ATE456863T1 - Verfahren zur herstellung einer dünnfilmtransistorstruktur - Google Patents

Verfahren zur herstellung einer dünnfilmtransistorstruktur

Info

Publication number
ATE456863T1
ATE456863T1 AT01273779T AT01273779T ATE456863T1 AT E456863 T1 ATE456863 T1 AT E456863T1 AT 01273779 T AT01273779 T AT 01273779T AT 01273779 T AT01273779 T AT 01273779T AT E456863 T1 ATE456863 T1 AT E456863T1
Authority
AT
Austria
Prior art keywords
thin film
film transistor
transistor structure
producing
trench
Prior art date
Application number
AT01273779T
Other languages
English (en)
Inventor
Hiroshi Suzuki
Kuniaki Sueoka
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE456863T1 publication Critical patent/ATE456863T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66757Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4908Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66765Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78603Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Bipolar Transistors (AREA)
AT01273779T 2001-02-19 2001-12-18 Verfahren zur herstellung einer dünnfilmtransistorstruktur ATE456863T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001042081 2001-02-19
PCT/JP2001/011110 WO2002067335A1 (fr) 2001-02-19 2001-12-18 Structure de transistor en couches minces, procede de fabrication d'une structure de transistor en couches minces, et dispositif d'affichage utilisant une structure de transistor en couches minces

Publications (1)

Publication Number Publication Date
ATE456863T1 true ATE456863T1 (de) 2010-02-15

Family

ID=18904430

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01273779T ATE456863T1 (de) 2001-02-19 2001-12-18 Verfahren zur herstellung einer dünnfilmtransistorstruktur

Country Status (9)

Country Link
US (2) US6952036B2 (de)
EP (1) EP1369928B1 (de)
JP (1) JP4022470B2 (de)
KR (1) KR100650417B1 (de)
CN (1) CN100459163C (de)
AT (1) ATE456863T1 (de)
DE (1) DE60141225D1 (de)
TW (1) TW541705B (de)
WO (1) WO2002067335A1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067335A1 (fr) 2001-02-19 2002-08-29 International Business Machines Corporation Structure de transistor en couches minces, procede de fabrication d'une structure de transistor en couches minces, et dispositif d'affichage utilisant une structure de transistor en couches minces
US6887776B2 (en) * 2003-04-11 2005-05-03 Applied Materials, Inc. Methods to form metal lines using selective electrochemical deposition
TWI253174B (en) * 2003-05-09 2006-04-11 Au Optronics Corp Ion sensitive field effect transistor and fabrication method of the same
ATE414995T1 (de) * 2003-05-12 2008-12-15 Cambridge Entpr Ltd Polymerer transistor
JP4858682B2 (ja) * 2003-06-04 2012-01-18 日本ゼオン株式会社 基板の製造方法
WO2005059990A1 (en) 2003-12-02 2005-06-30 Semiconductor Energy Laboratory Co., Ltd. Electronic device and semiconductor device and method for manufacturing the same
KR101111995B1 (ko) 2003-12-02 2012-03-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터, 디스플레이 장치 및 액정 디스플레이장치, 그리고 그 제조방법
JP4712361B2 (ja) * 2003-12-02 2011-06-29 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
JP4554344B2 (ja) * 2003-12-02 2010-09-29 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7223641B2 (en) 2004-03-26 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, liquid crystal television and EL television
KR100636503B1 (ko) * 2004-06-25 2006-10-18 삼성에스디아이 주식회사 발광 표시장치와 그의 제조방법
JP2006030502A (ja) * 2004-07-15 2006-02-02 Sony Corp 表示装置および表示装置の製造方法
JP4628040B2 (ja) * 2004-08-20 2011-02-09 株式会社半導体エネルギー研究所 半導体素子を備えた表示装置の製造方法
CN100452325C (zh) * 2005-03-22 2009-01-14 友达光电股份有限公司 一种薄膜晶体管与液晶显示器的制造方法
WO2006134899A1 (ja) * 2005-06-13 2006-12-21 Tohoku University 薄膜トランジスタ、配線板、及び電子装置の製造方法
TW200721501A (en) * 2005-07-05 2007-06-01 Univ Tohoku Thin-film transistor, wiring board and methods of producing the thin-film transistor and the wiring board
US7397086B2 (en) * 2005-12-23 2008-07-08 Xerox Corporation Top-gate thin-film transistor
JP2007203442A (ja) * 2006-02-06 2007-08-16 Univ Kanagawa 金属被覆砥粒,金属被覆砥粒の製造方法,およびその金属被覆砥粒を使用した砥石
CN101449374B (zh) * 2006-06-08 2011-11-09 国际商业机器公司 高热传导性柔软片及其制造方法
TWI305682B (en) * 2006-08-14 2009-01-21 Au Optronics Corp Bottom substrate for liquid crystal display device and the method of making the same
JP2008103653A (ja) * 2006-09-22 2008-05-01 Tohoku Univ 半導体装置及び半導体装置の製造方法
KR101272489B1 (ko) * 2006-10-03 2013-06-07 삼성디스플레이 주식회사 표시 기판, 이의 제조 방법 및 이를 구비하는 전기영동표시장치
JP5329038B2 (ja) * 2006-12-21 2013-10-30 宇部日東化成株式会社 半導体装置及び半導体装置の製造方法
KR101418588B1 (ko) * 2007-11-14 2014-07-16 삼성디스플레이 주식회사 표시 기판 및 이의 제조 방법
GB2454740B (en) * 2007-11-19 2011-12-21 Hewlett Packard Development Co Conductive interconnects
EP2151876A1 (de) * 2008-08-05 2010-02-10 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Elektrische Transportkomponente, Herstellungsverfahren dafür sowie elektro-optische Vorrichtung und opto-elektrische Vorrichtung
JP2010040897A (ja) * 2008-08-07 2010-02-18 Sony Corp 有機薄膜トランジスタ、有機薄膜トランジスタの製造方法、および電子機器
JP5533050B2 (ja) * 2009-04-23 2014-06-25 セイコーエプソン株式会社 半導体装置の製造方法、半導体装置、アクティブマトリクス装置、電気光学装置および電子機器
US9099437B2 (en) * 2011-03-08 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5891952B2 (ja) * 2012-05-29 2016-03-23 株式会社ジャパンディスプレイ 表示装置の製造方法
KR20140061030A (ko) 2012-11-13 2014-05-21 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
KR20140064550A (ko) * 2012-11-20 2014-05-28 삼성디스플레이 주식회사 박막 트랜지스터 표시판의 제조 방법
WO2015076358A1 (ja) * 2013-11-21 2015-05-28 株式会社ニコン 配線パターンの製造方法およびトランジスタの製造方法
TW201525064A (zh) * 2013-12-16 2015-07-01 Daxin Materials Corp 感光樹脂組成物、感光樹脂及有機發光二極體顯示元件
CN104795400B (zh) * 2015-02-12 2018-10-30 合肥鑫晟光电科技有限公司 阵列基板制造方法、阵列基板和显示装置
CN106128963B (zh) * 2016-09-23 2019-07-23 京东方科技集团股份有限公司 薄膜晶体管及制备方法、阵列基板及制备方法、显示面板
CN106876260B (zh) 2017-03-03 2020-03-27 惠科股份有限公司 一种闸电极结构及其制造方法和显示装置
CN107665896B (zh) * 2017-10-27 2021-02-23 北京京东方显示技术有限公司 显示基板及其制作方法、显示面板和显示装置
US11114475B2 (en) * 2017-11-22 2021-09-07 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. IPS thin-film transistor array substrate and manufacturing method thereof
CN109873037A (zh) * 2019-03-20 2019-06-11 京东方科技集团股份有限公司 薄膜晶体管及其制备方法、显示装置
CN113540127B (zh) * 2021-07-19 2023-09-19 合肥鑫晟光电科技有限公司 一种背板、显示面板、显示装置及其制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418758U (de) * 1987-07-25 1989-01-30
EP0598409B1 (de) * 1989-02-14 1998-11-18 Seiko Epson Corporation Verfahren zur Herstellung einer Halbleitervorrichtung
JPH0651350A (ja) * 1992-08-03 1994-02-25 Alps Electric Co Ltd 表示装置
JPH06107881A (ja) * 1992-09-30 1994-04-19 Mitsubishi Rayon Co Ltd 光拡散性メタクリル樹脂
JPH06177126A (ja) * 1992-12-01 1994-06-24 Alps Electric Co Ltd 薄膜積層体の形成方法
JPH0823102A (ja) * 1994-07-08 1996-01-23 Matsushita Electric Ind Co Ltd 電子部品及びその製造方法
US5530293A (en) * 1994-11-28 1996-06-25 International Business Machines Corporation Carbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuits
US5686329A (en) * 1995-12-29 1997-11-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method for forming a metal oxide semiconductor field effect transistor (MOSFET) having improved hot carrier immunity
GB2321336B (en) * 1997-01-15 2001-07-25 Univ Warwick Gas-sensing semiconductor devices
JP3859181B2 (ja) 1997-03-27 2006-12-20 東京応化工業株式会社 導電パターン形成方法
US6121159A (en) * 1997-06-19 2000-09-19 Lsi Logic Corporation Polymeric dielectric layers having low dielectric constants and improved adhesion to metal lines
JPH1146006A (ja) * 1997-07-25 1999-02-16 Canon Inc 光起電力素子およびその製造方法
JP3299167B2 (ja) 1998-02-13 2002-07-08 日本板硝子株式会社 埋設電極付き基板の製造方法
JPH11232335A (ja) 1998-02-13 1999-08-27 Nec Corp 注文管理装置
JPH11339672A (ja) * 1998-05-29 1999-12-10 Sony Corp 画像表示装置の製造方法
US6501098B2 (en) * 1998-11-25 2002-12-31 Semiconductor Energy Laboratory Co, Ltd. Semiconductor device
US6225238B1 (en) * 1999-06-07 2001-05-01 Allied Signal Inc Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes
JP3272326B2 (ja) 1999-06-14 2002-04-08 三協化学株式会社 2−ピリジルピリジン誘導体の製造方法
KR20010046141A (ko) * 1999-11-10 2001-06-05 구본준 박막 트랜지스터 및 배선 제조방법
WO2002067335A1 (fr) 2001-02-19 2002-08-29 International Business Machines Corporation Structure de transistor en couches minces, procede de fabrication d'une structure de transistor en couches minces, et dispositif d'affichage utilisant une structure de transistor en couches minces
US7045861B2 (en) * 2002-03-26 2006-05-16 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, liquid-crystal display device and method for manufacturing same
US6825517B2 (en) * 2002-08-28 2004-11-30 Cova Technologies, Inc. Ferroelectric transistor with enhanced data retention
TW200406829A (en) * 2002-09-17 2004-05-01 Adv Lcd Tech Dev Ct Co Ltd Interconnect, interconnect forming method, thin film transistor, and display device
US6887776B2 (en) * 2003-04-11 2005-05-03 Applied Materials, Inc. Methods to form metal lines using selective electrochemical deposition

Also Published As

Publication number Publication date
JPWO2002067335A1 (ja) 2004-06-24
EP1369928A1 (de) 2003-12-10
US20050250262A1 (en) 2005-11-10
US6952036B2 (en) 2005-10-04
EP1369928B1 (de) 2010-01-27
US20040113161A1 (en) 2004-06-17
JP4022470B2 (ja) 2007-12-19
TW541705B (en) 2003-07-11
DE60141225D1 (de) 2010-03-18
KR100650417B1 (ko) 2006-11-28
EP1369928A4 (de) 2006-01-11
WO2002067335A1 (fr) 2002-08-29
CN1489790A (zh) 2004-04-14
KR20030077621A (ko) 2003-10-01
CN100459163C (zh) 2009-02-04
US7326600B2 (en) 2008-02-05

Similar Documents

Publication Publication Date Title
ATE456863T1 (de) Verfahren zur herstellung einer dünnfilmtransistorstruktur
ATE340413T1 (de) Organischer dünnfilmtransistor mit siloxanpolymergrenzfläche
ATE533183T1 (de) Verfahren zur herstellung vertiefter zugangsvorrichtungen
EP1909327A3 (de) Dünnschichttransistortafel und Herstellungsverfahren dafür
DE60236436D1 (de) Einzelelektrontransistoren und verfahren zur herstellung
ATE434834T1 (de) Herstellungsverfahren von integriertem halbleiterschaltkreisbauelement mit halbleiterfestwertspeicherbauelementen
ATE557419T1 (de) Verfahren zur herstellung eines halbleiterbauelements
WO2004006633A3 (en) Integrated circuit including field effect transistor and method of manufacture
ATE509366T1 (de) Verfahren zur herstellung eines halbleiterbauelements, hergestellt auf einer oberfläche aus silizium mit 110- kristallebenenrichtung
JP2005135991A5 (de)
TW200614855A (en) Organic thin film transistor array and manufacturing method thereof
ATE363133T1 (de) Ein fet anordnung und eine methode zur herstellung einer fet anordnung
WO2003041185A3 (en) Organic thin film transistor with polymeric interface
DE602004021894D1 (de) TFT und Flachbildschirm mit Durchkontaktierungen und Anodenkontakt mit abgeschrägten Seitenwänden
DE60128489D1 (de) Von hinten beleuchtete bildaufnahmevorrichtung mit erhöhter empfindlichkeit vom uv bis nah-ir-bereich
WO2006096749A3 (en) Semiconductor device manufacture using a sidewall spacer etchback
ATE448567T1 (de) Mosfet-transistor und verfahren zu deren herstellung
ATE122176T1 (de) Verfahren zur herstellung einer halbleiteranordnung mit gatestruktur.
DE69124012D1 (de) Verfahren zur Herstellung einer Dünnfilm-Halbleitervorrichtung
DE602004005685D1 (de) Verfahren zur herstellung einer elektronischen anordung
US10868049B2 (en) Display device and manufacturing method thereof
DE60138387D1 (de) Verfahren zur herstellung eines dünnfilmtransistors
CN108807422B (zh) 阵列基板制作方法及阵列基板、显示面板
JP2005123438A (ja) 薄膜トランジスタおよび薄膜トランジスタの製造方法、および薄膜トランジスタアレイ、および表示装置、およびセンサー装置
DE602005004945D1 (de) Herstellung einer optischen Verbindungsschicht auf einem elektronischen Schaltkreis

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties