DE60128489D1 - Von hinten beleuchtete bildaufnahmevorrichtung mit erhöhter empfindlichkeit vom uv bis nah-ir-bereich - Google Patents
Von hinten beleuchtete bildaufnahmevorrichtung mit erhöhter empfindlichkeit vom uv bis nah-ir-bereichInfo
- Publication number
- DE60128489D1 DE60128489D1 DE60128489T DE60128489T DE60128489D1 DE 60128489 D1 DE60128489 D1 DE 60128489D1 DE 60128489 T DE60128489 T DE 60128489T DE 60128489 T DE60128489 T DE 60128489T DE 60128489 D1 DE60128489 D1 DE 60128489D1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- array
- range
- image recording
- increased sensitivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000035945 sensitivity Effects 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052710 silicon Inorganic materials 0.000 abstract 4
- 239000010703 silicon Substances 0.000 abstract 4
- 239000010453 quartz Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
Landscapes
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Photoreceptors In Electrophotography (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US753530 | 2001-01-02 | ||
US09/753,530 US6498073B2 (en) | 2001-01-02 | 2001-01-02 | Back illuminated imager with enhanced UV to near IR sensitivity |
PCT/US2001/050086 WO2002058153A2 (en) | 2001-01-02 | 2001-12-20 | Back illuminated imager with enhanced uv to near ir sensitivity |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60128489D1 true DE60128489D1 (de) | 2007-06-28 |
DE60128489T2 DE60128489T2 (de) | 2008-02-07 |
Family
ID=25031023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60128489T Expired - Lifetime DE60128489T2 (de) | 2001-01-02 | 2001-12-20 | Von hinten beleuchtete bildaufnahmevorrichtung mit erhöhter empfindlichkeit vom uv bis nah-ir-bereich |
Country Status (9)
Country | Link |
---|---|
US (1) | US6498073B2 (de) |
EP (1) | EP1356522B1 (de) |
JP (1) | JP2004531877A (de) |
AT (1) | ATE362657T1 (de) |
AU (1) | AU2002245175A1 (de) |
CA (1) | CA2434252A1 (de) |
DE (1) | DE60128489T2 (de) |
TW (1) | TW526525B (de) |
WO (1) | WO2002058153A2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10042947A1 (de) * | 2000-08-31 | 2002-03-21 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement auf GaN-Basis |
US20040140474A1 (en) * | 2002-06-25 | 2004-07-22 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device, method for fabricating the same and method for bonding the same |
WO2004054001A2 (en) * | 2002-12-09 | 2004-06-24 | Quantum Semiconductor Llc | Cmos image sensor |
JP4046067B2 (ja) | 2003-11-04 | 2008-02-13 | ソニー株式会社 | 固体撮像素子の製造方法 |
JP2005259828A (ja) * | 2004-03-10 | 2005-09-22 | Sony Corp | 固体撮像素子及びその製造方法 |
US7060592B2 (en) * | 2004-09-15 | 2006-06-13 | United Microelectronics Corp. | Image sensor and fabricating method thereof |
US7425460B2 (en) * | 2004-09-17 | 2008-09-16 | California Institute Of Technology | Method for implementation of back-illuminated CMOS or CCD imagers |
US7723215B2 (en) * | 2005-02-11 | 2010-05-25 | Sarnoff Corporation | Dark current reduction in back-illuminated imaging sensors and method of fabricating same |
US7238583B2 (en) * | 2005-02-11 | 2007-07-03 | Sarnoff Corporation | Back-illuminated imaging device and method of fabricating same |
WO2007059283A2 (en) | 2005-11-15 | 2007-05-24 | California Institute Of Technology | Back-illuminated imager and method for making electrical and optical connections to same |
US7586139B2 (en) | 2006-02-17 | 2009-09-08 | International Business Machines Corporation | Photo-sensor and pixel array with backside illumination and method of forming the photo-sensor |
US20080044984A1 (en) * | 2006-08-16 | 2008-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Methods of avoiding wafer breakage during manufacture of backside illuminated image sensors |
KR101447044B1 (ko) * | 2006-10-31 | 2014-10-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
JP5250236B2 (ja) * | 2006-10-31 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
WO2008118525A1 (en) * | 2007-03-27 | 2008-10-02 | Sarnoff Corporation | Method of fabricating back-illuminated imaging sensors |
WO2009146256A1 (en) * | 2008-05-30 | 2009-12-03 | Sarnoff Corporation | High-efficiency thinned imager with reduced boron updiffusion |
JP2011522415A (ja) * | 2008-05-30 | 2011-07-28 | サーノフ コーポレーション | Utsoiウェーハ上に製作された背面照射型撮像装置の背面を電子的にピン止めする方法 |
TWI440169B (zh) * | 2009-08-31 | 2014-06-01 | Sumco Corp | 固態攝影元件用半導體晶圓的薄膜化控制方法 |
JP2010118675A (ja) * | 2010-01-12 | 2010-05-27 | Sony Corp | 固体撮像素子及びその製造方法 |
US20110269295A1 (en) * | 2010-04-30 | 2011-11-03 | Hopper Peter J | Method of Forming a Semiconductor Wafer that Provides Galvanic Isolation |
JP2010258463A (ja) * | 2010-06-18 | 2010-11-11 | Sony Corp | 固体撮像素子の製造方法 |
JP5218502B2 (ja) * | 2010-08-30 | 2013-06-26 | ソニー株式会社 | 固体撮像装置の製造方法 |
US8975668B2 (en) | 2011-10-28 | 2015-03-10 | Intevac, Inc. | Backside-thinned image sensor using Al2 O3 surface passivation |
US11069560B2 (en) * | 2016-11-01 | 2021-07-20 | Shin-Etsu Chemical Co., Ltd. | Method of transferring device layer to transfer substrate and highly thermal conductive substrate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4656519A (en) | 1985-10-04 | 1987-04-07 | Rca Corporation | Back-illuminated CCD imagers of interline transfer type |
US5395788A (en) * | 1991-03-15 | 1995-03-07 | Shin Etsu Handotai Co., Ltd. | Method of producing semiconductor substrate |
US5227313A (en) | 1992-07-24 | 1993-07-13 | Eastman Kodak Company | Process for making backside illuminated image sensors |
US5276345A (en) * | 1992-10-30 | 1994-01-04 | California Institute Of Technology | Composite GaAs-on-quartz substrate for integration of millimeter-wave passive and active device circuitry |
US5270221A (en) | 1992-11-05 | 1993-12-14 | Hughes Aircraft Company | Method of fabricating high quantum efficiency solid state sensors |
US5426072A (en) * | 1993-01-21 | 1995-06-20 | Hughes Aircraft Company | Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate |
US5391257A (en) * | 1993-12-10 | 1995-02-21 | Rockwell International Corporation | Method of transferring a thin film to an alternate substrate |
WO1995018463A1 (en) * | 1993-12-30 | 1995-07-06 | Honeywell Inc. | Single crystal silicon on quartz |
WO1995023348A1 (en) * | 1994-02-25 | 1995-08-31 | Massachusetts Institute Of Technology | Methods and apparatus for detecting and imaging particles |
JP3542376B2 (ja) * | 1994-04-08 | 2004-07-14 | キヤノン株式会社 | 半導体基板の製造方法 |
FR2725074B1 (fr) * | 1994-09-22 | 1996-12-20 | Commissariat Energie Atomique | Procede de fabrication d'une structure comportant une couche mince semi-conductrice sur un substrat |
US5754228A (en) | 1995-09-25 | 1998-05-19 | Lockhead Martin Corporation | Rapid-sequence full-frame CCD sensor |
AU5354698A (en) | 1996-11-01 | 1998-05-29 | Lawrence Berkeley Laboratory | Low-resistivity photon-transparent window attached to photo-sensitive silicon detector |
US6214733B1 (en) * | 1999-11-17 | 2001-04-10 | Elo Technologies, Inc. | Process for lift off and handling of thin film materials |
US6287891B1 (en) * | 2000-04-05 | 2001-09-11 | Hrl Laboratories, Llc | Method for transferring semiconductor device layers to different substrates |
-
2001
- 2001-01-02 US US09/753,530 patent/US6498073B2/en not_active Expired - Fee Related
- 2001-12-20 AT AT01993333T patent/ATE362657T1/de not_active IP Right Cessation
- 2001-12-20 AU AU2002245175A patent/AU2002245175A1/en not_active Abandoned
- 2001-12-20 CA CA002434252A patent/CA2434252A1/en not_active Abandoned
- 2001-12-20 DE DE60128489T patent/DE60128489T2/de not_active Expired - Lifetime
- 2001-12-20 WO PCT/US2001/050086 patent/WO2002058153A2/en active IP Right Grant
- 2001-12-20 EP EP01993333A patent/EP1356522B1/de not_active Expired - Lifetime
- 2001-12-20 JP JP2002558337A patent/JP2004531877A/ja active Pending
- 2001-12-28 TW TW090132757A patent/TW526525B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE362657T1 (de) | 2007-06-15 |
US20020084474A1 (en) | 2002-07-04 |
AU2002245175A1 (en) | 2002-07-30 |
JP2004531877A (ja) | 2004-10-14 |
US6498073B2 (en) | 2002-12-24 |
EP1356522B1 (de) | 2007-05-16 |
WO2002058153A2 (en) | 2002-07-25 |
CA2434252A1 (en) | 2002-07-25 |
DE60128489T2 (de) | 2008-02-07 |
TW526525B (en) | 2003-04-01 |
EP1356522A2 (de) | 2003-10-29 |
WO2002058153A9 (en) | 2003-09-18 |
WO2002058153A3 (en) | 2003-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |