CN101449374B - 高热传导性柔软片及其制造方法 - Google Patents

高热传导性柔软片及其制造方法 Download PDF

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CN101449374B
CN101449374B CN2007800184060A CN200780018406A CN101449374B CN 101449374 B CN101449374 B CN 101449374B CN 2007800184060 A CN2007800184060 A CN 2007800184060A CN 200780018406 A CN200780018406 A CN 200780018406A CN 101449374 B CN101449374 B CN 101449374B
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小原小百合
末冈邦昭
平洋一
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Abstract

本发明的目的是减小发热体与散热体之间(间隙)的热阻。本发明提供的高热传导性柔软片，交替层叠石墨层和弹性层，石墨层的面方向或者石墨烯的端部，比弹性层的端部突出并且以覆盖弹性层的端部的至少一部分的方式弯曲。把本发明的片设置在发热体与散热体之间(间隙)，即使发热体表面或散热体表面的平坦度低，也能减小该间隙处的热阻，尤其能减小接合面处的接触热阻。

Description

高热传导性柔软片及其制造方法
技术领域
本发明通常涉及高热传导性柔软片。更详细地说是涉及采用高热传导性柔软片的热传导组件、该高热传导性柔软片和该热传导组件的制造方法。 
近年来，随着微处理器(CPU)等电子器件的高性能化及小型化，该电子器件产生的热也增大。因此，要求电子器件的冷却能力大的冷却技术。通常，电子器件采用散热器等的散热部件进行冷却。电子器件和散热部件，为了降低接合部(间隙)的热阻，通过高热传导性材料接合。 
电子器件和散热部件的表面并非完全平坦，而是具有微细的凹凸。因此，在电子器件和散热部件的接合间隙处采用金属等的硬传热材料的情况下，该材料与电子器件或散热部件的接合(紧贴性)不充分。结果，该接合部的热阻增大。因此，目前广泛采用能将该不均匀的接合间隙无间隙地掩埋的热油脂、相转换片等。但是，这些传热材料的热传导率比金属材料低(多数情况下是＜＜10W/mK)。因此，具有如下问题，即，特别是在接合间隙的厚度大时，热阻增大。 
在日本的公开特许公报·平8-238707中，公开了在硅酮橡胶基材中加入了金属粉等的添加剂的散热片。在美国专利6651736号中，公开了把碳材料作为填充剂加入到油脂、聚合物等的粘接剂中的方法。但是，即使采用这些方法，整体的热传导率仍然受基材(粘接剂)的热传导率制约，因此不能充分降低热阻。 
在日本的公开特许公报·平10-56114、平-11-302545、美国专利5695847中，公开了将石墨纤维等相对于接合面垂直配置的片状传热部件。用该方法得到的碳系复合部件，在大块状态下显示高热传导率。 
专利文献1：日本国公开特许公报、平8-238707 
专利文献2：美国专利6651736 
专利文献3：日本国公开特许公报、平10-56114 
专利文献4：日本国公开特许公报、平11-302545 
专利文献5：美国专利5695847 
发明内容
本发明的目的是，提供具有高热传导性的柔软的接合部件。 
本发明的另一目的是，减小发热体与散热体之间(间隙)的热阻。 
本发明的另一目的是，提高从发热体表面向散热体表面传热的热传导率。 
本发明的另一目的是，无论接合面的表面状态如何，都减小接合面的接触热阻。 
根据本发明，提供一种高热传导性柔软片，交替层叠石墨层和弹性层，石墨层的面方向的端部，比弹性层的端部突出而且以覆盖弹性层的端部的至少一部分的方式弯曲。 
根据本发明，提供一种热传导组件，备有发热体、散热体、和配置在发热体与散热体之间的片，上述片交替配置石墨层和弹性层，石墨层的面方向的端部比弹性层的端部突出而且以覆盖弹性层的端部的至少一部分的方式弯曲，另外，石墨层的面方向的一方端面与散热体的表面相接，其另一方端面与发热体的表面相接。 
通过将本发明的片设置在发热体与散热体之间(间隙)，可以减小该间隙处的热阻。 
通过把本发明的片设置在发热体与散热体之间(间隙)，即使在发热体表面或散热体表面的平坦性低的情况下，也能减小该间隙处的热阻，尤其能减小接合面处的接触热阻。 
通过将本发明的片设置在发热体与散热体之间(间隙)，可以提高从发热体表面向散热体表面传热的热传导率。
附图说明
图1是本发明的热传导组件的一个实施例的示意图。 
图2是图1的片5部分的放大图。 
图3是表示配置着碳原子的石墨烯构造的图。 
图4是表示本发明的石墨层50的形状的一例的图。 
图5是表示本发明的一个实施例的石墨层的形状的图。 
图6是表示本发明的制造方法中的块的形成工序的图。 
图7是表示本发明的制造方法的一个实施例的图。 
图8是表示本发明的制造方法的一个实施例的图。 
图9是表示本发明的制造方法的一个实施例的图。 
图10是表示本发明的制造方法的一个实施例的图。 
图11是表示用本发明的方法制造的片(实施例)的表面(端面)的图。 
图12是表示图11的片的截面的图。 
图13是表示作为本发明的比较例的表面(端面)的图。 
图14是表示片两面的温度差相对于热流入率q变化的曲线。 
图15是表示厚度与接触热阻的关系的图。 
具体实施方式
下面，参照附图详细说明本发明。图1是本发明的热传导组件的一个实施例的示意图。在发热体1与散热体7之间，经由填充材料3配置着高热传导性柔软片5。发热体1例如是微处理器等的电子部件(IC芯片、半导体元件)。散热体7，例如是由铝等制作的散热器。填充材料3不是必要部件。填充材料3也可以填充在发热体1与片5之间、或者散热体7与片5之间的至少一方中。填充材料3由硅油、液体金属、或散热油脂等的流动性材料构成。 
图2是图1的片5部分的放大图。片5交替配置(层叠)着石墨层50和弹性层52。弹性层52由与石墨层50具有粘接性的树脂材料构成。该树脂材料例如有硅系、聚酰亚胺系、丙烯酸系等。石墨层50的面方向(图2中的垂直方向)的端部，比弹性层52的端部突出并且 覆盖弹性层52的端部的至少一部分地弯曲。石墨层50的一方(上)端面与散热体7的表面相接，其另一方(下)端面与发热体1的表面相接。另外，图2表示石墨层50的端面通过填充材料3与散热体7的表面或发热体1的表面相接的情形。但是，并不限定于该构造，石墨层50的端面也可以直接与散热体7的表面或发热体1的表面相接。 
石墨层50由石墨的多层构造构成。石墨，如图3所示，具有碳原子在面方向(a-b面)配置成蜂巢构造的层。该一片层称为石墨烯。石墨用聚合物结合成为一个层。石墨的面方向(a-b面)与图2的垂直方向一致。在石墨中，热主要借助称为声子的结晶的格子振动传递。石墨烯间的距离约为石墨烯面内的原子间邻接距离的2.4倍。因此，石墨在石墨烯的面方向(a-b面)具有高热传导性(热各向异性)。图3的面方向(a-b面)的热传导性，比垂直(c-轴)方向高大约100倍至1000倍。因此，用石墨的面方向、即石墨烯的端面，与散热体或发热体的表面接触是很重要的。其原因是，通过与石墨烯的端面接触，格子振动或声子在石墨烯面内容易传播，结果，可减小接触部处的热阻。在本发明中，将石墨的碳原子层、或者石墨烯，沿着包含其端面(接触部)的发热体与散热体之间的整个间隙保持是很重要的。 
同时，在本发明中，使石墨层的端部以覆盖弹性层的端部的方式扩开是很重要的。其原因是，可以减小热传导性低的弹性层的端部与发热体(散热体)的接触面积，同时，可以增大热传导性高的石墨层的端面与发热体(散热体)的接触面积。其结果，用上述的端面接触，可更加减小接触部的热阻。 
图4表示石墨层50的形状的一例的图。在图中，为了清楚地表示多层构造，用若干条线表示各石墨层。石墨层端面的扩开宽度L，在设弯曲角为θ、石墨层50的厚度为t时，可以估计为L＝t/cosθ。在图4中，石墨层50的端面将弹性层52的端部大致完全地覆盖住。图4的形状，可以说是表示了理想的石墨层的形状。石墨层的端部，并不限定于图4所示那样地朝一个方向弯曲的情况。石墨层的端部也可以如图5所示那样，以覆盖相邻的两个弹性层的端部的方式扩开(呈扇 形、倒三角形)。另外，石墨层也可以是在其端部所接触的2个表面朝相反方向弯曲的“S字型”那样的形状。 
下面，参照图6～图10，说明本发明的片5的制造方法。先将石墨层和弹性层交替层叠、形成为一个块。图6表示该块的形成工序。在图6(a)中，先准备好特氟隆(R)制的铸模(模子)60。将石墨层和弹性层交替地放入该模子内、重叠。石墨层和弹性层的数目根据发热体(散热体)的尺寸适当选择。石墨层可以采用市售的石墨片，例如松下制的“PGS”石墨片(型号：EYGS091310，厚度：0.1mm)。弹性层可以采用市售的未硬化液状弹性体，例如，硅弹性体等。在图6(b)中，在层叠体上放置重物62、进行加压，同时，在炉中用150℃加热60分钟。液状的弹性体因加热而硬化，形成固态的块64(图6(c))。 
参照图7。图7(a)表示块64。石墨层(PGS)66和弹性层(硅弹性体)68层叠着。沿层叠方向将块64切断，形成若干个小块。例如，沿图7(a)的虚线A-A朝垂直方向切断。该切断使用带金刚石刀的切断机或金刚石锯等。切断的片的厚度是1μm至2mm。在该切断时，使得被切断的一个小块中的石墨层66的端部(切断面)，比弹性层68的端部(切断面)突出。同时，覆盖弹性层68的端部(切断面)的至少一部分地弯曲。为此，必须要调节切断速度、施加在刀上的荷载、刀的种类。例如，在把金刚石刀的旋转速度设定为120rpm、荷载设定为25g时，就可以具有良好再现性地形成本发明的端部。另外，在把荷载设定为75g、速度设定为200rpm的情况下，不能形成本发明的端部形状。经过该工序，可得到图7(b)或图4所示的、石墨层的端部突出并弯曲的形状。 
为了更加容易地得到该石墨层的端部形状，必须注意以下几点。首先，调节图6工序中的石墨层(PGS)间的粘接强度。具体地说，调节弹性层(硅弹性体)的硬化的温度和时间。这是为了在图7的切断工序中使PGS片具有自由度。如果PGS片有了自由度，则在用金刚石刀等切断时，硬度低的弹性层(硅弹性体)被选择性地切削掉。 结果，硬度高的PGS片的端部被留下，其端面比弹性层的端面突出。另外，由于刀的荷载是朝着使该突出部弯曲的方向作用，所以，该突出部弯曲，将弹性层的表面(端面)覆盖住(图4)。为了使其具有自由度，可以采用硬度非常低的弹性层，例如信越化学制的硅弹性体KE1308(JIS-A硬度7)等。 
在石墨层(PGS)间的粘接强度过低、在切断时可能不能支撑块本身的情况下，要将块的周围固定住。固定的方法是，首先为了保持块的柔软性，用弹性体等的柔软性材料将块的周围固定住。具体地说，例如，把块放入未硬化的硅弹性体材料中，抽真空。弹性体浸透到复合块中。然后，使硅弹性体硬化。接着，为了使片(小块)不因切断时的应力而弯曲，用硬度高的环氧材料等的材料将块的周围固定住。另外，该固定是根据需要而进行的。返回图7(c)，用研磨机等将端部弯曲了的石墨层磨削掉，使其表面(端面)平坦化。其目的是为了使石墨层的端面与发热体或散热体的表面更加紧密地接合。另外，也可以不实施该平坦化。 
下面，参照图8说明另一制造方法。图8(a)是与图7(a)同样的块64。沿层叠方向将块64切断，形成了若干个小块。例如，沿图7(a)中虚线A-A朝垂直方向切断。这些步骤都与图7基本相同。与图7的不同点是，在图8(a)中，以使切断面成为平坦面的方式进行切断。也就是说不进行这样的切断，即，使石墨层的端面从弹性层的端面突出。为此，要调整切断时使用的金刚石刀的旋转速度、荷载等。在切断后，得到具有大致平坦切断面的小块(片)70(图8(b))。把切断后的块中的弹性层(硅弹性体)的表面腐蚀。具体地说，把片(块)70放入硅用腐蚀液中，或者，把腐蚀液喷涂到块70的表面上。用腐蚀的时间、温度等来控制要除去的硅的量。 
图8(c)表示腐蚀后的片72。石墨层的端部突出，其突出的量相当于被除去的硅弹性体的量。接着，用辊等对石墨层的端部突出的表面加压，将其突出的端部弯曲。这时，一个石墨层的端部覆盖其相邻弹性层的端面地弯曲。在图8(d)中，表示石墨层的端部弯曲的状态 下的片74。然后，与图7(c)同样地，用研磨机等磨削端部弯曲的石墨层，使其表面(端面)平坦化。也可以不实施该平坦化。最后得到图8(e)的构造76。另外，在弯曲时，也可以使一个石墨层的端部覆盖其相邻的(前后的)2个弹性层地弯曲。这时，可得到图5所示的石墨层50的形状(扇形)。 
下面，参照图9、图10说明另一制造方法。在图9(a)中，准备好具有两片板80的模，该两片板80之间的距离相当于片的高度(厚度)d。将PGS片82接合在板80的一方端面上。这时，用杆84将片82按压在板80上进行固定。用两个刀86将PGS片82切断。切断方向是从垂直于片82的表面的方向倾斜角度α的方向(图9(a))。用杆84把切断后的片(块)88推入模子中(两个板之间)。片·块88的端部借助推入时的力，沿板80的表面弯曲(图9(b))。接着放入未硬化的弹性材料90(图9(c))。然后，再与(a)同样地，将PGS片82接合在板80的一方端面上。用两个刀86将PGS片82切断(图9(d))。用杆84把切断后的片(块)92推入模子中(两个板之间)(图9(e))。反复进行工序(a)～(e)，得到预定数量的PGS片·块和弹性层层叠的构造(图9(f))。最后，把在工序(f)得到的构造放在炉中加热。弹性材料硬化，得到本发明的片94(图9(g))。 
参照图10。为了更准确地控制图9的弹性材料90的宽度，把预先硬化了的片状弹性材料94按压在板80上进行固定。用刀96朝着与弹性片94的表面垂直的方向切断。用杆84把切断后的弹性片(块)推入模子中(两个板之间)。然后，为了掩埋间隙，也可以注入液态的弹性材料。为了防止空气进入形成气泡等，这些工序也可以都在减压状态下进行。 
用上述任一种制造方法制造的本发明的片5，通过其上下的面与发热体表面和散热体表面接合。其结果，可形成例如图1所示的热传导组件。另外，在接合时，为了进一步降低接触热阻，也可以在接触面上涂敷与石墨的亲和性(热结合性)好的氟化油。 
实施例
图11表示用本发明的方法制造出的片(实施例)的表面(端面)的显微镜照片。是使用松下制的“PGS”石墨片(型号：EYGS091310，厚度：0.1mm)。硬化后的硅弹性体的厚度是0.1mm。表面(端面)的各个PGS片(石墨层)的宽度是0.16～0.17mm。石墨层比原先的宽度扩大了约60～70μm。图12是同一样品的截面的显微镜照片。在表面C处石墨层100弯曲，呈覆盖弹性体200表面的“コ”字形。表面C处的石墨层100的宽度约为0.18mm，比原先的宽度扩大了约80μm。作为比较例，采用相同的PGS片，准备了其端面(切断面)平坦的层叠构造(片)。图13是该片的表面的显微镜照片。这时，石墨层的宽度是100μm，与原先的宽度大致相同。 
图14是表示实施例和比较例的、片两面的温度差相对于热流入率(q)变化的曲线。横轴表示相当于热流入率(q)的加热器功率(W)。纵轴表示片两面的温度差(℃)。从该曲线的倾斜度求出各自的热阻值。实施例的热阻值是14.6℃mm2/W，比较例的热阻值是27.4℃mm2/W。本发明实施例的热阻，约为比较例的一半(53％)。图15是表示实施例和比较例的、厚度(μm)与接触热阻(℃mm2/W)的关系的曲线。作为参考，在图15中，也示出了PGS片单体(100μm)的接触热阻值。本发明的实施例的接触热阻值，与比较例和单体PGS片相比，减小约10℃mm2/W(45％)。 
本发明的片的可适用范围大。例如，本发明的片，不仅适用于微处理器那样的小电子部件，也适用于等离子电视机那样的大型电气产品。在如处理器那样、水平方向的长度尺寸为数十mm的情况下，石墨层(片)的厚度为数十μm至100μm就可对应。另外，在像等离子电视机那样、水平方向的长度尺寸为数十厘米的情况下，石墨层(片)的厚度为数mm至10mm左右就可对应。 
在本发明中，以图1～图15为例作了说明。但是，本发明并不限定于这些实施例。在不脱离本发明主旨的范围内，可以作各种变形，这对于本专业普通技术人员来说是显而易见的。

Claims (13)

1.一种高热传导性柔软片，其特征在于，交替层叠石墨层和弹性层，上述弹性层由与石墨层具有粘接性的树脂材料构成，上述石墨层的面方向的端部比弹性层的端部突出而且以覆盖弹性层的端部的至少一部分的方式弯曲。
2.如权利要求1所述的片，其特征在于，上述石墨层的面方向的端部，覆盖相邻的两个弹性层的端部地扩开。
3.一种热传导组件，备有发热体、散热体、和配置在发热体与散热体之间的片，
上述片交替配置石墨层和弹性层，上述弹性层由与石墨层具有粘接性的树脂材料构成，上述石墨层的面方向的端部比弹性层的端部突出而且以覆盖弹性层的端部的至少一部分的方式弯曲，另外，石墨层的面方向的一方端面与散热体的表面相接，石墨层的面方向的另一方端面与发热体的表面相接。
4.如权利要求3所述的热传导组件，其特征在于，在上述发热体与上述片之间、和在上述散热体与上述片之间的至少一方上，具有填充材料。
5.如权利要求4所述的热传导组件，其特征在于，上述填充材料，由从硅油、液体金属和散热油脂构成的组中选择出的一种材料构成。
6.如权利要求3所述的热传导组件，其特征在于，上述石墨层的面方向的端部，以覆盖相邻的两个上述弹性层的端部的方式扩开。
7.如权利要求3或4所述的热传导组件，其特征在于，上述发热体包含IC芯片，上述散热体包含散热器。
8.一种高热传导性柔软片的制造方法，用于制造权利要求1或2所述的高热传导性柔软片，其特征在于，包括：
将石墨层和弹性层交替层叠、形成一个层叠块的步骤，上述弹性层由与石墨层具有粘接性的树脂材料构成；
沿着层叠方向将层叠块切断、形成若干个小块的步骤；
上述形成若干个小块的步骤，包括使小块中的石墨层的面方向的端部比弹性层的端部突出、并且以覆盖弹性层的端部的至少一部分的方式使其弯曲的步骤。
9.一种高热传导性柔软片的制造方法，用于制造权利要求1或2所述的高热传导性柔软片，其特征在于，包括：
将石墨层和弹性层交替层叠、形成一个块的步骤，上述弹性层由与石墨层具有粘接性的树脂材料构成；
沿着层叠方向将块切断、形成若干个小块的步骤；
使小块中的石墨层的面方向的端部比弹性层的端部突出的步骤；
以覆盖弹性层的端部的至少一部分的方式使突出的石墨层的面方向的端部弯曲的步骤。
10.如权利要求9所述的高热传导性柔软片的制造方法，其特征在于，在将上述石墨层的面方向的端部弯曲的步骤中，包括将石墨层的面方向的端部以覆盖相邻的两个弹性层的端部的方式扩开的步骤。
11.一种高热传导性柔软片的制造方法，用于制造权利要求1或2所述的高热传导性柔软片，其特征在于，包括：
(a)准备若干个石墨块的步骤；
(b)使石墨块的一面的端部比中央部突出的步骤；
(c)将弹性层接合在石墨块的上述一面上的步骤，上述弹性层由与石墨层具有粘接性的树脂材料构成；
(d)将另一个石墨块接合在弹性层上，使该石墨块的与弹性层的接合面相反侧的面的端部比中央部突出的步骤；
反复步骤(c)和(d)直到得到预定尺寸的层叠构造的步骤。
12.一种热传导组件的制造方法，其特征在于，包括：
准备好发热体的步骤；
将高热传导性柔软片接合在发热体上的步骤，该片交替配置石墨层和弹性层，上述弹性层由与石墨层具有粘接性的树脂材料构成，上述石墨层的与发热体的表面接合的面方向的端面比弹性层的端面突出、并且以覆盖弹性层的端面的至少一部分的方式弯曲；
将散热体接合在上述片上的步骤，上述石墨层的与散热体表面接合的面方向的端面比弹性层的端面突出、并且以覆盖弹性层的端面的至少一部分的方式弯曲。
13.如权利要求12所述的制造方法，其特征在于，还执行把填充材料注入上述发热体与上述片之间的步骤、和把填充材料注入上述散热体与上述片之间的步骤中的任一步骤或两个步骤。
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EP2034520A1 (en) 2009-03-11
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US20110198067A1 (en) 2011-08-18

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