-08-16 | Senju Metal Industry Co | Lead free solder paste and application thereof |
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US20100053924A1 (en) | 2010-03-04 |
KR101221148B1 (ko) | 2013-01-10 |
EP2131450A1 (en) | 2009-12-09 |
EP2608642A1 (en) | 2013-06-26 |
CN101675558B (zh) | 2013-05-08 |
KR20090118112A (ko) | 2009-11-17 |
CN103106951B (zh) | 2015-10-14 |
CN103106951A (zh) | 2013-05-15 |
EP2131450A4 (en) | 2011-08-31 |
EP2608642B1 (en) | 2015-04-29 |
CN101675558A (zh) | 2010-03-17 |
EP2131450B1 (en) | 2013-08-07 |
JP4983913B2 (ja) | 2012-07-25 |
WO2008111615A1 (ja) | 2008-09-18 |
US8343383B2 (en) | 2013-01-01 |
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